CN102956796A - Light-emitting diode crystal grain module and packaging method and removing fixture thereof - Google Patents
Light-emitting diode crystal grain module and packaging method and removing fixture thereof Download PDFInfo
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- CN102956796A CN102956796A CN2012104576618A CN201210457661A CN102956796A CN 102956796 A CN102956796 A CN 102956796A CN 2012104576618 A CN2012104576618 A CN 2012104576618A CN 201210457661 A CN201210457661 A CN 201210457661A CN 102956796 A CN102956796 A CN 102956796A
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- crystal particle
- led crystal
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- crystal grain
- emitting diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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Abstract
The invention discloses a light-emitting diode crystal grain module, which comprises at least one light-emitting diode crystal grain, a light cup base, at least one insulating layer, two conducting layers, two conducting wires and a sealant structure, wherein the light-emitting diode crystal grain is provided with a substrate and a plurality of epitaxial layers; the light cup base is provided with a bottom and an upper edge, light cup base bears at least one light-emitting diode crystal grain through the bottom, and the upper edge of the light cup base comprises at least one sealing trench or a sealing flange which surrounds the at least one light-emitting diode crystal grain; the at least one insulating layer is arranged on the sealing trench or the sealing flange; the two conducting layers are arranged on the insulating layer; the two conducting wires are respectively connected between the corresponding conducting layers and the at least one light-emitting diode crystal grain; and the sealant structure covers the at least one light-emitting diode crystal grain, the sealing trench or the sealing flange limits the formation range of the sealant structure, and the two conducting wires respectively extend towards the external part of sealant through the corresponding conducting layers. The light-emitting diode crystal grain module which is prepared by adopting a packaging method has the advantages that the size can be effectively reduced and the problem of low brightness is improved at the same time.
Description
The application be according to female case (application number: 2011101981970, denomination of invention: LED crystal particle module, its method for packing and pipette tool) dividing an application of proposing.
Technical field
The invention relates to a kind of method for packing and tool thereof of light-emitting component, and particularly relevant for a kind of method for packing of LED crystal particle module and pipette tool (fixture).
Background technology
The method for packing of LED crystal particle is roughly similar to general die package now.Fig. 1 namely illustrates the cutaway view of an existing LED crystal particle module.
Please refer to Fig. 1, when carrying out the encapsulation of LED crystal particle 100, at first cover elargol 11 (glue) in prefabricated enclosed seat 12.Then, to be attached to blue glue (blue tape) and go up and cut into the wafer of a plurality of LED crystal particle 100, by the grain with the vacuum suction mode with each LED crystal particle 100 after taking off on the blue glue, and take advantage of elargol 11 and sequentially insert in the enclosed seat 12 that a little is covered with elargol 11 before not solid, attach LED crystal particle 100 to utilize elargol 11.Afterwards, toast again and make elargol 11 curing, make LED crystal particle 100 borrow elargol 11 to be bonded on the enclosed seat 12, make LED crystal particle module 1 as shown in Figure 1.Then, carry out again such as routing, fill in the processes such as optical cement, cutting, and make LED light-source module (not illustrating).
Above-mentioned technique itself there is no too large defective and is applicable to industry volume production LED crystal particle module 1.Yet, for produced LED crystal particle module 1, because produce in advance enclosed seat 12 itself have the restriction of machining, so that can't reduce volume with the size of LED crystal particle 100, produce enclosed seat 12 and the situation that crystal grain 100 does not mate, still dislike excessive problem so have volume.
In view of this, the patent shelves namely propose a kind of new light-emitting diode packaging technology No. 096141685, to address the above problem.The LED crystal particle module volume that thereby encapsulation can be made effectively reduces, and improves simultaneously the problem of luminosity.
Yet, when this technology imports volume production in reality, photoresist is one of better selection as sacrifice layer, but solid gradually because understanding after the photoresist coating, so in the process of the photoresist (being sacrifice layer) of a plurality of LED crystal particle being set coating by grain, can occur can't be in time photoresist solid front with all LED crystal particle by the problem in the photoresist that is embedded at coating, and then cause the in fact difficulty of volume production.
Summary of the invention
The invention provides a kind of LED crystal particle module, comprise at least one LED crystal particle, it has a substrate and a plurality of epitaxial layer; One smooth cup, it has a bottom and a upper limb, and the light cup carries at least one LED crystal particle by the bottom; The upper limb of light cup comprises at least one closed groove or at least one closure flange (flange) around at least one LED crystal particle; At least one insulating barrier is positioned on closed groove or the closure flange; Two conductive layers are positioned on the insulating barrier; Two wires are connected between the corresponding conductive layer and at least one light-emitting diode; And a glue sealing structure, coating at least one LED crystal particle, the wherein shaping scope of closed groove or closure flange restriction glue sealing structure, and two wires is extended to sealing is outside via the conductive layer of correspondence respectively.
Wherein, this light cup has a speculum and a substrate, and this light cup carries the substrate of this at least one LED crystal particle by this speculum.
Wherein, this substrate of this LED crystal particle has at least one concavity structure, grows up so that this speculum and this substrate enter in this concavity structure.
The volume of the LED crystal particle module that the present invention's encapsulation makes can effectively reduce, and improves simultaneously the problem of luminosity.
Description of drawings
Fig. 1 is the cutaway view of existing LED crystal particle module.
Fig. 2 is the flow chart of method for packing of the volume production LED crystal particle module of one embodiment of the invention.
Fig. 3 be the LED crystal particle module that produces of the method for packing of the volume production LED crystal particle module of Fig. 2 on look schematic diagram.
Fig. 4 is the schematic diagram of V-V section in Fig. 3.
Fig. 5 is the coating photoresist step of the method for packing of one embodiment of the invention volume production LED crystal particle module.
Fig. 6 is that the row of the method for packing of one embodiment of the invention volume production LED crystal particle module puts the crystal grain step.
Fig. 7 is the tool sucking crystal grains step of the method for packing of one embodiment of the invention volume production LED crystal particle module.
Fig. 8 is the jig structure when implementing tool sucking crystal grains step.
Fig. 9 is that the synchronous pressure of the method for packing of one embodiment of the invention volume production LED crystal particle module is put the crystal grain step.
Figure 10 is the definition forming step of the method for packing of one embodiment of the invention volume production LED crystal particle module.
Figure 11 is the definition forming step of the method for packing of another embodiment of the present invention volume production LED crystal particle module.
Figure 12 is that the closed groove of the method for packing of one embodiment of the invention volume production LED crystal particle module forms step.
Figure 13 is that the closure flange of the method for packing of one embodiment of the invention volume production LED crystal particle module forms step.
Figure 14 is the sealing step of the method for packing of one embodiment of the invention volume production LED crystal particle module.
Figure 15 is the sealing step of the method for packing of another embodiment of the present invention volume production LED crystal particle module.
Figure 16 is one embodiment of the invention, uses the substrate with at least one concavity structure.
Wherein, Reference numeral:
1,4: the LED crystal particle module
11: elargol
12: enclosed seat
31: coating photoresist step
32: row puts the crystal grain step
33: tool sucking crystal grains step
34: synchronous pressure is put the crystal grain step
35: set crystal grain step
36: the definition forming step
37: etching makes the finished product step
41: the light cup
61: temporary substrate
62: the first photoresists
63: blue glue
64: carrier
65: tool
66: support basic unit
661 mirror coatings
67: the second photoresists
68: the module map picture
69: sacrifice flange
70: closed groove
71: sacrificial trench
72: closure flange
74: insulating barrier
76: conductive layer
78: wire
80: sealing
82: embedded structure
100: LED crystal particle
102: substrate
200: wafer
411: speculum
412: substrate
641: put the position
642: the first keepers
651: suction nozzle
652: cope match-plate pattern
653: lower bolster
654: the vacuum seal
655: vacuum chamber
656: perforation
657: the second keepers
V-V: hatching
Embodiment
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
In exemplary embodiment of the present invention, a kind of method for packing of volume production LED crystal particle module is provided, comprise the LED crystal particle module of light cup in order to actual volume production.At this, the method for packing of volume production LED crystal particle module comprises a coating photoresist step, a row to be put crystal grain step, a tool sucking crystal grains step, a synchronous pressure and puts crystal grain step, a set crystal grain step, a definition forming step and an etching and make the finished product step, with volume production LED crystal particle module.
Coating photoresist step is the first photoresist (i.e. the first sacrifice layer) that coating a layer thickness is not more than the LED crystal particle height on a temporary substrate.
Row puts the wafer that the crystal grain step will be attached on the blue glue and cut into most LED crystal particle, by the grain with vacuum suction, stickiness attaching, magnetic attaching, gripping or engaging mode with each LED crystal particle after taking off on the blue glue, sequentially insert each with carrier that puts the position arranged into an array and put in the position.
Tool sucking crystal grains step is simultaneously one to one drawn the most LED crystal particle that are placed in this carrier in the vacuum suction mode through these suction nozzles with a tool with most suction nozzles.
Synchronous pressure is put the crystal grain step before the first photoresist not yet solidifies, the most LED crystal particle that move this tool and will adsorb once are pressed in the first photoresist simultaneously, make the first photoresist certainly become continuous strand slip circle concave surface aspect with each LED crystal particle contact position to the temporary substrate direction because of surface tension effects.
The first photoresist that the order of set crystal grain step is formed with most arc concave surface aspects solidifies, and so that these LED crystal particle sets.
The definition forming step forms one and supports basic unit on the first photoresist that solidifies, and cooperate with the second photoresist (i.e. the second sacrifice layer) and define the module map picture of containing predetermined LED crystal particle quantity, obtain majority respectively with the LED crystal particle modules of the first photoresist and the link of this temporary substrate.Wherein, each LED crystal particle module has a light cup that is made of the predetermined block of this support basic unit, and the LED crystal particle that is arranged in this light cup predetermined number.
Etching makes the finished product step and removes the first photoresist and look like to make temporary substrate to separate with those LED crystal particle modules with this module map, namely makes most LED crystal particle modules.
In exemplary embodiment of the present invention, its effect is: with seven steps and cooperate tool, actual volume production comprises the LED crystal particle module of light cup.
In the following description content, similarly element is to represent with identical numbering.The explanation of each embodiment is graphic with reference to what add, can be in order to the specific embodiment of implementing in order to illustration the present invention.The direction term that the present invention mentions such as upper and lower, front, rear, left and right etc., only is the direction with reference to annexed drawings.Therefore, the direction term of use is explanation, but not is used for limiting the present invention.
Fig. 2 is the flow chart of method for packing of the volume production LED crystal particle module of one embodiment of the invention.Please refer to Fig. 2, in the present embodiment, the method for packing of volume production LED crystal particle module comprises a coating photoresist step 31, a row to be put crystal grain step 32, a tool sucking crystal grains step 33, a synchronous pressure and puts crystal grain step 34, a set crystal grain step 35, a definition forming step 36 and an etching and make seven techniques such as finished product step 37, and can actual volume production LED crystal particle module 4 as shown in Figures 3 and 4.
Fig. 3 be the LED crystal particle module that produces of the method for packing of the volume production LED crystal particle module of Fig. 2 on look schematic diagram, and Fig. 4 is the schematic diagram of V-V section in Fig. 3.
See also Fig. 3 and Fig. 4, in the present embodiment, LED crystal particle module 4 comprises a smooth cup 41, an and LED crystal particle 100 that is arranged in the light cup 41, wherein, light cup 41 has one and consists of in order to catoptrical speculum 411 with high reflectance material (i.e. the first material), reach one with the substrate 412 of high heat-conduction coefficient material (i.e. the second material) formation in order to heat radiation, LED crystal particle 100 then is the LED crystal particle of general volume production, its structure widely those skilled in the art institute is known, does not repeat them here.LED crystal particle module 4 need be proceeded such as routing again, fill in the technique such as optical cement, forms LED light-source module luminous when electric energy is provided, because these subsequent techniques are not that essence is relevant with the present invention, therefore do not add explanation at this.
The exemplary embodiment of the method for packing of following illustration volume production LED crystal particle module is after the explanation that cooperates above-mentioned LED crystal particle module 4, when meeting is more clearly understood.
Fig. 5 is the coating photoresist step of the method for packing of one embodiment of the invention volume production LED crystal particle module.See also Fig. 2 and Fig. 5, in the present embodiment, at first be coated with photoresist step 31, on a temporary substrate 61, be coated with the first photoresist 62 of the LED crystal particle such as a layer thickness is not more than 100 height.
Arrange synchronously this moment and put crystal grain step 32 and tool sucking crystal grains step 33.
Fig. 6 is that the row of the method for packing of one embodiment of the invention volume production LED crystal particle module puts the crystal grain step.See also Fig. 2 and Fig. 6, in the present embodiment, row puts the wafer 200 that crystal grain step 32 will be attached on the blue glue 63 and cut into most LED crystal particle 100, by the grain with vacuum suction, stickiness attaching, magnetic attaching, gripping or engaging mode with each LED crystal particle 100 after taking off on the blue glue 63, sequentially insert each with carrier that puts position 641 64 arranged into an array and put in the position 641.In the present embodiment, carrier 64 for example have for the location a plurality of the first keepers 642.
The row of the present embodiment puts crystal grain step 32 and existing resemble process, what adopt also is the equipment similar to present product line, both are different locate for example to be existing technique be with each LED crystal particle 100 after blue glue 63 takes off, directly insert a little with in the enclosed seat 12 of elargol 11, and in the present embodiment, then be sequentially to insert the putting in the position 641 of carrier 64, with pending next step.
Fig. 7 is the tool sucking crystal grains step of the method for packing of one embodiment of the invention volume production LED crystal particle module.Fig. 8 is the jig structure when implementing tool sucking crystal grains step.See also Fig. 2, Fig. 7 and Fig. 8, in the present embodiment, then carry out tool sucking crystal grains step 33.At this, simultaneously one to one draw the most LED crystal particle 100 that are placed in carrier 64 in the vacuum suction mode through suction nozzle 651 with a tool 65 with most suction nozzles 651.At this, tool 65 for example comprises a cope match-plate pattern 652 and a lower bolster 653 that mates with each other, and a vacuum seal 654 that is folded between the upper and lower template 652,653.
In the present embodiment, cope match-plate pattern 652 have one run through and can with the vacuum chamber 655 that produces online vacuum line (not illustrating) and be connected and be positioned at vacuum seal 654 corral scopes.Lower bolster 653 also has the perforation 656 that majority runs through plate body and is communicated with vacuum chamber 655, and suction nozzle 651 is communicated with perforation 656 accordingly respectively and outwards protrudes out from the plate body surface.
In addition, the lower bolster 653 of tool 65 has a plurality of the cooperation with grade in an imperial examination positioning piece 642 and makes each other the second keeper 657 of location, right angle, by this so that behind the location, the first keeper 642 right angles of tool 65 with the second keeper 657 and carrier 64, accurately with each suction nozzle 651 corresponding each LED crystal particle 100 of drawing in the carrier 64.
Fig. 9 is that the synchronous pressure of the method for packing of one embodiment of the invention volume production LED crystal particle module is put the crystal grain step.See also Fig. 2 and Fig. 9, in the present embodiment, then carry out synchronous pressure and put crystal grain step 34.Before the first photoresist 62 not yet solidifies, mobile the tool 65 and most LED crystal particle 100 that will adsorb are pressed in the first photoresist 62 simultaneously, make the first photoresist 62 because of surface tension effects from becoming continuous strand slip circle concave surface aspect with each LED crystal particle 100 contact position to temporary substrate 61 directions.
Afterwards, carry out set crystal grain step 35, the first photoresist 61 that is formed with most arc concave surface aspects with order solidifies.In set crystal grain step 35, for example be to make the first photoresist 61 solidify with roasting mode.
Figure 10 is the definition forming step of the method for packing of one embodiment of the invention volume production LED crystal particle module.See also Fig. 2, Fig. 4 and Figure 10, in the present embodiment, then define forming step 36, support basic unit 66 on the first photoresist 62 that solidifies, to form, and cooperate with the second photoresist 67 define contain predetermined LED crystal particle 100 quantity module map as 68, obtain most respectively with the LED crystal particle modules 4 of the first photoresist 62 with temporary substrate 61 links.Wherein, each LED crystal particle module 4 has the light cup 41 that consists of by supporting basic unit's 66 predetermined blocks, and is arranged in the LED crystal particle 100 of light cup 41.
In detail, definition forming step 36 is prior to forming a mirror coating 661 with the material plating with high reflectance on the first photoresist 62 that solidifies.Then, the second liquid photoresist 67 of coating on mirror coating.Afterwards, with gold-tinted technique the second photoresist 67 is defined as module map as 68.At this moment, module map makes mirror coating 661 surfaces form most independences and exposed region as 68.Continue, again in mirror coating 661 surfaces with the material (for example copper) with high thermal conductivity coefficient, thicken and form most substrates 412.At this, mirror coating 661 zones corresponding to each substrate are speculum 411.In the present embodiment, support basic unit 66 and for example consisted of by speculum 411 and substrate 412, and obtain a plurality of LED crystal particle modules 4 that link with the first photoresist 62 and temporary substrate 61 respectively.
Figure 11 is the definition forming step of the method for packing of another embodiment of the present invention volume production LED crystal particle module.See also Fig. 2, Fig. 4 and Figure 11, the definition forming step of the present embodiment is similar to the person of illustrating of Figure 10 institute, and difference between the two is as follows.
In the present embodiment, definition forming step 36 is prior to the second liquid photoresist 67 of coating on the first photoresist 62 that solidifies, and with gold-tinted technique the second photoresist 67 is defined as module map as 68 again, forms a plurality of independences and exposed region.Afterwards, sequentially form a speculum 411 and a substrate 412 in independence and exposed region respectively with the material with high reflectance and the material with high thermal conductivity coefficient, wherein speculum 411 supports basic unit 66 with substrate 412 common formation.
Then, see also Fig. 2, Fig. 3 and Fig. 4.Carry out at last etching and make finished product step 37, remove the first photoresist 62 and as 68 temporary substrate 61 is separated with module map with LED crystal particle module 4, make most LED crystal particle modules 4.
Before etching makes finished product step 37, or after etching makes finished product step 37, can carry out the techniques such as routing, sealing.Yet packaging adhesive material often can produce the glue situation of overflowing because surface tension effects is mobile along the wire rod of routing, so that the colloid alteration of form after the sealing, and then cause light to take out the reduction of efficient.Therefore, the present invention proposes another embodiment, as shown in figure 12.The second photoresist 67 more can define one by gold-tinted technique and sacrifice flange 69, can form a closed groove 70 because sacrificing flange 69 with back mirror 411, and wherein closed groove 70 is around at least one LED crystal particle 100.
Otherwise the present invention also can be in above-mentioned definition forming step 36, with gold-tinted technique the second photoresist 67 is defined as module map as after 68, with gold-tinted technique the first photoresist 62 is defined a sacrificial trench 71 again, as shown in figure 13.Subsequently, speculum 411 can form a closure flange (flange) 72 because of sacrificial trench 71, and wherein closure flange 72 is around at least one LED crystal particle 100.
Please refer to Figure 14 and Figure 15, after finishing aforementioned technique, each LED crystal particle module 4 more comprises synchronous execution the following step: at first, form an insulating barrier 74 on closed groove 70 or closure flange 72.Subsequently, form two conductive layers 76 on insulating barrier 74, connect respectively again two wires 78 between the conductive layer 76 and at least one light-emitting diode 100 of correspondence.At last, form a sealing 80 at least one LED crystal particle 100, wherein closed groove 70 or closure flange 72 can limit the formation scope of sealing 80, and the glue situation of avoiding overflowing occurs.Two above-mentioned wires 78 then extend to sealing 80 outsides via the conductive layer 76 of correspondence respectively, to connect external circuit or to be electrically connected other luminous secondary body crystal grain module.
Be noted that at this, etching makes finished product step 37 and is removing the first photoresist 62 and module map as 68 o'clock, because speculum is as thin as a wafer, thus be direct etching remove mirror coating 661 by module map as 68 regional structures that cover, obtain independently LED crystal particle module 4 of majority.
Be noted that in addition, in exemplary embodiment of the present invention, all be to explain to have a LED crystal particle 100 in the smooth cup 41, usually know that the knowledgeable all knows and have in the affiliated technical field, as long as 67 one-tenth module map of definition the second photoresist were as 68 o'clock change kenels, can make in the smooth cup 41 to have a plurality of LED crystal particle 100, change design because this part only belongs to simple kenel, therefore this is not done superfluous releasing again.
Moreover, one substrate 102 of above-mentioned at least one LED crystal particle 100 more can form at least one concavity structure 82 (concave structure), enter 82 growth of concavity structure so that support basic unit 66, so that increase the contact area that supports basic unit 66 and substrate 102, strengthen by this heat radiation, and the substrate 102 that supports basic unit 66 and LED crystal particle 100 is more firmly linked, as shown in figure 16.
In one embodiment of the invention, a kind of LED crystal particle module is provided, comprise at least one LED crystal particle, it has a substrate and a plurality of epitaxial layer; One smooth cup, it has a bottom and a upper limb, and the light cup carries at least one LED crystal particle by the bottom; The upper limb of light cup comprises at least one closed groove or at least one closure flange (flange) around at least one LED crystal particle; At least one insulating barrier is positioned on closed groove or the closure flange; Two conductive layers are positioned on the insulating barrier; Two wires are connected between the corresponding conductive layer and at least one light-emitting diode; And a glue sealing structure, coating at least one LED crystal particle, the wherein shaping scope of closed groove or closure flange restriction glue sealing structure, and two wires is extended to sealing is outside via the conductive layer of correspondence respectively.
In an example of the present embodiment, the light cup has a speculum and a substrate, and the light cup carries the substrate of at least one LED crystal particle by speculum.
In another example of the present embodiment, the substrate of LED crystal particle has at least one concavity structure, grows up so that speculum and substrate enter in the concavity structure.
In sum, in an embodiment of the present invention, utilize special tool to carry out crystal grain location, improve at present can only be by grain carries out the crystal grain location can't actual volume production problem.In addition, in an embodiment of the present invention, the volume of the LED crystal particle module that encapsulation makes can effectively reduce, and improves simultaneously the problem of luminosity.
Certainly; the present invention also can have other various embodiments; in the situation that do not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection range of claim of the present invention.
Claims (3)
1. a LED crystal particle module is characterized in that, comprising:
At least one LED crystal particle, this LED crystal particle have a substrate and a plurality of epitaxial layer;
One smooth cup, this light cup has a bottom and a upper limb, and this light cup is by at least one LED crystal particle of this bottom carrying;
This upper limb of this light cup comprises at least one closed groove or at least one closure flange around this at least one LED crystal particle;
At least one insulating barrier is positioned on this closed groove or this closure flange;
Two conductive layers are positioned on this insulating barrier;
Two wires are connected between corresponding this conductive layer and this at least one light-emitting diode; And
One glue sealing structure coats this at least one LED crystal particle, and wherein this closed groove or this closure flange limit the shaping scope of this glue sealing structure, and this two wire extends to this sealing is outside via this conductive layer of correspondence respectively.
2. LED crystal particle module according to claim 1 is characterized in that, this light cup has a speculum and a substrate, and this light cup carries the substrate of this at least one LED crystal particle by this speculum.
3. LED crystal particle module according to claim 2 is characterized in that, this substrate of this LED crystal particle has at least one concavity structure, grows up so that this speculum and this substrate enter in this concavity structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104576618A CN102956796A (en) | 2011-07-15 | 2011-07-15 | Light-emitting diode crystal grain module and packaging method and removing fixture thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104576618A CN102956796A (en) | 2011-07-15 | 2011-07-15 | Light-emitting diode crystal grain module and packaging method and removing fixture thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101981970A Division CN102244164B (en) | 2011-07-15 | 2011-07-15 | Light-emitting diode crystalline grain modules, encapsulation method thereof and removal jig thereof |
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| Publication Number | Publication Date |
|---|---|
| CN102956796A true CN102956796A (en) | 2013-03-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012104576618A Pending CN102956796A (en) | 2011-07-15 | 2011-07-15 | Light-emitting diode crystal grain module and packaging method and removing fixture thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113224219A (en) * | 2021-05-10 | 2021-08-06 | 珠海市宏科光电子有限公司 | Manufacturing method of intelligent full-color-mixing COB light source |
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| CN1638164A (en) * | 2004-01-05 | 2005-07-13 | 株式会社东芝 | Optical semiconductor device |
| CN101136447A (en) * | 2006-08-31 | 2008-03-05 | 株式会社东芝 | Semiconductor light emitting device |
| TW200921933A (en) * | 2007-11-05 | 2009-05-16 | Liung Feng Ind Co Ltd | Light-emitting diode chip component with thermal substrate and manufacturing method thereof |
| CN101452986A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for white light emitting diode device |
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- 2011-07-15 CN CN2012104576618A patent/CN102956796A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1638164A (en) * | 2004-01-05 | 2005-07-13 | 株式会社东芝 | Optical semiconductor device |
| CN101136447A (en) * | 2006-08-31 | 2008-03-05 | 株式会社东芝 | Semiconductor light emitting device |
| TW200921933A (en) * | 2007-11-05 | 2009-05-16 | Liung Feng Ind Co Ltd | Light-emitting diode chip component with thermal substrate and manufacturing method thereof |
| CN101452986A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for white light emitting diode device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113224219A (en) * | 2021-05-10 | 2021-08-06 | 珠海市宏科光电子有限公司 | Manufacturing method of intelligent full-color-mixing COB light source |
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Application publication date: 20130306 |