CN102958318B

CN102958318B - Fixing structure of radiating element

Info

Publication number: CN102958318B
Application number: CN201110236665.9A
Authority: CN
Inventors: 连正男
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2011-08-17
Filing date: 2011-08-17
Publication date: 2015-06-24
Anticipated expiration: 2031-08-17
Also published as: CN102958318A

Abstract

A fixing structure of a radiating element comprises a body and a plurality of fixing elements. The body is provided with a chamber, a first side and a second side, the chamber is provided with a plurality of supports, working fluid and at least one capillary structure layer, the supports are connected with the first side and the second side, and one end of each fixing element penetrates through the first side of the body and the corresponding support and is combined with the body. The fixing structure has the advantages that leakage can be prevented, air tightness of the chamber in the radiating element can be guaranteed, and the radiating element can be closely combined with other elements.

Description

The fixed structure of heat dissipation element

Technical field

A fixed structure for heat dissipation element, espespecially a kind of fixed structure of heat dissipation element, does not destroy this heat dissipation element when it is arranged, and then can prevent the chamber of this heat dissipation element inside generation seepage from affecting the fixed structure of the heat dissipation element of hot transfer efficiency.

Background technology

With existing electronic equipment gradually using the frivolous demand as bragging about, therefore each item all must reduce its size thereupon, but the thermal change that the size of electronic equipment reduces with and produces becomes the major obstacle of electronic equipment and system enhancement performance.The semiconductor dimensions no matter forming electronic component constantly reduces, and still requires constantly to increase performance.

When semiconductor dimensions reduces, result heat flux increases, heat flux increases institute and causes that the challenge that product cools to be exceeded be only all hot increases because the increase of heat flux cause can be overheated at different time and different length size, electronic failure or damage may be caused.

Press, temperature-uniforming plate is that the heat transfer in one face and face is in a big way applied, and it is different from the point-to-point heat exchange pattern of heat pipe, and is applicable to the comparatively narrow part in space and uses.

Temperature-uniforming plate has a heating surface and a cryosurface and a vacuum chamber and is filled with working fluid, in this vacuum chamber, there is multiple support column and capillary structure, described support column connects the heating surface of this temperature-uniforming plate and cryosurface and supports this vacuum chamber, temperature-uniforming plate system is sticked by this heating surface and thermal source, the cryosurface of this temperature-uniforming plate opposite side is then connected heat conduction with another heat abstractor, and this working fluid produces in heating surface place heat of adsorption amount the working fluid that evaporation converts gaseous state to, this gaseous working fluid produces condensation in this cryosurface place, be converted to liquid state, the working fluid of this liquid state is back to heating surface by the capillary structure of chamber interior, working fluid forms gas-liquid cycle heat conduction in this chamber.

Temperature-uniforming plate is combined with a substrate and is conducted the heat of the heater element on this substrate by temperature-uniforming plate by known system, known technology mainly lies in the position that temperature-uniforming plate avoids this chamber, namely the four coupling places of this temperature-uniforming plate respectively wear the copper post that has internal screw thread, the position system that substrate arranges copper post relative to this temperature-uniforming plate offers at least one hole, wear described copper post in the mode of screw lock again and this temperature-uniforming plate is fixed on this substrate by hole by a screw lock element simultaneously, but this fixed form is arranged at the four coupling places of this temperature-uniforming plate because of copper post, distant with this heater element, this temperature-uniforming plate is fixed afterwards and heater element cannot fit tightly, and then generation thermal chocking, for improving the aforementioned problem that cannot fit tightly, then direct for copper post correspondence is arranged at the adjacent place at the position that this temperature-uniforming plate and heater element are sticked by dealer, therefore the position that temperature-uniforming plate has chamber is directly run through in described copper post system, though tightness prevents thermal chocking from producing when can increase assembling, but the chamber of this temperature-uniforming plate loses air-tightness after running through destruction by described copper post, its chamber interior no longer has vacuum state, and destroy this chamber because copper post runs through, then the flow path of the working fluid of its inside therefore interruptedly may think that fluid flowing causes hot transfer efficiency to reduce firmly, even seriously also leakage may be produced, and then make this temperature-uniforming plate lose heat biography effectiveness, therefore known technology has its own shortcomings:

1. easily produce thermal chocking;

2. hot transfer efficiency reduces.

Summary of the invention

For this reason, for solving the shortcoming of above-mentioned known technology, the main purpose of the present invention is provide a kind of fixed structure promoting the heat dissipation element that combination tightness prevents thermal chocking from producing.

Secondary objective of the present invention is the fixed structure of the heat dissipation element of the vacuum degree not destroying heat abstractor interior vacuum chamber when providing a kind of manufacture.

For reaching above-mentioned object, system of the present invention provides a kind of fixed structure of heat dissipation element, is comprise: a body, multiple retaining element;

Described body has a chamber and one first side and one second side, and this chamber has multiple supporter and working fluid and a capillary structure layer, and described supporter connects first and second side aforementioned.

Described retaining element has a hole, and the first side of aforementioned body is run through in one end and this supporter is combined with this body.

Specifically, the invention provides a kind of fixed structure of heat dissipation element, comprise:

One body, has a chamber and one first side and one second side, and this chamber has multiple supporter and working fluid and at least one capillary structure layer, and described supporter connects first and second side aforementioned;

Multiple retaining element, described retaining element has a hole, and the first side of aforementioned body is run through in one end and this supporter is combined with this body.

Preferably, the fixed structure of described heat dissipation element, has internal thread in the hole of described retaining element.

Preferably, the fixed structure of described heat dissipation element, described capillary structure layer is complete is attached to aforementioned cavity.

Preferably, the fixed structure of described heat dissipation element, described body is corresponding to be sticked with a substrate, this at least one heat affected zone of body projection also contacts with at least one thermal source on this substrate, the all sides of described thermal source are provided with multiple hole, described hole is corresponding with aforementioned retaining element, and described body this side, heat affected zone contrary connects a radiator.

Preferably, the fixed structure of described heat dissipation element, also has a lock member and wears the hole of this retaining element and described body and substrate and fix.

Preferably, the fixed structure of described heat dissipation element, described at least one heat affected zone of body exterior projection, the adjacent described connecting portion in described heat affected zone.

Preferably, the fixed structure of described heat dissipation element, described body also has one first plate body and one second plate body correspondence covers and jointly defines aforementioned cavity.

Preferably, the fixed structure of described heat dissipation element, described retaining element runs through the first side of aforementioned body, and to run through this supporter overall simultaneously, but does not run through the second side of this body.

Preferably, the fixed structure of described heat dissipation element, described retaining element runs through the first side of aforementioned body and this supporter completed mainly through machining, and described machining is punching press and bores a hole and wherein arbitrary processing such as boring.

Not only can increase this heat dissipation element by the fixed structure of the heat dissipation element of the present invention avoids outside thermal chocking produces with the effect that fits tightly when heat-dissipating thing combines, more because it is through this supporter that the retaining element of the present invention and this body group are established, do not destroy the air-tightness of the chamber of this body, therefore this chamber still possesses vacuum degree, and internal process fluid does not produce leakage; Therefore the present invention has following advantages:

1. conjugation is good for thermal chocking;

2. do not produce leakage;

3. useful life is longer.

Accompanying drawing explanation

Fig. 1 is the first embodiment three-dimensional exploded view of the fixed structure of heat dissipation element of the present invention;

Fig. 2 is the first embodiment three-dimensional combination figure of the fixed structure of heat dissipation element of the present invention;

Fig. 3 is the first embodiment combination A-A cutaway view of the fixed structure of heat dissipation element of the present invention;

Fig. 4 is the three-dimensional combination figure of the second embodiment of the fixed structure of the heat dissipation element of the present invention;

Fig. 5 is the three-dimensional exploded view of the 3rd embodiment of the fixed structure of the heat dissipation element of the present invention;

Fig. 6 is the three-dimensional combination figure of the 3rd embodiment of the fixed structure of the heat dissipation element of the present invention;

Fig. 7 is the stereogram of the 4th embodiment of the fixed structure of the heat dissipation element of the present invention;

Fig. 8 is the B-B cutaway view of the 4th embodiment of the fixed structure of the heat dissipation element of the present invention;

Fig. 9 is the assembled sectional view of the 5th embodiment of the fixed structure of the heat dissipation element of the present invention.

[main element symbol description]

Body 1

First plate body 1a

Second plate body 1b

Chamber 11

First side 12

Second side 13

Supporter 14

Capillary structure layer 15

Heat affected zone 16

Retaining element 2

Hole 21

Internal thread 211

Working fluid 3

Substrate 4

Thermal source 41

Hole 42

Radiator 5

Lock member 6

Embodiment

Characteristic on the above-mentioned purpose of the present invention and structure and fuction thereof, will be explained according to the preferred embodiment of institute's accompanying drawings.

Refer to Fig. 1, Fig. 2, Fig. 3, be the first embodiment stereo decomposing of the fixed structure of heat dissipation element of the present invention and constitutional diagram and A-A cutaway view, as shown in the figure, the fixed structure of the heat dissipation element of the present invention is comprise: a body 1, multiple retaining element 2;

Described body 1 has chamber 11 and one first side 12 and one second side 13, this chamber 11 has multiple supporter 14 and working fluid 3 and at least one capillary structure layer 15, described supporter 14 is connect first and second side 12,13 aforementioned, and described capillary structure layer 15 is completely be attached to aforementioned cavity 11

Described retaining element 2 has a hole 21, and the first side 12 of aforementioned body 1 is run through in this retaining element 2 one end and this supporter 14 is combined with this body 1, has internal thread 211 in the hole 21 of described retaining element 2.

Described retaining element 2 be by welding processing and point discharge processing and machining and ultrasonic waves welding wherein arbitrary and aforementioned body 1 and retaining element 2 be combined, wherein this retaining element 2 run through the first side 12 of aforementioned body 1 and this supporter 14 mainly system completed by machining, described machining can be with punching press and bore a hole and boring etc. wherein arbitrary processing but do not regard it as be limited.

Because described retaining element 2 is that the position having a supporter 14 through this body 1 is combined with this body 1, therefore do not affect the air-tightness of this body 1 chamber 11 entirety, making in this chamber 11 is still vacuum state, makes the working fluid 3 of this chamber 11 inside also not to external leakage.

Refer to Fig. 4, it is the three-dimensional combination figure of the second embodiment of the fixed structure of the heat dissipation element of the present invention, as shown in the figure, the present embodiment part-structure system is identical with aforementioned first embodiment, therefore will repeat no more at this, only the present embodiment and not existing together of aforementioned first embodiment are at least one heat affected zone 16 of the outside projection of described body 1, the adjacent described retaining element 2 in described heat affected zone 16.

Refer to Fig. 5, Fig. 6, be stereo decomposing and the constitutional diagram of the 3rd embodiment of the fixed structure of the heat dissipation element of the present invention, as shown in the figure, the present embodiment part-structure system is identical with aforementioned first embodiment, therefore will repeat no more at this, only the present embodiment and aforementioned first embodiment do not exist together that to be that described body 1 is corresponding be sticked with a substrate 4, this at least one heat affected zone of body 1 projection 16 also contacts with at least one thermal source 41 on this substrate 4, described thermal source 41 weeks sides are provided with multiple hole 42, described hole 42 is corresponding with aforementioned retaining element 2, described body 1 this side, heat affected zone 16 contrary connects a radiator 5, and described body 1 and substrate 4 are fixed by the hole 42 being worn aforementioned retaining element 2 by least one lock member 6.

Refer to Fig. 7, Fig. 8, be stereogram and the B-B cutaway view of the 4th embodiment of the fixed structure of the heat dissipation element of the present invention, as shown in the figure, the present embodiment part-structure system is identical with aforementioned first embodiment, therefore will repeat no more at this, only not existing together of the present embodiment and aforementioned first embodiment is that described body 1 also has that one first plate body 1a and one second plate body 1b is corresponding to be covered and jointly define aforementioned cavity 11.

Refer to Fig. 9, it is the assembled sectional view of the 5th embodiment of the fixed structure of the heat dissipation element of the present invention, as shown in the figure, the present embodiment part-structure system is identical with aforementioned first embodiment, therefore will repeat no more at this, only not existing together of the present embodiment and aforementioned first embodiment be described retaining element 2 is the first side 12 running through aforementioned body 1, and to run through this supporter 14 overall simultaneously, but does not run through the second side 13 of this body 1.

Claims

1. a fixed structure for heat dissipation element, is characterized in that, comprises:

Multiple retaining element, described retaining element has a hole, and the first side of aforementioned body is run through in one end and this supporter is combined with this body, wherein, described retaining element runs through the first side of aforementioned body, and to run through this supporter overall simultaneously, but does not run through the second side of this body.

2. the fixed structure of heat dissipation element as claimed in claim 1, is characterized in that having internal thread in the hole of described retaining element.

3. the fixed structure of heat dissipation element as claimed in claim 1, it is characterized in that, described capillary structure layer is complete is attached to aforementioned cavity.

4. the fixed structure of heat dissipation element as claimed in claim 1, it is characterized in that, described body is corresponding to be sticked with a substrate, this at least one heat affected zone of body projection also contacts with at least one thermal source on this substrate, the all sides of described thermal source are provided with multiple hole, described hole is corresponding with aforementioned retaining element, and described body this side, heat affected zone contrary connects a radiator.

5. the fixed structure of heat dissipation element as claimed in claim 4, is characterized in that, also has a lock member and wears the hole of this retaining element and described body and substrate and fix.

6. the fixed structure of heat dissipation element as claimed in claim 1, is characterized in that, described at least one heat affected zone of body exterior projection, the adjacent described connecting portion in described heat affected zone.

7. the fixed structure of heat dissipation element as claimed in claim 1, it is characterized in that, described body also has one first plate body and one second plate body correspondence covers and jointly defines aforementioned cavity.

8. the fixed structure of heat dissipation element as claimed in claim 1, is characterized in that, described retaining element runs through the first side of aforementioned body and this supporter completed by machining, and described machining is punching press and bores a hole and wherein arbitrary processing such as boring.