TWI235446B - Auto recovery wafer testing apparatus and wafer testing method - Google Patents

Auto recovery wafer testing apparatus and wafer testing method Download PDF

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Publication number
TWI235446B
TWI235446B TW93110813A TW93110813A TWI235446B TW I235446 B TWI235446 B TW I235446B TW 93110813 A TW93110813 A TW 93110813A TW 93110813 A TW93110813 A TW 93110813A TW I235446 B TWI235446 B TW I235446B
Authority
TW
Taiwan
Prior art keywords
testing
wafer testing
wafer
tester
main system
Prior art date
Application number
TW93110813A
Other versions
TW200536033A (en
Inventor
Chiou-Ping Wu
Hsiu-Min Lin
Original Assignee
Powerchip Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powerchip Semiconductor Corp filed Critical Powerchip Semiconductor Corp
Priority to TW93110813A priority Critical patent/TWI235446B/en
Application granted granted Critical
Publication of TWI235446B publication Critical patent/TWI235446B/en
Publication of TW200536033A publication Critical patent/TW200536033A/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67288Monitoring of warpage, curvature, damage, defects or the like
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834Automated test systems [ATE]; using microprocessors or computers

Abstract

Auto recovery wafer testing apparatus and wafer testing method are provided. The wafer testing apparatus comprises a main system, a tester and a real time accessing module. The main system controls the process of the wafer testing. Tester is coupled to the main system for receiving commands from main system to perform testing to a plurality of chips, and output a plurality of testing data correspondingly. The real time accessing module is coupled to the tester for accessing testing data simultaneously. When the testing is interrupted, the tester can produce an auto recovery data according to the testing data saved in the real time accessing module, and continue testing to the chips that had not been tested. The wafer testing apparatus and the wafer testing method can save time of testing and improve the production efficiency.
TW93110813A 2004-04-19 2004-04-19 Auto recovery wafer testing apparatus and wafer testing method TWI235446B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93110813A TWI235446B (en) 2004-04-19 2004-04-19 Auto recovery wafer testing apparatus and wafer testing method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW93110813A TWI235446B (en) 2004-04-19 2004-04-19 Auto recovery wafer testing apparatus and wafer testing method
US10/710,670 US6963213B1 (en) 2004-04-19 2004-07-28 Auto-recovery wafer testing apparatus and wafer testing method
US11/160,661 US7164283B2 (en) 2004-04-19 2005-07-05 Auto-recovery wafer testing apparatus and wafer testing method

Publications (2)

Publication Number Publication Date
TWI235446B true TWI235446B (en) 2005-07-01
TW200536033A TW200536033A (en) 2005-11-01

Family

ID=35095646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93110813A TWI235446B (en) 2004-04-19 2004-04-19 Auto recovery wafer testing apparatus and wafer testing method

Country Status (2)

Country Link
US (2) US6963213B1 (en)
TW (1) TWI235446B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103207360A (en) * 2012-01-12 2013-07-17 苏州恒源太阳能电气机械有限公司 Vacuum attenuation box
CN103390538B (en) * 2012-05-08 2016-02-03 中芯国际集成电路制造(上海)有限公司 District lithography machine method and system for real-time dispatch
CN102945814B (en) * 2012-10-22 2015-07-22 致茂电子(苏州)有限公司 Semiconductor element testing system with rotary test arms
CN104102174B (en) * 2014-06-30 2016-09-07 北京七星华创电子股份有限公司 The latter method of a semiconductor device recovery software reset state

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW465234B (en) * 1997-02-18 2001-11-21 Discovision Ass Single chip VLSI implementation of a digital receiver employing orthogonal frequency division multiplexing
US6498999B1 (en) * 2000-07-24 2002-12-24 Lsi Logic Corporation Method and apparatus for design verification of an integrated circuit using a simulation test bench environment
US6745345B2 (en) * 2000-12-04 2004-06-01 International Business Machines Corporation Method for testing a computer bus using a bridge chip having a freeze-on-error option

Also Published As

Publication number Publication date
US20050231190A1 (en) 2005-10-20
US20050235181A1 (en) 2005-10-20
US7164283B2 (en) 2007-01-16
US6963213B1 (en) 2005-11-08
TW200536033A (en) 2005-11-01

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