CN102945814B - Semiconductor element testing system with rotary test arms - Google Patents
Semiconductor element testing system with rotary test arms Download PDFInfo
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- CN102945814B CN102945814B CN201210402732.4A CN201210402732A CN102945814B CN 102945814 B CN102945814 B CN 102945814B CN 201210402732 A CN201210402732 A CN 201210402732A CN 102945814 B CN102945814 B CN 102945814B
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Abstract
The invention relates to a semiconductor element testing system with rotary test arms. A test site allowing a plurality of testing instruments to be electrically coupled to the testing system comprises a conveying device provided a plurality of bearing seats for bearing objects to be measured, a first test seat positioned in the test site and provided with at least one test position, a second test seat positioned in the test site and provided with at least one test position, a first test arm and a second test arm. The first test arm and the second test arm can run between the conveying device, the first test seat and the second test seat in the way of carrying the objects to the measured, so that two different measurements can be carried out on the same machine through the rotary test arms, or the two test seats are only used for measurement; and as the two test seats can work simultaneously, the time spent during the whole measurement can be reduced, and the test speed can be increased.
Description
Technical field
The present invention, about a kind of semiconductor element test system with revolving type test arm, especially a kind ofly runs the test macro be alternatively between two test benches by revolving type test arm portable semiconductor element.
Background technology
Generally complete IC manufacturing, mainly comprises integrated circuit (IC) design and the wafer manufacture at initial stage, the test of the fabrication in mid-term, and the final test in later stage and product turnout.While semiconductor element day by day microminiaturization, the processing procedure of integrated circuit is quite important in each process stage.Wherein, testing electrical property can carry out testing to guarantee the normal operation of product energy for various semiconductor element electric parameter, the test of real border is then in test macro equipment, the test event different according to product intended real border by public template die and be loaded into different test programs or different customized tester of arranging in pairs or groups, and confirms that semiconductor element meets required specification.
The design that current semiconductor test machine station is tested in back segment there is innovation more, for example: automation system functions test machine (ASFT) Model 3240,3260 that the applicant ChromaATE Inc. sells provides a large amount of production facility of many group PCB1evel parallel testings, most different encapsulated type can be coordinated to comprise traditional QFP, TQFP, μ BGA, PGA and CSP encapsulation, by structure such as design multi-test point position, many waggons mechanism etc., increase the output (Throughput) of test.
Moreover, if same test bench imposes different test signals often need circuit through complexity and programming, and each determinand testing time often draw long.Time is money in test industry, the testing cost of each determinand calculates with testing time unit, so wanting of all trying one's best of industry in the saving testing time, design better testing process and make an effort, the most direct mode is exactly adopt more to simplify and the high board of output.
Lift an example, please refer to and Figure 1 shows that a known board partial block schematic diagram, this example is for two groups of test sections (Sites), each group test section all has conveying device, test arm, test bench and test board, as shown in the figure, first test section 11 has conveying device 111, first test arm 112, first test bench 113 and the first test board 1131, and the second test section 12 has conveying device 121, second test arm 122, second test bench 123 and the second test board 1231.
For first group of test section, after element under test must be carried to the first test bench 113 by conveying device 111 by testing process, testing process by the first test arm 112 presses down after packing element under test, testing time foundation test program is complicated and determine, each group of test section is all identical, is completed to be carried in conveying device 111 by the first test bench 113 by complete survey element under test to carry out grade separation by follow-up mechanism again.According to the above, if when having four groups of test sections, namely four groups of test arms and at least one group is needed to be responsible for the carrying arm of element under test grade separation, even if test arm can be responsible for moving the task of element under test and save the cost of carrying arm, relative just must sacrifice test arm simple function and be increased because of portable in the time of three dimensions movement.
And as shown in the above, partial test board is constantly carried in test process and is waited for and causes many time wastes, if time that carrying spends can be saved significantly and retain the elasticity of board, in good time changes testing process according to element under test test condition, can improve the production capacity delivery rate of measuring semiconductor element.
Summary of the invention
Therefore, inventor expects, if one group can be used by the revolving type test arm of time difference control between two test benches in a board, allow semiconductor element after the first test bench has been tested, directly to be passed to rapidly on the second test bench or directly portable carries out subsequent classification, and the same time, original position can be passed to next precalculated position by this revolving type test arm in the lump in the semiconductor element of the second test bench or holding fix, reduced when difference is tested because carrying the time spent by this overlapping replacement mode, and under mutually comparing with traditional carrying arm, more can improve production capacity delivery rate, should be a best solution.
The object of the present invention is to provide a kind of semiconductor element test system with revolving type test arm, it can reduce because carrying the time spent when difference is tested, raising production capacity delivery rate.
The semiconductor element test system with revolving type test arm provided by the invention, by the multiple test signal of electric property coupling to a test section of test macro, comprises: one has multiple load bearing seat with the conveying device of bearing semiconductor element; One first test bench, is positioned at this test section, arbitrary electric property coupling of this first test bench and multiple test signal; One second test bench, is positioned at this test section and adjacent to this first test bench, arbitrary electric property coupling of this second test bench and multiple test signal; One first test arm, runs between this conveying device, the first test bench, the second test bench in order to portable semiconductor element; And one second test arm, run between this conveying device, the first test bench, the second test bench in order to portable semiconductor element.
More particularly, this first test bench and the second test bench are respectively coupled to test signal independently instrument.
More particularly, this first test arm and the second test arm is overlapping runs between this conveying device, the first test bench and the second test bench, to replace semiconductor element that is to be measured or that be completed in the position of this load bearing seat and this first test bench or the second test bench.
More particularly, this first test arm and the second test arm by one group of Y-Z axial displacement mechanism, make this first test arm and the second test arm in Y direction move and portable is to be measured or the semiconductor element that is completed between this load bearing seat and the position of this first test bench and the second test bench.
More particularly, there is away from the end positions of this conveying device a feed zone and a sub-material district of bearing semiconductor element respectively.
Beneficial effect of the present invention is, this has the semiconductor element test system of revolving type test arm, at least one conveying device with multiple load bearing seat and multiple test bench are set on board, each test bench couples different electric signals and produces instrument, to arrange in pairs or groups one group of revolving type test arm, one of multiple test bench is placed in respectively by the test arm portable determinand by same actuating force, give each test bench alone to the test event of determinand, distributed by the overlapping replacement testing time and relieve pickup, the time of test wait, solving the single test bench testing time waits for long problem.
This invention also solves the inflexible limit commonly using the corresponding test bench of a test arm, allow the test bench that test arm can be corresponding different, enable determinand accept different test signals, allow test event have more various selectivity.
Accompanying drawing explanation
Fig. 1: for commonly using semiconductor element test schematic diagram;
Fig. 2: for the present invention has the enforcement Organization Chart of the semiconductor element test system of revolving type test arm;
Fig. 3: for the present invention has the revolving type test arm operational range schematic diagram of the semiconductor element test system of revolving type test arm.
Fig. 4: implement illustration for the present invention has first of the semiconductor element test system of revolving type test arm; And
Fig. 5: implement illustration for the present invention has second of the semiconductor element test system of revolving type test arm.
Embodiment
Have about aforementioned and other technology contents, feature and effect of the present invention, in the detailed description of following cooperation with reference to graphic preferred embodiment, can clearly present.
Refer to Fig. 2, Fig. 3, there is for the present invention is a kind of enforcement Organization Chart and the revolving type test arm operational range schematic diagram of the semiconductor element test system of revolving type test arm, from in figure, the present embodiment is applied to test determinand to be needed to apply different test signals, and produce test signal with existing instrument and equipment, by the aforementioned multiple instrument and equipment of electric property coupling to the test section 21 of semiconductor element test system, this test section 21 and conveying device 23 are between feed zone 26 and sub-material district 27, there is in this test section 21 first test bench 211 and the second test bench 212.The semiconductor element that conveying device 23 is responsible for repeatedly carrying to be measured and complete survey is between feed zone 26 and sub-material district 27.
Wherein, first test bench 211 has the first test position, and the first test position and the arbitrary of multiple tester are electrically conducted, in the present embodiment, first test position and the first tester 2111 electric property coupling, and the second test bench 212 also has arbitrary the second test position be electrically conducted with multiple tester, in the present embodiment, second test position and the second tester 2121 electric property coupling, wherein the first test position and the second test position are for putting semiconductor element 25 to be measured.This first test position and the second test position can put single or multiple semiconductor element.
Be only signal the present embodiment is graphic, the running route of this first test arm 221 and this second test arm 222 is covering first test bench 211, second test bench 212 and conveying device 23, portable, to place semiconductor element 25 to be measured.And this first test arm 221 is a revolving type test arm 22 with this second test arm 222, therefore when starting this revolving type test arm 22, first test arm 221 and the second test arm 222 can be rotated overlapping movement, to capture, to draw or to place semiconductor element 25.In operation, revolving type test arm 22 runs the overlapping pattern of different operations, for example: the operation allowing two groups of arms rotate by gear train, also can be driven by independently power each group of arm was run by the time difference, or adopt the modes such as motor, because this hardware controlled techniques belongs to, to know this skill personage known, therefore do not repeat one by one.
Because the second test bench 212 is be disposed adjacent with the first test bench 211, and the first test bench 211 is also disposed adjacent with the conveying device 23 with multiple load bearing seat 231, therefore when revolving type test arm 22 to be displaced into by Y-Z axial displacement mechanism 24 between conveying device 23 and the first test bench 211 or the second test bench 212, due to conveying device 23 and the first test bench 211, second test bench 212 adjacent, semiconductor element 25 that is to be measured or that be completed can be replaced between this load bearing seat 231 and the position of this first test bench 211 and the second test bench 212.
As Fig. 3 and Fig. 4, according to one of better embodiment, only need through a tester signal according to each determinand of semiconductor element test project condition hypothesis, first test bench 211 and the second test bench 212 can couple two testers providing signal identical 2111,2121, or couple the tester signal exported for a pair two.First test arm 221 by planning operation between this conveying device 23, first test bench 211, and the second test arm 222 runs between this conveying device 23, second test bench 212, therefore, when the first test bench 211 is identical with the test signal that the second test bench 212 provides, each test arm and test bench i.e. two two pairings.First test arm 221 can move to above load bearing seat 231 by the turn of revolving type test arm 22, semiconductor element 25 to be measured on load bearing seat 231 has been got, return determinand is seated in the first test bench 211 the first test position on, and again the first test arm 221 is moved after being completed, the semiconductor element 25 being about to be completed is carried on load bearing seat 231; And according to the time difference set, the first test arm 221, second test arm 222 can interlock operate time, this second test arm 222 and the second test bench 212 operation workflow and the first test arm 221 also with.
Please refer to Fig. 5 again, according to better embodiment two, need through two different tester signals according to each determinand of semiconductor element test project condition hypothesis, the first test bench 211 and the second test bench 212 will couple the tester of different signal.Sequencing for convenience of description, illustrates semiconductor element 25 to be measured can be subdivided into the first semiconductor element 250 to be measured and the second semiconductor element 251 to be measured in back segment.
So, when the first test bench 211 and the second test bench 212 impose test event different time, make the first semiconductor element 250 to be measured on the first test arm 221 portable load bearing seat 231 by this revolving type test arm 22 of turn and be placed on the first test position of the first test bench 211, now the second test arm 222 is by preparation or to have moved to above load bearing seat 231 and to have got the second semiconductor element 251 to be measured.First semiconductor element 250 to be measured will rest on for first test bench 211 a period of time, the time in normally a few second, depending on the first tester 2111 test program, after the first test bench 211 position measurement, first test arm 221 with the extremely short time by the test position of the first semiconductor element 250 portable to the second test bench 212 to be measured, again impose test signal by the second tester 2121, at the same time the second test arm 222 equally with the extremely short time by the test position of the second semiconductor element 251 to be measured by load bearing seat 231 portable to the first test bench 211.At this time point, the first semiconductor element 250, second to be measured semiconductor element 251 to be measured lays respectively at the first test bench 211, second test bench 212 acceptance test.
After above-mentioned test completes, first semiconductor element 250 to be measured is placed to load bearing seat 231 by the test position portable of the first test arm 221 from the second test bench 212, and the second semiconductor element 251 to be measured places acceptance test by the second test arm 222 from test position portable to the second test bench 212 within the extremely short time of the first test bench 211.And the first test arm 221 is after placement completes the first semiconductor element 250 to be measured, another load bearing seat will move to the semiconductor element to be measured 25 that below the first test arm 221, pickup one is new, portable moves to the first test bench 211 and accepts the first tester 2121 tester and impose test signal rapidly again, and the revolving type gone round and begun again by the first test arm 221, second test arm 222 is tested.
In this better enforcement design, relatively far away to the distance of load bearing seat 231 with the second test bench 212, so traveling time is longer, so testing process will be distributed in the second tester 2121 for a long time, the second test bench 212 is allowed to add the testing time of total time close to the second tester 2121 of the first tester test 2111 to load bearing seat 231 and test arm pickup time.
According to above mechanism design of the present invention, by following cut-and-try formula Max.UPH=(3600/ (B+C)) * N, production capacity rate can be learnt by outline; Wherein parameter B is time cycle of operation (Cycle Time) of test arm, parameter C is authority time (Index Time), Parameter N is determinand quantity (Device Number).
Be less than or equal to 1.9 seconds when the input signal testing time of determinand, the parameter of B namely with 1.9 substitute into computings, C for authority time be 0.5 second, determinand N be 4 time, (3600 seconds) per hour testable quantity and get final product:
From above-mentioned operation result, the more known test arm of actual operation delivery rate that the present invention can obtain comes better, and under the same testing time, the present invention can complete the test of more determinand.
A kind of semiconductor element test system with revolving type test arm provided by the present invention, when mutually comparing with other located by prior art, has more standby following advantages:
The present invention arranges at least one conveying device with multiple load bearing seat and multiple test bench on board, each test bench couples different electric signals and produces instrument, to arrange in pairs or groups one group of revolving type test arm, one of multiple test bench is placed in respectively by different test arm portable determinands, give each test bench alone to the test event of determinand, distribute by the overlapping replacement testing time time of pickup, test wait of relieving, solving the single test bench testing time waits for long problem.
The present invention can solve the inflexible limit commonly using the corresponding test bench of a test arm, allows the test bench that a test arm can be corresponding different, enables determinand accept different test signals, allows test event have more various selectivity.
Two test benches proposed by the invention, when the test signal that determinand accepts is identical, significantly can improve test speed.
By the above detailed description of preferred embodiments, it is desirable to clearly to describe feature of the present invention and spirit, and not with above-mentioned disclosed preferred embodiment, category of the present invention is limited.On the contrary, its objective is wish to contain various change and tool equality be arranged in the present invention institute in the category of the scope of the claims applied for.
Claims (3)
1. have a semiconductor element test system for revolving type test arm, it is characterized in that, by the multiple test signal of electric property coupling to a test section of test macro, described test macro comprises:
One has multiple load bearing seat with the conveying device of bearing semiconductor element;
One first test bench, is positioned at this test section, any one electric property coupling of this first test bench and multiple test signal;
One second test bench, is positioned at this test section and adjacent to this first test bench, any one electric property coupling of this second test bench and multiple test signal;
One first test arm, runs between this conveying device, the first test bench, the second test bench in order to portable semiconductor element; And
One second test arm, runs between this conveying device, the first test bench, the second test bench in order to portable semiconductor element;
Wherein, this first test bench and the second test bench are respectively coupled to independently tests signal, described signal of independently testing comes from same tester or from different testers, this first test arm and the second test arm is overlapping runs on this conveying device, between the first test bench and the second test bench, this first test arm by one first semiconductor element to be measured from this first test bench portable to this second test bench time, this second test arm by one second semiconductor element to be measured from this load bearing seat portable to this first test bench, this first test arm by this first semiconductor element to be measured from this second test bench portable to this load bearing seat time, this second test arm by this second semiconductor element to be measured from this first test bench portable to this second test bench.
2. a kind of semiconductor element test system with revolving type test arm as claimed in claim 1, it is characterized in that, this first test arm and the second test arm by one group of Y-Z axial displacement mechanism, make this first test arm and the second test arm in Y direction move and portable is to be measured or the semiconductor element that is completed between this load bearing seat and the position of this first test bench and the second test bench.
3. a kind of semiconductor element test system with revolving type test arm as claimed in claim 1, it is characterized in that, the end positions away from this conveying device has a feed zone and a sub-material district of bearing semiconductor element respectively.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210402732.4A CN102945814B (en) | 2012-10-22 | 2012-10-22 | Semiconductor element testing system with rotary test arms |
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| CN201210402732.4A CN102945814B (en) | 2012-10-22 | 2012-10-22 | Semiconductor element testing system with rotary test arms |
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| CN104459505B (en) * | 2014-11-21 | 2017-11-24 | 格科微电子（上海）有限公司 | The wafer-level test system and method for imaging sensor |
| CN106226676A (en) * | 2016-07-05 | 2016-12-14 | 南通富士通微电子股份有限公司 | A kind of chip parameter test system |
| CN108789405B (en) * | 2018-05-28 | 2021-04-27 | 广东科学技术职业学院 | Automatic test path planning method and system based on six-axis mechanical arm |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2567767Y (en) * | 2002-06-25 | 2003-08-20 | 竑腾科技股份有限公司 | Testing machine with continuous double-testing region |
| CN200989932Y (en) * | 2004-01-29 | 2007-12-12 | 霍华德·罗伯茨 | Test system for reducing index time |
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| TWI235446B (en) * | 2004-04-19 | 2005-07-01 | Powerchip Semiconductor Corp | Auto recovery wafer testing apparatus and wafer testing method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2567767Y (en) * | 2002-06-25 | 2003-08-20 | 竑腾科技股份有限公司 | Testing machine with continuous double-testing region |
| CN200989932Y (en) * | 2004-01-29 | 2007-12-12 | 霍华德·罗伯茨 | Test system for reducing index time |
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