CN102945915B - Coating technique of LED fluorescent powder - Google Patents
Coating technique of LED fluorescent powder Download PDFInfo
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- CN102945915B CN102945915B CN201210403642.7A CN201210403642A CN102945915B CN 102945915 B CN102945915 B CN 102945915B CN 201210403642 A CN201210403642 A CN 201210403642A CN 102945915 B CN102945915 B CN 102945915B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The invention relates to a coating technique of LED fluorescent powder. The coating technique of the LED fluorescent powder comprises the following steps of: 1, producing an optical lens, wherein a non-light emitting surface of the optical lens is equipped with an ITO (Indium Tin Oxide) conducting layer, the outer surface of the optical lens is shaped in a free curved surface, and a lens layer has no conducting function; 2, preparing a fluorescent powder layer by the electrophoretic deposition method, and coating the fluorescent powder layer on the ITO conducting layer of optical glass; and 3, placing the optical lens produced in the step 2 in an oven for baking to remove water and volatilize organic matters. The coating technique of the LED fluorescent powder disclosed by the invention is applied in the production of the LED fluorescent powder layers.
Description
Technical field
The present invention relates to LED(Light-Emitting Diode, light-emitting diode), particularly relate to a kind of LED encapsulation structure by far field excitation.
Background technology
Realize LED to send white light and have a variety of mode, have RGB chip portfolio, have blue chip excitated fluorescent powder, have UV chip excitated fluorescent powder etc., mode the most frequently used at present on blue light or black light LED chip, applies fluorescent material and realizes white light reflection.The blue light (420nm-470nm) utilizing LED chip to launch or black light (370nm-410nm) are as principal spectrum, and fluorescent material is stimulated after absorbing principal spectrum and produces the secondary spectrum longer than principal spectrum wavelength, thus is converted to dual wavelength or three-wavelength white light.In said process, fluorescent material (fluorescent material) covers the encapsulating structure of LED and technology is then the key technology that white light LEDs is made.
The covering of fluorescent material, normally by fluorescent powder grain and silica gel (or other organic carriers) are mixed into glue, is then coated in the surface of blue light or black light LED chip.The encapsulation flow process of existing white light LEDs can be divided into following step:
1, fixed chip: LED chip glue or scolding tin are fixed on support or substrate, then puts the support or substrate that are placed with LED chip into oven cooking cycle, makes adhesive curing;
2, electrode bonding wire: the mode of the p/n electrode bonding wire of LED chip is soldered on the pad of the metallic circuit of support or substrate;
3, fluorescent material coating: first fluorescent material and silica gel (or other organic carriers) are deployed into fluorescent glue, and fully stir, with dispensing needle head or other spot gluing equipments, above-mentioned fluorescent glue is directly coated to the top of LED chip after stirring, forms phosphor powder layer.
Great power LED usually also can increase transparent organic silicon glue again on phosphor powder layer, thus realizes the lens of hemisphere or other optic shape.Through the LED encapsulation structure of above-mentioned encapsulation flow processing, fluorescent material is directly coated on LED chip, there is following shortcoming:
1, fluorescent material often reduces with the rising of temperature the absorption intensity of principal spectrum and light conversion efficiency; And above-mentioned fluorescent material is directly coated on LED chip, and can generate heat when LED chip normally works, therefore the temperature of fluorescent material also can raise, and have impact on activity and the conversion efficiency of fluorescent material, and then affects the Performance And Reliability of white light LEDs;
2, fluorescent material is directly coated on LED chip, also can cause its unsteadiness in the situation of being heated, the drift of such as colour temperature, the change etc. of color rendering index.Because temperature is while affecting the activity of fluorescent material, also the optical wavelength excited fluorescent material produces certain impact, along with the rising of LED chip temperature, fluorescent material is active while inactivation gradually, fluorescent material send light wavelength also along with the red skew of generation, namely light-emitting phosphor wavelength offsets towards red wavelength, causes colour temperature and color to offset.Thus cause the characteristics of luminescence of fluorescent material to be deteriorated, brightness decline and colourity change can be produced thus;
3, fluorescent material is directly coated on LED chip, makes fluorescent material performance degradation at relatively high temperatures, and then causes the light decay of white light LEDs;
4, in addition, also there is fluorescent material precipitation and mix sex chromosome mosaicism, during point glue, gel quantity is uneven, causes colour temperature and consistency of colour good not.
Therefore one section of application publication number is the patent of invention of CN101867007A, discloses a kind of preparation method of LED phosphor powder layer.The method prepares phosphor powder layer in LED chip light extraction direction and side light direction, this phosphor powder layer is away from LED chip surface, it specifically has two kinds of methods, and method one is: the dispersion-phosphor slurry of (1) preparation fluorescent material and binder glue; (2) apply: phosphor slurry is coated in glass lamp housing surface, form the coating of fluorescent powder dispersoid; (3) remove photoresist: remove the organic components such as the binder glue in dispersion, obtain that there is certain thickness phosphor powder layer.Method two is: the dispersion-phosphor slurry of (1) preparation fluorescent material and photosensitive colloid; (2) apply: phosphor slurry is coated in glass lamp housing surface, form the coating of fluorescent powder dispersoid; (3) expose, develop: the fluorescent material photoresists dispersion coating obtaining desired thickness; (4) photoresists are removed: remove the photoresists composition in fluorescent coating, obtain having the phosphor powder layer determining thickness.In the process of said method, the painting method of phosphor slurry can be the one or more combination in perfusion, spin coating, suction painting, extrusion, electrophoretic deposition.Although above-mentioned patent mentions electrophoresis, the content of its reality adopts embedding method point glue, and be not described the specific implementation process of electrophoresis, and its realizability is difficult to pass judgment on.Further, the electrophoresis that above-mentioned patent adopts is common process, and its complex technical process, production difficulty is large.
In addition, existing electrophoretic techniques adopts constant voltage or constant current electrophoresis method mostly, controls electrophoresis time and deposits phosphor powder layer.This method, because electrophoretic liquid concentration in electrophoresis process is in change, by controlling electrophoresis time, is difficult to control phosphor powder layer thickness accurately; And the phosphor powder layer compactness obtained is good not.
Summary of the invention
Technical problem to be solved by this invention is, provides a kind of LED fluorescent powder coating processes, and by fluorescent material and LED chip being separated, solution fluorescent material is directly coated in the problem that LED chip causes; By adopting the electrophoretic techniques improved, obtaining the phosphor powder layer that compactness is high, solving the deficiency of electrophoresis method in prior art.
In order to solve the problems of the technologies described above, thinking of the present invention is, utilizes far field phosphor technologies, using as the LED chip of thermal source and phosphor powder layer separately, thus avoids color temperature shift, and improves the brightness of LED.Wherein, LED chip and phosphor powder layer are separated, is the surface utilizing electrophoretic techniques fluorescent material to be uniformly coated on the ITO conductive layer of optical lens, and is filled with layer of silica gel between optical lens and LED chip.
Technical scheme of the present invention is, a kind of LED fluorescent powder coating processes, comprises the following steps:
Step 1: make optical lens, the non-exiting surface of this optical lens is provided with ITO conductive layer, and this optical lens is optical glass having high refractive index material, and its outer surface is free form surface shape, and not there is conducting function, only have the ITO conductive layer of bottom to have conducting function.Wherein, when the height because of lens equals radius, light transmittance is lower, so the height of optical lens is less than radius or is greater than radius;
Step 2: prepare phosphor powder layer by electrophoretic deposition, be attached to by phosphor powder layer on the ITO conductive layer of optical lens, it specifically comprises the following steps:
Step 21: the preparation of fluorescent material electrolyte solution: with isopropyl alcohol or isobutanol for solvent, with Mg (NO
3)
2(magnesium nitrate) or Al (NO
3)
3(aluminum nitrate) is electrolyte, electrolyte (Mg (NO
3)
2or Al (NO
3)
3) to join solvent (isopropyl alcohol or isobutanol) according to finite concentration ratio inner, make it dissolve completely by supersonic oscillations, make fluorescent material electrolyte solution.Wherein, electrolytical concentration range: 0.06g/L-0.4g/L;
Step 22: the preparation of fluorescent material electrophoresis liquid: add LED fluorescent powder (as YAG fluorescent powder in the fluorescent material electrolyte solution that step 21 is made, YAG is yag crystal) particle, add a small amount of fluorescent material antiprecipitant, and pass through magnetic stirrer, fluorescent material even suspension is made to be dispersed in fluorescent material electrolyte solution, form fluorescent material electrophoresis liquid, the cation (Mg of fluorescent material adsorbing electrolyte
2+or Al
3+) and positively charged.Fluorescent material is with identical positive charge, and based on the principle of two like magnetic poles repel each other, fluorescent material keeps dispersed in the solution.And add antiprecipitant in electrophoresis liquid, due to space steric effect, electrophoresis liquid dispersion keeps stable.This antiprecipitant preferably adopts a day Bender mountain antisolvent precipitation powder DM-30 to make;
Wherein, mixing time can be determined according to the number of fluorescent material electrophoresis liquid and fluorescent material, within general 4 hours, is advisable.Wherein, the concentration range of LED fluorescent powder particle is: 5g/L-10g/L;
Step 23: fluorescent material is deposited on the ITO conductive layer of optical lens by electrophoretic apparatus, thus form phosphor powder layer.Wherein, electrophoretic apparatus comprises power supply, optical lens, holds the container of fluorescent material electrophoresis liquid and be located at the battery lead plate of this container bottom, described optical lens is placed in container, and its conductive layer contacts with fluorescent material electrophoresis liquid, and the ITO conductive layer of this optical lens is parallel with battery lead plate; The positive pole connecting electrode plate of described power supply, the negative pole of described power supply connects the ITO conductive layer of optical lens.Wherein, battery lead plate is the substrate of metal material, such as the material such as copper, silver.Supply voltage is between 40V-400V, and electrophoresis time is between 1-5 minute;
In said process, when negative and positive two anode-cathode distance (i.e. distance between the ITO conductive layer of battery lead plate and optical lens) is certain, the field intensity size in electrophoresis liquid can be regulated by the voltage changing two interpolars, finally realize the regulation and control to electrophoretic velocity;
Step 24: when phosphor powder layer thickness reaches 10-90um, terminates electrophoresis.Phosphor powder layer thickness reaches 10-90um, is also the stacking 2-6 layer of phosphor particles;
Step 3: baking: the optical lens that the surface of step 2 being made is coated with phosphor powder layer is positioned over oven for baking, removing moisture and volatile organic compounds, baking temperature is 100-120 degree, and baking time is at 1 hours;
In addition, the phosphor powder layer using above-mentioned steps to make encapsulates, further comprising the steps of:
Step 4: be placed on by LED chip on support and complete die bond, after bonding wire, covers optical lens above support, and wherein, the phosphor powder layer one of optical lens is facing to LED chip direction;
Step 5: filling gel between optical lens and LED chip;
Step 6: put into the solidification that oven for baking completes filling gel.
In order to obtain the controlled phosphor powder layer of fine and close thickness, as a further technical scheme, in the step 23 of described step 2, by the substep electrophoretic deposition method of control electricity, LED fluorescent powder is deposited on the ITO conductive layer of optical lens, specifically comprise the following steps: first preset the accessible peak of electricity in electrophoretic apparatus, then be energized, start electrophoresis process; In electrophoresis process, if when the electricity detected reaches the peak preset, then stop electrophoresis process; Wherein, electrophoresis process is that substep carries out electrophoretic deposition: first carry out an electrophoretic deposition fluorescent material, then certain hour is stopped, treat that electrophoresis solution reaches stable equilibrium state again, carry out secondary electrophoretic deposition fluorescent material next time again, repeat this substep electrophoretic deposition process, until phosphor powder layer reaches required thickness.In addition, because fluorescent material particle diameter is too little, then cause luminous efficiency low; And fluorescent material particle diameter is too large, the phosphor powder layer compactness that electrophoresis obtains is poor, proves through actual experiment, fluorescent material particle diameter best results within the scope of 4-20um.
The present invention adopts such scheme, by LED chip and phosphor powder layer are separated, the electrophoretic techniques improved is utilized fluorescent material to be uniformly coated on the surface of the ITO conductive layer of optical lens, thus obtaining fine and close and thin phosphor powder layer, the phosphor powder layer controllability produced like this is comparatively strong, utilizes LED chip to excite this photoluminescent phosphor layer, its colour temperature controllability is strong, consistency is good, and Phosphor Decay in Rare Earth is little, and the reliability of LED is strong.
In addition, the project organization of optical lens of the present invention also has the following advantages: the light emission rate of the exiting surface of optical lens is higher, and light is more even, solves hot spot problem.And this optical lens is solid construction, easy to make, its external form can flexible design as required.The phosphor powder layer dense arrangement that the ITO conductive layer of optical lens is coated with is relative to the method for traditional fluorescent material and glue mixing point glue, stronger to the controllability of LED colour temperature.
Also have, adopt electrophoretic deposition technique to realize the coating of phosphor powder layer in the present invention, relative to traditional electrophoretic deposition technique, present invention employs the substep electrophoretic deposition method controlling electricity, and optimize the technological parameter of electrophoresis process, thus the high phosphor powder layer of compactness can be obtained.
Accompanying drawing explanation
Fig. 1 is the supporting structure schematic diagram of embodiments of the invention.
Fig. 2 is the overall schematic of embodiments of the invention.
Fig. 3 is the electrophoresis process figure of embodiments of the invention.
Fig. 4 be electrophoretic apparatus in enforcement of the present invention and quantity of electricity controller with the use of figure.
Embodiment
Now the present invention is further described with embodiment by reference to the accompanying drawings.
Now using high-power LED bracket as a specific embodiment, LED fluorescent powder coating processes of the present invention is described.As depicted in figs. 1 and 2, this LED encapsulation structure comprises LED chip 1, support 2, layer of silica gel 3, phosphor powder layer 4, optical lens 5.The non-exiting surface of this optical lens 5 is provided with ITO(Indium Tin Oxides, nano indium tin metal oxide) conductive layer 51, the outer surface of this optical lens 5 is free form surface shape, and does not have conducting function.
Support 2 is provided with the pedestal 14 of the cup of placing LED chip 1, the positive conductive feet 11 of being drawn by wire 13 by the both positive and negative polarity of LED chip 1 and negative conductive feet 12 and coated above-mentioned positive conductive feet 11 and negative conductive feet 12; Described LED chip 1 is positioned in the cup of described support 2, and described layer of silica gel 3 is located between described LED chip 1 and phosphor powder layer 4, and described layer of silica gel 3 covers described LED chip 1 completely; Described optical lens 5 is located on described phosphor powder layer 4.Its medium-height trestle 2 being also provided with through hole 15, for injecting silica gel, forming layer of silica gel 3.The present embodiment illustrates embodiment for blue-light LED chip.
The LED technique (step 1-step 3 is fluorescent powder coating technique) of above-mentioned LED encapsulation structure is as follows:
Step 1: make optical lens 5, the non-exiting surface of this optical lens 5 is provided with ITO conductive layer 51, and this optical lens is optical glass having high refractive index material, and its outer surface is free form surface shape, and not there is conducting function, only have the ITO conductive layer 51 of bottom to have conducting function.Wherein, when the height because of lens equals radius, light transmittance is lower, so the height of optical lens is less than radius or is greater than radius;
Step 2: prepare phosphor powder layer by electrophoretic deposition, be attached to by phosphor powder layer on the ITO conductive layer 51 of optical lens 5, it specifically comprises the following steps:
Step 21: the preparation of fluorescent material electrolyte solution: with isopropyl alcohol or isobutanol for solvent, with Mg (NO
3)
2(magnesium nitrate) or Al (NO
3)
3(aluminum nitrate) is electrolyte, electrolyte (Mg (NO
3)
2or Al (NO
3)
3) to join solvent (isopropyl alcohol or isobutanol) according to finite concentration ratio inner, make it dissolve completely by supersonic oscillations, make fluorescent material electrolyte solution.The present embodiment take isopropyl alcohol as solvent, with Mg (NO
3)
2for electrolyte, Mg (NO
3)
2concentration range: 0.06g/L-0.4g/L;
Step 22: the preparation of fluorescent material electrophoresis liquid: add YAG fluorescent powder particle (the surface-coated YAG series phosphor powder of blue-light LED chip in the fluorescent material electrolyte solution that step 21 is made, this fluorescent material can launch gold-tinted under blue ray radiation, like this, some blue light is transformed into gold-tinted, white light LEDs is formed) with remaining blue light, add a small amount of fluorescent material antiprecipitant DM-30, and pass through magnetic stirrer, YAG fluorescent powder even suspension is made to be dispersed in fluorescent material electrolyte solution, form fluorescent material electrophoresis liquid, the cation Mg of YAG fluorescent powder adsorbing electrolyte
2+and it is positively charged.Wherein, mixing time can be determined according to the number of fluorescent material electrophoresis liquid and fluorescent material, within general 4 hours, is advisable.Wherein, in order to obtain the controlled phosphor powder layer of fine and close thickness, the particle size range of YAG fluorescent powder particle is 4-20um.The concentration range of YAG fluorescent powder particle is: 5g/L-10g/L.Fluorescent material is with identical positive charge, and based on the principle of two like magnetic poles repel each other, fluorescent material keeps dispersed in the solution.And in electrophoresis liquid, add antiprecipitant DM-30, due to space steric effect, make electrophoresis liquid dispersion keep stable;
Step 23: YAG fluorescent powder is deposited on the ITO conductive layer 51 of optical lens 5 by electrophoretic apparatus 100, thus form phosphor powder layer.Wherein, as shown in Figure 3, electrophoretic apparatus 100 comprises power supply, optical lens 5, the container 6 holding fluorescent material electrophoresis liquid and the battery lead plate 7 be located at bottom this container 6, described optical lens 5 is placed in container 6, its conductive layer contacts with fluorescent material electrophoresis liquid, and the ITO conductive layer 51 of this optical lens 5 is parallel with battery lead plate 7; Containing a large amount of phosphor particles 16 in fluorescent material electrophoresis liquid; The positive pole connecting electrode plate 7 of described power supply, the negative pole of described power supply connects the ITO conductive layer 51 of optical lens 5.The materials such as wherein, battery lead plate 7 is the substrate of metal material, such as copper, silver.Supply voltage is between 40V-400V, and electrophoresis time is between 1-5 minute;
LED fluorescent powder is deposited on the ITO conductive layer 51 of optical lens 5 particular by the substep electrophoretic deposition method controlling electricity by the present invention, as shown in Figure 4, is undertaken by the cooperation of electrophoretic apparatus 100 and quantity of electricity controller 101.Electrophoretic apparatus 100 adopts the method for DC constant voltage electrophoresis, has constant electric field between two electrodes.The effect of quantity of electricity controller 101 is, when the electricity (voltage, electric current or power factor) of the circuit by electrophoretic apparatus 100 reaches set point, will stop electrophoresis process.Above-mentioned thinking is: the electrolyte added in electrophoresis liquid can be adsorbed on phosphor surface, and the amount of absorption depends on the specific area of fluorescent material, and the electrically charged amount of fluorescent material institute that namely particle diameter is large is large, and the electrically charged amount of fluorescent material institute that particle diameter is little is little; Stop electrophoresis process when reaching a certain amount of by the electricity in control circuit because electricity and fluorescent material amount proportional, so can accurately control fluorescent material thickness and deposition.This method overcomes the problem that electrophoretic liquid concentration changes fluorescent material varied in thickness between the different production batch that cause.Wherein, quantity of electricity controller 101 is prior art; be a kind of be distribution system, the matching used intelligent controller of automation control system; for parameters such as voltage, electric current, power factors in observation circuit; coordinate the low-voltage electrical apparatus of Electronic control can realize, to the automatic control of circuit, various defencive function can being provided as requested.As the modular product of one, commercially can buy, therefore be not described in detail here;
Electrophoretic deposition step by step: by the dynamics research to electrophoresis process, if adopt disposable electrophoretic deposition, because fluorescent material electrophoretic velocity is very fast, fast deposition on ITO conductive layer 51, wherein form many spaces between fluorescent powder grain, bisque compactness is good not.And the present invention adopts electrophoretic deposition step by step, namely first carry out an electrophoretic deposition fluorescent material, then stop certain hour rear electrophoresis solution and again reach stable equilibrium state, then carry out second time electrophoretic deposition fluorescent material.For the first time after electrophoretic deposition fluorescent material, between fluorescent powder grain, have certain space, then when carrying out second time fluorescent material deposition, fluorescent powder grain meeting preferential deposition is between space.Fine and close phosphor powder layer just can be obtained like this by the electrophoretic deposition of twice;
In said process, when negative and positive two anode-cathode distance (i.e. distance between the ITO conductive layer 51 of battery lead plate and optical lens 5) is certain, the field intensity size in electrophoresis liquid can also be regulated by the voltage changing two interpolars, finally realize the regulation and control to electrophoretic velocity.The invention provides a kind of stable electrophoresis liquid formula, the method for the above-mentioned electrophoresis of employing can obtain the phosphor powder layer of uniform particles distribution.And it is high to combine optical lens light emission rate, its optics exiting surface can the feature of flexible design, can produce light efficiency good, the LED that reliability is high;
Step 24: when phosphor powder layer thickness reaches 10-90um, terminates electrophoresis.Phosphor powder layer thickness reaches 10-90um, is also the stacking 2-6 layer of phosphor particles;
Step 3: baking: the optical lens 5 that the surface of step 2 being made is coated with phosphor powder layer is positioned over oven for baking, removing moisture and volatile organic compounds, baking time is at 1 hours;
Step 4: be placed on by LED chip on support and complete die bond, after bonding wire, is fixed on above support by optical lens 5, wherein, optical lens 5 be provided with phosphor powder layer 4 one facing to LED chip 1 direction;
Step 5: filling gel between optical glass 5 and LED chip 1: the both sides of the junction of optical glass 5 and support 2 are respectively equipped with through hole 15, as the passage of the soft silica gel of perfusion;
Step 6: put into the solidification that oven for baking completes filling gel.
Fluorescent material in the present invention and lens integration, be easy to large-scale industrial production, have good practicality.
Although specifically show in conjunction with preferred embodiment and describe the present invention; but those skilled in the art should be understood that; not departing from the spirit and scope of the present invention that appended claims limits; can make a variety of changes the present invention in the form and details, be protection scope of the present invention.
Claims (8)
1. a LED fluorescent powder coating processes, is characterized in that: comprise the following steps:
Step 1: make optical lens, the non-exiting surface of this optical lens is provided with ITO conductive layer, and the outer surface of this optical lens does not have conducting function;
Step 2: prepare phosphor powder layer by electrophoretic deposition, is coated on the ITO conductive layer of optical glass by phosphor powder layer;
Step 3: optical lens step 2 made is positioned over oven for baking, to remove moisture and volatile organic compounds;
Wherein, described step 2 specifically comprises the following steps:
Step 21: the preparation of fluorescent material electrolyte solution: with isopropyl alcohol or isobutanol for solvent, with Mg (NO
3)
2or Al (NO
3)
3for electrolyte, electrolyte is joined in solvent, and make it dissolve completely, make fluorescent material electrolyte solution;
Step 22: the preparation of fluorescent material electrophoresis liquid: add LED fluorescent powder in fluorescent material electrolyte solution, and stirred by blender, make fluorescent material even suspension be dispersed in fluorescent material electrolyte solution, the cation of fluorescent material adsorbing electrolyte and positively charged, form fluorescent material electrophoresis liquid;
Step 23: be deposited on the ITO conductive layer of optical lens by LED fluorescent powder by electrophoretic apparatus, forms phosphor powder layer;
In described step 23, by the substep electrophoretic deposition method of control electricity, LED fluorescent powder is deposited on the ITO conductive layer of optical lens, specifically comprise the following steps: first preset the accessible peak of electricity in electrophoretic apparatus, be then energized, start electrophoresis process; In electrophoresis process, if when the electricity detected reaches the peak preset, then stop electrophoresis process; Wherein, electrophoresis process is that substep carries out electrophoretic deposition: first carry out an electrophoretic deposition fluorescent material, then certain hour is stopped, treat that electrophoresis solution reaches stable equilibrium state again, carry out secondary electrophoretic deposition fluorescent material next time again, repeat this substep electrophoretic deposition process, until phosphor powder layer reaches required thickness.
2. LED fluorescent powder coating processes according to claim 1, is characterized in that: the particle size range of described LED fluorescent powder particle is 4-20um.
3. LED fluorescent powder coating processes according to claim 1, is characterized in that: the supply voltage of described electrophoretic apparatus is between 40V-400V.
4. LED fluorescent powder coating processes according to claim 1, is characterized in that: the time of energising is 1-5 minute.
5. LED fluorescent powder coating processes according to claim 1, is characterized in that: in the preparation of the fluorescent material electrophoresis liquid of described step 22, also add fluorescent material antiprecipitant.
6. LED fluorescent powder coating processes according to claim 1, is characterized in that: described electrolytical concentration range: 0.06g/L-0.4g/L.
7. LED fluorescent powder coating processes according to claim 1, is characterized in that: the concentration range of described LED fluorescent powder particle is: 5g/L-10g/L.
8. LED fluorescent powder coating processes according to claim 1, is characterized in that: described phosphor powder layer thickness range is 10-90um.
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| CN103280509A (en) * | 2013-05-24 | 2013-09-04 | 北京半导体照明科技促进中心 | Powder coating method and method using same for coating LED (light emitting diode) fluorescent powder |
| DE102013109031B4 (en) * | 2013-08-21 | 2021-11-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Process for the production of an optoelectronic semiconductor chip |
| US9206958B2 (en) * | 2013-09-16 | 2015-12-08 | Osram Sylvania Inc. | Thin film wavelength converters and methods for making the same |
| TWI613011B (en) * | 2016-09-30 | 2018-02-01 | 漢邦普淨節能科技有限公司 | Device for coating phosphors and coating method |
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| EP2105976A2 (en) * | 2008-03-26 | 2009-09-30 | Seoul Semiconductor Co., Ltd. | Method and apparatus for coating phosphor, and light emitting diode comprising phosphor coating layer |
| CN101661979A (en) * | 2008-08-28 | 2010-03-03 | 采钰科技股份有限公司 | Semiconductor device and method for fabricating same |
| CN102588752A (en) * | 2011-01-07 | 2012-07-18 | 晶元光电股份有限公司 | Light emitting device |
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| EP2105976A2 (en) * | 2008-03-26 | 2009-09-30 | Seoul Semiconductor Co., Ltd. | Method and apparatus for coating phosphor, and light emitting diode comprising phosphor coating layer |
| CN101661979A (en) * | 2008-08-28 | 2010-03-03 | 采钰科技股份有限公司 | Semiconductor device and method for fabricating same |
| CN102588752A (en) * | 2011-01-07 | 2012-07-18 | 晶元光电股份有限公司 | Light emitting device |
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