CN102978671B - 一种智能卡封装框架的电镀方法 - Google Patents
一种智能卡封装框架的电镀方法 Download PDFInfo
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- CN102978671B CN102978671B CN201210509212.3A CN201210509212A CN102978671B CN 102978671 B CN102978671 B CN 102978671B CN 201210509212 A CN201210509212 A CN 201210509212A CN 102978671 B CN102978671 B CN 102978671B
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- nickel
- gold
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- plating
- phosphorus
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- 238000009713 electroplating Methods 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 156
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 83
- 239000010931 gold Substances 0.000 claims abstract description 83
- 229910052737 gold Inorganic materials 0.000 claims abstract description 83
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 78
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims abstract description 73
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract description 70
- 238000007747 plating Methods 0.000 claims abstract description 50
- 238000007493 shaping process Methods 0.000 claims abstract description 13
- 238000002203 pretreatment Methods 0.000 claims abstract description 12
- 238000007598 dipping method Methods 0.000 claims description 53
- 239000003814 drug Substances 0.000 claims description 52
- 239000007788 liquid Substances 0.000 claims description 51
- 239000000203 mixture Substances 0.000 claims description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 39
- 229910052802 copper Inorganic materials 0.000 claims description 39
- 239000010949 copper Substances 0.000 claims description 39
- 150000003839 salts Chemical class 0.000 claims description 27
- 238000005238 degreasing Methods 0.000 claims description 26
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 16
- 239000004327 boric acid Substances 0.000 claims description 16
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 16
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 claims description 16
- 238000005516 engineering process Methods 0.000 claims description 14
- 230000004913 activation Effects 0.000 claims description 11
- 239000012190 activator Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 8
- 230000010355 oscillation Effects 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 239000004902 Softening Agent Substances 0.000 claims description 7
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 claims description 7
- 239000000080 wetting agent Substances 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000004519 grease Substances 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims description 2
- FBMUYWXYWIZLNE-UHFFFAOYSA-N nickel phosphide Chemical compound [Ni]=P#[Ni] FBMUYWXYWIZLNE-UHFFFAOYSA-N 0.000 claims description 2
- 238000011536 re-plating Methods 0.000 claims description 2
- 230000003628 erosive effect Effects 0.000 abstract description 7
- 239000000654 additive Substances 0.000 description 33
- 230000000996 additive effect Effects 0.000 description 33
- 239000003795 chemical substances by application Substances 0.000 description 30
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 19
- 239000011574 phosphorus Substances 0.000 description 19
- 229910052698 phosphorus Inorganic materials 0.000 description 19
- 239000000243 solution Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 238000005282 brightening Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000005868 electrolysis reaction Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical group C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical group [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- NBBUYPNTAABDEY-UHFFFAOYSA-N cyclobutane-1,1-diol Chemical compound OC1(O)CCC1 NBBUYPNTAABDEY-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
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CN201210509212.3A CN102978671B (zh) | 2012-12-03 | 2012-12-03 | 一种智能卡封装框架的电镀方法 |
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CN201210509212.3A CN102978671B (zh) | 2012-12-03 | 2012-12-03 | 一种智能卡封装框架的电镀方法 |
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CN102978671A CN102978671A (zh) | 2013-03-20 |
CN102978671B true CN102978671B (zh) | 2016-04-13 |
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WO2021020064A1 (ja) * | 2019-07-31 | 2021-02-04 | 昭和電工株式会社 | 積層体およびその製造方法 |
KR20220010770A (ko) * | 2019-09-13 | 2022-01-26 | 쇼와 덴코 가부시키가이샤 | 적층체 및 그 제조 방법 |
CN111962117B (zh) * | 2020-07-06 | 2021-11-23 | 青岛凯瑞电子有限公司 | 一种陶瓷-金属外壳的多层镀镍工艺 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101978096A (zh) * | 2008-03-20 | 2011-02-16 | 阿托特希德国有限公司 | Ni-P层系统及其制备方法 |
CN102330123A (zh) * | 2011-07-27 | 2012-01-25 | 太仓市金鹿电镀有限公司 | 一种连续镀金工艺 |
Family Cites Families (1)
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US7615255B2 (en) * | 2005-09-07 | 2009-11-10 | Rohm And Haas Electronic Materials Llc | Metal duplex method |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101978096A (zh) * | 2008-03-20 | 2011-02-16 | 阿托特希德国有限公司 | Ni-P层系统及其制备方法 |
CN102330123A (zh) * | 2011-07-27 | 2012-01-25 | 太仓市金鹿电镀有限公司 | 一种连续镀金工艺 |
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Address after: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee after: New Henghui Electronics Co.,Ltd. Address before: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee before: SHANDONG XINHENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
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