CN102901924B - The method of the single-particle inversion characteristic of a kind of part of detecting triplication redundancy FPGA - Google Patents
The method of the single-particle inversion characteristic of a kind of part of detecting triplication redundancy FPGA Download PDFInfo
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Abstract
Description
技术领域 technical field
本发明属于粒子辐照测试领域，尤其涉及一种部分三模冗余加固后的SRAM型FPGA的单粒子翻转特性的测试方法。 The invention belongs to the field of particle irradiation testing, and in particular relates to a method for testing the single-particle flipping characteristics of a SRAM-type FPGA partially reinforced by triple-mode redundancy.
背景技术 Background technique
SRAM型FPGA由配置存储器、块存储器、触发器、全局控制寄存器和半闭锁结构等组成，以其集成度高、灵活性强、开发周期短的特点，在航天领域得到了越来越广泛的应用。然而，其工作的空间环境存在着大量γ光子、辐射带电子、高能质子等高能粒子，而SRAM型FPGA是一种单粒子翻转敏感器件，由配置存储器、块存储器、触发器、全局控制寄存器和半闭锁结构等组成，每一部分均可能在高能粒子的轰击下产生单粒子翻转，这对SRAM型FPGA的影响尤为明显。 SRAM-type FPGA is composed of configuration memory, block memory, flip-flop, global control register and semi-blocking structure, etc., with its high integration, strong flexibility, and short development cycle, it has been more and more widely used in the aerospace field . However, there are a large number of high-energy particles such as gamma photons, radiation band electrons, and high-energy protons in the space environment where it works, and the SRAM-type FPGA is a single-event flip-sensitive device, which consists of configuration memory, block memory, flip-flops, global control registers and Compositions such as semi-blocking structures, each part may produce single-event flips under the bombardment of high-energy particles, which has a particularly obvious impact on SRAM-type FPGAs.
现代FPGA工艺向着低电压、高集成度方向发展，这使得发生空间辐射响应的阈值越来越低，发生故障的概率越来越大。空间辐射效应的发生，轻则会使设备工作异常，重则会导致设备烧毁、永久失效。因此，FPGA必须进行高可靠性设计，来最大限度地预防和解决空间辐射效应的影响。 Modern FPGA technology is developing towards low voltage and high integration, which makes the threshold of space radiation response lower and lower, and the probability of failure is higher and higher. The occurrence of space radiation effects will cause the equipment to work abnormally if it is light, and cause the equipment to burn and permanently fail if it is serious. Therefore, FPGA must be designed with high reliability to prevent and solve the impact of space radiation effects to the greatest extent.
三模冗余加固(Triple Modular Redundancy，TMR)，常用的抗单粒子翻转的措施之一.三个模块同时执行相同的操作，以多数相同的输出作为表决系统的正确输出，通常称为三取二。三个模块中只要不同时出现两个相同的错误，就能掩蔽掉故障模块的错误，保证系统正确的输出。由于三个模块是互相独立的，两个模块同时出现错误是极小概率事件，故可以大大提高系统的可靠性。但三模冗余会增加器件内部资源使用量，在一些应用中，由于使用资源大，而器件内部资源总量是一定的，无法做到对所有的电路进行三模冗余设计，设计师根据影响程度，对影响大的部分关键电路进行三模冗余，其余部分不采取三模冗余。因为仅是部分冗余，而不是所有的电路都进行冗余，因此无法预计部分冗余后是否能够真正提高器件的抗单粒子翻转的性能，这种部分三模冗余后的器件单粒子翻转特性测试 Triple Modular Redundancy (TMR), one of the commonly used anti-single-event flipping measures. Three modules perform the same operation at the same time, with most of the same output as the correct output of the voting system, usually called triple take two. As long as two of the same errors do not occur in the three modules at the same time, the error of the faulty module can be masked to ensure the correct output of the system. Since the three modules are independent of each other, it is a very small probability event that two modules have errors at the same time, so the reliability of the system can be greatly improved. However, triple-mode redundancy will increase the internal resource usage of the device. In some applications, due to the large amount of resources used, and the total amount of internal resources of the device is certain, it is impossible to design all circuits with triple-mode redundancy. For the degree of impact, three-mode redundancy is implemented for some key circuits that have a large impact, and triple-mode redundancy is not adopted for the rest. Because only partial redundancy, not all circuits are redundant, it is impossible to predict whether the anti-single event upset performance of the device can be really improved after partial redundancy. The single event upset of the device after partial triple-mode redundancy Characteristic test
发明内容 Contents of the invention
因此，本发明的目的在于提供一种部分三模冗余SRAM型FPGA的单粒子翻转特性的测试方法，能够准确地能够测试出部分三模冗余对器件的加固效果。 Therefore, the object of the present invention is to provide a method for testing the single event upset characteristic of a part of the triple-mode redundant SRAM FPGA, which can accurately test the reinforcement effect of the part of the triple-mode redundancy on the device.
本发明提供一种部分三模冗余SRAM型FPGA的单粒子翻转特性的测试方法，该方法的流程如图1所示，包括： The present invention provides a kind of testing method of the single event turnover characteristic of partly three-mode redundant SRAM type FPGA, and the flow process of this method is as shown in Figure 1, comprises:
1）用LET值大于翻转阈值的高能粒子，在设定的注量率下辐照被测器件，当器件输出特性不正确且在停止粒子束辐照的时间T1内器件功能未恢复正常时，则记录1次单粒子错误，重新配置FPGA器件功能，并多次重复辐照被测器件以得到累计的单粒子错误，并计算单粒子错误截面； 1) Use high-energy particles whose LET value is greater than the flipping threshold to irradiate the device under test at the set fluence rate. When the output characteristics of the device are incorrect and the device function does not return to normal within the time T1 when the particle beam irradiation is stopped, Then record a single event error, reconfigure the FPGA device function, and repeatedly irradiate the device under test to obtain the accumulated single event error, and calculate the single event error cross section;
2）使粒子的LET值不变而注量率降低，并重复上述步骤1），得到另一单粒子错误截面，若该单粒子错误截面与前一次单粒子错误截面的差异小于一预定值，则取该次单粒子错误截面为被测器件的最终单粒子错误截面值，若该单粒子错误截面与前一次单粒子错误截面之差大于一预定值，则继续重复该步骤2）； 2) Keep the LET value of the particle unchanged and reduce the fluence rate, and repeat the above step 1) to obtain another single particle error cross section, if the difference between the single particle error cross section and the previous single particle error cross section is less than a predetermined value, Then take this single event error cross section as the final single event error cross section value of the device under test, if the difference between the single event error cross section and the previous single event error cross section is greater than a predetermined value, continue to repeat the step 2);
3）提供另一与被测器件相同的不进行三模冗余加固的对比器件，用与步骤1）中的LET值相同的高能粒子，在对比注量率下，辐照对比器件，当器件输出特性不正确且在停止粒子束辐照的时间T1内器件功能未恢复正常，则记录1次单粒子错误，并多次重复辐照对比器件以得到多次单粒子错误，并计算单粒子错误截面； 3) Provide another comparison device that is the same as the device under test without three-mode redundancy reinforcement, use high-energy particles with the same LET value as in step 1), and irradiate the comparison device at the comparison fluence rate, when the device If the output characteristics are incorrect and the device function does not return to normal within the time T1 when the particle beam irradiation is stopped, record a single event error, and repeat the irradiation of the comparison device many times to obtain multiple single event errors, and calculate the single event error section;
4）计算未三模冗余加固的对比器件的单粒子错误截面与步骤2）得到的被测器件的最终单粒子错误截面的比值。 4) Calculate the ratio of the single event error cross section of the comparison device without three-mode redundancy reinforcement to the final single event error cross section of the device under test obtained in step 2).
根据本发明提供的方法，根据步骤4）得到的比值判断加固效果，比值越大，则说明三模冗余加固效果大，比值越小，说明三模冗余加固效果越小。 According to the method provided by the present invention, the reinforcement effect is judged according to the ratio obtained in step 4). The larger the ratio, the greater the reinforcement effect of the three-mode redundancy, and the smaller the ratio, the smaller the reinforcement effect of the three-mode redundancy.
根据本发明提供的方法，其中上述步骤1）和步骤3）中，停止辐照的时间T1为20至50秒。 According to the method provided by the present invention, in the above step 1) and step 3), the time T1 for stopping the irradiation is 20 to 50 seconds.
根据本发明提供的方法，其中上述步骤1）中，多次重复辐照被测器件，直到累积出现预定次数的单粒子错误时停止辐照。 According to the method provided by the present invention, in the above-mentioned step 1), the device under test is irradiated multiple times, and the irradiation is stopped until a predetermined number of single event errors are accumulated.
根据本发明提供的方法，其中上述步骤1）中，多次重复辐照被测器件，直到辐照累积注量达到预定量时停止辐照·。 According to the method provided by the present invention, in the above step 1), the device under test is irradiated multiple times, and the irradiation is stopped until the cumulative fluence of irradiation reaches a predetermined amount.
根据本发明提供的方法，其中上述步骤3），多次重复辐照对比器件，直到累积出现预定次数的单粒子错误时停止辐照。 According to the method provided by the present invention, wherein the above-mentioned step 3) repeats the irradiation of the comparison device for several times, and stops the irradiation until a predetermined number of single event errors are accumulated.
根据本发明提供的方法，其中上述步骤3）中，多次重复辐照对比器件，直到辐照累积注量达到预定量时停止辐照。 According to the method provided by the present invention, in the above step 3), the contrast device is irradiated multiple times, and the irradiation is stopped until the cumulative fluence of irradiation reaches a predetermined amount.
根据本发明提供的方法，其中上述步骤3中），所述对比注量率比步骤1）中所述的最终单粒子错误截面值所对应的注量率大两个数量级。 According to the method provided by the present invention, in the above step 3), the comparative fluence rate is two orders of magnitude greater than the fluence rate corresponding to the final single particle error cross section value described in step 1).
根据本发明提供的方法，其中步骤2）中所述的预定值在0-10%之间。 According to the method provided by the present invention, wherein the predetermined value in step 2) is between 0-10%.
本发明提供的方法能够准确地能够测试出部分三模冗余对器件的加固效果。 The method provided by the invention can accurately test the strengthening effect of part of the triple-mode redundancy on the device.
附图说明 Description of drawings
图1为根据本发明的方法的示意图。 Figure 1 is a schematic diagram of the process according to the invention.
具体实施方式 Detailed ways
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合具体实施例，对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。 In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
本实施例提供一种部分三模冗余SRAM型FPGA的单粒子翻转特性的测试方法，包括： The present embodiment provides a method for testing the single event flip characteristics of a part of the triple-mode redundant SRAM type FPGA, including:
1）将被测FPGA器件进行部分三模冗余加固； 1) Carry out part of the three-mode redundancy reinforcement of the FPGA device under test;
2）用LET（传能线密度）值大于FPGA器件的翻转阈值的高能粒子，在设定的注量率（102个粒子/cm2·s）下辐照被测器件，并在辐照期间测试器件的输出特性； 2) Use high-energy particles whose LET (energy transfer linear density) value is greater than the switching threshold of the FPGA device, irradiate the device under test at a set fluence rate (10 2 particles/cm 2 ·s), and irradiate During testing the output characteristics of the device;
3）当器件输出特性不正确时，停止粒子束辐照，同时继续监测器件输出特性； 3) When the output characteristics of the device are not correct, stop the particle beam irradiation while continuing to monitor the output characteristics of the device;
4）若在停止辐照T1=30秒的时间内，器件功能恢复正常，则继续辐照，若停止辐照T1=30秒的时间内，器件功能未恢复正常，则记录1次单粒子错误，通过设置停止辐照的时间T1，来消除器件的自身修复对测试结果造成的影响； 4) If the function of the device returns to normal within T1=30 seconds of stopping the irradiation, continue the irradiation; if the function of the device does not return to normal within T1=30 seconds of stopping the irradiation, record a single event error , by setting the time T1 to stop the irradiation, to eliminate the influence of the self-repair of the device on the test results;
5）重新配置FPGA器件功能，重复步骤2)-4)，直到累积出现100 次单粒子错误时停止辐照； 5) Reconfigure the function of the FPGA device, repeat steps 2)-4), and stop the irradiation until 100 single event errors have accumulated;
6）计算单粒子错误截面，其中单粒子错误截面等于总的单粒子错误数除以总的入射粒子注量； 6) Calculate the single event error cross section, where the single event error cross section is equal to the total number of single event errors divided by the total incident particle fluence;
7）使粒子注量率降低1个数量级，在降低后的注量率（10个粒子/cm2·s）下辐照被测器件，并在辐照期间测试器件的输出特性，然后重复上述步骤3）-6），得到降低后的注量率下的单粒子错误截面； 7) Reduce the particle fluence rate by 1 order of magnitude, irradiate the device under test at the reduced fluence rate (10 particles/cm 2 ·s), and test the output characteristics of the device during the irradiation, and then repeat the above Steps 3)-6) to obtain the single particle error cross section at the reduced fluence rate;
8）比较最后一次设定的注量率与上一次设定的注量率下的单粒子错误截面的差异，若两者基本相同（差值小于一预定值，例如相差10%以内），则停止辐照，继续执行步骤9）；若两者差异大（差值大于一预定值，例如相差10%以上），则重复步骤7），即不断地降低粒子注量率，直到单粒子错误截面基本趋于平稳，从而去除注量率对测试结果造成的影响，取注量率最低时（即最后一次设定的注量率下）所对应的单粒子错误截面值作为被测器件的最终单粒子错误截面值； 8) Compare the difference between the last set fluence rate and the single particle error cross section under the last set fluence rate, if the two are basically the same (the difference is less than a predetermined value, for example, the difference is within 10%), then Stop the irradiation and continue to step 9); if the difference between the two is large (the difference is greater than a predetermined value, such as a difference of more than 10%), repeat step 7), that is, continuously reduce the particle fluence rate until the single particle error cross section Basically tends to be stable, so as to remove the impact of the fluence rate on the test results, and take the single particle error cross-section value corresponding to the lowest fluence rate (that is, the last set fluence rate) as the final unit value of the device under test. Particle error cross-section value;
9）提供另一与被测器件相同的对比器件，该对比器件不进行三模冗余加固； 9) Provide another comparison device that is the same as the device under test, and this comparison device does not carry out three-mode redundancy reinforcement;
10）用LET值与步骤1）中的LET值相同的高能粒子，在对比注量率（102个粒子/cm2·s）下，辐照对比器件，辐照期间测试器件的输出特性，所述对比注量率比步骤8）中所述的最后一次设定的注量率大两个数量级； 10) Use high-energy particles with the same LET value as the LET value in step 1), irradiate the comparative device at a comparative fluence rate (10 2 particles/cm 2 ·s), and test the output characteristics of the device during irradiation, The comparative fluence rate is two orders of magnitude greater than the last set fluence rate described in step 8);
11）当器件输出特性不正确时，停止粒子束辐照，继续监测器件输出特性，若在停止辐照T1=30秒的时间内，器件功能恢复正常，则继续辐照，若停止辐照T1=30秒的时间内，器件功能未恢复正常，则记录1次单粒子错误； 11) When the output characteristics of the device are incorrect, stop the particle beam irradiation and continue to monitor the output characteristics of the device. If the device function returns to normal within the time of stopping the irradiation T1=30 seconds, continue the irradiation. If the irradiation is stopped for T1 = Within 30 seconds, if the function of the device does not return to normal, a single event error will be recorded;
12）重复步骤10）-11），直到累积出现100次单粒子错误时停止辐照； 12) Repeat steps 10)-11) until the irradiation is stopped when 100 single event errors have accumulated;
13）计算单粒子错误截面，单粒子错误截面等于单粒子错误数除以入射粒子总的注量； 13) Calculate the single particle error cross section, which is equal to the number of single particle errors divided by the total fluence of incident particles;
14）计算未三模冗余加固的对比器件的单粒子错误截面与步骤8）得到的被测器件的单粒子错误截面的比值，该比值越大，则说明三模冗余加固效果越大，比值越小，说明三模冗余加固效果小，则说明设计人员应调整部分冗余的设计方案。 14) Calculate the ratio of the single event error cross-section of the comparison device without three-mode redundancy reinforcement to the single-event error cross-section of the device under test obtained in step 8). The larger the ratio, the greater the effect of three-mode redundancy reinforcement. The smaller the ratio, the smaller the reinforcement effect of the three-mode redundancy, and the designer should adjust the partial redundancy design.
根据本发明的其他实施例，其中上述步骤8）中，单粒子错误截面是否基本相同的预定值并不局限于10%，也可以为3%、5%、8%等，优选为0-10%，本领域技术人员可以根据实际应用中对测试精度的需要而采用不 同的预定值。 According to other embodiments of the present invention, in the above step 8), the predetermined value of whether the single particle error cross section is basically the same is not limited to 10%, it can also be 3%, 5%, 8%, etc., preferably 0-10 %, those skilled in the art can adopt different predetermined values according to the needs of test accuracy in practical applications.
根据本发明的其他实施例，其中上述步骤4）和步骤11）中，所述停止辐照的时间T1优选在20-50秒内。 According to other embodiments of the present invention, in the above step 4) and step 11), the time T1 for stopping the irradiation is preferably within 20-50 seconds.
本实施例中的步骤5）和步骤12）中，采用多次重复的方式得到多个样本，并将重复达到一定的次数作为重复结束的依据，从而得出统计学意义上的单粒子错误截面，重复的次数越多，得到的样本越多，所得到的统计学意义上的单粒子错误截面越接近准确值，其中累积出现的次数优选为100次左右。根据本发明的其他实施例，还可以采取达到一定的总的累积注量作为重复结束的依据，累积注量优选达到107个粒子/cm2左右。 In step 5) and step 12) in this embodiment, multiple samples are obtained by repeating multiple times, and a certain number of repetitions is used as the basis for the end of the repetition, so as to obtain the single-event error cross-section in the statistical sense , the more times of repetition, the more samples obtained, and the closer the obtained statistical single event error cross-section is to the accurate value, wherein the cumulative number of occurrences is preferably about 100 times. According to other embodiments of the present invention, reaching a certain total cumulative fluence can also be taken as the basis for the end of the repetition, and the cumulative fluence is preferably about 10 7 particles/cm 2 .
最后所应说明的是，以上实施例仅用以说明本发明的技术方案而非限制。尽管参照实施例对本发明进行了详细说明，本领域的普通技术人员应当理解，对本发明的技术方案进行修改或者等同替换，都不脱离本发明技术方案的精神和范围，其均应涵盖在本发明的权利要求范围当中。 Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than limit them. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications or equivalent replacements to the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention, and all of them should be included in the scope of the present invention. within the scope of the claims.
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| CN103577643B (en) * | 2013-11-06 | 2016-06-01 | 中国空间技术研究院 | A kind of SRAM type FPGA single particle upset effect emulation method |
| CN104268253B (en) * | 2014-10-09 | 2017-10-27 | 中国科学院自动化研究所 | A kind of part triplication redundancy method counted based on look-up table configuration bit |
| CN104462658B (en) * | 2014-11-06 | 2017-07-28 | 北京空间飞行器总体设计部 | A kind of triplication redundancy safeguard structure FPGA single particle overturns the appraisal procedure of failure probability |
| CN105204389A (en) * | 2015-10-08 | 2015-12-30 | 武汉聚鑫源机电工程设备有限公司 | Programmable rotating speed signal device based on software and hardware dual TMR type |
| CN114968685B (en) * | 2022-05-30 | 2024-07-26 | 中国人民解放军国防科技大学 | Testing Method for Single Event Upset Cross Section of EDAC Hardened Microprocessor |
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