CN102918937A - Printed circuit board and method for producing printed circuit board - Google Patents
Printed circuit board and method for producing printed circuit board Download PDFInfo
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- CN102918937A CN102918937A CN2012800014840A CN201280001484A CN102918937A CN 102918937 A CN102918937 A CN 102918937A CN 2012800014840 A CN2012800014840 A CN 2012800014840A CN 201280001484 A CN201280001484 A CN 201280001484A CN 102918937 A CN102918937 A CN 102918937A
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- conductive particle
- circuit board
- printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
According to this method for producing a printed circuit board, firstly, a through-hole (41) is formed in an insulating layer (20) so as to reach through to an electroconductive substrate (10). Subsequently, a region of the insulating layer (20) including the through-hole (41) is coated with an electroconductive ink including an electroconductive particulate to form an electroconductive particulate layer (31). Thereafter, an electroplating layer (33) is formed by electroplating on the electroconductive particulate layer (31). The electroconductive particulate layer (31) and an electroless plating layer (32) surrounding a blind via (40) are then removed.
Description
Technical field
The present invention relates to have the manufacture method of printed circuit board (PCB) and this printed circuit board (PCB) of blind hole.
Background technology
As the blind hole of printed circuit board (PCB), the known technology that has in the patent documentation 1.As shown in Figure 6, form the 1st conductive pattern 110 and the 2nd conductive pattern 120 on the surface of insulating barrier 130.In insulating barrier 130, form the blind hole 140 that runs through insulating barrier 130.The 1st conductive pattern 110 and the 2nd conductive pattern 120 interconnect by blind hole 140.Blind hole 140 forms by filled conductive slurry 143 in through hole 141.
In recent years, along with the high-density line of printed circuit board (PCB), need to make the diameter of blind hole 140 less.Therefore, need to make the internal diameter of through hole 141 less.In addition, in order in through hole 141, to fill the electrocondution slurry 143 of capacity, also need to reduce the viscosity of electrocondution slurry 143.But, when using low viscous electrocondution slurry 143, occur in the time of can making electrocondution slurry 143 hot curing to flow, thereby make blind hole diameter BD produce easily deviation.That is to say that blind hole diameter BD crosses sometimes welding disk pattern 142 and expands, in this case, the conductive pattern of adjacency may be short-circuited.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2008-181915 communique
Summary of the invention
The problem that invention will solve
The object of the present invention is to provide a kind of printed circuit board (PCB) that the deviation of blind hole diameter can be suppressed less and the manufacture method of this printed circuit board (PCB).
The means of dealing with problems
In order to address the above problem, according to the first embodiment of the present invention, a kind of manufacture method of printed circuit board (PCB) is provided, and described printed circuit board (PCB) has insulating barrier, at the 1st of insulating barrier the 1st conductive layer that forms, at the 2nd the 2nd conductive layer that forms of insulating barrier and connect the 1st conductive layer and the blind hole of the 2nd conductive layer.This manufacture method comprises following operation: through hole forms operation, wherein, forms the through hole that passes to the 1st conductive layer in insulating barrier; The 1st layer forms operation, and wherein, coating contains the conductivity China ink of conductive particle to form the conductive particle layer in comprising the zone of through hole; The 2nd layer forms operation, wherein, forms electrodeposited coating by electroplating at the conductive particle layer; And patterned layer formation operation, wherein, remove through hole conductive particle layer on every side, and form the 2nd conductive layer that comprises conductive particle layer and electrodeposited coating.
According to the method, after forming blind hole, remove the conductive particle layer.Therefore, in order to form the conductive particle layer, can adopt the low conductivity China ink of viscosity.The deviation that can suppress thus, the low blind hole diameter that causes of viscosity of conductivity China ink.
In the manufacture method of above-mentioned printed circuit board (PCB), preferably after forming blind hole, to the blind hole heat treated of switching on.Blind hole comprises the conductive particle layer.In addition, the resistance value of conductive particle layer is subject to the impact of the contact resistance at the part place that conductive particle contacts with each other easily.In this respect, according to the method, by heat treated that blind hole is switched on, partial melting or sintering that conductive particle is contacted with each other.Can reduce thus conductive particle contact resistance each other, and then reduce the resistance value of blind hole.
In the manufacture method of above-mentioned printed circuit board (PCB), the 1st layer forms operation and preferably includes following operation: the operation of coating conductivity China ink; Make the solvent of conductivity China ink evaporate to form the operation of conductive particle layer; And the operation that forms electroless plating at the conductive particle layer.According to the method, owing to be filled with the plating material in the gap between the conductive particle of conductive particle layer, therefore can make the conductive particle layer become fine and close.As a result, can reduce the resistance value of blind hole.
In the manufacture method of above-mentioned printed circuit board (PCB), preferably, the 1st layer of formation operation also is included in and forms before the electroless plating, and in the operation of conductive particle layer coating oxide remover, described oxide remover is removed the oxide of the 1st conductive layer surface.According to the method, owing to the oxide of having removed the 1st conductive layer surface by oxide remover, it is large that the bond strength of the 1st conductive layer and conductive particle layer becomes.As a result, suppressed peeling off between the 1st conductive layer and the conductive particle layer.
In the manufacture method of above-mentioned printed circuit board (PCB), preferably, the 1st layer of formation operation also is included in after the coating oxide remover, oxide remover carried out the operation of heat treated in inert atmosphere.According to the method, be applied to oxide remover on the conductive particle layer after, in inert atmosphere, it is carried out heat treated.Therefore, compare with aerial heat treated, suppressed the reaction of oxide remover and airborne oxygen, thereby promoted the reaction of the oxide of oxide remover and the 1st conductive layer.Therefore, compare with the situation of in air, carrying out heat treated, further suppressed peeling off between the 1st conductive layer and the conductive particle layer.
In the manufacture method of above-mentioned printed circuit board (PCB), preferably, oxide remover comprise reduce described oxide reducing agent and dissolve in the dissolved substance of described oxide at least one.Reducing agent with Reduction of Oxide so that oxide decompose.Dissolved substance with oxide dissolution so that oxide decompose.According to the method, because the oxide of the 1st conductive layer is decomposed, therefore the engaging force between the 1st conductive layer and the conductive particle layer becomes large.
In the manufacture method of above-mentioned printed circuit board (PCB), preferably, reducing agent is with the Reduction of Oxide of the 1st conductive layer surface, and dissolved substance is with oxide dissolution.According to the method, because the conductivity China ink comprises in reducing agent and the dissolved substance at least one, by coating conductivity China ink, reducing agent is contacted with at least one oxide with the 1st conductive layer in the dissolved substance.The oxide that can decompose thus the 1st conductive layer.
In the manufacture method of above-mentioned printed circuit board (PCB), the 1st conductive layer is preferably stainless steel substrate.According to the method, adopt the situation of copper material to compare with the 1st conductive layer, printed circuit board (PCB) can have high resiliency.In addition, the parts that are formed with circuit at stainless steel surfaces needing can be used for the parts (hang up (head suspension) such as magnetic heads such as hard disks and use circuit substrate) of Vibrant buffer.
In the manufacture method of above-mentioned printed circuit board (PCB), preferably, stainless steel substrate has nickel dam at the contact-making surface of itself and insulating barrier.Usually, because the easy oxidation in stainless surface, the bonding strength of stainless steel and blind hole may reduce.In this respect, according to the method, nickel dam can suppress the oxidation of stainless steel surfaces, thereby can suppress the reduction for the bonding strength of blind hole.
In order to address the above problem, according to the second embodiment of the present invention, a kind of printed circuit board (PCB) is provided, and described printed circuit board (PCB) has insulating barrier, at the 1st of insulating barrier the 1st conductive layer that forms, at the 2nd the 2nd conductive layer that forms of insulating barrier and connect the 1st conductive layer and the blind hole of the 2nd conductive layer.The 2nd conductive layer has: be formed on the insulating barrier and contain the conductive particle layer of a plurality of conductive particles; Be laminated in the electroless plating on the conductive particle layer; And being laminated in electrodeposited coating on the electroless plating, blind hole has: the conductive particle layer that forms and contain a plurality of conductive particles in the position corresponding with the through hole that runs through insulating barrier; Be laminated in the electroless plating on the conductive particle layer of blind hole; And being laminated in electrodeposited coating on the electroless plating of blind hole, blind hole is connected with the 1st conductive layer in the bottom surface of through hole.
Blind hole is stacked gradually by insulating barrier, electroless plating and electrodeposited coating and forms.Yet, in this structure, because a little less than the bond strength between insulating barrier and the electroless plating, so electroless plating may be from insulation displacement.In this respect, according to the method, electrodeposited coating is connected with the 1st conductive layer by conductive particle layer and electroless plating.In this case, the conductive particle layer is larger than the bond strength of electroless plating and insulating barrier with the engaging force of insulating barrier.Therefore, can suppress conductive particle layer peeling off from insulating barrier.
In above-mentioned printed circuit board (PCB), preferably, a plurality of conductive particles are melted at the part place that contacts with each other or sintering and interconnecting, and conductive particle and the 1st conductive layer are melted at the part place that contacts with each other or sintering and interconnecting.According to the method, a plurality of conductive particle meltings or sintering and interconnect, and conductive particle and the 1st conductive layer melting or sintering and interconnect.Therefore, the current density of the guiding path of blind hole increases, thereby the resistance value of blind hole is diminished.
In above-mentioned printed circuit board (PCB), preferably, the diameter of through hole is more than the 10 μ m, and the thickness of conductive particle layer is below the 0.5 μ m.When forming the conductive particle layer in the whole through hole, because the conductive particle layer contains a lot of gaps, therefore reduced the intensity of blind hole.In this respect, according to the method, stacked electroless plating and electrodeposited coating on the conductive particle layer of the bottom surface that is formed at through hole and side.Therefore, compare with the situation that in whole through hole, forms the conductive particle layer, can improve the intensity of blind hole.
Brief Description Of Drawings
The partial cross section figure of the printed circuit board (PCB) that [Fig. 1] one embodiment of the invention are related.
The partial cross section figure of [Fig. 2] blind hole.
[Fig. 3] (A) ~ (D) is the partial cross section figure that shows the manufacturing process of printed circuit board (PCB).
[Fig. 4] (A) ~ (D) is the partial cross section figure that shows the manufacturing process of printed circuit board (PCB).
[Fig. 5] shows the table of the relation between the resistance value of creating conditions of printed circuit board (PCB) and blind hole.
The partial cross section figure of the printed circuit board (PCB) that [Fig. 6] is traditional.
Embodiment
Seeing figures.1.and.2 describes an embodiment, and this embodiment is: printed circuit board (PCB) of the present invention is embodied as the head suspension circuit substrate, and described head suspension is used for carrying the magnetic head of hard drive with circuit substrate.
As depicted in figs. 1 and 2, printed circuit board (PCB) 1 has the electrically-conductive backing plate 10 as the 1st conductive layer, the conductive pattern 30 that is laminated in the insulating barrier 20 of electrically-conductive backing plate 10 upper surfaces and is formed at conduct the 2nd conductive layer of insulating barrier 20 upper surfaces.In the present embodiment, the lower surface of insulating barrier 20 is the 1st, and the upper surface of insulating barrier is the 2nd.
As electrically-conductive backing plate 10, adopting (for example) thickness is the stainless steel substrate of 10 μ m ~ 500 μ m.In addition, as electrically-conductive backing plate 10, can adopt aluminium sheet, iron plate, copper coin, conductive metal plywood or conductivity alloy.The thickness of electrically-conductive backing plate 10 is set according to purposes.As electrically-conductive backing plate 10, also can use the stainless steel substrate that is formed with nickel dam on the surface.In this case, nickel dam becomes diaphragm, has suppressed stainless oxidation.
Insulating barrier 20 is formed by the insulative resin with retractility, for example, is formed by polyimide film.Therefore, insulating barrier 20 can deform corresponding to the vibration of printed circuit board (PCB) 1.
The electroless plating 32 that conductive pattern 30 forms by the formed conductive particle layer 31 of metallic particles, at conductive particle layer 31 and consist of at the electrodeposited coating 33 that electroless plating 32 forms.The layer that conductive particle layer 31 and electroless plating 32 are combined is as the 1st layer, with electrodeposited coating 33 as the 2nd layer, below described.
The conductive particle 31A of adjacency is sintered or melting at the part place that contacts with each other, thereby a plurality of conductive particle 31A are interconnected.In addition, the part that conductive particle 31A contacts with electrically-conductive backing plate 10 also is sintered or melting, thereby conductive particle 31A and electrically-conductive backing plate 10 are interconnected.
In insulating barrier 20, form the through hole 41 that passes to electrically-conductive backing plate 10.Blind hole 40 is in the position corresponding with through hole 41, is stacked gradually by conductive particle layer 31, electroless plating 32 and electrodeposited coating 33 to form.Blind hole 40 has the structure identical with conductive pattern 30.
Next, with reference to Fig. 3 (A) ~ Fig. 4 (D) manufacture method of printed circuit board (PCB) 1 is described.
Shown in Fig. 3 (A), be on the electrically-conductive backing plate 10 of 10 μ m ~ 500 μ m at thickness, the polyimide precursor resin of coating solution shape., 300 ℃ or more polyimide precursor resin heated, make its curing thereafter.Thus, forming thickness at electrically-conductive backing plate 10 is the insulating barrier 20 of 10 μ m ~ 200 μ m.
Shown in Fig. 3 (B), in insulating barrier 20, the through hole 41(through hole that forms diameter at the part place corresponding with blind hole 40 and be 10 μ m ~ 200 μ m forms operation).For the formation of through hole 41, can adopt laser method or etching method.At this moment, form like this through hole 41, until the bottom surface of through hole 41 passes to electrically-conductive backing plate 10, that is, the degree of depth of through hole 41 is identical with the thickness of insulating barrier 20.The internal diameter of through hole 41 is 10 μ m ~ 200 μ m.After forming through hole 41, in order to remove because the resin burr that laser or etching produce, toner etc. carry out the desmearing processing.
Shown in Fig. 3 (C), after the surface treatment of insulating barrier 20, the whole surface coating conductivity China ink at electrically-conductive backing plate 10 further carries out drying (the 1st layer forms operation) to the conductivity China ink that is coated with.After the conductivity China ink drying, in order to remove formed oxide on the surface of the surface of conductive particle 31A and electrically-conductive backing plate 10, the coating oxide remover, and further the oxide remover that is coated with is carried out drying.In addition, for sintering conductive particle 31A, carry out heat treated.The below is elaborated to each operation.
As the surface treatment method of insulating barrier 20, can enumerate plasma treatment, with aqueous slkali make surface hydrophilic alkali treatment, make the corona treatment of the surface modification of object, the UV of the surface modification of object processed etc. by corona discharge.By these surface treatment methods, can make the surface roughening of insulating barrier 20, perhaps import hydrophilic group on the surface of insulating barrier 20.As a result, the surface tension between conductivity China ink and the insulating barrier 20 reduces.
The conductivity China ink is scattered in the designated solvent conductive particle 31A to prepare.For the dispersion of conductive particle 31A, can adopt particle dispersants.As solvent, for example can adopt water.The viscosity of conductivity China ink and the viscosity of water are almost identical.Therefore, even the diameter of through hole 41 is little of 10 μ m, also can be easily in through hole 41 the filled conductive China ink.As solvent, also can adopt the mixed liquor of the volatile solvents such as ethanol or water and volatile solvent.As conductive particle 31A, can adopt average grain diameter is the particle of tens of nm.
As particle dispersants, for example, can adopt molecular weight is 2000 ~ 100000 macromolecule dispersing agent.Particularly, as particle dispersants, can adopt the amine macromolecule dispersing agents such as polymine, PVP.In addition, as particle dispersants, also can adopt hydro carbons macromolecule dispersing agent that has hydroxy-acid group in polyacrylic acid, the carboxymethyl cellulose equimolecular etc.
Use roller at the whole surface coating conductivity China ink of electrically-conductive backing plate 10.Regulate the thickness of the conductivity China ink that is coated with, so that the thickness of dried conductivity China ink is 0.1 μ m.For the coating of conductivity China ink, can also adopt spin-coating method, spraying process, rod to be coated with the methods such as method, die coating method, slot coated method, dip coating.When the conductivity China ink is dry, in order to evaporate the water in the conductivity China ink, under air atmosphere, keep 80 ℃ temperature predetermined time.Thus, form the thin layer of conductive particle 31A on the surface of insulating barrier 20.
After the conductivity China ink drying, be coated with oxide remover on the surface of conductive particle 31A and the surface of electrically-conductive backing plate 10.Regulate oxide remover, so that the oxide removal substance dissolves is in predetermined solvent.As solvent, for example can adopt water.As solvent, also can adopt the mixed liquor of the volatile solvents such as ethanol or water and volatile solvent.
Behind the coating oxide remover, in inert gas atmosphere, heat.The heating-up temperature of oxide remover is 50 ℃ ~ 450 ℃, more preferably 100 ℃ ~ 400 ℃.The heat treated time is 1 minute ~ 200 minutes, more preferably 10 minutes ~ 60 minutes.By heat treated, the oxide layer and the oxide removal material that exist on each surface of conductive particle 31A and electrically-conductive backing plate 10 are reacted, thereby this oxide layer is decomposed.
As the oxide removal material, be divided into following two types.
The 1st type oxide removal material is the reducing substances of reduced oxide.As reducing substances, can enumerate hypophosphorous acid, phosphorous acid, ascorbic acid, ethylenediamine tetra-acetic acid (EDTA), alcohol, hydrazine, formaldehyde etc.
The 2nd type oxide removal material is acidity or the alkaline matter that makes oxide dissolution.As this material, can enumerate allylamine, formic acid, glutamic acid, aliphatic acid, lactic acid, phthalic acid, maleic acid, malic acid, boric acid, ammonium chloride, magnesium chloride, chloromethanes, chloroform, sodium acetate, KBr, calcium bromide, trichloroethylene, vulcanized sodium, sodium iodide, aluminum sulfate, carbon trichloride etc.Particularly, allylamine, formic acid, glutamic acid, aliphatic acid, lactic acid, phthalic acid, maleic acid, malic acid, even because they have residually after the oxide remover drying, and ionic element can be not residual yet, therefore preferred.
About oxide remover, any one in the oxide removal material of the 1st type oxide removal material and the 2nd type or both can be dissolved in the solvent and use.In addition, also can in solvent, add the pH adjusting agent of dispersant or the regulator solution pH of oxide removal material.
In the dried heat treated of conductivity China ink, in sintering conductive particle 31A, remove conductive particle 31A organic substance (hereinafter referred to as " residual organic matter ") in addition.As residual organic matter, can enumerate particle dispersants contained in the conductivity China ink, oxide remover etc.In order to suppress the oxidation of conductive particle 31A, in (for example) nitrogen atmosphere, carry out heat treated.In heat treated, be warming up to 350 ℃ with 5 ℃/minute programming rates, again 350 ℃ temperature was kept 30 minutes.Thus, sintering conductive particle 31A, and be connected to each other between the conductive particle 31A, thereby form conductive particle layer 31.Can be as described above at a lower temperature the reason of sintering be because average grain diameter to be the surface energy of conductive particle 31A of tens of nm high.
Next, shown in Fig. 3 (D), form electroless plating 32, so that be approximately 0.2 μ m apart from the thickness of insulating barrier 20.Particularly, after the metallic catalysts such as conductive particle layer 31 and insulating barrier 20 coating Pd-Sn, dissolving Sn is attached on the conductive particle layer 31 Pd.Then, by impregnated in the copper electrolyte, form electroless plating 32 at conductive particle layer 31 and insulating barrier 20.Like this, the gap between the gap between the conductive particle 31A of adjacency and conductive particle 31A and the electrically-conductive backing plate 10 is all filled by electroless plated metal.Thus, when the density of conductive particle layer 31 increases, form fine and close electroless plating 32 on the surface of conductive particle layer 31.
Next, form conductive pattern 30 and blind hole 40 by half addition-pattern (semi additive-pattern) method.The below is specifically described each operation.
Shown in Fig. 4 (A), on the surface except the part corresponding with blind hole 40 and conductive pattern 30 of electroless plating 32, form resist 50.Resist 50 by after being laminated to photoresist on the substrate, adopt photomask to expose and develop to form.
Shown in Fig. 4 (B), carry out the plating of copper, form the 2nd layer of electrodeposited coating 33(at electroless plating 32 and form operation).Thus, form conductive pattern 30 and blind hole 40 at conductive particle layer 31 and insulating barrier 20.
Shown in Fig. 4 (C), peel off resist 50 after, remove Seed Layer (seed layer) with dioxysulfate water, that is, electroless plating 32 and conductive particle layer 31.Be attached to the Pd on the insulating barrier 20 when further removing electroless plating.By above operation, form blind hole 40 and conductive pattern 30(patterned layer and form operation).
Next, will compare the manufacture method of the present embodiment and traditional manufacture method, and be explained.
In traditional manufacture method, in insulating barrier 20, behind the formation through hole 41, around through hole 41, form welding disk pattern.Then, by to through hole 41 filled conductive slurries, welding disk pattern is connected with electrically-conductive backing plate 10.According to this method, the problem that the electrocondution slurry that produces can't be filled in order to solve the thin footpath that is accompanied by through hole 41, needs reduce the viscosity of electrocondution slurry.Yet the reduction of electrocondution slurry viscosity can cause such problem: electrocondution slurry is crossed welding disk pattern and is expanded when hot curing, thereby blind hole diameter produces deviation.
In this respect, the present application is characterised in that each operation of Fig. 4 (A) ~ Fig. 4 (C).In other words, different from the manufacture method of traditional blind hole 40, owing to implement operation to through hole 41 filled conductive materials before plating, i.e. therefore the coating of conductivity China ink can adopt low viscous conductivity China ink.In addition, get final product owing to after the coating of conductivity China ink, remove Seed Layer (electroless plating 32 and conductive particle layer 31), so the generation of blind hole 40 dimensional discrepancys can be inhibited.Therefore, can make the accuracy to size of blind hole 40 identical with the pattern accuracy of half addition-pattern method.
In addition, in the manufacture method of the printed circuit board (PCB) 1 of the present embodiment, after forming blind hole 40 and conductive pattern 30, in order to reduce the resistance value of blind hole 40, to blind hole 40 heat treated of switching on.The below describes this processing.
Shown in Fig. 4 (D), the probe 61 of the hot side of constant-current supply 60 is contacted with the electrodeposited coating 33 of blind hole 40.In addition, the probe 62 of ground connection side is contacted with electrically-conductive backing plate 10.Then, adopt two probes 61 and 62 to make in the blind hole 40 and pass through constant current.
The resistance of conductive particle layer 31 and electroless plating 32 is to be determined by the contact resistance between the contact resistance between the contact resistance between the conductance of conductive particle 31A, electroless conductance, the conductive particle 31A, conductive particle 31A and the electrically-conductive backing plate 10, electroless plating and the conductive particle 31A etc.In above-mentioned each key element, the resistance of conductive particle layer 31 and electroless plating 32 is subjected to the impact of contact resistance between the conductive particle 31A and the contact resistance between conductive particle 31A and the electrically-conductive backing plate 10 larger especially.In addition, be formed with in the situation of oxide layer on the surface of conductive particle 31A and the surface of electrically-conductive backing plate 10, above-mentioned each contact resistance has promoted the resistance of conductive particle layer 31 and electroless plating 32 largelyr.Therefore, in order to reduce each contact resistance, make in the blind hole 40 by pulse current, thus with respectively sintering or melting of the contact portion between the contact portion between the conductive particle 31A and conductive particle 31A and the electrically-conductive backing plate 10.Thus, make between the conductive particle 31A to connect, and conductive particle 31A and electrically-conductive backing plate 10 are interconnected.In addition, in this case, the contact resistance between the contact resistance between the conductive particle 31A and conductive particle 31A and the electrically-conductive backing plate 10 diminishes respectively.
Next, with reference to embodiment and the Comparative Examples of printed circuit board (PCB) 1 shown in Figure 5, describe to the effect of the coating oxide remover in the manufacture method of printed circuit board (PCB) 1 and to blind hole 40 logical electrically heated effects.
In embodiment 1 ~ 3, the laggard electric heating that works of coating oxide remover.In Comparative Examples, be not coated with oxide remover and switch on heating.Then, for each embodiment and Comparative Examples, measure respectively the resistance value of the blind hole 40 of energising heating front and back.
＜embodiment 1 〉
What base material adopted is the electrically-conductive backing plate 10 that is laminated with insulating barrier 20.
What electrically-conductive backing plate 10 adopted is that thickness is the SUS304 substrate of 20 μ m.
Insulating barrier 20 is formed by polyimide resin.The thickness of insulating barrier is made as 10 μ m.
To insulating barrier 20 irradiation YAG laser, form the through hole 41 of blind hole 40.The diameter of through hole 41 is made as 60 μ m.
Conductivity China ink adopts is to be that the copper particle of 40nm only is scattered in the aqueous solution that forms in the water with 8 quality % with average grain diameter.
Behind base material coating conductivity China ink, 80 ℃ of lower heating about 30 seconds, make electrically-conductive backing plate 10 dryings.
After the conductivity China ink drying, the 1.0 quality % aqueous solution of ascorbic acid are coated on the dry thing of conductivity China ink as oxide remover (reducing agent).In inert gas atmosphere, keep 90 ℃ temperature 30 minute thereafter.Then, be warming up to 350 ℃ with 5 ℃/minute programming rates, under 350 ℃ temperature, heated 30 minutes again, form conductive particle layer 31.
Carry out the electroless plating of copper at conductive particle layer 31.The thickness of electroless plating is made as 0.2 μ m.
On electroless plating, form conductive pattern 30 and blind hole 40 by half addition-pattern method.
Making electric current is that 5A, pulse duration are that the pulse current of 100 μ s is switched in blind hole 40.
(result)
The resistance value of blind hole 40 before energising is 1.4 Ω.
The resistance value of blind hole 40 after energising is 0.11 Ω.
＜embodiment 2 〉
Make and create conditions identically with embodiment 1, difference is: after conductivity China ink drying, with the 1.0 quality % aqueous solution of glutamic acid as oxide remover (oxide dissolution agent) coat on the dry thing of conductivity China ink.
(result)
The resistance value of blind hole 40 before energising is 1.2 Ω.
The resistance value of blind hole 40 after energising is 0.09 Ω.
＜embodiment 3 〉
Make and create conditions identically with embodiment 1, difference is: after conductivity China ink drying, with the 1.0 quality % aqueous solution of maleic acid as oxide remover (oxide dissolution agent) coat on the dry thing of conductivity China ink.
(result)
The resistance value of blind hole 40 before energising is 1.2 Ω.
The resistance value of blind hole 40 after energising is 0.09 Ω.
＜Comparative Examples 〉
Make and create conditions identically with embodiment 1 ~ 3, difference is: be not coated with oxide remover.
(result)
The resistance value of blind hole 40 before energising is 1.8 Ω.
The resistance value of blind hole 40 after energising is 0.14 Ω.
＜estimate
With reference to Fig. 5 each embodiment and Comparative Examples are compared.
For in each embodiment and the Comparative Examples any one, in blind hole 40, carry out pulse electrifying, the effect of pulse electrifying is all identical.That is, the resistance value after the energising is less than the resistance value before switching on.It is believed that, this is because before pulse electrifying, contact site office resistance value between the contact portion between the conductive particle 31A and conductive particle 31A and electrically-conductive backing plate 10 is higher, in contrast, behind the pulse electrifying, each contact portion is heated and melting or sintering, and the resistance value of each contact portion is reduced.
On the other hand, the resistance value of the blind hole 40 before switching on is compared, the resistance value of each embodiment is less than the resistance value of Comparative Examples.It is believed that this is because for any one embodiment, owing to be coated with oxide remover, thereby removed the oxide on conductive particle 31A surface and the oxide of electrically-conductive backing plate 10 surfaces (blind hole 40 bottom surfaces).
Hereinafter, according to the present embodiment, can realize following action effect.
(1) is coated with the conductivity China inks to form conductive particle layer 31 at insulating barrier 20.Next, form blind hole 40 by electroplating at conductive particle layer 31.Further, remove blind hole 40 conductive particle layer 31 and electroless plating 32 on every side.According to the method, remove conductive particle layer 31 after the formation blind hole 40.Therefore, can adopt the low viscosity conductivity China ink that is used to form conductive particle layer 31.Thus, can suppress deviation owing to the low blind hole diameter that causes of viscosity of conductive film.
(2) form blind hole 40 after, to blind hole 40 heat treated of switching on.Blind hole 40 comprises conductive particle layer 31.In addition, the resistance value of conductive particle layer 31 is subject to the impact of the contact resistance of the contact site office between the conductive particle 31A easily.According to the present embodiment, by heat treated that blind hole 40 is switched on, make contact portion melting or sintering between the conductive particle 31A.Thus, can reduce the contact resistance between the conductive particle 31A, and then reduce the resistance value of blind hole 40.
(3) make the solvent of conductivity China ink evaporate to form conductive particle layer 31 after, form electroless platings 32 at conductive particle layer 31.According to the method, owing to be filled with the plating material in the gap between conductive particle 31A, therefore can make conductive particle layer 31 become fine and close.As a result, can reduce the resistance value of blind hole 40.
(4) behind the formation conductive particle layer 31, be coated with oxide remover at conductive particle layer 31.Consist of according to this, removed the oxide on electrically-conductive backing plate 10 surfaces by oxide remover, so the bond strength of electrically-conductive backing plate 10 and conductive particle layer 31 becomes large.As a result, suppressed peeling off between electrically-conductive backing plate 10 and the conductive particle layer 31.
(5) behind the coating oxide remover, in inert atmosphere, it is carried out heat treated.According to the method, to compare with the heat treated of in air, carrying out, the reaction of oxide remover and airborne oxygen is inhibited, thereby has promoted the oxide of oxide remover and electrically-conductive backing plate 10 to react.Therefore, further suppressed peeling off between electrically-conductive backing plate 10 and the conductive particle layer 31.
(6) as oxide remover, can adopt with the reducing agent of Reduction of Oxide and with in the dissolved substance of oxide dissolution at least one.Reducing agent makes Reduction of Oxide oxide to decompose.Dissolved substance makes oxide dissolution oxide to decompose.According to the method, because the oxide of electrically-conductive backing plate 10 is decomposed, it is large that the engaging force between electrically-conductive backing plate 10 and the conductive particle layer 31 becomes.
(7) electrically-conductive backing plate 10 can adopt stainless steel substrate.Consist of according to this, adopt the situation of copper material to compare with electrically-conductive backing plate 10, printed circuit board (PCB) 1 can have high resiliency.
(8) blind hole 40 has conductive particle layer 31, electroless plating 32 and electrodeposited coating 33.Blind hole 40 stacks gradually electroless plating and electrodeposited coating 33 at insulating barrier 20 and forms.Yet, in this structure, because a little less than the bond strength between insulating barrier 20 and the electroless plating 32, so electroless plating 32 may be peeled off from insulating barrier 20.In this respect, according to the present embodiment, electrodeposited coating 33 is connected with electroless plating by conductive particle layer 31 and is connected with electrically-conductive backing plate 10.In this case, conductive particle layer 31 is larger than the bond strength of electroless plating and insulating barrier 20 with the engaging force of insulating barrier 20.Therefore, suppressed conductive particle layer 31 peeling off from insulating barrier 20.
(9) a plurality of conductive particle 31A are melted at the part place that contacts with each other or sintering and interconnecting.In addition, conductive particle 31A and electrically-conductive backing plate 10 are melted at the part place that contacts with each other or sintering and interconnecting.Consist of according to this, because the current density of the guiding path of blind hole 40 increases, the resistance value of blind hole 40 is diminished.
Need to prove, can also carry out change as follows to the present embodiment.
Usually, because oxidation occurs stainless steel surfaces easily, so the bonding strength of stainless steel substrate and blind hole 40 may reduce.In order to prevent this situation, on the contact-making surface of itself and insulating barrier 20, can have nickel dam as the stainless steel substrate of electrically-conductive backing plate 10.Consist of according to this, because nickel dam has suppressed the oxidation of stainless steel surfaces, thereby can suppress the reduction of the bonding strength of stainless steel substrate and blind hole 40.
After conductivity China ink drying, be coated with oxide remover at conductive particle layer 31, but also can in the conductivity China ink, add oxide remover in advance.Even like this, the reducing agent in the conductivity China ink is contacted with the oxide of dissolved substance with electrically-conductive backing plate 10, thereby decompose the oxide of electrically-conductive backing plate 10.According to the method, each operation of drying that does not need the coating of oxide remover and contain the solution of oxide remover, thus manufacturing process is simplified.
After conductivity China ink drying, carry out coating and the drying of oxide remover, but also can in the sintering circuit of conductive particle 31A, comprise the drying of oxide remover.For example, use two stage heating-up temperature, the coating thing to oxide remover under inert atmosphere heats.The temperature in the 1st stage is made as the temperature (namely 50 ℃ ~ 100 ℃) of the moisture evaporation that makes oxide remover, and kept 30 minutes.Then, the temperature in the 2nd stage is made as 350 ℃, and kept 30 minutes.
Also can pass through half addition-full plate (semi-additive panel) method and form conductive pattern 30 and blind hole 40.In any one manufacture method, can after forming conductive pattern 30, remove conductive particle layer 31 and electroless plating 32, therefore, compare with traditional method, can improve the accuracy to size of blind hole 40.
The blind hole 40 that the present invention also is applicable to connect conductive pattern 30 and is arranged at the conductive pattern 30 above or below it.
Except use printed circuit board (PCB) 1 for the head suspension of the magnetic head that carries hard drive, the present invention also is applicable to various printed circuit board (PCB)s 1.
Claims (12)
1. the manufacture method of a printed circuit board (PCB), described printed circuit board (PCB) has insulating barrier, at the 1st of described insulating barrier the 1st conductive layer that forms, in the 2nd the 2nd conductive layer that forms of described insulating barrier and the blind hole that connects described the 1st conductive layer and described the 2nd conductive layer, described manufacture method is characterised in that and comprises following operation:
Through hole forms operation, wherein, forms the through hole that passes to described the 1st conductive layer in described insulating barrier;
The 1st layer forms operation, and wherein, coating contains the conductivity China ink of conductive particle to form the conductive particle layer in containing the zone of described through hole;
The 2nd layer forms operation, wherein, forms electrodeposited coating by electroplating at described conductive particle layer; And
Patterned layer forms operation, wherein, removes described through hole described conductive particle layer on every side, and forms described the 2nd conductive layer that comprises described conductive particle layer and described electrodeposited coating.
2. the manufacture method of printed circuit board (PCB) according to claim 1 is characterized in that,
After forming described blind hole, to the described blind hole heat treated of switching on.
3. the manufacture method of printed circuit board (PCB) according to claim 1 and 2 is characterized in that,
Described the 1st layer of formation operation comprises following operation:
Be coated with the operation of described conductivity China ink;
Make the solvent of described conductivity China ink evaporate to form the operation of described conductive particle layer; And
Form the operation of electroless plating at described conductive particle layer.
4. the manufacture method of printed circuit board (PCB) according to claim 3 is characterized in that,
Form in the operation at described the 1st layer, also be included in before the formation electroless plating, in the operation of described conductive particle layer coating oxide remover, described oxide remover is removed the oxide of described the 1st conductive layer surface.
5. the manufacture method of printed circuit board (PCB) according to claim 4 is characterized in that,
Form in the operation at described the 1st layer, also be included in after the described oxide remover of coating, in inert atmosphere, described oxide remover is carried out the operation of heat treated.
6. according to claim 4 or the manufacture method of 5 described printed circuit board (PCB)s, it is characterized in that,
Described oxide remover contain reduce described oxide reducing agent and dissolve in the dissolved substance of described oxide at least one.
7. the manufacture method of printed circuit board (PCB) according to claim 6 is characterized in that,
Described reducing agent is with the Reduction of Oxide of described the 1st conductive layer surface, and described dissolved substance is with described oxide dissolution.
8. the manufacture method of the described printed circuit board (PCB) of any one is characterized in that according to claim 1 ~ 7,
Described the 1st conductive layer is stainless steel substrate.
9. the manufacture method of printed circuit board (PCB) according to claim 8 is characterized in that,
Described stainless steel substrate has nickel dam at the contact-making surface of itself and described insulating barrier.
10. printed circuit board (PCB), this printed circuit board (PCB) has insulating barrier, at the 1st of described insulating barrier the 1st conductive layer that forms, in the 2nd the 2nd conductive layer that forms of described insulating barrier and the blind hole that connects described the 1st conductive layer and described the 2nd conductive layer, it is characterized in that
Described the 2nd conductive layer has:
Be formed on the described insulating barrier and contain the conductive particle layer of a plurality of conductive particles;
Be laminated in the electroless plating on the described conductive particle layer; And
Be laminated in the electrodeposited coating on the described electroless plating,
Described blind hole has:
Form and contain the conductive particle layer of a plurality of conductive particles in the position corresponding with the through hole that runs through described insulating barrier;
Be laminated in the electroless plating on the conductive particle layer of described blind hole; And
Be laminated in the electrodeposited coating on the electroless plating of described blind hole,
Described blind hole is connected with described the 1st conductive layer in the bottom surface of described through hole.
11. printed circuit board (PCB) according to claim 10 is characterized in that,
Described a plurality of conductive particle is melted at the part place that contacts with each other or sintering and interconnecting,
Described conductive particle and described the 1st conductive layer are melted at the part place that contacts with each other or sintering and interconnecting.
12. according to claim 10 or 11 described printed circuit board (PCB)s, it is characterized in that,
The diameter of described through hole is more than the 10 μ m, and the thickness of described conductive particle layer is below the 0.5 μ m.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011083902A JP5335023B2 (en) | 2011-04-05 | 2011-04-05 | Method for manufacturing printed wiring board |
| JP2011-083902 | 2011-04-05 | ||
| PCT/JP2012/058409 WO2012137669A1 (en) | 2011-04-05 | 2012-03-29 | Printed circuit board and method for producing printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102918937A true CN102918937A (en) | 2013-02-06 |
| CN102918937B CN102918937B (en) | 2016-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280001484.0A Expired - Fee Related CN102918937B (en) | 2011-04-05 | 2012-03-29 | Printed circuit board (PCB) and the manufacture method of this printed circuit board (PCB) |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5335023B2 (en) |
| CN (1) | CN102918937B (en) |
| WO (1) | WO2012137669A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107634012A (en) * | 2017-09-13 | 2018-01-26 | 京东方科技集团股份有限公司 | A kind of package substrate and preparation method thereof, display panel, display device |
| CN111463192A (en) * | 2013-08-01 | 2020-07-28 | 日月光半导体制造股份有限公司 | Semiconductor package |
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|---|---|---|---|---|
| JP6473018B2 (en) * | 2015-03-10 | 2019-02-20 | 住友電工プリントサーキット株式会社 | Method for manufacturing substrate for printed wiring board, substrate for printed wiring board and printed wiring board |
| JP2022030666A (en) * | 2020-08-07 | 2022-02-18 | 日東電工株式会社 | Manufacturing method of wiring circuit board, and wiring circuit board |
| JP7289602B2 (en) * | 2020-11-13 | 2023-06-12 | 日東電工株式会社 | WIRED CIRCUIT BOARD AND METHOD FOR MANUFACTURING WIRED CIRCUIT BOARD |
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| CN1794900A (en) * | 2004-12-24 | 2006-06-28 | 日本Cmk株式会社 | Printed circuit board and method of manufacturing the same |
| JP2010118460A (en) * | 2008-11-12 | 2010-05-27 | Sumitomo Electric Ind Ltd | Printed wiring board and its manufacturing method |
| WO2010122918A1 (en) * | 2009-04-24 | 2010-10-28 | 住友電気工業株式会社 | Substrate for printed wiring board, printed wiring board, and methods for producing same |
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- 2011-04-05 JP JP2011083902A patent/JP5335023B2/en active Active
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- 2012-03-29 WO PCT/JP2012/058409 patent/WO2012137669A1/en active Application Filing
- 2012-03-29 CN CN201280001484.0A patent/CN102918937B/en not_active Expired - Fee Related
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| CN1794900A (en) * | 2004-12-24 | 2006-06-28 | 日本Cmk株式会社 | Printed circuit board and method of manufacturing the same |
| JP2010118460A (en) * | 2008-11-12 | 2010-05-27 | Sumitomo Electric Ind Ltd | Printed wiring board and its manufacturing method |
| WO2010122918A1 (en) * | 2009-04-24 | 2010-10-28 | 住友電気工業株式会社 | Substrate for printed wiring board, printed wiring board, and methods for producing same |
| JP2010272837A (en) * | 2009-04-24 | 2010-12-02 | Sumitomo Electric Ind Ltd | Substrate for printed wiring board, printed wiring board, and method for producing substrate for printed wiring board |
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| CN111463192A (en) * | 2013-08-01 | 2020-07-28 | 日月光半导体制造股份有限公司 | Semiconductor package |
| CN107634012A (en) * | 2017-09-13 | 2018-01-26 | 京东方科技集团股份有限公司 | A kind of package substrate and preparation method thereof, display panel, display device |
| CN107634012B (en) * | 2017-09-13 | 2021-05-07 | 京东方科技集团股份有限公司 | Packaging substrate, preparation method thereof, display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012137669A1 (en) | 2012-10-11 |
| JP5335023B2 (en) | 2013-11-06 |
| CN102918937B (en) | 2016-11-09 |
| JP2012222047A (en) | 2012-11-12 |
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