CN102959743B - 发光装置和led灯泡 - Google Patents

发光装置和led灯泡 Download PDF

Info

Publication number
CN102959743B
CN102959743B CN201180030116.4A CN201180030116A CN102959743B CN 102959743 B CN102959743 B CN 102959743B CN 201180030116 A CN201180030116 A CN 201180030116A CN 102959743 B CN102959743 B CN 102959743B
Authority
CN
China
Prior art keywords
led chip
light
fluorophor
formula
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180030116.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN102959743A (zh
Inventor
中川胜利
大屋恭正
碓井大地
山川昌彦
白川康博
近藤弘康
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seoul Semiconductor Co Ltd
Original Assignee
Toshiba Corp
Toshiba Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Materials Co Ltd filed Critical Toshiba Corp
Publication of CN102959743A publication Critical patent/CN102959743A/zh
Application granted granted Critical
Publication of CN102959743B publication Critical patent/CN102959743B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
CN201180030116.4A 2010-09-16 2011-09-14 发光装置和led灯泡 Active CN102959743B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010-208110 2010-09-16
JP2010208110 2010-09-16
JP2011-142542 2011-06-28
JP2011142542 2011-06-28
PCT/JP2011/005160 WO2012035762A1 (ja) 2010-09-16 2011-09-14 発光装置とｌｅｄ電球

Publications (2)

Publication Number Publication Date
CN102959743A CN102959743A (zh) 2013-03-06
CN102959743B true CN102959743B (zh) 2015-06-17

Family

ID=45831248

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180030116.4A Active CN102959743B (zh) 2010-09-16 2011-09-14 发光装置和led灯泡

Country Status (3)

Country Link
JP (1) JP5559338B2 (ja)
CN (1) CN102959743B (ja)
WO (1) WO2012035762A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6108756B2 (ja) * 2012-10-18 2017-04-05 シャープ株式会社 発光装置
KR102305233B1 (ko) * 2014-11-24 2021-09-27 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 모듈 및 이를 포함하는 조명 장치
JP6783987B2 (ja) * 2017-03-01 2020-11-11 豊田合成株式会社 発光装置
JP6333429B2 (ja) * 2017-03-06 2018-05-30 シャープ株式会社 発光装置
KR101937196B1 (ko) 2017-08-08 2019-01-14 재경전광산업 주식회사 엘이디 전구용 엘이디 모듈, 엘이디 모듈 어레이 및 그 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101813255A (zh) * 2009-02-23 2010-08-25 优志旺电机株式会社 光源装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6661029B1 (en) * 2000-03-31 2003-12-09 General Electric Company Color tunable organic electroluminescent light source
US20050285926A1 (en) * 2004-06-29 2005-12-29 Fuji Photo Film Co., Ltd. Light source assembly, method of producing light source assembly, and color thermal printer
JP2006049857A (ja) * 2004-06-29 2006-02-16 Fuji Photo Film Co Ltd 光源、および光源の作製方法、並びにカラー感熱プリンタ
JP4459736B2 (ja) * 2004-06-30 2010-04-28 ライオン株式会社 貼付剤製造用ロールサンド式塗工機及び貼付剤の製造方法
JP2007220432A (ja) * 2006-02-15 2007-08-30 Erebamu:Kk 発光装置
JP2008294309A (ja) * 2007-05-25 2008-12-04 Showa Denko Kk 発光装置、表示装置
US7703669B2 (en) * 2007-10-31 2010-04-27 The Boeing Company Intelligent fastener installation system
JP2009170114A (ja) * 2008-01-10 2009-07-30 Toshiba Lighting & Technology Corp Ｌｅｄ電球及び照明器具
WO2009145259A1 (ja) * 2008-05-30 2009-12-03 株式会社東芝 白色光源、バックライト、液晶表示装置および照明装置
JP2010050235A (ja) * 2008-08-20 2010-03-04 Mitsubishi Chemicals Corp 半導体発光装置およびその製造方法
JP2010050236A (ja) * 2008-08-20 2010-03-04 Mitsubishi Chemicals Corp 半導体発光装置およびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101813255A (zh) * 2009-02-23 2010-08-25 优志旺电机株式会社 光源装置

Also Published As

Publication number Publication date
JP5559338B2 (ja) 2014-07-23
CN102959743A (zh) 2013-03-06
JPWO2012035762A1 (ja) 2014-01-20
WO2012035762A1 (ja) 2012-03-22

Similar Documents

Publication Publication Date Title
CN101026214B (zh) 白光发射装置
CN108352432B (zh) 用于一般照明及显示器背光的磷光体转换白光发光装置和光致发光化合物
CN101432897B (zh) 产生白光的荧光照明
CN108305929B (zh) 具有高显色性的白光发光装置
CN100449807C (zh) 发光装置和显示装置
EP1893719B1 (en) Illumination system comprising color deficiency compensating luminescent material
CN103080635B (zh) Led电灯泡
CN1214471C (zh) 具有至少一只发光二极管作为光源的照明单元
CN101252159B (zh) 白色发光器件
KR101244921B1 (ko) 멀티칩 백색 ｌｅｄ 소자
CN103080634B (zh) Led电灯泡
CN102714897A (zh) 高显色指数的可调色温照明器件
TW200926457A (en) White light-emitting lamp for illumination and illuminating device using the same
CN103222077A (zh) 发光装置
CN103959490A (zh) 用于固态发光装置及灯的光致发光波长转换组件
CN102959312B (zh) Led灯泡
CN1922741A (zh) 发光元件和照明器具
CN102356479A (zh) 具有远端发光材料的照明设备
CN1432198A (zh) 基于led的发射白色的照明单元
CN102959310A (zh) Led灯泡
US10236423B2 (en) Light-emitting device
CN106104822A (zh) 发光装置
CN102959743B (zh) 发光装置和led灯泡
CN100567795C (zh) 面发光装置
JP2012064327A (ja) Ｌｅｄ電球

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20210715

Address after: Kanagawa Prefecture, Japan

Patentee after: TOSHIBA MATERIALS Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: Toshiba Corp.

Patentee before: TOSHIBA MATERIALS Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20220124

Address after: Gyeonggi Do, South Korea

Patentee after: Seoul Semiconductor Co.,Ltd.

Address before: Kanagawa

Patentee before: TOSHIBA MATERIALS Co.,Ltd.

TR01 Transfer of patent right