CN102958274A - 电路板 - Google Patents

电路板 Download PDF

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Publication number
CN102958274A
CN102958274A CN2011102433564A CN201110243356A CN102958274A CN 102958274 A CN102958274 A CN 102958274A CN 2011102433564 A CN2011102433564 A CN 2011102433564A CN 201110243356 A CN201110243356 A CN 201110243356A CN 102958274 A CN102958274 A CN 102958274A
Authority
CN
China
Prior art keywords
pad
signal line
signal wire
circuit board
bonding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011102433564A
Other languages
English (en)
Inventor
翁程飞
孙正衡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2011102433564A priority Critical patent/CN102958274A/zh
Priority to TW100131168A priority patent/TW201311063A/zh
Priority to US13/304,374 priority patent/US20130048363A1/en
Publication of CN102958274A publication Critical patent/CN102958274A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

一种电路板，包括一板体，该板体设置相互断开的一第一信号线与一第二信号线，该第一信号线的一端设置一第一焊盘，该第二信号线靠近该第一信号线的第一焊盘设置一第二焊盘，第一焊盘及第二焊盘之间间隔一定距离且其中之一设有锡膏，锡膏受热融化同时覆盖第一焊盘及第二焊盘可使第一信号线及第二信号线连通。本发明电路板通过锡膏熔化后使第一信号线与第二信号线导通，无需使用开关元件，从而降低电路板的成本。

Description

电路板
技术领域
本发明涉及一种电路板。
背景技术
现有的电路板通常设有一些开关元件，如零欧姆电阻，来控制信号的导通与关闭。然使用开关元件将增加电路板的成本。
发明内容
鉴于以上内容，有必要提供一种有效降低成本的电路板。
一种电路板，包括一板体，该板体设置相互断开的一第一信号线与一第二信号线，该第一信号线的一端设置一第一焊盘，该第二信号线靠近该第一信号线的第一焊盘设置一第二焊盘，第一焊盘及第二焊盘之间间隔一定距离且其中之一设有锡膏，锡膏受热融化同时覆盖第一焊盘及第二焊盘可使第一信号线及第二信号线连通。
相较现有技术，本发明电路板通过锡膏熔化后使第一信号线与第二信号线导通，无需使用开关元件，从而降低电路板的成本。
附图说明
下面参照附图结合具体实施方式对本发明作进一步的描述。
图1为本发明电路板的较佳实施方式的示意图，其中第一信号线与一第二信号线断开。
图2为本发明电路板的较佳实施方式的示意图，其中第一信号线与一第二信号线连通。
主要元件符号说明
板体 10
第一信号线 12
第一焊盘 120
第二信号线 14
第二焊盘 140
锡膏 20
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明电路板的较佳实施方式包括一板体10。该板体10设置一第一信号线12及一第二信号线14。该第一信号线12与第二信号线14相互断开。该第一信号线12的一端设置一第一焊盘120，该第二信号线14于靠近该第一信号线12的一端设置一环绕该第一焊盘120的环形的第二焊盘140。该第二焊盘140的内侧与第一焊盘120的外侧之间间隔一定距离。该第二焊盘140的外侧涂有阻焊剂。锡膏20涂于该第一信号线12的第一焊盘120。
请参阅图2，如果需将该第一信号线12与第二信号线14连通，加热使锡膏20熔化，使锡膏20同时覆盖第一焊盘120与该第二信号线14的第二焊盘140，从而使第一信号线12与第二信号线14连通。
由于该板体10于该第二焊盘140的外侧涂有阻焊剂，故锡膏熔化后沿第二焊盘140形成一圆形的焊点，可避免信号通过锡膏时反射。

Claims (3)

1.一种电路板，包括一板体，该板体设置相互断开的一第一信号线与一第二信号线，该第一信号线的一端设置一第一焊盘，该第二信号线靠近该第一信号线的第一焊盘设置一第二焊盘，第一焊盘及第二焊盘之间间隔一定距离且其中之一设有锡膏，锡膏受热融化同时覆盖第一焊盘及第二焊盘可使第一信号线及第二信号线连通。
2.如权利要求1所述的电路板，其特征在于：第一焊盘呈圆形，第二焊盘间隔一定距离环绕该第一焊盘且呈环形。
3.如权利要求2所述的电路板，其特征在于：锡膏设置在第一焊盘上，该第二焊盘的外侧设有阻焊材料。
CN2011102433564A 2011-08-24 2011-08-24 电路板 Pending CN102958274A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2011102433564A CN102958274A (zh) 2011-08-24 2011-08-24 电路板
TW100131168A TW201311063A (zh) 2011-08-24 2011-08-30 電路板
US13/304,374 US20130048363A1 (en) 2011-08-24 2011-11-24 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011102433564A CN102958274A (zh) 2011-08-24 2011-08-24 电路板

Publications (1)

Publication Number Publication Date
CN102958274A true CN102958274A (zh) 2013-03-06

Family

ID=47742007

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011102433564A Pending CN102958274A (zh) 2011-08-24 2011-08-24 电路板

Country Status (3)

Country Link
US (1) US20130048363A1 (zh)
CN (1) CN102958274A (zh)
TW (1) TW201311063A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104883813A (zh) * 2015-06-10 2015-09-02 昆山市华涛电子有限公司 一种硬性线路板
CN106658996A (zh) * 2016-12-19 2017-05-10 奇酷互联网络科技（深圳）有限公司 实现电路通断切换的方法和印刷电路板
CN103974531B (zh) * 2014-05-14 2018-01-09 新华三技术有限公司 一种印刷电路板的制作方法、印刷电路板及电子器件

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105430902A (zh) * 2015-11-23 2016-03-23 广东欧珀移动通信有限公司 移动终端及用于移动终端的pcb板
DE102016101620A1 (de) * 2016-01-29 2017-08-03 Biotronik Se & Co. Kg Batteriebrücke und Verfahren zum Aktivieren einer elektronischen Vorrichtung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5308928A (en) * 1989-11-09 1994-05-03 International Business Machines Corporation Soldering interconnects for selective line coupling
CN1620223A (zh) * 1997-12-29 2005-05-25 伊比登株式会社 多层印刷布线板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5308928A (en) * 1989-11-09 1994-05-03 International Business Machines Corporation Soldering interconnects for selective line coupling
CN1620223A (zh) * 1997-12-29 2005-05-25 伊比登株式会社 多层印刷布线板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103974531B (zh) * 2014-05-14 2018-01-09 新华三技术有限公司 一种印刷电路板的制作方法、印刷电路板及电子器件
CN104883813A (zh) * 2015-06-10 2015-09-02 昆山市华涛电子有限公司 一种硬性线路板
CN104883813B (zh) * 2015-06-10 2018-02-06 昆山市华涛电子有限公司 一种硬性线路板
CN106658996A (zh) * 2016-12-19 2017-05-10 奇酷互联网络科技（深圳）有限公司 实现电路通断切换的方法和印刷电路板

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Publication number Publication date
TW201311063A (zh) 2013-03-01
US20130048363A1 (en) 2013-02-28

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Application publication date: 20130306