CN102964515B - Resin for interlayer insulating film and protective film, and photosensitive resin composition - Google Patents
Resin for interlayer insulating film and protective film, and photosensitive resin composition Download PDFInfo
- Publication number
- CN102964515B CN102964515B CN201210203245.5A CN201210203245A CN102964515B CN 102964515 B CN102964515 B CN 102964515B CN 201210203245 A CN201210203245 A CN 201210203245A CN 102964515 B CN102964515 B CN 102964515B
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- China
- Prior art keywords
- resin
- methyl
- acid
- acrylic monomer
- ester
- Prior art date
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- 239000011347 resin Substances 0.000 title claims abstract description 105
- 229920005989 resin Polymers 0.000 title claims abstract description 105
- 239000011342 resin composition Substances 0.000 title claims abstract description 46
- 239000011229 interlayer Substances 0.000 title claims abstract description 6
- 230000001681 protective effect Effects 0.000 title claims abstract description 6
- 239000000178 monomer Substances 0.000 claims abstract description 88
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 85
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 30
- 239000004593 Epoxy Substances 0.000 claims abstract description 25
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000005977 Ethylene Substances 0.000 claims abstract description 25
- 125000003118 aryl group Chemical group 0.000 claims abstract description 25
- 150000001875 compounds Chemical class 0.000 claims abstract description 25
- 239000002904 solvent Substances 0.000 claims abstract description 24
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910000077 silane Inorganic materials 0.000 claims abstract description 22
- -1 propyl diester Chemical class 0.000 claims description 114
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 32
- 238000010276 construction Methods 0.000 claims description 21
- 150000008065 acid anhydrides Chemical class 0.000 claims description 20
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 claims description 8
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 claims description 6
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical group C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 claims description 6
- DCUFMVPCXCSVNP-UHFFFAOYSA-N methacrylic anhydride Chemical compound CC(=C)C(=O)OC(=O)C(C)=C DCUFMVPCXCSVNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 4
- ARJOQCYCJMAIFR-UHFFFAOYSA-N prop-2-enoyl prop-2-enoate Chemical compound C=CC(=O)OC(=O)C=C ARJOQCYCJMAIFR-UHFFFAOYSA-N 0.000 claims description 3
- DPTGFYXXFXSRIR-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl prop-2-enoate Chemical compound C1C(COC(=O)C=C)CCC2OC21 DPTGFYXXFXSRIR-UHFFFAOYSA-N 0.000 claims description 2
- 239000003999 initiator Substances 0.000 abstract description 9
- 230000035515 penetration Effects 0.000 abstract description 9
- 229920001577 copolymer Polymers 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 150000008064 anhydrides Chemical class 0.000 abstract 1
- 239000002585 base Substances 0.000 description 44
- 239000000463 material Substances 0.000 description 34
- LDHQCZJRKDOVOX-UHFFFAOYSA-N 2-butenoic acid Chemical compound CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 28
- XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 19
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 15
- 239000000203 mixture Substances 0.000 description 15
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 150000002148 esters Chemical class 0.000 description 13
- 125000004494 ethyl ester group Chemical group 0.000 description 13
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 11
- 239000010408 film Substances 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 8
- 238000011161 development Methods 0.000 description 8
- 230000018109 developmental process Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- GRVDJDISBSALJP-UHFFFAOYSA-N methyloxidanyl Chemical group [O]C GRVDJDISBSALJP-UHFFFAOYSA-N 0.000 description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 150000003254 radicals Chemical class 0.000 description 7
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 7
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 7
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- 235000019439 ethyl acetate Nutrition 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 5
- 239000012965 benzophenone Substances 0.000 description 5
- 125000005395 methacrylic acid group Chemical group 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 150000002924 oxiranes Chemical group 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 4
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 4
- 150000001735 carboxylic acids Chemical class 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 4
- XSCHRSMBECNVNS-UHFFFAOYSA-N quinoxaline Chemical compound N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- DSSYKIVIOFKYAU-XCBNKYQSSA-N (R)-camphor Chemical compound C1C[C@@]2(C)C(=O)C[C@@H]1C2(C)C DSSYKIVIOFKYAU-XCBNKYQSSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 3
- 241000723346 Cinnamomum camphora Species 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 3
- 229960000846 camphor Drugs 0.000 description 3
- 229930008380 camphor Natural products 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 3
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- FKRCODPIKNYEAC-UHFFFAOYSA-N propionic acid ethyl ester Natural products CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 3
- 239000001327 prunus amygdalus amara l. extract Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical compound OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 2
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XWUNIDGEMNBBAQ-UHFFFAOYSA-N Bisphenol A ethoxylate diacrylate Chemical compound C=1C=C(OCCOC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCCOC(=O)C=C)C=C1 XWUNIDGEMNBBAQ-UHFFFAOYSA-N 0.000 description 2
- WQUYGVLLSSYSRD-UHFFFAOYSA-N C(C=C)(=O)OCC(C)O.CC=CC(=O)O Chemical compound C(C=C)(=O)OCC(C)O.CC=CC(=O)O WQUYGVLLSSYSRD-UHFFFAOYSA-N 0.000 description 2
- WXNOGBYAKIIZTE-UHFFFAOYSA-N CC(=C)C(O)=O.CO[SiH](OC)OC Chemical compound CC(=C)C(O)=O.CO[SiH](OC)OC WXNOGBYAKIIZTE-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- FFOPEPMHKILNIT-UHFFFAOYSA-N Isopropyl butyrate Chemical compound CCCC(=O)OC(C)C FFOPEPMHKILNIT-UHFFFAOYSA-N 0.000 description 2
- AXISYYRBXTVTFY-UHFFFAOYSA-N Isopropyl tetradecanoate Chemical compound CCCCCCCCCCCCCC(=O)OC(C)C AXISYYRBXTVTFY-UHFFFAOYSA-N 0.000 description 2
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- FIIMPIBOJUPHNA-UHFFFAOYSA-N O1CCCC1.CC=CC(=O)O Chemical compound O1CCCC1.CC=CC(=O)O FIIMPIBOJUPHNA-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Chemical compound CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- HIVQCJOGAHNXBO-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] propanoate Chemical compound CCC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C HIVQCJOGAHNXBO-UHFFFAOYSA-N 0.000 description 2
- 229960000583 acetic acid Drugs 0.000 description 2
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical class C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 2
- 150000003926 acrylamides Chemical class 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- JVASZXZJOJUKDT-UHFFFAOYSA-N bis(1-aminocyclohexa-2,4-dien-1-yl)methanone Chemical compound C1C=CC=CC1(N)C(=O)C1(N)CC=CC=C1 JVASZXZJOJUKDT-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
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Abstract
The invention provides a resin for an interlayer insulating film and a protective film, which is a copolymer obtained by reacting an acrylic monomer containing an epoxy structure, a silane-containing acrylic monomer, an aromatic ring-containing acrylic monomer and an unsaturated carboxylic acid and/or an anhydride thereof selected from the group consisting of the acrylic monomers. The invention also provides a photosensitive resin composition, which comprises the resin, a polymerizable compound with an ethylene type unsaturated bond, a photopolymerization initiator and a solvent. The resin of the invention can provide excellent surface hardness, adhesive force and penetration rate, so that the resin meets the requirement of industrial utilization.
Description
Technical field
The present invention relates to a kind of resin combination, especially a kind of alkali-soluble acrylic resin and Photosensitve resin composition thereof, for the manufacture of interlayer dielectric and protective membrane.
Background technology
At present; photosensitive material has been widely used in the fields such as printed circuit board (PCB) (PCB), unicircuit (IC), display panels (LCD) and MEMS (micro electro mechanical system) (MEMS), for production example as the protective layer in photoresist and electronic package or insulation layer.JP2007-156139 discloses a kind of Photosensitve resin composition, can be used for making the light interval body in display panels, and provides splendid elasticity.Sensitive materials refers to the aitiogenic material of light, after absorb light energy, there is intramolecule (Intra-reaction) or intermolecular (Inter-reaction) change (such as change in polarity, splitting of chain or chain are crosslinked), and cause exposure region and unexposed area to produce the difference on dissolution rate to developing solution.Such as, negative photosensitive material produces crosslinking reaction after exposure and becomes and is insoluble in developing solution; Otherwise positive type photosensitive material then becomes after exposure and is soluble in developing solution, makes exposure region that developing solution can be used to remove.Photoetching technique (photolithography), is namely the characteristic utilizing sensitive materials, is made the fine pattern in electronic package by steps such as exposure, developments.In photolithographic fabrication operation, utilize as radiation such as UV-light, electron beam or X-rays, through light shield (photomask), the sensitive materials be covered on base material is optionally exposed, recycling exposure region and the difference of unexposed area on dissolution rate are developed, and are transferred on sensitive materials to make the pattern on light shield (such as: line pattern).
Due to development trend that is microminiaturized and high integration (Integration), many characteristics of resin material also need to promote thereupon.Therefore, require and the diversification application meeting resin material for meeting high resolving power etc., photosensitive material must have high photosensitivity, high penetration, high surface hardness, high heat resistance, high flat degree, high etch-resistance, low heat expansion property, and to characteristics such as the high adhesive forces of base material etc., to provide the performance of product excellence, and the reliability of improving product and qualification rate.JP 3994429(JP 2000-162769) disclose the resin combination that one can be used for being formed film in display panels, integrated circuit (IC) apparatus or solid-state image capturing apparatus (solid state image pickup device), it can provide good surface smoothness (surface smoothness), thermotolerance (heat resistance), transparency (transparency) and chemical resistant properties (chemical resistance).TW 180311 discloses one for the photoresist of short wavelength's imaging (short wavelength imaging), can provide good resolving power and the sticking power to Copper base material.Separately, TW I336711 discloses a kind of eurymeric photoresist, imports in resin, to improve dry etching patience and developing solution affinity by polynuclear plane and high polarity unit.TW I342467 then discloses a kind of negative light resistance agent, outside the composition such as resin, photo-sensitive initiators, adds mixture that is water-insoluble and water-soluble monomer in composition, to increase development contrast.
But in order to meet the demand of industry, still needing badly and there is high adhesive force and can water-fastness, etch resistant etc., and the resin material of the characteristic such as high surface hardness and high penetration is provided simultaneously.
Summary of the invention
The invention provides a kind of resin, can be used for Photosensitve resin composition, to meet the demand that industry utilizes.Resin of the present invention is by comprising the acrylic monomer containing epoxy construction, the acrylic monomer containing silane, being different from this containing epoxy construction, containing silane and the multipolymer that reacts containing the unsaturated carboxylic acid of the acrylic monomer of aromatic nucleus and acid anhydrides thereof at least one (that is unsaturated carboxylic acid and/or its acid anhydrides) containing the acrylic monomer and being selected from of aromatic nucleus.According to the present invention, this resin is alkali soluble resin, and its weight-average molecular weight is 5000 to 30000.
According to the present invention one specific embodiment, unsaturated carboxylic acid is selected from one of vinylformic acid and methacrylic acid, and this acid anhydrides system is selected from one of acrylic anhydride and methacrylic anhydride.
According to the present invention one specific embodiment, the acrylic monomer containing epoxy construction is selected from the acrylic monomer containing epoxy cyclohexane ring (epoxycyclohexane ring).
In certain embodiments of the present invention, resin is the multipolymer of unsaturated carboxylic acid and/or its acid anhydrides and acrylic monomer, and this acrylic monomer comprises methacrylic monomers and methacrylate ester monomer.According to the present invention one specific embodiment, should be methacrylic acid 3,4-epoxycyclohexyl-methyl ester containing the acrylic monomer of epoxy construction.According to the present invention one specific embodiment, the acrylic monomer containing silane is methacrylic acid 3-(Trimethoxy silane base) propyl diester.According to the present invention one specific embodiment, the acrylic monomer containing phenyl ring is benzyl methacrylate.Be binding on ester group part with this epoxy construction group, silicon group and aromatic group.
The present invention also provides a kind of Photosensitve resin composition, and it comprises resin of the present invention, has the polymerizable compound of ethylene type unsaturated link(age), Photoepolymerizationinitiater initiater and solvent.
According to the present invention one specific embodiment, the content of this resin, in the gross weight of this Photosensitve resin composition for benchmark, is 10 to 30wt%.
According to the present invention one specific embodiment, this has the polymerizable compound of ethylene type unsaturated link(age), is the polyfunctional compound with ethylene type unsaturated link(age), and this polyfunctional compound can carry out being polymerized or being cross-linked with this resin.This has the content of the polymerizable compound of ethylene type unsaturated link(age), in the gross weight of this Photosensitve resin composition for benchmark, is 5 to 20wt%.
According to the present invention one specific embodiment, the content of this Photoepolymerizationinitiater initiater, in the gross weight of this Photosensitve resin composition for benchmark, is 0.5 to 5wt%.
In certain embodiments of the present invention, Photosensitve resin composition comprises solvent.The content of solvent, in the gross weight of this Photosensitve resin composition for benchmark, is 50 to 80wt%.
Resin provided by the invention and Photosensitve resin composition thereof, while providing high surface hardness and high penetration, can promote its sticking power, and to represent the characteristics such as excellent water-fastness, etch resistant, pole meets the demand of industry.
Embodiment
Below, by particular specific embodiment, embodiments of the present invention are described, those skilled in the art can understand other advantage of the present invention and effect by content disclosed in the present specification.The present invention is also implemented by other different specific embodiment or is applied, and the every details in this specification sheets also based on different viewpoints and application, can carry out various modification and change under not departing from the spirit of this creation.
Unless otherwise indicated herein, otherwise the singulative " " used in specification sheets and claims and " being somebody's turn to do " comprise most individual.
Unless otherwise indicated herein, otherwise the term "or" used in specification sheets and claims generally includes the implication of "and/or".
Term as used herein " weight-average molecular weight " is the value being converted into polystyrene weight-average molecular weight (Mw) utilizing gel permeation chromatography (GPC) to measure for solvent with tetrahydrofuran (THF) (THF).
Term as used herein " acrylic acid series " comprises acrylic acid series and metha crylic.Term as used herein " (methyl) vinylformic acid ... " represent and comprise or do not comprise the word in bracket.Such as, " (methyl) vinylformic acid " comprises vinylformic acid and methacrylic acid, and " (methyl) acrylic anhydride " comprises acrylic anhydride and methacrylic anhydride, by that analogy.
The invention provides a kind of resin, by comprising the acrylic monomer containing epoxy construction, the acrylic monomer containing silane, to be different from this acrylic monomer containing epoxy construction containing the acrylic monomer and being selected from of aromatic nucleus, the acrylic monomer containing silane and containing at least one multipolymer reacted in the unsaturated carboxylic acid of the acrylic monomer of aromatic nucleus and acid anhydrides thereof.
According to the present invention, this resin is alkali soluble resin, can be used for Photosensitve resin composition.According to the present invention one specific embodiment, the weight-average molecular weight of resin is 5000 to 30000.
For the unsaturated carboxylic acid of resin of the present invention, there is no particular restriction.The example of unsaturated carboxylic acid includes but not limited to: (methyl) vinylformic acid, butenoic acid (crotonic acid), maleic acid, FUMARIC ACID TECH GRADE, methyl-maleic acid (citroconic acid), methylfumaric acid, methylene-succinic acid (itaconic acid), Sorbic Acid and combination thereof etc.For the unsaturated carboxylic acid anhydrides of resin of the present invention, there is no particular restriction.The example of unsaturated carboxylic acid anhydrides includes but not limited to the acid anhydrides and combination etc. thereof of above-mentioned unsaturated carboxylic acid.
According to the present invention one specific embodiment, containing at least one unsaturated carboxylic acid or its acid anhydrides in resin.According to the present invention one specific embodiment, unsaturated carboxylic acid is (methyl) vinylformic acid preferably.According to the present invention one specific embodiment, unsaturated acid anhydride is (methyl) acrylic anhydride preferably.In the certain embodiments of these specific embodiments, resin of the present invention be unsaturated carboxylic acid with should containing the multipolymer of epoxy construction, siliceous and acrylic monomer containing aromatic nucleus.
According to the present invention, unsaturated carboxylic acid and/or its acid anhydrides contain epoxy construction with this, form multipolymer containing silane and containing the acrylic monomer (calling acrylic monomer in the following text) of aromatic nucleus.In one specific embodiment, when forming multipolymer, the consumption of this unsaturated carboxylic acid and/or its acid anhydrides, in the total amount of this unsaturated carboxylic acid and/or its acid anhydrides and this acrylic monomer for benchmark, is 10 to 40 % by mole.
According to the present invention one specific embodiment, resin is the multipolymer of unsaturated carboxylic acid and acrylic monomer, and this acrylic monomer comprises the acrylic monomer containing epoxy construction, the acrylic monomer containing silane and the acrylic monomer containing aromatic nucleus.
Being not particularly limited containing the acrylic monomer of epoxy construction for resin of the present invention, if containing epoxide group and can with unsaturated carboxylic acid and/or its anhydride copolymers.Such as, acrylic monomer containing epoxy construction can be selected from but be not limited to the polymerizable esters of unsaturated carboxylic acids (polymerizable unsaturated carboxylic acid ester) containing epoxy construction, such as, containing (methyl) acrylate, its derivative, its analogue etc. of epoxide group, and combination.
Example containing (methyl) acrylate and derivative etc. thereof of epoxide group includes but not limited to: (methyl) acrylate containing oxyethane ring (oxirane ring) and derivative thereof, such as, (methyl) acrylic acid epoxy ethyl ester (oxiranyl (meth) acrylates), (methyl) Glycidyl Acrylate ((methyl) glycidyl acrylate), (methyl) vinylformic acid 2-methylglycidyl ester, (methyl) vinylformic acid 2-ethyl epoxypropyl ester, (methyl) vinylformic acid 2-epoxy ethyl ethyl ester, (methyl) vinylformic acid 2-glycidoxyethyl ester (2-glycidyloxyethyl (meth) acrylates), (methyl) vinylformic acid 3-glycidoxypropyl group ester, (methyl) acrylic acid epoxy propoxyphenyl ester (glycidyloxyphenyl (meth) acrylates) etc., and combination, (methyl) acrylate containing epoxy cyclohexane ring (epoxycyclohexane ring) and derivative thereof, such as, (methyl) vinylformic acid 3,4-epoxycyclohexyl ester, (methyl) vinylformic acid 3,4-epoxycyclohexyl-methyl ester, (methyl) vinylformic acid 2-(3,4-epoxycyclohexyl) ethyl ester, (methyl) vinylformic acid 2-(3,4-epoxycyclohexyl methoxyl group) ethyl ester, (methyl) vinylformic acid 3-(3,4-epoxycyclohexyl methoxyl group) propyl diester etc., and combination, containing 5, (methyl) acrylate of 6-epoxy-2-dicyclo [2.2.1] heptane ring (5,6-epoxy-2-bicyclo [2.2.1] heptane ring) and derivative thereof, such as, (methyl) vinylformic acid 5,6-epoxy-2-dicyclo [2.2.1] heptyl ester etc., containing 3,4-epoxy three ring [5.2.1.0
2,6] (methyl) acrylate of decane and derivative thereof, vinyl ether containing epoxide group and derivative thereof, allyl ethers containing epoxide group and derivative thereof, its analogue etc., and combination.
According to the present invention one specific embodiment, there is in resin the acrylic monomer of at least one containing epoxy construction.According to the present invention one specific embodiment, acrylic monomer containing epoxy construction is selected from (methyl) acrylate, its derivative, its analogue etc. containing epoxy cyclohexane ring, and combination, preferably be selected from methacrylic acid 3,4-epoxycyclohexyl-methyl ester, vinylformic acid 3,4-epoxycyclohexyl-methyl ester and combination thereof, more preferably methacrylic acid 3,4-epoxycyclohexyl-methyl ester.
According to the present invention one specific embodiment, when forming multipolymer, should containing the consumption of acrylic monomer of epoxy construction, in the total amount of unsaturated carboxylic acid and/or its acid anhydrides and all acrylic monomers for benchmark, be 10 to 50 % by mole.
Being not particularly limited containing the acrylic monomer of silane for resin of the present invention, if containing silane and can with unsaturated carboxylic acid and/or its anhydride copolymers.Such as, the acrylic monomer containing silane can be selected from but be not limited to: containing the polymerizable esters of unsaturated carboxylic acids of silane, such as, containing (methyl) acrylate, its derivative, its analogue etc. of silane, and combination.
Example containing (methyl) acrylate and derivative etc. thereof of silane includes but not limited to: methacrylic acid 3-(Trimethoxy silane base) propyl diester (3-(trimethoxysilyl) propyl methacrylate), vinylformic acid 3-(Trimethoxy silane base) propyl diester, methacrylic acid 2-(Trimethoxy silane base) ethyl ester, methacrylic acid Trimethoxy silane ylmethyl ester, methacrylic acid 3-(triethoxysilicane alkyl) propyl diester, vinylformic acid 3-(triethoxysilicane alkyl) propyl diester, methacrylic acid 2-(triethoxysilicane alkyl) ethyl ester, methacrylic acid triethoxysilicane alkyl methyl ester, methacryloxypropyl three (methoxy ethoxy) silane (methacryloxypropyltri (methoxyethoxy) silane), 3-(methacryloxy) hydroxypropyl methyl dimethoxysilane, 3-(acryloxypropyl) methyl dimethoxysilane, 3-(methacryloxy) propyl-dimethyl Ethoxysilane, 3-(acryloxy) propyl-dimethyl Ethoxysilane, 3-[three (trimethyl silicane alcoxyl base) silylation] propyl methacrylate, 3-[three (dimethylvinylsiloxy base silane oxygen base)] propyl methacrylate, 3-(trichlorosilane base) propyl methacrylate, N-3-(methacryloxy-2-hydroxypropyl)-APTES, its derivative, its analogue etc., and combination.Preferable methyl vinylformic acid 3-(Trimethoxy silane base) propyl diester, vinylformic acid 3-(Trimethoxy silane base) propyl diester, methacrylic acid 2-(Trimethoxy silane base) ethyl ester, methacrylic acid Trimethoxy silane ylmethyl ester, methacrylic acid 3-(triethoxysilicane alkyl) propyl diester, vinylformic acid 3-(triethoxysilicane alkyl) propyl diester, methacrylic acid 2-(triethoxysilicane alkyl) ethyl ester, its derivative, its analogue etc., and combination.
According to the present invention one specific embodiment, there is in resin the acrylic monomer of at least one containing silane.According to the present invention one specific embodiment, the acrylic monomer containing silane is selected from methacrylic acid 3-(Trimethoxy silane base) propyl diester, vinylformic acid 3-(Trimethoxy silane base) propyl diester, methacrylic acid 3-(triethoxysilicane alkyl) propyl diester, vinylformic acid 3-(triethoxysilicane alkyl) propyl diester and combination thereof.Preferably be selected from methacrylic acid 3-(Trimethoxy silane base) propyl diester, vinylformic acid 3-(Trimethoxy silane base) propyl diester and combination thereof, be more preferably methacrylic acid 3-(Trimethoxy silane base) propyl diester.
According to the present invention one specific embodiment, when forming multipolymer, should containing the consumption of acrylic monomer of silane, in the total amount of unsaturated carboxylic acid and/or its acid anhydrides and all acrylic monomers for benchmark, be 10 to 30 % by mole.
Being not particularly limited containing the acrylic monomer of aromatic nucleus for resin of the present invention, if containing aromatic nucleus and can with unsaturated carboxylic acid and/or its anhydride copolymers.Such as, acrylic monomer containing aromatic nucleus can be selected from but be not limited to: containing the polymerizable esters of unsaturated carboxylic acids of aromatic nucleus, such as containing (methyl) acrylate, its derivative, its analogue etc. of aromatic nucleus, and combination, wherein the carbon number of this aromatic nucleus is 6 to 10 carbon atoms.
Example containing (methyl) acrylate and derivative etc. thereof of aromatic nucleus includes but not limited to: phenyl acrylate, phenyl methacrylate, benzyl acrylate, benzyl methacrylate, CA, methyl methacrylate phenyl ester, vinylformic acid 2-nitro phenyl ester (2-nitro phenyl acrylate), methacrylic acid 2-nitro phenyl ester, vinylformic acid 4-nitro phenyl ester, methacrylic acid 4-nitro phenyl ester, methacrylic acid 2-p-Nitrobenzyl (2-Nitro benzyl methacrylate), methacrylic acid 4-p-Nitrobenzyl, vinylformic acid 2-chlorobenzene ester (2-Chloro phenyl acrylate), methacrylic acid 2-chlorobenzene ester, vinylformic acid 4-chlorobenzene ester, methacrylic acid 4-chlorobenzene ester, vinylformic acid 2,4,6-trichlorine phenyl ester, methacrylic acid 2,4,6-trichlorine phenyl ester, Pentachlorophenyl Acrylate, methacrylic acid pentachlorophenyl ester, vinylformic acid 2,4,6-tribromophenyl, 2,4,6 tribromophenyl Methacrylate, vinylformic acid pentabromo-phenyl ester, methacrylic acid pentabromo-phenyl ester, vinylformic acid benzyl chloride ester, methacrylic acid benzyl chloride ester, vinylformic acid 1-phenyl chlorocarbonate, methacrylic acid 1-phenyl chlorocarbonate, vinylformic acid 2-phenyl chlorocarbonate, methacrylic acid 2-phenyl chlorocarbonate, vinylformic acid 3-phenylpropyl acrylate, methacrylic acid 3-phenylpropyl acrylate, vinylformic acid tetrahydrochysene benzene dimethyl ester, methacrylic acid tetrahydrochysene benzene dimethyl ester, methacrylic acid phenylbenzene methyl esters, vinylformic acid 2-phenoxy ethyl, methacrylic acid 2-phenoxy ethyl, vinylformic acid 2-hydroxyl-3-phenoxy-propyl, methacrylic acid 2-hydroxyl-3-phenoxy-propyl, vinylformic acid phenoxy group binaryglycol ester, methacrylic acid phenoxy group binaryglycol ester, vinylformic acid phenoxy group TEG ester, methacrylic acid phenoxy group TEG ester, vinylformic acid phenoxy group six glycol ester, methacrylic acid phenoxy group six glycol ester, its derivative, its analogue etc., and combination.
According to the present invention one specific embodiment, there is in resin the acrylic monomer of at least one containing aromatic nucleus.According to the present invention one specific embodiment, acrylic monomer containing aromatic nucleus is selected from phenyl acrylate, phenyl methacrylate, benzyl acrylate, benzyl methacrylate, CA, methyl methacrylate phenyl ester, its derivative, its analogue etc., and combination.Preferably be selected from phenyl acrylate, phenyl methacrylate, benzyl acrylate, benzyl methacrylate, CA, methyl methacrylate phenyl ester and combination thereof, be more preferably benzyl methacrylate.
According to the present invention one specific embodiment, when forming multipolymer, should containing the consumption of acrylic monomer of aromatic nucleus, in the total amount of unsaturated carboxylic acid and/or its acid anhydrides and all acrylic monomers for benchmark, be 10 to 20 % by mole.
In addition, according to the present invention one example, reactive monomer can also optionally be added to adjust the characteristic of resin, such as but not limited to surface hardness, pliability, sticking power, viscosity etc.According to the present invention one specific embodiment, reactive monomer and unsaturated carboxylic acid and/or its anhydride copolymers optionally can be added, to prepare resin.In the certain embodiments of these specific embodiments, reactive monomer is selected from ethylene type unsaturated monomer.In one specific embodiment, reactive monomer is optionally selected from Monofunctional monomers and polyfunctional monomer.In the certain embodiments of these specific embodiments, reactive monomer is multi-functional ethylene type unsaturated monomer.
Such as, ethylene type unsaturated monomer can be but is not limited to: esters of unsaturated carboxylic acids; Unsaturated aromatic monomer; The monomer of amide-containing; Propionate, vinyl-acetic ester etc.; And combination.
The example of ethylene type unsaturated monomer includes but not limited to: (methyl) acrylate and derivative thereof, such as, and (methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) tert-butyl acrylate, (methyl) Ethyl acrylate, (methyl) Octyl acrylate, (methyl) lauryl acrylate, (methyl) stearyl acrylate ester, (methyl) cyclohexyl acrylate, (methyl) allyl acrylate, (methyl) vinylformic acid three ring decyl ester (tricyclodecanyl (meth) acrylate), (methyl) phenyl acrylate, (methyl) benzyl acrylate, (methyl) vinylformic acid oxa-ring butyl ester (oxetanyl (meth) acrylates), (methyl) vinylformic acid 3-methyl-3-oxa-ring butyl ester, (methyl) vinylformic acid 3-ethyl-3-oxa-ring butyl ester, (methyl) vinylformic acid (3-methyl-3-oxetanylmethoxy) methyl esters ((3-methyl-3-oxetanyl) methyl (meth) acrylates), (methyl) vinylformic acid (3-ethyl-3-oxetanylmethoxy) methyl esters, (methyl) vinylformic acid 2-(3-methyl-3-oxetanylmethoxy) ethyl ester, (methyl) vinylformic acid 2-(3-ethyl-3-oxetanylmethoxy) ethyl ester, (methyl) vinylformic acid 2-[(3-methyl-3-oxetanylmethoxy) methoxyl group] ethyl ester (2-[(3-methyl-3-oxetanyl) methyloxy] ethyl (meth) acrylates), (methyl) vinylformic acid 2-[(3-ethyl-3-oxetanylmethoxy) methoxyl group] ethyl ester, (methyl) vinylformic acid 3-[(3-methyl-3-oxetanylmethoxy) methoxyl group] propyl ester, (methyl) vinylformic acid 3-[(3-ethyl-3-oxetanylmethoxy) methoxyl group] propyl ester, (methyl) vinylformic acid 2-hydroxyl ethyl ester, (methyl) vinylformic acid tetrahydrofuran (THF) methyl esters, (methyl) vinylformic acid 2-hydroxypropyl acrylate, (methyl) vinylformic acid 2-(tri-ring [5.2.1.0
2,6] last of the ten Heavenly stems oxygen base) ethyl ester (2-(tricyclo [5.2.1.0
2,6] decyloxy) ethyl (meth) acrylates) etc., and combination.
Other example is as vinylbenzene, Vinyl toluene (such as: adjacent Vinyl toluene, a Vinyl toluene, to Vinyl toluene), α-vinyltoluene, chloro-styrene etc., and combination; Acrylamide derivative, such as, (methyl) acrylamide, N methacrylamide, N-ethyl methacrylamide, N hydroxymethyl acrylamide, N-methylol methacrylamide, N-methoxymethyl acrylamide, N-ethoxymethyl acrylamide, N-butoxy methyl acrylamide, vinyl cyanide etc. and combination thereof; Maleimide derivatives; Propionate, vinyl-acetic ester, vinyl benzoate etc. and combination thereof; Iso-butylene; And combination.
The reactive monomer added in resin, can use commercially available polyfunctional compound, such as, but not limited to Nikalac MX-302 (being manufactured by Sanwa Chemical Co., Ltd.), Aronix M-400, M-402, M-403, M-404, M-408, M-450, M-305, M-309, M-310, M-313, M-315, M-320, M-325, M-326, M-327, M-350, M-360, M-208, M-210, M-215, M-220, M-225, M-233, M-240, M-245, M-260, M-270, M-1100, M-1200, M-1210, M-1310, M-1600, M-221, M-203, TO-924, TO-1270, TO-1231, TO-595, TO-756, TO-1343, TO-1382, TO-902, TO-904, TO-905, TO-1330 is (by Toagosei Co., Ltd. manufacture), Kayarad D-310, D-330, DPHA, DPCA-20, DPCA-30, DPCA-60, DPCA-120, DN-0075, DN-2475, SR-295, SR-355, SR-399E, SR-494, SR-9041, SR-368, R-415, SR-444, SR-454, SR-492, SR-499, SR-502, SR-9020, SR-9035, SR-111, SR-212, SR-213, SR-230, SR-259, SR-268, SR-272, SR-344, SR-349, SR-368, SR-601, SR-602, SR-610, SR-9003, PET-30, T-1420, GPO-303, TC-120S, HDDA, NPGDA, TPGDA, PEG400DA, MANDA, HX-220, HX-620, R-551, R-712, R-167, R-526, R-551, R-712, R-604, R-684, TMPTA, THE-330, TPA-320, TPA-330, KS-HDDA, KS-TPGDA, KS-TMPTA is (by Nippon Kayaku Co., Ltd. manufacture), LightAcrylate PE-4A, DPE-6A, DTMP-4A (being manufactured by Kyoeisha Chemical Co., Ltd.) etc., and combination.
According to the present invention one specific embodiment, reactive monomer is (methyl) acrylate and derivative thereof preferably.In the certain embodiments of this embodiment, resin is the multipolymer of unsaturated carboxylic acid and/or its acid anhydrides and acrylic monomer, this acrylic monomer comprise the acrylic monomer containing epoxy construction, the acrylic monomer containing silane, containing the acrylic monomer of aromatic nucleus and reactive monomer.
When forming multipolymer, the consumption of this reactive monomer, in the total amount of unsaturated carboxylic acid and/or its acid anhydrides, all acrylic monomers for benchmark, is 40 to 90 % by mole.
The preparation of resin can utilize polyreaction to carry out, and polyreaction is carried out usually under the existence of radical initiator.There is no particular restriction for radical initiator, can use radical initiator general used in this technical field.One or more radical initiator can be used.When using the mixture of two or more radical initiators, blending ratio is not particularly limited.The consumption of radical initiator, in the total amount of unsaturated carboxylic acid and/or its acid anhydrides, all acrylic monomers for benchmark, is preferably 1 to 10wt%.The temperature of polymerization is generally 50 to 80 DEG C, is good with 60 to 70 DEG C.
Polyreaction is carried out usually under the existence of solvent, preferably uses the solvent being enough to each composition in dissolving resin, radical initiator and obtained resin.There is no particular restriction for solvent, can use solvent general used in this technical field.One or more solvent can be used.When using the mixture of solvent of two or more, blending ratio is not particularly limited.The amount of solvent is also unrestricted, in the total amount of unsaturated carboxylic acid and/or its acid anhydrides, all acrylic monomers for benchmark, is preferably 50 to 80wt%.
Resin of the present invention is alkali soluble resin, can be used for Photosensitve resin composition.
The present invention also provides Photosensitve resin composition.According to the present invention one specific embodiment, Photosensitve resin composition comprises resin of the present invention, has polymerizable compound and the Photoepolymerizationinitiater initiater of ethylene type unsaturated link(age).
The content of this resin, in the gross weight of this Photosensitve resin composition for benchmark, be 10 to 30wt%, be preferably 15 to 25wt%, according to the present invention one specific embodiment, the resin prepared is mixed with the polymerizable compound and Photoepolymerizationinitiater initiater with ethylene type unsaturated link(age), to obtain Photosensitve resin composition.
For the polymerizable compound with ethylene type unsaturated link(age) of Photosensitve resin composition of the present invention, polymerized/cross-linked can be carried out with resin after absorb light energy.For the polymerizable compound with ethylene type unsaturated link(age) of the present invention, there is no particular restriction, as long as can carry out polymerized/cross-linked with resin after absorb light energy.According to the present invention one specific embodiment, the polymerizable compound with ethylene type unsaturated link(age) is selected from the monomer and/or oligomer with ethylene type unsaturated link(age).According to the present invention one specific embodiment, the polymerizable compound of tool ethylene type unsaturated link(age) is optionally selected from the person that has simple function group and/or has polyfunctional group person's (" polyfunctional group " used has usual meaning, refer to containing more than 1 functional group) herein.In the certain embodiments of these specific embodiments, the polymerizable compound with ethylene type unsaturated link(age) is selected from multi-functional polymerizable compound.
The example with the polymerizable compound of ethylene type unsaturated link(age) includes but not limited to: (methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) tert-butyl acrylate, (methyl) Ethyl acrylate, (methyl) Octyl acrylate, (methyl) lauryl acrylate, (methyl) stearyl acrylate ester, (methyl) cyclohexyl acrylate, (methyl) allyl acrylate, (methyl) vinylformic acid three ring decyl ester, (methyl) phenyl acrylate, (methyl) benzyl acrylate, (methyl) vinylformic acid oxa-ring butyl ester, (methyl) vinylformic acid 3-methyl-3-oxa-ring butyl ester, (methyl) vinylformic acid 3-ethyl-3-oxa-ring butyl ester, (methyl) vinylformic acid (3-methyl-3-oxetanylmethoxy) methyl esters, (methyl) vinylformic acid (3-ethyl-3-oxetanylmethoxy) methyl esters, (methyl) vinylformic acid 2-(3-methyl-3-oxetanylmethoxy) ethyl ester, (methyl) vinylformic acid 2-(3-ethyl-3-oxetanylmethoxy) ethyl ester, (methyl) vinylformic acid 2-[(3-methyl-3-oxetanylmethoxy) methoxyl group] ethyl ester, (methyl) vinylformic acid 2-[(3-ethyl-3-oxetanylmethoxy) methoxyl group] ethyl ester, (methyl) vinylformic acid 3-[(3-methyl-3-oxetanylmethoxy) methoxyl group] propyl ester, (methyl) vinylformic acid 3-[(3-ethyl-3-oxetanylmethoxy) methoxyl group] propyl ester, (methyl) vinylformic acid 2-hydroxyl ethyl ester, (methyl) vinylformic acid tetrahydrofuran (THF) methyl esters, (methyl) vinylformic acid 2-hydroxypropyl acrylate, (methyl) vinylformic acid 2-(tri-ring [5.2.1.0
2,6] last of the ten Heavenly stems oxygen base) ethyl ester etc., and combination, vinylbenzene, Vinyl toluene (such as: adjacent Vinyl toluene, a Vinyl toluene, to Vinyl toluene), α-vinyltoluene, chloro-styrene etc., and combination, acrylamide derivative, such as, (methyl) acrylamide, N methacrylamide, N-ethyl methacrylamide, N hydroxymethyl acrylamide, N-methylol methacrylamide, N-methoxymethyl acrylamide, N-ethoxymethyl acrylamide, N-butoxy methyl acrylamide, vinyl cyanide etc. and combination thereof, maleimide derivatives, propionate, vinyl-acetic ester, vinyl benzoate etc. and combination thereof, iso-butylene, and combination.
There is the polymerizable compound of ethylene type unsaturated link(age), commercially available polyfunctional compound can be used, such as, but not limited to Nikalac MX-302 (being manufactured by Sanwa Chemical Co., Ltd.), AronixM-400, M-402, M-403, M-404, M-408, M-450, M-305, M-309, M-310, M-313, M-315, M-320, M-325, M-326, M-327, M-350, M-360, M-208, M-210, M-215, M-220, M-225, M-233, M-240, M-245, M-260, M-270, M-1100, M-1200, M-1210, M-1310, M-1600, M-221, M-203, TO-924, TO-1270, TO-1231, TO-595, TO-756, TO-1343, TO-1382, TO-902, TO-904, TO-905, TO-1330 is (by Toagosei Co., Ltd. manufacture), Kayarad D-310, D-330, DPHA, DPCA-20, DPCA-30, DPCA-60, DPCA-120, DN-0075, DN-2475, SR-295, SR-355, SR-399E, SR-494, SR-9041, SR-368, R-415, SR-444, SR-454, SR-492, SR-499, SR-502, SR-9020, SR-9035, SR-111, SR-212, SR-213, SR-230, SR-259, SR-268, SR-272, SR-344, SR-349, SR-368, SR-601, SR-602, SR-610, SR-9003, PET-30, T-1420, GPO-303, TC-120S, HDDA, NPGDA, TPGDA, PEG400DA, MANDA, HX-220, HX-620, R-551, R-712, R-167, R-526, R-551, R-712, R-604, R-684, TMPTA, THE-330, TPA-320, TPA-330, KS-HDDA, KS-TPGDA, KS-TMPTA is (by Nippon Kayaku Co., Ltd. manufacture), Light Acrylate PE-4A, DPE-6A, DTMP-4A (being manufactured by Kyoeisha Chemical Co., Ltd.) etc., and combination.
According to the present invention one specific embodiment, having the content of the polymerizable compound of ethylene type unsaturated link(age), in the gross weight of this Photosensitve resin composition for benchmark, is 5 to 20wt%, preferably 10 to 15wt%
For the Photoepolymerizationinitiater initiater of Photosensitve resin composition of the present invention, there is no particular restriction, can cause the Photoepolymerizationinitiater initiater of Raolical polymerizable after can using absorb light energy.
The example of Photoepolymerizationinitiater initiater includes but not limited to: bitter almond oil camphor and alkane ether thereof, such as, and bitter almond oil camphor, benzoin methylether, ethoxybenzoin, benzoin iso-propylether, bitter almond oil camphor phenylate (benzoin phenyl ether), benzoin acetate, methyl phenyl ketone, such as, methyl phenyl ketone, 2,2-dimethoxy-2-phenyl acetophenone, 2,2-diethoxy-2-phenyl acetophenone, 1,1-dichloroacetophenone, aminoacetophenone, such as, 2-methyl isophthalic acid-[4-(methylthio group) phenyl]-2-morpholinyl third-1-ketone, 2-phenmethyl-2-dimethylin-1-(4-morpholino phenyl)-Ding-1-ketone, anthraquinone, such as, 2-methylanthraquinone, 2-ethyl-anthraquinone, 2-tertiary butyl anthraquinone, 1-chloroanthraquinone, 2-amyl anthraquinone (2-amylanthraquinone), thioxanthone (thioxanthone) and oxygen green onion ketone (xanthone), such as, 2,4-dimethyl thioxanthone, 2,4-diethyl thioxanthones, CTX, 2,4-diisopropylthioxanthone, ketal, such as, methyl phenyl ketone dimethyl ketal, benzyl dimethyl ketone, benzophenone, such as, benzophenone, 4, two (N, N'-bis--methyl-amido) benzophenone (4, the 4'-bis (N of 4'-, N'-di-methyl-amino) benzophenone), 4,4'-two (N, N'-bis--ethyl-amido) benzophenone, acridine derivatives (acridine derivative), phenazene derivative (phenazine derivative), quinoxaline derivatices (quinoxaline derivative), triphenylphosphine, phosphine oxide, such as, (2, 6-Dimethoxybenzoyl)-2, 4, 4-amyl group phosphine oxide ((2, 6-dimethoxybenzoyl)-2, 4, 4-pentylphosphine oxide), two (2, 4, 6-trimethylbenzoyl) phenyl phosphine oxide (bis (2, 4, 6-trimethylbenzoyl)-phenyl phosphine oxide), 2, 4, 6-trimethylbenzoy-dipheny phosphine oxide (2, 4, 6-trimethylbenzoyl-diphenyl phosphine oxide), ethyl-2, 4, 6-trimethylbenzoyl-phenyl phosphine oxide (ethyl-2, 4, 6-trimethylbenzoyl-phenylphosphinate), 1-phenyl-1,2-propanedione-2-O-benzoyl oximes (1-phenyl-1,2-propanedione2-O-benzoyl oxime), 4-(2-hydroxyl-oxethyl) phenyl-(2-propyl group)-one (4-(2-hydroxyethoxy) Phenyl-(2-propyl) ketone), 1-aminophenyl ketone (1-aminophenylketone) and 1-photoinitiator (1-hydroxy phenyl ketone), such as, 1-hydroxycyclohexylphenylketone, 2-hydroxyisopropyl phenyl ketone, phenyl 1-hydroxyisopropyl ketone (phenyl 1-hydroxyisopropylketone), 4-isopropyl phenyl 1-hydroxyisopropyl ketone (4-isopropylphenyl 1-hydroxyisopropylketone), various superoxide (peroxide), and combination.
According to the present invention one specific embodiment, the content of Photoepolymerizationinitiater initiater, in the gross weight of this Photosensitve resin composition for benchmark, is 0.5 to 5wt%, is preferably 1 to 3wt%.
According to the present invention one specific embodiment, Photosensitve resin composition optionally can comprise solvent.The solvent that Photosensitve resin composition uses is not particularly limited, as long as the composition of Photosensitve resin composition can be dispersed or dissolved, and not react with these compositions, and, there is the volatility of appropriateness and suitable drying rate, and even and level and smooth film can be provided after volatilization.Solvent general used in this technical field can be used.
The example of solvent includes but not limited to: ethers, such as, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diglycol monotertiary positive propyl ether, diglycol monotertiary n-butyl ether, triethylene glycol monomethyl ether, triglycol list ether, propylene glycol monomethyl ether, dihydroxypropane single-ether, propylene glycol list positive propyl ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, DPE, dipropylene glycol list positive propyl ether, dipropylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, tripropylene glycol list ether, diglyme, glycol ether MEE, diethyl carbitol and tetrahydrofuran (THF) etc., ketone, such as, methylethylketone, pimelinketone, 2-heptanone and 3-heptanone etc., ester class, such as, ethyl lactate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetic ester, diethylene glycol monoethyl ether acetic ester, propylene glycol methyl ether acetate, propylene glycol methyl ether acetate (PGMEA), 2 hydroxy propanoic acid formic acid, 2 hydroxy propanoic acid ethyl ester, 2-hydroxy-2-methyl ethyl propionate, 3-methoxy methyl propionate, 3-methoxypropionate, 3-ethoxypropanoate, 3-ethoxyl ethyl propionate, 3-ethoxyethyl propionic ester, ethoxy ethyl acetate, hydroxyl ethyl acetate, 2-hydroxy-3-methyl methyl-butyrate, 3-methyl-3-methoxybutyl acetic ester, 3-methyl-3-methoxybutyl propionic ester, ethyl acetate, acetic acid n Propanoic acid, isopropyl acetate, n-butyl acetate, isobutyl acetate, the positive the eleventh of the twelve Earthly Branches acid of formic acid, Isoamyl Acetate FCC, n-butyl propionate, ethyl butyrate, propyl butyrate, isopropyl butyrate, the positive butyl ester of butyric acid, Pyruvic Acid Methyl ester, Pyruvic Acid Ethyl ester, pyruvic acid n-propyl, methyl acetoacetate, methyl aceto acetate and 2-3-hydroxyethyl butyrate etc., the fragrance same clan, such as, toluene and dimethylbenzene etc., the acid amides same clan, such as, N-Methyl pyrrolidone, DMF and N,N-dimethylacetamide etc.Preferred pimelinketone, ethyl lactate, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol methyl ether acetate and 3-ethoxyethyl propionic ester.One or more solvents can be used.When using the mixture of two or more solvents, blending ratio is not particularly limited.
In addition, above-mentioned solvent also can be used with the high boiling solvent such as Benzyl base ether, two n-hexyl ethers, second eyeball acetone, isophorone, caproic acid, enanthic acid, 1-octanol, 1-naphthalene alcohol, Benzyl alcohol, vinegar acid Benzyl ester, ethyl benzoate, oxalic acid diethyl ester, ethyl maleate, gamma-butyrolactone, NSC 11801, propylene carbonate, ethyleneglycol monophenylether acetic ester.
In one specific embodiment, the content of solvent, in the gross weight of this Photosensitve resin composition for benchmark, is 50 to 80wt%, is preferably 55 to 75wt%.
According to the present invention one specific embodiment, Photosensitve resin composition optionally can comprise additive.The example of additive includes but not limited to: properties-correcting agent (modifer), tough agent (toughener), stablizer (stabilizer), defoamer, dispersion agent (dispersant), flow agent (leveling agent), thickening material (thickening agent), toughener (reinforcing agent), coupler (coupling agent), increase and scratch agent (flexibility-imparting agent), softening agent (plasticizer), sensitizer (sensitizers), water, fire retardant, antioxidant, static inhibitor, hot-setter, tensio-active agent, pigment, dyestuff, filler, antisettling agent and analogue etc. thereof, and combination.
In one specific embodiment, the content of additive, in the gross weight of this Photosensitve resin composition for benchmark, is no more than 5wt% usually.
According to the present invention one specific embodiment, Photosensitve resin composition can be used for making photoresist, especially negative light resistance agent.In the certain embodiments of these specific embodiments, after Photosensitve resin composition is applied to base material, drying, exposure, development are with patterning.In the certain embodiments of these specific embodiments, by put on base material Photosensitve resin composition patterning after, can etch or plating base material further.
Photosensitve resin composition can put on various base material and (comprise inorganic materials, organic materials or its mixture etc.), such as, but be not limited to: glass substrate, silicon substrate (as: silicon, silicon-dioxide, through the silicon-dioxide of doping, silicon nitride, polysilicon etc.), Al substrate, GaAs substrate, tantalum substrate, copper base, ceramic substrate, aluminium/copper mixture substrate, polycarbonate substrate, polyester substrate, polymeric amide substrate, polyamideimide-based plate, polyimide substrate, cellulose acetate substrate, polystyrene, styrene-acrylonitrile copolymer, phenol resin, epoxy resin etc. and analogue thereof.These substrates also can carry out the pre-treatment such as medicine (e.g., organo-silane coupling agents etc.) process, electricity slurry process, sputter process, ion plating process, gas-phase reaction process, vacuum evaporation process.When base material is silicon substrate, its surface also can be formed with current potential coupling assembly (Charge Couple Device, CCD), thin film transistor (Thin Film Transistor, TFT) etc.
After Photosensitve resin composition is applied to base material, can heat to carry out soft baking.Then, suitable light shield is utilized to carry out selectivity exposure, to obtain required pattern with the base material of suitable light source to coating Photosensitve resin composition.After having exposed, base material be impregnated in alkaline developer, until the photoresist layer of unexposed area is dissolved completely or almost.Afterwards base material is taken out and heat-treat (firmly roasting).
According to the present invention one specific embodiment, Photosensitve resin composition can be used for making the protective layer in electronic package or insulation layer.
Photosensitve resin composition of the present invention can provide suitable development capability and high penetration, and promotes its surface hardness and sticking power simultaneously, represents the characteristics such as excellent water-fastness, etch resistant, the reliability of improving product and qualification rate.
The present invention will be further illustrated by embodiment, but this embodiment is not for limiting category of the present invention.Unless specifically stated otherwise, be benchmark for " % " and " weight part " of the content and any amount of substance that represent any composition with weight in the following example and comparing embodiment.
Embodiment
The preparation of resin
Resin 1: be in the flask of 6L at the internal volume having stirrer, thermometer, reflux cooling pipe, dropping funnel and nitrogen ingress pipe, load MEDG (diethylene glycol monomethyl ethyl ether (Methyl Ethyl DiGlycol)) 270 grams, after stirring, be warming up to 65 DEG C of constant temperature.Another by 2,2 '-azobis isobutyronitrile (polymerization starter) 14.2 grams, 2,4-phenylbenzene-4-methyl-1-pentene (chain-transfer agent) 4 grams, 3-(Trimethoxy silane base) propyl methacrylate 33.5 grams (A-174, mol ratio=18%), vinylformic acid 2-(tri-ring [5.2.1.0
2,6] last of the ten Heavenly stems oxygen base) ethyl ester 31.7 grams of (TCDMA, mol ratio=19%), methacrylic acid 12.3 grams of (MAA, mol ratio=19%), methacrylic acid 3,4-epoxycyclohexyl-methyl ester 40.0 grams of (M-100, mol ratio=26%), benzyl methacrylate 25.3 grams of (BzMA, mol ratio=18%) add in flask stir make it dissolve, 75 DEG C are warming up to and constant temperature 2.5 hours after dissolving, obtain resin copolymer solution, solid holdup 31.8 % by weight, molecular-weight average (Mw) is 8000.
Resin 2 to resin 6 is prepared according to above-mentioned resin 1 mode, and wherein resin 4 to resin 6 is applied to comparative example, and composition is as table one:
Table one
A-174: methacrylic acid 3-(Trimethoxy silane base) propyl diester
STYRENE: vinylbenzene
TCDMA: methacrylic acid three ring decyl ester
MAA: methacrylic acid
M-100: methacrylic acid 3,4-epoxycyclohexyl-methyl ester
THFMA: Tetrahydrofurfuryl Methacrylate
BzMA: benzyl methacrylate
HEMA: methacrylic acid-2-hydroxy methacrylate
Solid holdup: in the weighing bottle of constant weight, take 1 gram of sample (resin copolymer solution), drying 12 hours in 105 DEG C of thermostatic drying chambers, weigh after cooling, calculate solid holdup, the general compliance rate estimating polymerization thus, unconverted monomer can exist in fluid form, and polymkeric substance exists with solid.
For the preparation of the resin combination of interlayer dielectric and protective membrane
Embodiment 1
The solid content that Homogeneous phase mixing resin 1(is converted into resin is 15.60 grams) solution 50 grams, CGI 242(Photoepolymerizationinitiater initiater, manufactured by BASF (BASF) company) 2 grams, new Doutrate (the Aronix M 400 of vinylformic acid two, there is the polymerizable compound of ethylene type unsaturated link(age)) 15 grams and propylene glycol monomethyl ether (solvent) 33 grams, be configured to the resin combination of 100 grams, then with this solution of the metre filter of 0.2 μm (micron), to obtain resin combination.
Embodiment 2 to 3
Replace the resin 1 in embodiment 1 respectively with resin 2 and resin 3, according to the step of embodiment 1, prepare resin combination respectively.
Comparative example 1 to 3
Replace the resin 1 in embodiment 1 respectively with resin 4, resin 5, resin 6, according to the step of embodiment 1, prepare resin combination respectively.
Test
Then, in the following manner the composition of above-mentioned gained is carried out to the test of sticking power (adhesion), surface hardness (surface hardness), penetration coefficient (transmittance) and development capability etc.
Respectively by the resin combination of above-mentioned gained, be uniformly coated in the mode of rotary coating (rotating speed 1000rpm, 7 seconds) and be coated with ITO(indium tin oxide) conductive glass base material on.Soft roasting (Pre-bake) is carried out 10 minutes with 100 ° of C in baking oven.Through light shield, and with 150mJ/cm
2exposure energy resin combination is exposed (Exposure).After 30 seconds, in baking oven, (Post-bake) is firmly baked 30 minutes with 230 ° of C with the washed with de-ionized water (Rinse) of flowing.According to following method, the film that resin combination is formed on base material is tested, to assess the characteristic of resin combination.
(1) sticking power after washing
The base material being formed with resin combination film is soaked in deionized water, at 80 DEG C, maintains 1 hour.Then, with hundred lattice scrapers and 3M adhesive tape test resin combination to the sticking power (ASTMD3359 method of testing) of base material, to assess etching rear film to the sticking power of base material, in evaluation score, the sticking power of 5B is best, and 4B takes second place, and 0B is the poorest.
(2) sticking power after etching
The base material being formed with resin combination film is immersed in (HCl:215ml, 37wt% in the acid etching liquid of iron(ic) chloride; H
2o:69.2ml; FeCl3:16.8ml, 15wt%), at 40 DEG C, maintain 3 minutes.Then, with hundred lattice scrapers and 3M adhesive tape test to the sticking power (ASTM D3359 method of testing) of base material, to assess etching rear film to the sticking power of base material, in evaluation score, the sticking power of 5B is best, and 4B takes second place, and 0B is the poorest.
Result is shown in following table two, as shown in Table 2, with the Photosensitve resin composition prepared by the resin of the embodiment of the present invention, has good resistance to etching solution, and after the etching to the sticking power that base material performance is excellent.
(3) surface hardness
To the film formed by resin combination, carry out pencil test (Pencil Scratch HardnessTest), to assess the surface hardness of film.Result is shown in following table, it is characterized in that, 6B represents that hardness is the poorest, and 6H represents hardness optimal, such as: if use H pencil surface without scratch, use 2H pencil surface also without scratch, but use 3H pencil surface to have scratch, then judge that the hardness of test film is as 2H.
As shown in Table 2, with the Photosensitve resin composition prepared by the resin of the embodiment of the present invention, provide good surface hardness.
(4) 230 DEG C of penetration coefficients
Utilize microspectrophotometer (MX-50, OLYMPUS Inc.), with the wavelength of 400nm, measure the light transmittance of the film formed by resin combination.
Result is shown in following table two, as shown in Table 2, with the Photosensitve resin composition prepared by the resin of the embodiment of the present invention, while providing good sticking power and surface hardness, also can maintain high penetration coefficient.
(5) development capability
Respectively by resin combination, carry out in the foregoing manner being coated with, soft roasting after to comprise the light shield exposure of the figure of 30um perforate.And after 25 ° of C develop 60sec, after 30 seconds, after firmly roasting, under microscope, measure perforate value with the washed with de-ionized water (Rinse) of flowing with KOH 0.04%.Its result is as table two:
Table two
Photosensitve resin composition prepared by the resin of the embodiment of the present invention, suitable development capability and penetration coefficient can be provided, and promote its surface hardness and sticking power simultaneously, represent the characteristics such as excellent water-fastness, etch resistant, the reliability of improving product and yield, the demand that real symbol industry utilizes.
Above-described embodiment is illustrative composition of the present invention and preparation method only, but not for limiting the present invention.These those skilled in the art any all without prejudice under spirit of the present invention and category, can carry out modifying to above-described embodiment and change.Therefore, the scope of the present invention, should be as contained in claims.
Claims (14)
1. the negative-type photosensitive resin composition for interlayer dielectric and protective membrane; comprise resin, there is the polymerizable compound of ethylene type unsaturated link(age), Photoepolymerizationinitiater initiater and solvent; wherein this resin, by comprising the acrylic monomer containing epoxy construction, the acrylic monomer containing silane, being different from this containing epoxy construction, containing silane with containing at least one multipolymer reacted in the unsaturated carboxylic acid of the acrylic monomer of aromatic nucleus and acid anhydrides thereof containing the acrylic monomer and being selected from of aromatic nucleus.
2. resin combination according to claim 1, is characterized in that, this unsaturated carboxylic acid is selected from one of vinylformic acid and methacrylic acid, and this acid anhydrides is selected from one of acrylic anhydride and methacrylic anhydride.
3. resin combination according to claim 2, is characterized in that, this unsaturated carboxylic acid is methacrylic acid.
4. resin combination according to claim 1, is characterized in that, the acrylic monomer containing epoxy construction is selected from the acrylic monomer containing epoxy cyclohexane ring.
5. resin combination according to claim 4, is characterized in that, should be methacrylic acid 3,4-epoxycyclohexyl-methyl ester or vinylformic acid 3,4-epoxycyclohexyl-methyl ester containing the acrylic monomer of epoxy construction.
6. resin combination according to claim 1, is characterized in that, should be methacrylic acid 3-(Trimethoxy silane base) propyl diester containing the acrylic monomer of silane.
7. resin combination according to claim 1, is characterized in that, should be benzyl methacrylate containing the acrylic monomer of aromatic nucleus.
8. resin combination according to claim 1, is characterized in that, should be methacrylic acid three ring decyl ester containing the acrylic monomer of aromatic nucleus.
9. resin combination according to claim 1, its weight-average molecular weight is 5000 to 30000.
10. resin combination according to claim 1, is characterized in that, the content of this resin, in the gross weight of this negative-type photosensitive resin composition for benchmark, is 10 to 30wt%.
11. resin combinations according to claim 1, is characterized in that, this has the content of the polymerizable compound of ethylene type unsaturated link(age), in the gross weight of this negative-type photosensitive resin composition for benchmark, are 5 to 20wt%.
12. resin combinations according to claim 1, is characterized in that, the content of this Photoepolymerizationinitiater initiater, in the gross weight of this negative-type photosensitive resin composition for benchmark, are 0.5 to 5wt%.
13. resin combinations according to claim 1, it is characterized in that, this has the polymerizable compound of ethylene type unsaturated link(age), is the polyfunctional compound with ethylene type unsaturated link(age), and this polyfunctional compound can carry out being polymerized or being cross-linked with this resin.
14. resin combinations according to claim 1, is characterized in that, the content of this solvent, in the gross weight of this negative-type photosensitive resin composition for benchmark, are 50 to 80wt%.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100131216A TW201310166A (en) | 2011-08-31 | 2011-08-31 | Resin and composition thereof for manufacture insulator layer and over coat |
| TW100131216 | 2011-08-31 |
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| KR20150033793A (en) * | 2013-09-24 | 2015-04-02 | 롬엔드하스전자재료코리아유한회사 | Negative-type photosensitive resin composition and insulating film using same |
| CN103555118B (en) * | 2013-10-18 | 2016-01-13 | 江西省科学院应用化学研究所 | A kind of preparation method containing methyl siliconic acid graftomer water-resisting agent |
| KR102235156B1 (en) * | 2013-12-09 | 2021-04-05 | 롬엔드하스전자재료코리아유한회사 | Negative-type photosensitive resin composition |
| JP6221862B2 (en) * | 2014-03-14 | 2017-11-01 | Jsr株式会社 | Radiation-sensitive composition, display element spacer or interlayer insulating film, and method for forming them |
| JP6292388B2 (en) * | 2014-03-24 | 2018-03-14 | Jsr株式会社 | Radiation sensitive resin composition |
| JP6458236B2 (en) * | 2014-09-26 | 2019-01-30 | ナトコ株式会社 | Alkali-soluble resin, photosensitive resin composition and use thereof |
| JP6627308B2 (en) * | 2015-07-27 | 2020-01-08 | Jnc株式会社 | Thermosetting composition |
| TWI609028B (en) * | 2016-05-06 | 2017-12-21 | 財團法人工業技術研究院 | Copolymer and resin composition, packaging film and package structure including the same |
| KR102539889B1 (en) * | 2016-08-11 | 2023-06-05 | 동우 화인켐 주식회사 | Chemically amplified photosensitive resist composition and insulation layer prepared from the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001222111A (en) * | 1999-11-29 | 2001-08-17 | Fuji Photo Film Co Ltd | Positive resist laminated body |
| JP2002244298A (en) * | 2001-02-22 | 2002-08-30 | Chisso Corp | Polymer built-up film, resist comprising polymer built-up film, composite polymer built-up film, resist comprising composite polymer built-up film and method for producing composite polymer built-up film |
| CN1811596A (en) * | 2005-01-27 | 2006-08-02 | 东进世美肯株式会社 | Light-sensitive resin composite |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100416916B1 (en) * | 2001-05-11 | 2004-02-05 | 학교법인 한양학원 | Silicon-containing polymer and resist composition using the same |
| KR100824356B1 (en) * | 2002-01-09 | 2008-04-22 | 삼성전자주식회사 | Photoresist Composition And Method of Manufacturing Pattern Using The Same |
| WO2006080786A1 (en) * | 2005-01-25 | 2006-08-03 | Lg Chem. Ltd. | Thermally curable resin composition with extended storage stability and good adhesive property |
| JP2008024915A (en) * | 2006-06-23 | 2008-02-07 | Jsr Corp | Radiation-sensitive resin composition for use in spacer, spacer, and forming method thereof |
| JP4882788B2 (en) * | 2007-02-21 | 2012-02-22 | Ｊｓｒ株式会社 | Radiation-sensitive resin composition, spacer, production method thereof, and liquid crystal display device |
| KR101506535B1 (en) * | 2007-02-28 | 2015-03-27 | 제이엔씨 주식회사 | Positive photosensitive resin composition |
| JP5108480B2 (en) * | 2007-11-28 | 2012-12-26 | 東京応化工業株式会社 | Photosensitive resin composition for interlayer insulation film |
| JP2011002711A (en) * | 2009-06-19 | 2011-01-06 | Sumitomo Chemical Co Ltd | Photosensitive resin composition |
| CN102549496B (en) * | 2009-10-16 | 2014-11-26 | 夏普株式会社 | Radiation-sensitive resin composition and method of forming interlayer dielectric |
-
2011
- 2011-08-31 TW TW100131216A patent/TW201310166A/en unknown
-
2012
- 2012-06-19 CN CN201210203245.5A patent/CN102964515B/en active Active
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001222111A (en) * | 1999-11-29 | 2001-08-17 | Fuji Photo Film Co Ltd | Positive resist laminated body |
| JP2002244298A (en) * | 2001-02-22 | 2002-08-30 | Chisso Corp | Polymer built-up film, resist comprising polymer built-up film, composite polymer built-up film, resist comprising composite polymer built-up film and method for producing composite polymer built-up film |
| CN1811596A (en) * | 2005-01-27 | 2006-08-02 | 东进世美肯株式会社 | Light-sensitive resin composite |
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| CN102964515A (en) | 2013-03-13 |
| JP2013053312A (en) | 2013-03-21 |
| JP5564083B2 (en) | 2014-07-30 |
| TW201310166A (en) | 2013-03-01 |
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