CN102918937B - Printed circuit board (PCB) and the manufacture method of this printed circuit board (PCB) - Google Patents
Printed circuit board (PCB) and the manufacture method of this printed circuit board (PCB) Download PDFInfo
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- CN102918937B CN102918937B CN201280001484.0A CN201280001484A CN102918937B CN 102918937 B CN102918937 B CN 102918937B CN 201280001484 A CN201280001484 A CN 201280001484A CN 102918937 B CN102918937 B CN 102918937B
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- conductive
- conductive particle
- pcb
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
According to the manufacture method of printed circuit board (PCB) involved in the present invention, first, in insulating barrier (20), formation passes to the through hole (41) of electrically-conductive backing plate (10).It follows that the coating electric conductivity ink containing conductive particle in the region comprising through hole (41) on insulating barrier (20), form conductive particle layer (31).Then, on conductive particle layer (31), electrodeposited coating (33) is formed by plating.Then, the conductive particle layer (31) around blind hole (40) and electroless plating (32) are removed.
Description
Technical field
The present invention relates to the manufacturer of printed circuit board (PCB) and this printed circuit board (PCB) with blind hole
Method.
Background technology
Blind hole as printed circuit board (PCB), it is known to the technology in patent documentation 1.Such as Fig. 6
Shown in, the surface of insulating barrier 130 is formed the 1st conductive pattern the 110 and the 2nd conductive pattern
120.In insulating barrier 130, form the blind hole 140 running through insulating barrier 130.1st conduction
Pattern 110 and the 2nd conductive pattern 120 are connected with each other by blind hole 140.Blind hole 140
Formed by filling electrocondution slurry 143 in through hole 141.
In recent years, along with the high-density line of printed circuit board (PCB), need to make blind hole 140
Diameter is less.Accordingly, it would be desirable to make the internal diameter of through hole 141 less.It addition, in order to run through
Hole 141 is filled enough electrocondution slurries 143, in addition it is also necessary to reduce the viscosity of electrocondution slurry 143.
But, when using low viscous electrocondution slurry 143, can make to send out during electrocondution slurry 143 heat cure
Raw flowing, so that blind hole diameter BD easily produces deviation.It is to say, blind hole diameter
BD crosses welding disk pattern 142 sometimes and extends, in this case, and adjacent conductive pattern
Case is it may happen that short circuit.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2008-181915 publication
Summary of the invention
The problem that invention is to be solved
It is an object of the invention to provide and a kind of can the deviation of blind hole diameter be suppressed less
Printed circuit board (PCB) and the manufacture method of this printed circuit board (PCB).
The means of solution problem
In order to solve the problems referred to above, according to the first embodiment of the invention, it is provided that Yi Zhongyin
The manufacture method of printed circuit board, described printed circuit board (PCB) have insulating barrier, at insulating barrier the 1st
On face formed the 1st conductive layer, on the 2nd of insulating barrier formed the 2nd conductive layer, with
And connect the 1st conductive layer and the blind hole of the 2nd conductive layer.This manufacture method includes following operation:
Through hole formation process, wherein, forms the through hole passing to the 1st conductive layer in a insulating layer；
1st layer of formation process, wherein, in the region comprise through hole, coating is containing conductive particle
Electric conductivity ink to form conductive particle layer；2nd layer of formation process, wherein, is existed by plating
Electrodeposited coating is formed on conductive particle layer；And patterned layer formation process, wherein, remove through hole
Conductive particle layer around, and form the 2nd conductive layer of bag layer comprising conductive particles and electrodeposited coating.
According to the method, after forming blind hole, remove conductive particle layer.Therefore, in order to be formed
Conductive particle layer, can use the electric conductivity ink that viscosity is low.Thus, it is possible to suppression electric conductivity ink
The deviation of low the caused blind hole diameter of viscosity.
In the manufacture method of above-mentioned printed circuit board (PCB), preferably after forming blind hole, to blind hole
Carry out electrified regulation process.Blind hole bag layer comprising conductive particles.It addition, the resistance of conductive particle layer
Value is easily subject to the impact of the contact resistance at the part that conductive particle contacts with each other.This side
Face, according to the method, by blind hole is carried out electrified regulation process, makes conductive particle each other
The partial melting of contact or sintering.It is possible to reduce conductive particle contact electricity each other
Resistance, and then reduce the resistance value of blind hole.
In the manufacture method of above-mentioned printed circuit board (PCB), the 1st layer of formation process preferably include with
Lower operation: the operation of applying conductive ink；Make the solvent evaporation of electric conductivity ink to form conduction
The operation of granulosa；And on conductive particle layer, form the operation of electroless plating.According to the method,
Owing to the gap between the conductive particle of conductive particle layer being filled with plating material, therefore can make
Conductive particle layer becomes fine and close.As a result, it is possible to reduce the resistance value of blind hole.
In the manufacture method of above-mentioned printed circuit board (PCB), it is preferred that the 1st layer of formation process
Before being additionally included in formation electroless plating, conductive particle layer is coated with the work of oxide remover
Sequence, described oxide remover removes the oxide of the 1st conductive layer surface.According to the method,
Owing to being eliminated the oxide of the 1st conductive layer surface, the 1st conductive layer by oxide remover
Become big with the bond strength of conductive particle layer.Result, it is suppressed that the 1st conductive layer and conductive particle
Stripping between Ceng.
In the manufacture method of above-mentioned printed circuit board (PCB), it is preferred that the 1st layer of formation process
After being additionally included in coating oxide remover, in an inert atmosphere oxide remover is carried out
The operation of heat treated.According to the method, oxide remover is applied on conductive particle layer
Afterwards, in an inert atmosphere it is carried out heat treated.Therefore, with aerial heating at
Reason is compared, it is suppressed that the reaction of the oxygen in oxide remover and air, thus promotes oxidation
The reaction of the oxide of thing remover and the 1st conductive layer.Therefore, with heat in atmosphere
Situation about processing is compared, and further suppress the stripping between the 1st conductive layer and conductive particle layer
From.
In the manufacture method of above-mentioned printed circuit board (PCB), it is preferred that oxide remover bag
In the reducing agent containing the described oxide of reduction and the dissolving material dissolving described oxide extremely
Few one.Reducing agent by oxide reduction so that peroxide breaks down.Dissolve material oxide is molten
Solve so that peroxide breaks down.According to the method, owing to the oxide of the 1st conductive layer is decomposed,
Therefore the engaging force between the 1st conductive layer and conductive particle layer becomes big.
In the manufacture method of above-mentioned printed circuit board (PCB), it is preferred that reducing agent is led the 1st
The oxide reduction on electric layer surface, dissolves material and is dissolved by oxide.According to the method, due to
Electric conductivity ink comprises reducing agent and at least one dissolved in material, by applying conductive ink,
Reducing agent and at least one dissolved in material and the oxide interface of the 1st conductive layer can be made.
The thus oxide of decomposable asymmetric choice net the 1st conductive layer.
In the manufacture method of above-mentioned printed circuit board (PCB), the 1st conductive layer is the most stainless steel-based
Plate.According to the method, compared with the situation that the 1st conductive layer uses copper material, printed circuit board (PCB) can
To have high resiliency.Furthermore it is possible to the parts being formed with circuit on stainless steel surfaces are used for
Need parts (head suspension (head suspension) electricity consumption such as such as hard disk of Vibrant buffer
Base board).
In the manufacture method of above-mentioned printed circuit board (PCB), it is preferred that stainless steel substrate is at it
With there is on the contact surface of insulating barrier nickel dam.Easily aoxidize generally, due to stainless surface,
The bonding strength of rustless steel and blind hole may reduce.In this respect, according to the method, nickel dam
The oxidation of stainless steel surfaces can be suppressed such that it is able to suppress the fall of the bonding strength for blind hole
Low.
In order to solve the problems referred to above, according to the second embodiment of the invention, it is provided that Yi Zhongyin
Printed circuit board, described printed circuit board (PCB) has insulating barrier, formation on the 1st of insulating barrier
1st conductive layer, the 2nd conductive layer formed on the 2nd of insulating barrier and connection the 1st
Conductive layer and the blind hole of the 2nd conductive layer.2nd conductive layer has: is formed on insulating barrier and contains
There is the conductive particle layer of multiple conductive particle；It is laminated in the electroless plating on conductive particle layer；
And the electrodeposited coating being laminated on electroless plating, blind hole has: with run through running through of insulating barrier
Position corresponding to hole is formed and conductive particle layer containing multiple conductive particles；It is laminated in blind
Electroless plating on the conductive particle layer in hole；And the plating being laminated on the electroless plating of blind hole
Layer, blind hole is connected with the 1st conductive layer in the bottom surface of through hole.
Blind hole is stacked gradually by insulating barrier, electroless plating and electrodeposited coating and forms.But, at this
In structure, owing to the bond strength between insulating barrier and electroless plating is weak, therefore electroless plating can
Can be from insulation displacement.In this respect, according to the method, electrodeposited coating by conductive particle layer and
Electroless plating and be connected with the 1st conductive layer.In this case, conductive particle layer and insulating barrier
Engaging force is bigger with the bond strength of insulating barrier than electroless plating.Therefore, it can suppress conductive particle
Layer is from the stripping of insulating barrier.
In above-mentioned printed circuit board (PCB), it is preferred that multiple conductive particles are contacting with each other
Part at be melted or sinter and be connected with each other, conductive particle and the 1st conductive layer are mutually
It is melted or sinters and be connected with each other at the part of contact.According to the method, multiple electric conductivity
Grain is melted or sinters and is connected with each other, and conductive particle and the 1st conductive layer melt or sintering
And be connected with each other.Therefore, the electric current density of the guiding path of blind hole increases such that it is able to make blind
The resistance value in hole diminishes.
In above-mentioned printed circuit board (PCB), it is preferred that more than a diameter of 10 μm of through hole,
The thickness of conductive particle layer is below 0.5 μm.When whole through hole is formed conductive particle layer
Time, owing to conductive particle layer contains a lot of gap, therefore reduce the intensity of blind hole.This side
Face, according to the method, stacking on the conductive particle layer of the bottom surface and side that are formed at through hole
Electroless plating and electrodeposited coating.Therefore, with the situation forming conductive particle layer in whole through hole
Compare, it is possible to increase the intensity of blind hole.
Brief Description Of Drawings
The partial cross section of the printed circuit board (PCB) involved by [Fig. 1] one embodiment of the invention
Figure.
The partial section view of [Fig. 2] blind hole.
[Fig. 3] (A) ~ (D) is the partial cross section of the manufacturing process showing printed circuit board (PCB)
Figure.
[Fig. 4] (A) ~ (D) is the partial cross section of the manufacturing process showing printed circuit board (PCB)
Figure.
[Fig. 5] shows the relation between the manufacturing condition of printed circuit board (PCB) and the resistance value of blind hole
Table.
The partial section view of the printed circuit board (PCB) that [Fig. 6] is traditional.
Detailed description of the invention
Seeing figures.1.and.2 and illustrate an embodiment, this embodiment is: will
The printed circuit board (PCB) of the present invention is embodied as head suspension circuit substrate, and described head suspension is used
Circuit substrate is for carrying the magnetic head in hard drive.
As depicted in figs. 1 and 2, printed circuit board (PCB) 1 has the conduction as the 1st conductive layer
Substrate 10, it is laminated in the insulating barrier 20 of electrically-conductive backing plate 10 upper surface and is formed at insulating barrier
The conductive pattern 30 as the 2nd conductive layer of 20 upper surfaces.In the present embodiment, insulation
The lower surface of layer 20 is the 1st, and the upper surface of insulating barrier is the 2nd.
As electrically-conductive backing plate 10, using (such as) thickness is the stainless of 10 μm ~ 500 μm
Steel substrate.It addition, as electrically-conductive backing plate 10, aluminium sheet, iron plate, copper coin, conduction can be used
Property metal plywood or electric conductivity alloy.The thickness of electrically-conductive backing plate 10 sets according to purposes.
As electrically-conductive backing plate 10, it is possible to use be formed with the stainless steel substrate of nickel dam on surface.?
In this case, nickel dam becomes protecting film, it is suppressed that stainless oxidation.
Insulating barrier 20 is formed by the insulative resin with retractility, such as, by polyimides
Film is formed.Therefore, insulating barrier 20 can correspond to the vibration of printed circuit board (PCB) 1 and becomes
Shape.
Conductive particle layer 31 that conductive pattern 30 is formed by metallic particles, at conductive particle layer
The electroless plating 32 formed on 31 and electrodeposited coating 33 structure formed on electroless plating 32
Become.Layer conductive particle layer 31 and electroless plating 32 combined is as the 1st layer, by electricity
Coating 33, as the 2nd layer, is described below.
Conductive particle layer 31 is by the conductive particle 31A stacking that mean diameter is tens of nm
Become.Mean diameter is that in the cumulative distribution representing particle diameter, accumulated value is the value (D50) when 50%.
Cumulative distribution be with scanning electron microscope (SEM) 500 granules are carried out image analysis,
Then make based on the value radius of circle value of granule being carried out volume conversion and try to achieve.Conduction
The thickness of granular layer 31 is below 0.5 μm.
Conductive particle 31A is made up of copper (Cu).As conductive particle 31A, except Cu
In addition, such as can also use containing selected from Ag, Au, Pt, Pd, Ru, Sn, Ni, Fe,
The granule of at least one in the group of Co, Ti, In.Alternatively, it is also possible to by these electric conductivity
The mixture of granule 31A forms conductive particle layer 31.The particle diameter of conductive particle 31A is preferred
Scope at 30nm ~ 100nm.By particle diameter being set in described scope, it is possible to make to lead
The surface of electricity granular layer 31 smooths.
Adjacent conductive particle 31A is sintered or melted at the part contacted with each other, from
And make multiple conductive particle 31A be connected with each other.It addition, conductive particle 31A and conduction
The part of substrate 10 contact is also sintered or melted, so that conductive particle 31A and conduction
Substrate 10 is connected with each other.
Electroless plating 32 is by the nothing of the metals (hereinafter referred to as electroless plated metal) such as copper, silver, nickel
Plating is formed.In the case of conductive particle 31A is copper granule, attached from copper granule
From the viewpoint of the property, it is preferred that formed electroless plating 32 by copper or nickel.Electroless plating
32 by the lower floor formed on the layer identical with conductive particle layer 31 and are laminated in lower floor
Upper strata constituted.Lower floor is such layer, this layer by be filled in conductive particle 31A it
Between gap in electroless plated metal formed.Upper strata is as main component containing electroless plated metal
Layer.The thickness of electroless plating 32 is 0.1 μm ~ 0.5 μm.
Electrodeposited coating 33 is formed by the plating of the metal such as copper or nickel.The thickness of electrodeposited coating 33 is 5
μm~30μm.The thickness of electrodeposited coating 33 is bigger than the thickness of electroless plating 32.Electrodeposited coating 33
Thickness set according to the purposes of printed circuit board (PCB) 1.
The through hole 41 passing to electrically-conductive backing plate 10 is formed in insulating barrier 20.Blind hole 40 be
The position corresponding with through hole 41, by conductive particle layer 31, electroless plating 32 and plating
Layer 33 stacks gradually and is formed.Blind hole 40 has the structure identical with conductive pattern 30.
It follows that with reference to Fig. 3 (the A) ~ Fig. 4 (D) manufacture method to printed circuit board (PCB) 1
Illustrate.
As shown in Fig. 3 (A), on the electrically-conductive backing plate 10 that thickness is 10 μm ~ 500 μm,
The polyimide precursor resin of coating solution shape.Thereafter, to polyimides more than 300 DEG C
Precursor resin heats so that it is solidification.Thus, forming thickness on electrically-conductive backing plate 10 is
The insulating barrier 20 of 10 μm ~ 200 μm.
As shown in Fig. 3 (B), in insulating barrier 20, at the part corresponding with blind hole 40
Form the through hole 41(through hole formation process of a diameter of 10 μm ~ 200 μm).For
The formation of through hole 41, can use laser method or etching method.Now, so formation runs through
Hole 41, until the bottom surface of through hole 41 passes to electrically-conductive backing plate 10, i.e. through hole 41 deep
Spend identical with the thickness of insulating barrier 20.The internal diameter of through hole 41 is 10 μm ~ 200 μm.Shape
After becoming through hole 41, in order to remove resin burr, the tree produced due to laser or etching
Cosmetics ends etc., carry out desmearing process.
As shown in Fig. 3 (C), after the surface of insulating barrier 20 processes, at electrically-conductive backing plate 10
Whole surface on applying conductive ink, further the electric conductivity ink being coated with is dried
(the 1st layer of formation process).Electric conductivity ink is dried, in order to remove at conductive particle 31A
Surface and electrically-conductive backing plate 10 surface on the oxide that formed, be coated with oxide remover,
And further the oxide remover being coated with is dried.It addition, in order to sinter electric conductivity
Granule 31A, carries out heat treated.Below each operation is described in detail.
As the surface treatment method of insulating barrier 20, Cement Composite Treated by Plasma can be enumerated, use alkali
Solution makes the alkali of surface hydrophilic process, be made by corona discharge the electricity of the surface modification of object
The dizzy UV process etc. processing, being made by ultraviolet the surface modification of object.By these tables
Face processing method, can make the rough surface of insulating barrier 20, or the table at insulating barrier 20
Face imports hydrophilic group.As a result, the surface tension between electric conductivity ink and insulating barrier 20 reduces.
Electric conductivity ink makes conductive particle 31A be scattered in designated solvent to prepare.Right
In the dispersion of conductive particle 31A, particle dispersants can be used.As solvent, such as
Water can be used.The viscosity of electric conductivity ink is almost identical with the viscosity of water.Therefore, even if running through
The diameter in hole 41 is little to 10 μm, it is also possible to easily fill electric conductivity ink in through hole 41.
As solvent, it would however also be possible to employ the volatile solvents such as ethanol or water are mixed with volatile solvent
Close liquid.As conductive particle 31A, the granule that mean diameter can be used to be tens of nm.
As particle dispersants, it is for instance possible to use molecular weight is the height of 2000 ~ 100000
Dispersal agent molecule.Specifically, as particle dispersants, polymine can be used, gather
The amine macromolecule dispersing agents such as vinyl pyrrolidone.It addition, as particle dispersants, it is possible to
To use the hydro carbons macromolecule in polyacrylic acid, carboxymethyl cellulose equimolecular with hydroxy-acid group
Dispersant etc..
Use roller applying conductive ink on the whole surface of electrically-conductive backing plate 10.Regulation is coated with
Electric conductivity ink thickness so that dried electric conductivity ink thickness be 0.1 μm.For
Electric conductivity ink coating, it is also possible to use spin-coating method, spraying process, stick coating method, die coating methods,
The methods such as slot coated method, dip coating.When electric conductivity ink is dried, in order to evaporate electric conductivity ink
In water, in air atmosphere, maintain the time that the temperature of 80 DEG C is predetermined.Thus, absolutely
The thin layer of conductive particle 31A is formed on the surface of edge layer 20.
Electric conductivity ink is dried, at the surface of conductive particle 31A and the table of electrically-conductive backing plate 10
Oxide remover it is coated with on face.Regulation oxide remover so that oxide removal material is molten
In the solvent that Xie Yu is predetermined.As solvent, such as, can use water.As solvent, it is also possible to
Use the mixed liquor of the volatile solvents such as ethanol or water and volatile solvent.
After coating oxide remover, heat in inert gas atmosphere.Oxide goes
Except the heating-up temperature of agent is 50 DEG C ~ 450 DEG C, more preferably 100 DEG C ~ 400 DEG C.Add
Heat treatment time is 1 minute ~ 200 minutes, more preferably 10 minutes ~ 60 minutes.Logical
Cross heat treated, make present on each surface of conductive particle 31A and electrically-conductive backing plate 10
Oxide layer reacts with oxide removal material, so that this oxide layer is decomposed.
As oxide removal material, it is divided into following two type.
The reducing substances that oxide removal material is reduced oxide of the 1st type.Make
For reducing substances, hypophosphorous acid, phosphorous acid, ascorbic acid, ethylenediaminetetraacetic acid can be enumerated
(EDTA), alcohol, hydrazine, formaldehyde etc..
The oxide removal material of the 2nd type is the acidity or basic species making oxide dissolve
Matter.As this material, can enumerate allylamine, formic acid, glutamic acid, fatty acid, lactic acid,
Phthalic acid, maleic acid, malic acid, boric acid, ammonium chloride, magnesium chloride, chloromethanes, chlorine
Imitative, sodium acetate, potassium bromide, calcium bromide, trichloro ethylene, sodium sulfide, sodium iodide, aluminum sulfate,
Hexachlorethane etc..Particularly, allylamine, formic acid, glutamic acid, fatty acid, lactic acid, adjacent benzene
Dioctyl phthalate, maleic acid, malic acid, even if owing to they have residual at oxide remover after drying
Staying, ionic element also will not remain, the most preferably.
About oxide remover, can be by the oxide removal material and the 2nd of the 1st type
Any one or both in the oxide removal material of type are dissolved in solvent and make
With.Alternatively, it is also possible to add the dispersant of oxide removal material in a solvent or regulate molten
The pH adjusting agent of liquid pH.
In the electric conductivity dried heat treated of ink, sintering the same of conductive particle 31A
Time, remove the Organic substance (hereinafter referred to as " residual organic matter ") beyond conductive particle 31A.
As residual organic matter, particle dispersants contained in electric conductivity ink can be enumerated, oxide goes
Except agent etc..In order to suppress the oxidation of conductive particle 31A, in (such as) nitrogen atmosphere
Carry out heat treated.In heat treated, it is warming up to 350 DEG C with the programming rate of 5 DEG C/min,
Again the temperature of 350 DEG C is maintained 30 minutes.Thus, sinter conductive particle 31A, and
Interconnect between conductive particle 31A, thus form conductive particle layer 31.Can be as above
State the reason sintered at a lower temperature like that and be because the electric conductivity that mean diameter is tens of nm
The surface of granule 31A can be high.
It follows that as shown in Fig. 3 (D), form electroless plating 32 so that distance insulating barrier
The thickness of 20 is about 0.2 μm.Specifically, at conductive particle layer 31 and insulating barrier 20
After the metallic catalysts such as upper coating Pd-Sn, dissolve Sn, make Pd be attached to conductive particle layer
On 31.Then, by impregnated in copper electrolyte, at conductive particle layer 31 and insulating barrier 20
Upper formation electroless plating 32.So, the adjacent gap between conductive particle 31A, with
And the gap between conductive particle 31A and electrically-conductive backing plate 10 all filled by electroless plated metal.
Thus, while the density of conductive particle layer 31 increases, on the surface of conductive particle layer 31
Form fine and close electroless plating 32.
It follows that form conduction by half addition-pattern (semi additive-pattern) method
Pattern 30 and blind hole 40.Below each operation is specifically described.
As shown in Figure 4 (A), electroless plating 32 except with blind hole 40 and conductive pattern
On surface outside the part of 30 correspondences, form resist 50.Resist 50 is by by light
After cause resist layer is pressed on substrate, photomask is used to be exposed and develop and formed.
As shown in Fig. 4 (B), carry out the plating of copper, electroless plating 32 is formed plating
Layer the 2nd layer of formation process of 33().Thus, on conductive particle layer 31 and insulating barrier 20
Form conductive pattern 30 and blind hole 40.
As shown in Fig. 4 (C), after peeling off resist 50, remove seed with dioxysulfate water
Layer (seed layer), i.e. electroless plating 32 and conductive particle layer 31.Remove nothing further
The Pd on insulating barrier 20 it is attached to during plating.By above operation, form blind hole 40 and lead
Electrical pattern 30(patterned layer formation process).
It follows that the manufacture method of the present embodiment and traditional manufacture method will be compared, and
It is explained.
In traditional manufacture method, after forming through hole 41 in insulating barrier 20, passing through
Surrounding's formation welding disk pattern of perforation 41.Then, by filling electrocondution slurry to through hole 41,
Welding disk pattern is made to be connected with electrically-conductive backing plate 10.According to this method, in order to solve along with passing through
The thin footpath of perforation 41 and problem that the electrocondution slurry that produces cannot be filled, need to reduce and conduct electricity
The viscosity of slurry.But, the reduction of electrocondution slurry viscosity can cause such problem: conductive paste
Material is crossed welding disk pattern when heat cure and is extended, thus blind hole diameter produces deviation.
In this respect, the present application is characterised by each work of Fig. 4 (A) ~ Fig. 4 (C)
Sequence.In other words, different from the manufacture method of traditional blind hole 40, owing to implementing before plating
Fill the operation of conductive material to through hole 41, i.e. the coating of electric conductivity ink, therefore can adopt
With low viscous electric conductivity ink.Additionally, due to remove Seed Layer (nothing after electric conductivity ink is coated with
Electrodeposited coating 32 and conductive particle layer 31), the therefore generation energy of blind hole 40 dimensional discrepancy
Access suppression.Therefore, it is possible to make accuracy to size and the half addition-pattern method of blind hole 40
Pattern fidelity is identical.
It addition, in the manufacture method of the printed circuit board (PCB) 1 of the present embodiment, blind being formed
Behind hole 40 and conductive pattern 30, in order to reduce the resistance value of blind hole 40, blind hole 40 is carried out
Electrified regulation processes.Below this process is illustrated.
As shown in Figure 4 (D) shows, probe 61 and the blind hole of the hot side of constant current source 60 are made
The electrodeposited coating 33 of 40 contacts.It addition, make the probe 62 of ground side contact with electrically-conductive backing plate 10.
Then, two probes 61 and 62 are used to make blind hole 40 passes through constant current.
The resistance of conductive particle layer 31 and electroless plating 32 is leading by conductive particle 31A
Electricity contact resistance between rate, electroless conductivity, conductive particle 31A, electric conductivity
Contact resistance, electroless plating and conductive particle 31A between granule 31A and electrically-conductive backing plate 10
Between contact resistance etc. determine.In above-mentioned each key element, conductive particle layer 31 and without electricity
The resistance of coating 32 is especially by the contact resistance between conductive particle 31A and electric conductivity
The impact of the contact resistance between granule 31A and electrically-conductive backing plate 10 is bigger.It addition, in conduction
In the case of being formed with oxide layer on the property surface of granule 31A and the surface of electrically-conductive backing plate 10,
Above-mentioned each contact resistance promotes conductive particle layer 31 and the resistance of electroless plating 32 larger.
Therefore, in order to reduce each contact resistance, make in blind hole 40 by pulse current, thus will lead
Contact portion between conductive particles 31A and conductive particle 31A and electrically-conductive backing plate 10
Between contact portion sinter respectively or melted.Thus, make to connect between conductive particle 31A
Connect, and make conductive particle 31A be connected with each other with electrically-conductive backing plate 10 simultaneously.It addition,
In this case, the contact resistance between conductive particle 31A and conductive particle 31A
And the contact resistance between electrically-conductive backing plate 10 is respectively smaller.
It follows that the embodiment of reference printed circuit board (PCB) 1 shown in Fig. 5 and comparative example,
To the effect of the coating oxide remover in the manufacture method of printed circuit board (PCB) 1 and to blind
The effect of hole 40 electrified regulation illustrates.
In embodiment 1 ~ 3, after coating oxide remover, carry out electrified regulation.In contrast
In example, it is not coated with oxide remover and carries out electrified regulation.Then, for each embodiment and
Comparative example, the respectively resistance value of the blind hole 40 before and after measurement electrified regulation.
<embodiment 1>
Base material uses the electrically-conductive backing plate 10 being laminated with insulating barrier 20.
Electrically-conductive backing plate 10 uses the SUS304 substrate that thickness is 20 μm.
Insulating barrier 20 is formed by polyimide resin.The thickness of insulating barrier is set to 10 μm.
Irradiate YAG laser to insulating barrier 20, form the through hole 41 of blind hole 40.Run through
The diameter in hole 41 is set to 60 μm.
Electric conductivity ink uses copper granule that mean diameter is 40nm only with 8 mass %
The aqueous solution being dispersed in water.
On base material after applying conductive ink, heat at 80 DEG C about 30 seconds, make conduction
Substrate 10 is dried.
Electric conductivity ink is dried, using 1.0 mass % aqueous solutions of ascorbic acid as oxide
Remover (reducing agent) is coated on the dried object of electric conductivity ink.Thereafter, at indifferent gas bromhidrosis
In atmosphere, maintain the temperature 30 minutes of 90 DEG C.Then, with the programming rate liter of 5 DEG C/min
Temperature is to 350 DEG C, then heats 30 minutes at a temperature of 350 DEG C, forms conductive particle layer 31.
Conductive particle layer 31 carries out the electroless plating of copper.The thickness of electroless plating is set to 0.2
μm。
On electroless plating, form conductive pattern 30 and blind hole by half addition-pattern method
40。
To make electric current be 5A, pulse width is that the pulse current of 100 μ s is logical in blind hole 40
Electricity.
(result)
The blind hole 40 resistance value before energising is 1.4 Ω.
Blind hole 40 resistance value after powered up is 0.11 Ω.
<embodiment 2>
Making manufacturing condition same as in Example 1, difference is: be dried at electric conductivity ink
After, using 1.0 mass % aqueous solutions of glutamic acid as oxide remover (oxide lytic agent)
Coat on the dried object of electric conductivity ink.
(result)
The blind hole 40 resistance value before energising is 1.2 Ω.
Blind hole 40 resistance value after powered up is 0.09 Ω.
<embodiment 3>
Making manufacturing condition same as in Example 1, difference is: be dried at electric conductivity ink
After, using 1.0 mass % aqueous solutions of maleic acid as oxide remover (oxide lytic agent)
Coat on the dried object of electric conductivity ink.
(result)
The blind hole 40 resistance value before energising is 1.2 Ω.
Blind hole 40 resistance value after powered up is 0.09 Ω.
<comparative example>
Making manufacturing condition identical with embodiment 1 ~ 3, difference is: be not coated with oxygen
Compound remover.
(result)
The blind hole 40 resistance value before energising is 1.8 Ω.
Blind hole 40 resistance value after powered up is 0.14 Ω.
<evaluation>
With reference to Fig. 5, each embodiment and comparative example are compared.
For any one in each embodiment and comparative example, blind hole 40 carries out pulse and leads to
Electricity, the effect of pulse electrifying is the most identical.That is, the resistance value after energising is than the resistance value before energising
Little.It is thought that this is due to before pulse electrifying, connecing between conductive particle 31A
Contact portion is divided and contact site office resistance between conductive particle 31A and electrically-conductive backing plate 10
Be worth higher, in contrast, after pulse electrifying, each contact portion heated and melted or
Sintering, makes the resistance value of each contact portion reduce.
On the other hand, the resistance value of the blind hole 40 before energising is compared, each embodiment
Resistance value is less than the resistance value of comparative example.It is thought that this is due to for any one embodiment,
Owing to being coated with oxide remover, thus eliminate the oxidation on conductive particle 31A surface
Thing and the oxide of electrically-conductive backing plate 10 surface (blind hole 40 bottom surface).
Hereinafter, according to the present embodiment, it is possible to achieve following action effect.
(1) on insulating barrier 20, applying conductive is black to form conductive particle layer 31.Connect down
Come, on conductive particle layer 31, form blind hole 40 by plating.Further, blind hole 40 is removed
Conductive particle layer 31 around and electroless plating 32.According to the method, after forming blind hole 40
Remove conductive particle layer 31.It is therefore possible to use for forming the low viscous of conductive particle layer 31
Degree electric conductivity ink.Thus, it is possible to suppression owing to the viscosity of conductive film is low, blind hole that is that cause is straight
The deviation in footpath.
(2), after forming blind hole 40, blind hole 40 is carried out electrified regulation process.Blind hole 40
Bag layer comprising conductive particles 31.It addition, the resistance value of conductive particle layer 31 is easily subject to electric conductivity
The impact of the contact resistance of the contact site office between granule 31A.According to the present embodiment,
By blind hole 40 is carried out electrified regulation process, make the contact site between conductive particle 31A
Divide melted or sintering.Thereby, it is possible to the contact resistance reduced between conductive particle 31A,
And then reduce the resistance value of blind hole 40.
(3) after the solvent making electric conductivity ink evaporates to form conductive particle layer 31, in conduction
Electroless plating 32 is formed on granular layer 31.According to the method, due at conductive particle 31A
Between gap in be filled with plating material, conductive particle layer 31 therefore can be made to become fine and close.Knot
Really, it is possible to reduce the resistance value of blind hole 40.
(4), after forming conductive particle layer 31, conductive particle layer 31 is coated with oxide and goes
Except agent.According to this composition, eliminated the oxygen on electrically-conductive backing plate 10 surface by oxide remover
Compound, therefore the bond strength of electrically-conductive backing plate 10 and conductive particle layer 31 becomes big.As a result, press down
Make the stripping between electrically-conductive backing plate 10 and conductive particle layer 31.
(5) after coating oxide remover, in an inert atmosphere it is carried out heat treated.
According to the method, compared with the heat treated carried out in atmosphere, oxide remover and air
In the reaction of oxygen be inhibited, thus promote oxide remover and electrically-conductive backing plate 10
Oxide reacts.Therefore, electrically-conductive backing plate 10 and conductive particle layer are further inhibited
Stripping between 31.
(6) as oxide remover, can use by oxide reduce reducing agent, with
And at least one dissolved in material by oxide dissolving.Oxide reduction is made by reducing agent
Peroxide breaks down.Dissolve material to be dissolved by oxide and make peroxide breaks down.According to the method,
Owing to the oxide of electrically-conductive backing plate 10 is decomposed, electrically-conductive backing plate 10 and conductive particle layer 31 it
Between engaging force become big.
(7) electrically-conductive backing plate 10 can use stainless steel substrate.According to this composition, with conduction
Substrate 10 uses the situation of copper material to compare, and printed circuit board (PCB) 1 can have high resiliency.
(8) blind hole 40 has conductive particle layer 31, electroless plating 32 and electrodeposited coating 33.
Blind hole 40 stacks gradually electroless plating and electrodeposited coating 33 on insulating barrier 20 and is formed.
But, in this configuration, owing to the bond strength between insulating barrier 20 and electroless plating 32 is weak,
Therefore electroless plating 32 may be peeled off from insulating barrier 20.In this respect, according to this embodiment party
Case, electrodeposited coating 33 by conductive particle layer 31 and electroless plating 32 with electrically-conductive backing plate 10
Connect.In this case, conductive particle layer 31 compares electroless plating with the engaging force of insulating barrier 20
Layer is big with the bond strength of insulating barrier 20.Therefore, it is suppressed that conductive particle layer 31 is from insulating barrier
The stripping of 20.
(9) multiple conductive particle 31A be melted at the part contacted with each other or sinter and
It is connected with each other.It addition, conductive particle 31A and electrically-conductive backing plate 10 are in the part contacted with each other
Place is melted or sinters and be connected with each other.According to this composition, due to the guiding path of blind hole 40
Electric current density increase, it is possible to make the resistance value of blind hole 40 diminish.
It should be noted that the present embodiment can also be carried out change as follows.
It is susceptible to oxidation, therefore stainless steel substrate and blind hole generally, due to stainless steel surfaces
The bonding strength of 40 may reduce.In order to prevent this situation, as electrically-conductive backing plate 10 not
Rust steel substrate can have nickel dam on its contact surface with insulating barrier 20.According to this composition,
Owing to nickel dam inhibits the oxidation of stainless steel surfaces such that it is able to suppression stainless steel substrate and blind hole
The reduction of the bonding strength of 40.
Dried at electric conductivity ink, conductive particle layer 31 is coated with oxide remover,
But oxide remover can also be added in advance in electric conductivity ink.Even if it is so, the most permissible
Make the reducing agent in electric conductivity ink and dissolve the oxide interface of material and electrically-conductive backing plate 10, from
And decompose the oxide of electrically-conductive backing plate 10.According to the method, it is not necessary to oxide remover
Coating and dry each operation of the solution containing oxide remover, so that manufacturing process is simple
Change.
Dried at electric conductivity ink, carry out the coating of oxide remover and be dried, but also
Being dried of oxide remover can be included in the sintering circuit of conductive particle 31A.Example
As, use two stage heating-up temperature, under an inert atmosphere the coating material of oxide remover is entered
Row heating.The temperature in the 1st stage is set to the temperature making the moisture of oxide remover evaporate
(i.e. 50 DEG C ~ 100 DEG C), and maintain 30 minutes.Then, the temperature in the 2nd stage is set to
350 DEG C, and maintain 30 minutes.
Half addition-full plate (semi-additive panel) method can also be passed through and form conductive pattern
30 and blind hole 40.In any one manufacture method, conductive pattern 30 can formed
Rear removing conductive particle layer 31 and electroless plating 32, therefore, compared with traditional method, energy
Enough improve the accuracy to size of blind hole 40.
It is suitable for connect conductive pattern 30 and be disposed above or lower section
The blind hole 40 of conductive pattern 30.
Except for carry the head suspension printed circuit board (PCB) 1 of magnetic head in hard drive with
Outward, present disclosure additionally applies for various printed circuit board (PCB) 1.
Claims (10)
1. a manufacture method for printed circuit board (PCB), described printed circuit board (PCB) have insulating barrier,
On the 1st of described insulating barrier formed the 1st conductive layer, at the 2nd of described insulating barrier
On face formed the 2nd conductive layer and connect described 1st conductive layer and described 2nd conductive layer
Blind hole, described manufacture method is characterised by including following operation:
Through hole formation process, wherein, is formed in described insulating barrier and passes to the described 1st and lead
The through hole of electric layer；
1st layer of formation process, wherein, is coated with in the region containing described through hole and contains
The electric conductivity ink of conductive particle is to form conductive particle layer, and described 1st layer of formation process includes
Following operation: be coated with described electric conductivity ink operation, make described electric conductivity ink solvent evaporation with
Form the operation of described conductive particle layer, and coating oxide goes on described conductive particle layer
After agent, described conductive particle layer forms the operation of electroless plating, described oxide removal
Agent removes the oxide of described 1st conductive layer surface；
2nd layer of formation process, wherein, forms electricity by plating on described conductive particle layer
Coating；And
Patterned layer formation process, wherein, removes the described conductive particle around described through hole
Layer, and form described 2nd conductive layer comprising described conductive particle layer and described electrodeposited coating.
The manufacture method of printed circuit board (PCB) the most according to claim 1, it is characterised in that
After forming described blind hole, described blind hole is carried out electrified regulation process.
The manufacture method of printed circuit board (PCB) the most according to claim 1, it is characterised in that
In described 1st layer of formation process, be additionally included in coating described oxide remover it
After, in an inert atmosphere described oxide remover is carried out the operation of heat treated.
The manufacture method of printed circuit board (PCB) the most according to claim 1, it is characterised in that
Described oxide remover contains and reduces the reducing agent of described oxide and dissolve described
At least one dissolved in material of oxide.
The manufacture method of printed circuit board (PCB) the most according to claim 4, it is characterised in that
The oxide of described 1st conductive layer surface is reduced by described reducing agent, and described molten
Solve material to be dissolved by described oxide.
The manufacture method of printed circuit board (PCB) the most according to claim 1 and 2, its feature
It is,
Described 1st conductive layer is stainless steel substrate.
The manufacture method of printed circuit board (PCB) the most according to claim 6, it is characterised in that
Described stainless steel substrate has nickel dam on its contact surface with described insulating barrier.
8. a printed circuit board (PCB), this printed circuit board (PCB) is according to claim 1 and 2
Method manufacture, have insulating barrier, on the 1st of described insulating barrier formed the 1st conductive layer,
On the 2nd of described insulating barrier formed the 2nd conductive layer and connect described 1st conduction
Layer and the blind hole of described 2nd conductive layer, it is characterised in that
Described 2nd conductive layer has:
It is formed on described insulating barrier and contains the conductive particle layer of multiple conductive particles；
It is laminated in the electroless plating on described conductive particle layer；And
It is laminated in the electrodeposited coating on described electroless plating,
Described blind hole has:
Formed in the position corresponding with the through hole running through described insulating barrier and lead containing multiple
The conductive particle layer of conductive particles；
It is laminated in the electroless plating on the conductive particle layer of described blind hole；And
It is laminated in the electrodeposited coating on the electroless plating of described blind hole,
Described blind hole is connected with described 1st conductive layer in the bottom surface of described through hole.
Printed circuit board (PCB) the most according to claim 8, it is characterised in that
The plurality of conductive particle is melted at the part contacted with each other or sinters and be mutual
Connect,
Described conductive particle and described 1st conductive layer are melted at the part contacted with each other
Or sinter and be connected with each other.
Printed circuit board (PCB) the most according to claim 8 or claim 9, it is characterised in that
More than a diameter of 10 μm of described through hole, and the thickness of described conductive particle layer
It it is below 0.5 μm.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011083902A JP5335023B2 (en) | 2011-04-05 | 2011-04-05 | Method for manufacturing printed wiring board |
| JP2011-083902 | 2011-04-05 | ||
| PCT/JP2012/058409 WO2012137669A1 (en) | 2011-04-05 | 2012-03-29 | Printed circuit board and method for producing printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102918937A CN102918937A (en) | 2013-02-06 |
| CN102918937B true CN102918937B (en) | 2016-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280001484.0A Expired - Fee Related CN102918937B (en) | 2011-04-05 | 2012-03-29 | Printed circuit board (PCB) and the manufacture method of this printed circuit board (PCB) |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5335023B2 (en) |
| CN (1) | CN102918937B (en) |
| WO (1) | WO2012137669A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111463192A (en) * | 2013-08-01 | 2020-07-28 | 日月光半导体制造股份有限公司 | Semiconductor package |
| JP6473018B2 (en) * | 2015-03-10 | 2019-02-20 | 住友電工プリントサーキット株式会社 | Method for manufacturing substrate for printed wiring board, substrate for printed wiring board and printed wiring board |
| CN107634012B (en) * | 2017-09-13 | 2021-05-07 | 京东方科技集团股份有限公司 | Packaging substrate, preparation method thereof, display panel and display device |
| JP7515339B2 (en) * | 2020-08-07 | 2024-07-12 | 日東電工株式会社 | Method for manufacturing a wired circuit board, and wired circuit board |
| JP7289602B2 (en) * | 2020-11-13 | 2023-06-12 | 日東電工株式会社 | WIRED CIRCUIT BOARD AND METHOD FOR MANUFACTURING WIRED CIRCUIT BOARD |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1794900A (en) * | 2004-12-24 | 2006-06-28 | 日本Cmk株式会社 | Printed circuit board and method of manufacturing the same |
| JP2010118460A (en) * | 2008-11-12 | 2010-05-27 | Sumitomo Electric Ind Ltd | Printed wiring board and its manufacturing method |
| WO2010122918A1 (en) * | 2009-04-24 | 2010-10-28 | 住友電気工業株式会社 | Substrate for printed wiring board, printed wiring board, and methods for producing same |
| JP2010272837A (en) * | 2009-04-24 | 2010-12-02 | Sumitomo Electric Ind Ltd | Substrate for printed wiring board, printed wiring board, and method for producing substrate for printed wiring board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009026898A (en) * | 2007-07-18 | 2009-02-05 | Daisho Denshi:Kk | Method of manufacturing multilayer printed wiring board, and multilayer printed wiring board |
| JP2010153628A (en) * | 2008-12-25 | 2010-07-08 | Hitachi Chem Co Ltd | Method for manufacturing multilayer wiring board |
-
2011
- 2011-04-05 JP JP2011083902A patent/JP5335023B2/en active Active
-
2012
- 2012-03-29 WO PCT/JP2012/058409 patent/WO2012137669A1/en active Application Filing
- 2012-03-29 CN CN201280001484.0A patent/CN102918937B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1794900A (en) * | 2004-12-24 | 2006-06-28 | 日本Cmk株式会社 | Printed circuit board and method of manufacturing the same |
| JP2010118460A (en) * | 2008-11-12 | 2010-05-27 | Sumitomo Electric Ind Ltd | Printed wiring board and its manufacturing method |
| WO2010122918A1 (en) * | 2009-04-24 | 2010-10-28 | 住友電気工業株式会社 | Substrate for printed wiring board, printed wiring board, and methods for producing same |
| JP2010272837A (en) * | 2009-04-24 | 2010-12-02 | Sumitomo Electric Ind Ltd | Substrate for printed wiring board, printed wiring board, and method for producing substrate for printed wiring board |
| TW201101947A (en) * | 2009-04-24 | 2011-01-01 | Sumitomo Electric Industries | Substrate for printed wiring board, printed wiring board and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5335023B2 (en) | 2013-11-06 |
| CN102918937A (en) | 2013-02-06 |
| WO2012137669A1 (en) | 2012-10-11 |
| JP2012222047A (en) | 2012-11-12 |
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