CN102923643A - Method for producing novel micro-fluidic chip based on industrial standard printed circuit board process - Google Patents
Method for producing novel micro-fluidic chip based on industrial standard printed circuit board process Download PDFInfo
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- CN102923643A CN102923643A CN2012104460024A CN201210446002A CN102923643A CN 102923643 A CN102923643 A CN 102923643A CN 2012104460024 A CN2012104460024 A CN 2012104460024A CN 201210446002 A CN201210446002 A CN 201210446002A CN 102923643 A CN102923643 A CN 102923643A
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Abstract
The invention relates to a method for producing a novel micro-fluidic chip based on an industrial standard printed circuit board (PCB) process. The method comprises steps of designing a PCB copper-clad geometrical shape in accordance with a micro channel structure of the micro-fluidic chip; drawing a PCB picture in accordance with the copper-clad geometrical shape by using standard PCB design software; according to the PCB picture, obtaining a micro-fluidic chip body of the PCB through direct processing in a PCB factory; coating ultraviolet curing adhesive in a spin mode on a glass covering plate; agglutinating the copper-clad surface of the micro-fluidic chip body of the PCB with the adhesive-coating surface of the glass covering plate; and placing the agglutinated micro-fluidic chip body of the PCB and glass covering plate to an ultraviolet curing box for curing. An inlet and an outlet of the micro-fluidic chip and a micro channel are processed and formed, the standardization degree is high, the yield rate is high, the cost is low, the channel is applicable to an organic solvent, and the production environment is independent of ultra-clean and high-temperature conditions. The method is suitable to industrial large-scale batch production and scientific small-scale trial-production.
Description
Technical field
The present invention relates to a kind of preparation method that is applicable to the standby new microfluidic chip of microemulsion dripping, belong to the manufacture technology field of micro-fluidic chip.
Background technology
At present, microfluidic system has become an important branch of MEMS, and it is little to have size, dead volume is little, and is low in energy consumption, and control accuracy is high, the advantages such as fast response time are mainly used in the aspects such as biological detection, microemulsion moulding, the preparation of advanced function material.
The preparation method of more common micro-fluidic chip mainly contains three kinds, is respectively etching moulding, soft lithographic casting, glass capillary assembling.Document 1(Physics of Fluids, 2005,17:013601) the silicon substrate microchannel technique of report, adopt the body silicon etching process to make, the processing dimension depth-to-width ratio is large, and machining accuracy is high, and the microchannel devices that obtains can high pressure resistant (13.6 standard atmospheric pressures).Document 2(Science, 2005,308:537-541) reported the preparation technology of glass capillary microchannel, after circular glass capillary heating, draw out a conical geometric shape, this circular glass capillary that is accurately drawn is assembled in the square capillary glass tube, has just formed miniflow convergent type micro-fluidic chip.Chinese invention patent CN102580799A discloses a kind of glass capillary assembly technology, at first the channel design according to design cuts out corresponding sheet glass assembly at slide, it is built channel design at substrate, with the cover plate bonding, circular glass capillary and polyfluortetraethylene pipe are assembled to assembly sheet glass passage, thereby form miniflow convergent type micro-fluidic chip.Document 3(Analytical Chemistry, 1998,70 (23): 4974-4984) reported the preparation method of a kind of soft lithographic casting dimethyl silicone polymer (PDMS) microchannel, utilize photoetching technique to make casting mould at silicon chip, again the PDMS prepolymer is cast on the mould and solidifies, then PDMS is taken off, and with the glass bonding, thereby form micro-fluidic chip.
Etching method of forming high cost, yield rate is low, the process-cycle is long, and the unit of processing of domestic generation is few, with the anchor clamps that need the otherwise designed special use being connected of exterior line; The glass capillary assembling method is based on making by hand, and repeatability is relatively poor; Soft lithographic casting good reproducibility is made simply, but because the polymeric materials such as PDMS have gas permeability, and yielding, the more important thing is that PDMS and multiple oil phase organic solvent mix, so that the application of PDMS micro-fluidic chip is restricted.
Summary of the invention
The object of the invention is to the problem that exists in the existing facture of microchip, propose a kind of novel manufacture craft, this technique is based on printed circuit board (PCB) (PCB) technology of industrial standard, and the mating surface treatment process is made micro-fluidic chip; The micro-fluidic chip high conformity of making, the lead time is short, and cost of manufacture is low, can be mass, and prepared micro-fluidic chip is applicable to the preparation method of the micro-fluidic chip of multiple organic solvent.
Counting mode of the present invention: a kind of preparation method of micro-fluidic chip comprises the steps:
(1) according to the MCA and the fluid access hole that design in advance micro-fluidic chip, the geometry of the pcb board of design micro-fluidic chip; Utilize the pcb board design software of standard, draw pcb board figure, wherein, the width of microchannel is the 150-1000 micron, 1.2 to 3 millimeters of fluid discrepancy through-hole diameters;
(2) according to draw pcb board figure on the base material that covers 15 to 90 microns of copper thicknesses of choosing with the MCA etching out, get simultaneously the fluid through hole of coming in and going out, then carry out gold-platedly, obtain the micro-fluidic chip main body; Wherein, gold plating thickness is 1 to 3 micron; Base material thickness is 0.6 to 3 millimeter;
(3) get the ultra-violet curing glue of 450-650 microlitre, use sol evenning machine in slide surface, take even glue speed as 1500-5000 rev/min, time 30-60 carries out uniform gluing second;
(4) the micro-fluidic chip main body that the slide sticky surface that obtains that step 3 is prepared and step 2 prepare is fitted, and applies uniform load and clamps;
(5) micro-fluidic chip main body and slide being placed under clamped condition in the ultra-violet curing box, is 4 to 400 watts at power, solidifies 1 minute to 2 hours, leaves standstill after the taking-up 24 hours, namely obtains micro-fluidic chip.
Further, described step 3 can also for: get the ultra-violet curing glue of 450-650 microlitre, with after ethanol mixes take volume ratio as 1:1-10:1, use sol evenning machine in slide surface in ultra-violet curing glue, take even glue speed as 1500-5000 rev/min, time 30-60 carries out uniform gluing second.
Further, described base material comprises paper base material, glass cloth base material, epoxy resin base material, polyester resin base material, heat-resisting thermoplastic matrix or flexible copper-clad paper tinsel base material.
Further, described slide is soda-lime glass, potash glass, magnalium glass, lead glass, Pyrex or quartz glass.
Preparation method provided by the invention has the following advantages:
1, the used material of the present invention is the slide of standard model and the pcb board based on industrial standard that can be mass, and PCB process standardization degree is high, and yield rate is high, and technological parameter is easy to adjust, and cost is low, and the organic solvent-resistant corrosion, is difficult for adsorption sample.
2, the production environment that the present invention relates to does not rely on ultra-clean production environment, can finish in common laboratory.
3, the bonding techniques of taking ultra-violet curing that the present invention relates to does not need ultra-clean and hot environment.
The together machine-shaping of the entrance and exit of the micro-fluidic chip that 4, the present invention relates to and microchannel has avoided chip to cause subsiding of border, microchannel in the initial and ending phase of boring, has also avoided the cracked situation of glass.
Description of drawings
Fig. 1 is the facture of microchip process chart based on printed-board technology.
Among the figure: 1-PCB plate figure; The 2-base material; 3-PCB plate micro-fluidic chip main body; The 4-glass cover-plate; 5-ultra-violet curing glue.
Fig. 2 is the standard industry pcb board figure among the embodiment 1.
Among the figure: 6-external fluid phase entrance; Phase fluid entrance in the 7-; 8-miniflow aggregation infrastructure; The 9-collecting pit; The 10-fluid issuing.
Fig. 3 is that microemulsion drops in miniflow aggregation infrastructure place's generation figure among the embodiment 1.
Fig. 4 is the standard industry pcb board figure of the parallel channel micro-fluidic chip among the embodiment 3.
Among the figure: 11-microchannel 1; 12-microchannel 2; 13-microchannel 3; 14-microchannel 4.
Fig. 5 is the size distribution plot that the parallel channel generates the micro emulsion drop among the embodiment 3.
The specific embodiment
Employed experimental technique is conventional method if no special instructions among the following embodiment, and general PCB processing enterprise all can finish.
Used material, reagent etc. if no special instructions, all can obtain from commercial channels among the following embodiment.
Technological process among the following embodiment if no special instructions, all as shown in Figure 1.According to the MCA of micro-fluidic chip, pcb board Fig. 1 of copper geometry is covered in design, and dash area is for covering the copper zone, and white portion is the microchannel that the etching copper layer forms afterwards, and black part is divided into the stream socket through hole; Obtain pcb board micro-fluidic chip main body 3 according to pcb board Fig. 1 in base material 2 processing by the printed circuit plate mill; Spin coating ultra-violet curing glue 5 on glass cover-plate 4; The coated face that covers copper face and glass cover-plate 4 of pcb board micro-fluidic chip main body 3 is bonding; Pcb board micro-fluidic chip main body 3 after bonding is put into the ultra-violet curing box with glass cover-plate 4 solidify, finish the making of micro-fluidic chip.
Embodiment 1, miniflow aggregation infrastructure facture of microchip oil-in-water microemulsion drip
The channel design of design micro-fluidic chip is the miniflow aggregation infrastructure, and shown among Fig. 28, the width of microchannel is 300 microns in this structure.Dash area is for covering the copper zone among Fig. 2, and white portion is the microchannel that the etching copper layer forms afterwards, and black part is divided into the stream socket through hole.External fluid phase entrance 6 and interior phase fluid entrance 7 are of a size of 1.2 millimeters among Fig. 2, and fluid issuing 10 is of a size of 3 millimeters.Collecting pit 9 is used for observing the micro emulsion drop of generation among Fig. 2, and it is of a size of 18 millimeters * 14 millimeters.The pcb board overall dimensions of this design is 76.2 millimeters * 25.4 millimeters, measure-alike with standard Pyrex slide, the epoxy resin base material thickness is 1 millimeter, covering copper thickness is 70 microns, gold plating thickness is 3 microns, and according to the technological process of Fig. 1, ultra-violet curing glue (glue and ethanol volume ratio are 2:1) 650 microlitres after using sol evenning machine to dilute carry out spin coating in slide surface, even glue speed is 3000 rev/mins, and the even glue time is 40 seconds.After the bonding, apply uniform load pcb board and slide are clamped, under clamped condition, micro-fluidic chip is placed on power and is in 4 watts the ultra-violet curing box and solidified 2 hours, left standstill 24 hours.Be gateway place that the syringe needle of 20G be bonded in fluid with epoxide-resin glue with model at the back side of micro-fluidic chip, using internal diameter is that 0.86 millimeter plastic tube links to each other introducing and draws fluid with syringe needle.
Use the structure fabrication oil-in-water microemulsion of Fig. 2 to drip, at first hydrophilic treated is carried out in the microchannel, hydrophilizing agent (3-Aminoprogyl triethoxysilane) is passed into the microchannel seal and left standstill 2 hours, pass into again washed with de-ionized water.In paraffin oil, add polymer EM90(1 wt%), and use the whirlpool agitator that it is fully mixed, as interior phase fluid.In water, add polyvinyl alcohol (10 wt %), be heated to 80 ℃ and stir and to make its dissolving, as external fluid phase.Inject micro-fluidic chip with interior with external fluid phase respectively with micro-injection pump, generate the micro emulsion drop at miniflow aggregation infrastructure place, can examine under a microscope the micro emulsion drop in the collecting pit.
The MCA of design micro-fluidic chip is the miniflow aggregation infrastructure, and as shown in Figure 2, the width of microchannel is 150 microns in this structure.External fluid phase entrance 6 and interior phase fluid entrance 7 are of a size of 1.2 millimeters among Fig. 2; Fluid issuing 10 is of a size of 3 millimeters.The pcb board overall dimensions of this design is 76.2 millimeters * 25.4 millimeters, measure-alike with the standard quartz glass slide, flexible copper-clad paper tinsel base material thickness is 0.6 millimeter, covering copper thickness is 15 microns, gold plating thickness is 2 microns, and according to the technological process of Fig. 1, ultra-violet curing glue (glue and ethanol volume ratio are 1:1) 550 microlitres after using sol evenning machine to dilute carry out spin coating in slide surface, even glue speed is 1500 rev/mins, and the even glue time is 35 seconds.After the bonding, apply uniform load pcb board and slide are clamped, under clamped condition, micro-fluidic chip is placed on power and is in 100 watts the ultra-violet curing box and solidified 10 minutes, left standstill 24 hours.Be gateway place that the syringe needle of 20G be bonded in fluid with epoxide-resin glue with model at the back side of micro-fluidic chip, using internal diameter is that 0.86 millimeter plastic tube links to each other introducing and draws fluid with syringe needle.
Use the structure fabrication water in oil microemulsion of Fig. 2 to drip, in silicone oil, add DOW CORNING 749(2 wt%), and use the whirlpool agitator that it is fully mixed, as external fluid phase.Use deionized water as interior phase fluid.Use micro-injection pump to inject micro-fluidic chip with interior with external fluid phase respectively, generate the micro emulsion drop at miniflow aggregation infrastructure place.
The making of embodiment 3, parallel channel micro-fluidic chip
The process chart that this embodiment makes as shown in Figure 1
The design micro-fluidic chip is comprised of four parallel channels with miniflow aggregation infrastructure, and as shown in Figure 4, dash area is for covering the copper zone among Fig. 4, and white portion is the microchannel that the etching copper layer forms afterwards, and black part is divided into the stream socket through hole.The pcb board overall dimensions of this design is 75 millimeters * 38 millimeters, measure-alike with another kind of standard aluminum magnesium glass slide, the polyester resin base material thickness is 3 millimeters, covering copper thickness is 90 microns, and gold plating thickness is 1 micron, and external fluid phase entrance 6 and interior phase fluid entrance 7 are of a size of 2 millimeters, technological process according to Fig. 1, use sol evenning machine that ultra-violet curing glue 450 microlitres are carried out spin coating in slide surface, even glue speed is 5000 rev/mins, and the even glue time is 30 seconds.After the bonding, apply uniform load pcb board and slide are clamped, under clamped condition, micro-fluidic chip is placed on power and is in 400 watts the ultra-violet curing box and solidified 1 minute, left standstill 24 hours.Be gateway place that the syringe needle of 20G be bonded in fluid with epoxide-resin glue with model at the back side of micro-fluidic chip, using internal diameter is that 0.86 millimeter plastic tube links to each other introducing and draws fluid with syringe needle.
Use the structure fabrication oil-in-water microemulsion of Fig. 4 to drip, at first hydrophilic treated is carried out in the microchannel, hydrophilizing agent (3-Aminoprogyl triethoxysilane) is passed into the microchannel seal and left standstill 2 hours, pass into again washed with de-ionized water.In paraffin oil, add polymer EM90(1 wt%), and use the whirlpool agitator that it is fully mixed, as interior phase fluid.In water, add polyvinyl alcohol (10 wt %), be heated to 80 ℃ and stir and to make its dissolving, as external fluid phase.Use micro-injection pump to inject micro-fluidic chip with interior with external fluid phase respectively, generate the micro emulsion drop at miniflow aggregation infrastructure place.Under the same conditions, the production efficiency of parallel channel micro-fluidic chip can reach four times among the embodiment 1, has greatly improved production efficiency.
Fig. 5 be the micro-fluidic chip made of present embodiment external fluid phase 1000 microlitres/hour, interior phase fluid 300 microlitres/hour flow under, the parallel channel generates the size distribution plot of micro emulsion drop, can find out that drop has good homogeneity.
Embodiment 4, miniflow aggregation infrastructure facture of microchip water in oil microemulsion drip
The MCA of design micro-fluidic chip is the miniflow aggregation infrastructure, and the width of microchannel is 150 microns in this structure.External fluid phase entrance and interior phase fluid entrance are of a size of 1.2 millimeters; Fluid issuing is of a size of 3 millimeters.The pcb board overall dimensions of this design is 76.2 millimeters * 25.4 millimeters, measure-alike with standard potash glass slide, paper base material thickness is 0.6 millimeter, covering copper thickness is 15 microns, gold plating thickness is 3 microns, and according to the technological process of Fig. 1, ultra-violet curing glue (glue and ethanol volume ratio are 10:1) 600 microlitres after using sol evenning machine to dilute carry out spin coating in the soda-lime glass slide surface, even glue speed is 4500 rev/mins, and the even glue time is 45 seconds.After the bonding, apply uniform load pcb board and slide are clamped, under clamped condition, micro-fluidic chip is placed on power and is in 20 watts the ultra-violet curing box and solidified 1.5 hours, left standstill 24 hours.Be gateway place that the syringe needle of 20G be bonded in fluid with epoxide-resin glue with model at the back side of micro-fluidic chip, using internal diameter is that 0.86 millimeter plastic tube links to each other introducing and draws fluid with syringe needle.
In silicone oil, add DOW CORNING 749(2 wt%), and use the whirlpool agitator that it is fully mixed, as external fluid phase.Use deionized water as interior phase fluid.Use micro-injection pump to inject micro-fluidic chip with interior with external fluid phase respectively, generate the micro emulsion drop at miniflow aggregation infrastructure place.
The making of embodiment 5, parallel channel micro-fluidic chip
The design micro-fluidic chip is comprised of four parallel channels with miniflow aggregation infrastructure, the pcb board overall dimensions of this design is 75 millimeters * 38 millimeters, measure-alike with another kind of standard soda-lime glass slide, the glass cloth base material thickness is 3 millimeters, covering copper thickness is 90 microns, gold plating thickness is 1 micron, external fluid phase entrance 6 and interior phase fluid entrance 7 are of a size of 2 millimeters, technological process according to Fig. 1, use sol evenning machine ultra-violet curing glue 500 microlitres to carry out spin coating in slide surface, even glue speed is 2000 rev/mins, and the even glue time is 60 seconds.After the bonding, apply uniform load pcb board and slide are clamped, under clamped condition, micro-fluidic chip is placed on power and is in 200 watts the ultra-violet curing box and solidified 0.5 hour, left standstill 24 hours.Be gateway place that the syringe needle of 20G be bonded in fluid with epoxide-resin glue with model at the back side of micro-fluidic chip, using internal diameter is that 0.86 millimeter plastic tube links to each other introducing and draws fluid with syringe needle.
At first hydrophilic treated is carried out in the microchannel, hydrophilizing agent (3-Aminoprogyl triethoxysilane) is passed into the microchannel seal and left standstill 2 hours, pass into again washed with de-ionized water.In paraffin oil, add polymer EM90(1 wt%), and use the whirlpool agitator that it is fully mixed, as interior phase fluid.In water, add polyvinyl alcohol (10 wt %), be heated to 80 ℃ and stir and to make its dissolving, as external fluid phase.Use micro-injection pump to inject micro-fluidic chip with interior with external fluid phase respectively, generate the micro emulsion drop at miniflow aggregation infrastructure place.Under the same conditions, the production efficiency of parallel channel micro-fluidic chip can reach four times among the embodiment 1, has greatly improved production efficiency.
Claims (4)
1. based on the new microfluidic chip preparation method of industry standard printed technique
, it is characterized in that, comprise the steps:
(1) according to the MCA and the fluid access hole that design in advance micro-fluidic chip, the geometry of the pcb board of design micro-fluidic chip; Utilize the pcb board design software of standard, draw pcb board figure, wherein, the width of microchannel is the 150-1000 micron, 1.2 to 3 millimeters of fluid discrepancy through-hole diameters;
(2) according to draw pcb board figure on the base material that covers 15 to 90 microns of copper thicknesses of choosing with the MCA etching out, get simultaneously the fluid through hole of coming in and going out, then carry out gold-platedly, obtain the micro-fluidic chip main body; Wherein, gold plating thickness is 1 to 3 micron; Base material thickness is 0.6 to 3 millimeter;
(3) get the ultra-violet curing glue of 450-650 microlitre, use sol evenning machine in slide surface, take even glue speed as 1500-5000 rev/min, time 30-60 carries out uniform gluing second;
(4) the micro-fluidic chip main body that the slide sticky surface that obtains that step 3 is prepared and step 2 prepare is fitted, and applies uniform load and clamps;
(5) micro-fluidic chip main body and slide being placed under clamped condition in the ultra-violet curing box, is 4 to 400 watts at power, solidifies 1 minute to 2 hours, leaves standstill after the taking-up 24 hours, namely obtains micro-fluidic chip.
2. method according to claim 1, it is characterized in that: described step 3 can also be the ultra-violet curing glue of getting the 450-650 microlitre, with ultra-violet curing glue with after ethanol mixes take volume ratio as 1:1-10:1, use sol evenning machine in slide surface, take even glue speed as 1500-5000 rev/min, time 30-60 carries out uniform gluing second.
3. method according to claim 1 and 2, it is characterized in that: described base material comprises paper base material, glass cloth base material, epoxy resin base material, polyester resin base material, heat-resisting thermoplastic matrix or flexible copper-clad paper tinsel base material.
4. method according to claim 1 and 2, it is characterized in that: described slide is soda-lime glass, potash glass, magnalium glass, lead glass, Pyrex or quartz glass.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105289767A (en) * | 2015-11-11 | 2016-02-03 | 南京理工大学 | Micro-fluidic chip |
| CN108187595A (en) * | 2018-01-17 | 2018-06-22 | 西南大学 | A kind of nanogold microreactor and preparation method for pyruvic acid ozonation treatment |
| CN108355727A (en) * | 2018-01-19 | 2018-08-03 | 东南大学 | A kind of preparation method of micro-fluidic chip template |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6443179B1 (en) * | 2001-02-21 | 2002-09-03 | Sandia Corporation | Packaging of electro-microfluidic devices |
| US20030096081A1 (en) * | 2001-10-19 | 2003-05-22 | Lavallee Guy P. | Integrated microfluidic, optical and electronic devices and method for manufacturing |
| US20030175947A1 (en) * | 2001-11-05 | 2003-09-18 | Liu Robin Hui | Enhanced mixing in microfluidic devices |
| CN1800951A (en) * | 2005-09-02 | 2006-07-12 | 吉林北方彩晶数码电子有限公司 | Peripheral sealing technology for thinning glass box substrate |
| CN101359722A (en) * | 2008-09-23 | 2009-02-04 | 吉林大学 | Encapsulation method for top radiation organic EL part |
| CN101593632A (en) * | 2009-06-29 | 2009-12-02 | 彩虹集团公司 | A kind of method for packing of DSSC |
| US20100044376A1 (en) * | 2006-11-21 | 2010-02-25 | Gyros Patent Ab | Method of bonding a micrifluidic device and a microfluidic device |
-
2012
- 2012-11-09 CN CN2012104460024A patent/CN102923643A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6443179B1 (en) * | 2001-02-21 | 2002-09-03 | Sandia Corporation | Packaging of electro-microfluidic devices |
| US20030096081A1 (en) * | 2001-10-19 | 2003-05-22 | Lavallee Guy P. | Integrated microfluidic, optical and electronic devices and method for manufacturing |
| US20030175947A1 (en) * | 2001-11-05 | 2003-09-18 | Liu Robin Hui | Enhanced mixing in microfluidic devices |
| CN1800951A (en) * | 2005-09-02 | 2006-07-12 | 吉林北方彩晶数码电子有限公司 | Peripheral sealing technology for thinning glass box substrate |
| US20100044376A1 (en) * | 2006-11-21 | 2010-02-25 | Gyros Patent Ab | Method of bonding a micrifluidic device and a microfluidic device |
| CN101359722A (en) * | 2008-09-23 | 2009-02-04 | 吉林大学 | Encapsulation method for top radiation organic EL part |
| CN101593632A (en) * | 2009-06-29 | 2009-12-02 | 彩虹集团公司 | A kind of method for packing of DSSC |
Non-Patent Citations (1)
| Title |
|---|
| TOBIAS MERKEL ET AL.: ""A new technology for fluidic microsystems based on PCB technology"", 《SENSORS AND ACTUATORS》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105289767A (en) * | 2015-11-11 | 2016-02-03 | 南京理工大学 | Micro-fluidic chip |
| CN108187595A (en) * | 2018-01-17 | 2018-06-22 | 西南大学 | A kind of nanogold microreactor and preparation method for pyruvic acid ozonation treatment |
| CN108355727A (en) * | 2018-01-19 | 2018-08-03 | 东南大学 | A kind of preparation method of micro-fluidic chip template |
| CN108355727B (en) * | 2018-01-19 | 2021-01-26 | 东南大学 | Preparation method of micro-fluidic chip template |
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Application publication date: 20130213 |