CN102891209A - Solar cell as well as preparation method and device thereof - Google Patents
Solar cell as well as preparation method and device thereof Download PDFInfo
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- CN102891209A CN102891209A CN2011102063618A CN201110206361A CN102891209A CN 102891209 A CN102891209 A CN 102891209A CN 2011102063618 A CN2011102063618 A CN 2011102063618A CN 201110206361 A CN201110206361 A CN 201110206361A CN 102891209 A CN102891209 A CN 102891209A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 86
- 238000007747 plating Methods 0.000 claims abstract description 126
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 62
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 62
- 230000005684 electric field Effects 0.000 claims description 78
- 230000001680 brushing effect Effects 0.000 claims description 56
- 239000004411 aluminium Substances 0.000 claims description 53
- 238000000034 method Methods 0.000 claims description 45
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 230000007704 transition Effects 0.000 claims description 21
- 238000005245 sintering Methods 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 17
- 229920000742 Cotton Polymers 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- 238000005238 degreasing Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- 238000009434 installation Methods 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 6
- 238000011282 treatment Methods 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 238000002203 pretreatment Methods 0.000 claims description 5
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The invention provides a solar cell as well as a preparation method and device thereof, which belong to the technical field of photovoltaics. In the preparation method, by using an electro-brush plating device with a brush plating pen, a back electrode of the solar cell is constructed on a back field of the solar cell in an electro-brush plating way. The solar cell is formed through the adoption of the preparation method. The preparation method provided by the invention has the advantages of simplicity in operation, convenience for constructing and low preparation cost and is easy to be compatible with the traditional solar cell preparation method; moreover, the back electrode can be formed at a normal temperature, the back electrode has the advantages of good weldable characteristic and good binding force, is especially suitable for being applied to p-type full back field cells and n-type aluminum back junction cells and is beneficial for improving the performance of the solar cell.
Description
Technical field
The invention belongs to the photovoltaic technology field, the preparation method who relates to solar cell relates in particular to and a kind ofly adopts the preparation method of the solar cell that Brush Plating method composition prepares the solar cell back electrode and use applied solar cell preparation facilities among solar cell that the method preparation forms, this preparation method.
Background technology
Solar cell is the elementary cell that forms solar module, and normally, a plurality of solar cells are connected in series the formation solar module by the interconnector welding.
For each solar cell, normally, draw the photogenerated current that produces in the front at its positive secondary grid line of formation and/or main grid line to compile, form back of the body electric field at its back side and draw the photogenerated current that produces at its back side with collection.For preventing that interconnector from affecting the incident efficient of light, interconnector is arranged on the back side of solar cell, usually, for guaranteeing the connection reliability between interconnector and the back of the body electric field, also is provided with overleaf and the back electrode of carrying on the back the electric field electric connection.When welding formed solar module, an end of interconnector was welded to connect in the back electrode of a solar cell, and the other end is welded to connect the main grid line in another solar cell.
At present, traditional silk screen printing (or the steel mesh printing etc.) technique extensive use in the preparation of solar cell.Back of the body electric field and back electrode for back of solar cell, take p-type solar cell (solar cell that adopts the preparation of p-type substrate to form) as example, the composition printing is used to form the slurry (aluminium paste for example of back of the body electric field respectively on back of solar cell, it forms aluminum back electric field) and be used to form slurry (for example silver-colored aluminium paste or the silver slurry of back electrode, the back electrode weldability of its formation is good), and then common sintering forms back of the body electric field and back electrode.This method for preparing back electrode has following shortcoming:
(1) slurry of back electrode is understood the recombination rate that increases solar cell behind the sintering overleaf, affects the performance of solar cell;
(2) temperature of sintering high (for example more than 800 ℃), it is unfavorable for the lifting of efficiency of solar cell;
(3) the silk-screen printing technique process cost is high.
Especially, above silk-screen printing technique is applied to the aluminium back of the body of N-shaped solar cell (solar cell that adopts the preparation of N-shaped substrate to form) and ties preparation simultaneously, the back electrode slurry such as printed silver aluminium paste on cell substrate, can cause pn interface short circuit (in the N-shaped solar cell, the pn interface is near the back side) during sintering.
Simultaneously, Chinese patent application number be CN201010118152.3, application artificial " South China Normal University ", denomination of invention in " method of preparing solar array electrode by electro-brush plating " patent, the method for a kind of positive electrode that adopts technique of brush plating to prepare solar cell (for example main grid line and secondary grid line) has been proposed.But, in the method, need the steps such as coating protective film, laser grooving, surface activation process, the process that Brush Plating forms positive electrode is complicated, and in fact, the positive electrode of this Brush Plating preparation is difficult to form, poor with the adhesion of solar cell substrate.Therefore, the technical staff generally avoids adopting the method for Brush Plating to form positive electrode at the silicon substrate of solar cell.
Summary of the invention
For the defective of above prior art, one of purpose of the present invention is, reduces the preparation cost of the back electrode of solar cell.
Another purpose of the present invention is, avoids preparing the sintering process in the solar cell back electrode.
A further object of the present invention is, improves the performance of solar cell.
For realizing above purpose or other purpose, the invention provides following technical scheme.
According to an aspect of of the present present invention, a kind of preparation method of solar cell is provided, wherein, use with the electric brushing coating installation of brushing plating pen and tie the back electrode of the described solar cell of composition Brush Plating at the back of the body electric field of described solar cell/aluminium back of the body.
According to a preparation method's provided by the invention embodiment, wherein, before described Brush Plating, also comprise the pre-treatment step that is used to form transition zone.
Particularly, described transition zone places between described back of the body electric field/aluminium back of the body knot and the described back electrode, and it is used for strengthening the adhesion between described back electrode and the back of the body electric field/aluminium back of the body knot.
Alternatively, the thickness range of described transition zone can be 0.5 micron to 2 microns.
Alternatively, described preliminary treatment can soaking the zinc processing, chemical nickel plating is processed or spraying conductive paste and the low temperature drying processing for the displacement reaction mode.
In described preparation method before, preferably, described electric brushing coating installation comprises that described negative plate is electrically connected at the negative pole of the power supply of electric brushing coating installation for the negative plate of putting solar cell, and described brushing plating pen is electrically connected at the positive pole of the power supply of electric brushing coating installation.
In described preparation method before, preferably, when Brush Plating, described brushing plating pen is contacted with described back of the body electric field/aluminium back of the body knot and moves by set rate with respect to solar cell, is positioned at back electrode on back of the body electric field/aluminium back of the body knot with formation.
Alternatively, the rate travel scope of described brushing plating pen can be 0.5 m/min to 5 m/mins; The operating voltage range of Brush Plating can be 5 volts to 16 volts.
Preferably, be provided with degreasing cotton layer for the store electricity plating bath on the described brushing plating pen.
Preferably, described brushing plating pen comprises conduction handle and anode, and the surface of described anode is provided with the degreasing cotton layer for storage Special electric plating bath.
Preferably, described electroplate liquid is tinning solution or brush silver plating solution.
In described preparation method before, preferably, described solar cell is the N-shaped solar cell, ties the described back electrode of composition Brush Plating at the aluminium back of the body of described solar cell.
In described preparation method before, preferably, described back of the body electric field is full back of the body electric field structure.
In described preparation method before, preferably, described back of the body electric field is aluminum back electric field.
In described preparation method before, preferably, described back of the body electric field forms by the membrane deposition method that does not rely on sintering process.
In described preparation method before, preferably, described membrane deposition method can be sputter or evaporation.
In described preparation method before, preferably, described back electrode forms in alignment with the main grid line in solar cell front substantially, and described back electrode is the lines form of continous way or discontinuous.
In described preparation method before, preferably, the Brush Plating back electrode comprises step:
(1) copper brushing plating metal level; And
(2) Brush Plating silver metal layer or tin metal layer.
According to another aspect of the present invention, a kind of solar cell is provided, its preparation method according to above-described solar cell prepares formation.
Embodiment according to solar cell provided by the invention, wherein, described solar cell also comprises the transition zone that is arranged between described back of the body electric field/aluminium back of the body knot and the described back electrode, and described transition zone is used for strengthening the adhesion between described back electrode and the back of the body electric field/aluminium back of the body knot.
Alternatively, the thickness range of described transition zone can be 0.5 micron to 2 microns.
In described solar cell embodiment before, preferably, described solar cell is the N-shaped solar cell, ties the described back electrode of composition Brush Plating at the aluminium back of the body of described solar cell.
In described solar cell embodiment before, preferably, described back of the body electric field is full back of the body electric field structure.
In described solar cell embodiment before, preferably, described back of the body electric field is aluminum back electric field.
In described solar cell embodiment before, preferably, described back of the body electric field forms by the membrane deposition method that does not rely on sintering process.
In described solar cell embodiment before, preferably, described back electrode forms in alignment with the main grid line in solar cell front substantially, and described back electrode is the lines form of continous way or discontinuous.
In described solar cell embodiment before, preferably, described back electrode is to comprise copper metal layer and cover the silver metal layer of this copper metal layer or the lamination layer structure of tin metal layer.
In described solar cell embodiment before, preferably, the back electrode of described solar cell is contacted with the back of the body electric field of solar cell/aluminium back of the body knot by described brushing plating pen and forms.
In described solar cell embodiment before, preferably, be provided with the degreasing cotton layer for the store electricity plating bath on the described brushing plating pen.
In described solar cell embodiment before, preferably, described brushing plating pen comprises conduction handle and anode, and the surface of described anode is provided with the degreasing cotton layer for storage Special electric plating bath.
Provide a kind of solar cell preparation facilities of using the above preparation method more on the one hand according to of the present invention, this solar cell preparation facilities comprises:
Solar cell, and
With the electric brushing coating installation of brushing plating pen, described electric brushing coating installation comprises be used to the negative plate of putting described solar cell;
Wherein, the front of described solar cell is fixed on the described negative plate opposite to each other, and described brushing plating pen is operationally tied at the back of the body electric field of described solar cell/aluminium back of the body and mobilely formed described back electrode with composition.
According to an embodiment of solar cell preparation facilities provided by the invention, wherein, described brushing plating pen is electrically connected at the positive pole of power module by positive wire, and described negative plate is connected in the negative pole of power module by cathode conductor.
In described solar cell preparation facilities before, preferably, be provided with the degreasing cotton layer for the store electricity plating bath on the described brushing plating pen.
In described solar cell preparation facilities before, preferably, described brushing plating pen comprises conduction handle and anode, and the surface of described anode is provided with the degreasing cotton layer for storage Special electric plating bath.
Technique effect of the present invention is, by tying the Brush Plating back electrode at back of the body electric field/aluminium back of the body, but satisfying the good performance requirement of the welding characteristic of back electrode, adhesion simultaneously, simple to operate, composition convenient, preparation cost is low, be easy to and existing solar cell preparation method compatible; And back electrode can form at normal temperatures, has avoided the process of high temperature sintering, is conducive to improve the conversion efficiency of solar cell; The back electrode of the method preparation is also easily compatible with full back of the body electric field structure, especially is fit to be applied to p-type and entirely carries on the back electric field battery and N-shaped aluminium back of the body junction battery, thereby be conducive to reduce the recombination-rate surface at the back side, improves the performance of solar cell.
Description of drawings
From following detailed description by reference to the accompanying drawings, will make above and other objects of the present invention and advantage more fully clear, wherein, same or analogous key element adopts identical label to represent.
Fig. 1 is the basic structure schematic diagram of applied solar cell preparation facilities in the method for preparing solar cell provided by the invention.
Fig. 2 is the cross section structure schematic diagram of the p-type solar cell of the prepared formation of back electrode preparation method that provides of one embodiment of the invention.
Fig. 3 is the cross section structure schematic diagram of the N-shaped solar cell of the prepared formation of back electrode preparation method that provides of one embodiment of the invention.
Embodiment
The below introduces is a plurality of some in may embodiment of the present invention, aims to provide basic understanding of the present invention, is not intended to confirm key of the present invention or conclusive key element or limits claimed scope.Understand easily, according to technical scheme of the present invention, do not changing under the connotation of the present invention other implementation that one of ordinary skill in the art can propose mutually to replace.Therefore, following embodiment and accompanying drawing only are the exemplary illustrations to technical scheme of the present invention, and should not be considered as of the present invention all or be considered as restriction or restriction to technical solution of the present invention.
In the accompanying drawings, for the sake of clarity, might amplify the thickness of layer or the area in zone, but should not be considered to strictly reflect the proportionate relationship of physical dimension as schematic diagram.
" front of solar cell " among the present invention refers to receive when battery operated the one side of solar light irradiation, i.e. light receiving surface, and " back side of solar cell " among the present invention refers to the one side opposite with " front of solar cell ".
Figure 1 shows that the basic structure schematic diagram of applied solar cell preparation facilities in the method for preparing solar cell provided by the invention.As shown in Figure 1, consider the graphics feature requirement of back electrode, select to use the back electrode that comes composition Brush Plating solar cell 10 with the Brush Plating system of brushing plating pen 230; In this solar cell preparation facilities, brushing plating pen 230 is electrically connected at the positive pole ("+") of power module 210 by positive wire 231, in addition, negative plate 220 that be used for to put solar cell 10 is connected in the negative pole ("-") of power module 210 by cathode conductor 221, and power module 210 can be the DC power supply that is used for brush plating.
In the method for preparing back electrode of this invention, the front of the solar cell 10 in the solar cell preparation facilities is opposite in negative plate 220 ground and fixedly places on the negative plate 20, in this embodiment, the front of solar cell 10 also can form metal electrode (for example secondary grid line), also can be for also not forming metal electrode.The back side of solar cell 10 has formed back of the body electric field (if 10 for p-type solar cell) or aluminium back of the body knot (if 10 be the N-shaped solar cell), preferably, back of the body electric field is full back of the body electric field, the structure that the part, the back side of solar cell is occupied by back electrode in this different and prior art, therefore, reduce recombination-rate surface, can improve the conversion efficiency of solar cell.Brushing plating pen 230 is with the Special electric plating bath, in the process of Brush Plating, brushing plating pen 230 be contacted with the back of the body electric field of solar cell 10/aluminium back of the body knot and with respect to solar cell 10 by the set rate motion, thereby form the back electrode that is positioned on back of the body electric field/aluminium back of the body knot.
Particularly, brushing plating pen 230 comprises conduction handle and anode, usually use graphite anode, the surface of graphite anode can be provided for storing the degreasing cotton layer of Special electric plating bath, degreasing cotton layer not only can be stored the Special electric plating bath, can also prevent that anode and back of the body electric field/aluminium back of the body knot from directly contacting (otherwise producing easily electric arc), and graphite ion or the salt of graphite anode surface generation played certain filtration.Special electric plating bath by degreasing cotton layer storage can be selected according to the material of the back electrode that will form, and at first when the material of selection back electrode, requires to select according to aspect of performances such as the weldability of back electrode, non-oxidizability, conductivity; For example, back electrode can be selected tin, silver or sn-ag alloy etc., and correspondingly, the Special electric plating bath can be chosen as respectively tinning solution or brush silver plating solution.Before the beginning Brush Plating, can immerse brushing plating pen in the respective electrical plating bath, make brushing plating pen 230 these electroplate liquids of storage, therefore, when Brush Plating, solar cell does not need to be placed in the electroplating solution.
When electroplating, brushing plating pen 230 requires to design with respect to the movement locus of solar cell 10 pattern according to back electrode.Particularly, during plating, brushing plating pen 230 is 0.5-5m/min with respect to the scope of the rate travel of solar cell 10, for example can be 2.5m/min; The operating voltage range of Brush Plating can for 5 volts to 16V, for example can be 10V.According to the requirements such as thickness parameter of back electrode, those skilled in the art specifically can select the above technical parameter of Brush Plating.Brushing plating pen 230 is behind the back of the body electric field of solar cell 10/aluminium back of the body knot apparent motion, and back of the body electric field/aluminium back of the body is tied the formation back electrode.Particularly, can be substantially the forming in alignment with the main grid line in solar cell front of back electrode,, it can be the lines form of continous way, also can be the lines form of discontinuous.
Figure 2 shows that the cross section structure schematic diagram of the p-type solar cell of the prepared formation of back electrode preparation method that one embodiment of the invention provides.Embodiment as shown in Figure 2, cell substrate comprises p-type semiconductor regions 130 and the N-shaped semiconductor regions 110 that mixes and form; N-shaped semiconductor regions 110 is positioned at the front of solar cell 10, also is formed with successively antireflection layer 111 and secondary grid line 113 on it; The back side of solar cell 10 is p-type semiconductor regions 130, and formed pn interface forms near the front of solar cell between p-type semiconductor regions 130 and the N-shaped semiconductor regions 110.Back of the body electric field (for example aluminum back electric field) 133 is formed on the p-type semiconductor regions 130, particularly, back of the body electric field 133 can adopt silk screen printing or steel mesh printing slurry (for example aluminium paste) to reburn and tie formation, also can adopt the membrane deposition method that does not rely on sintering process on p-type semiconductor regions 130, to form, for example, by sputter (such as magnetron sputtering), the evaporation membrane deposition method plated metal aluminium such as (such as thermal evaporations) on the cell substrate back side.Preferably, when the membrane deposition method that does not rely on sintering process forms back of the body electric field 133, reduce contact resistance by heat treatment (for example 400 ℃ of left and right sides annealing in process) or laser treatment again after the deposition.
Figure 3 shows that the cross section structure schematic diagram of the N-shaped solar cell of the prepared formation of back electrode preparation method that one embodiment of the invention provides.Embodiment as shown in Figure 3, cell substrate comprises the N-shaped semiconductor regions 150 in the front that is positioned at solar cell 10, also is formed with successively antireflection layer 151 and secondary grid line 153 on it; The back side of solar cell 10 is aluminium back of the body knot 173, be formed on the N-shaped cell substrate, usually, aluminium paste by aluminium back of the body knot 173 in sintering process (sintering temperature is about 577 ℃) to the diffusion into the surface of cell substrate N-shaped, can partly form p-type semiconductor regions (not shown), thereby form the pn knot with N-shaped semiconductor regions 150.The thickness of the p-type semiconductor regions in the aluminium back of the body knot 173 is the 3-6 micron, for example 5 microns.
Continue as shown in Figures 2 and 3, in the solar cell 10 that the Brush Plating method forms, except back electrode (137 or 177), also comprise transition zone (135 or 175), this transition zone is between back electrode and back of the body electric field/aluminium back of the body knot, can be used for strengthening the back electrode of Brush Plating and the adhesion between back of the body electric field/aluminium back of the body knot, to satisfy the reliability requirement after welding forms assembly.This is because self adhesion that the oxide that the surface of back of the body electric field/aluminium back of the body knot may be adhered to affects between its back electrode of tying material and Brush Plating with adhesion or back of the body electric field/aluminium back of the body of the back electrode of Brush Plating is too little.Therefore, in the preferred embodiment of Brush Plating method of the present invention, before the employing brushing plating pen carries out brush plating, also comprise and adopt pre-treatment step in order to form transition zone (135 or 175).
In a further example, in the adhesion of transition zone (135 or 175) between the back electrode that strengthens Brush Plating and back of the body electric field/aluminium back of the body knot, can also improve the speed of Brush Plating back electrode.
Several embodiment of the preparation back electrode method that comprises this pre-treatment step below are provided.
Embodiment one
(1a) preliminary treatment: to the back of the body electric field regional area of the full aluminium back surface field of p-type silk screen printing solar cell or Zone Full, soak zinc by displacement reaction and process;
(1b) Brush Plating: for making things convenient for components welding, regional tinning corresponding with the main grid line position in solar cell front on back of the body electric field forms back electrode.
Embodiment two
(2a) preliminary treatment: to part or the Zone Full of the aluminium of N-shaped screen-printed solar cell back of the body knot, soak zinc by displacement reaction and process;
(2b) Brush Plating: for making things convenient for components welding, carrying on the back the zone corresponding with the main grid line position in solar cell front on the electric field, brushing plating pen is with the about 15min of speed of related movement, tinning of 3m/min, to form back electrode.
Embodiment three
(3a) preliminary treatment: the aluminum back electric field that forms in sputter/aluminium back of the body is tied, and forms the zone of back electrode, chemical nickel plating in wish;
(3b) Brush Plating: according to the structural design of solar cell, tie the silver-plated formation back electrode of regional brush that needs welding at back of the body electric field/aluminium back of the body.
Embodiment four
(4a) preliminary treatment: tie at the aluminum back electric field that evaporates aluminium formation/aluminium back of the body, in the zone of wish formation back electrode, spraying electrocondution slurry and low temperature (temperature is lower than 200 ℃) are dried;
(4b) Brush Plating: according to the structural design of solar cell, brushing plating pen is at back of the body electric field spraying electrocondution slurry and need zone that welding draws with the silver-plated 10min of speed of related movement, brush of 5m/min, to form back electrode.
Can find by above embodiment, in the pre-treatment step, include but not limited in order to the method that forms transition zone: soak zinc processing, chemical nickel plating processing, spraying conductive paste and the low temperature drying of displacement reaction mode are processed.It not is restrictive that the concrete material of transition zone is selected, and those skilled in the art can select according to the factors such as material of the back electrode of Brush Plating the material of transition zone, and the thickness range of transition zone can for 0.5 micron-2 microns, for example be 1.2 microns.
As can be seen from Figure 3, for the N-shaped solar cell, the pn interface forms near the back side of solar cell, when forming back electrode 177 by the Brush Plating method, the formation of back electrode 177 does not comprise the high temperature processing procedures such as sintering, thereby can prevent that back electrode metal (for example silver) from diffusing to the short circuit that cause in the interface in a large number, and can guarantee the adhesion that back electrode 230 and aluminium are carried on the back knot 173.Therefore, the Brush Plating of the present invention method for preparing back electrode is particularly suitable for N-shaped aluminium back of the body connection solar cell.
In going back an example, the back electrode 230 of Brush Plating can be lamination layer structure, for example, the copper metal layer that back electrode comprises the silver metal layer (perhaps for tin metal layer) on top layer, covered by silver layer, particularly, first form copper metal layer (electroplate liquid can adopt copper brushing plating solution) in transition zone 135 or 175 brush plating that powers on, Brush Plating forms silver metal layer (perhaps being the tin metal layer) again, can reduce like this thickness of silver metal layer (perhaps being the tin metal layer), the preparation cost of relative reduce back electrode.
Need to prove, the preparation method of above back electrode can be applied to the preparation of polytype solar cell, particularly, for the solar cell that is not suitable for forming back of the body electric field by silk screen printing and high temperature sintering (for example, PERC(passivation emitter back side battery), the laser sintered type of LFC() battery), it is particularly suitable; For example, it also can also be applied to metal around the preparation of wearing type (Metal Wrap Through, MWT) back of the body contact solar cell.
Therefore, when using above-mentioned Brush Plating method to prepare back electrode, at first, solar cell does not need to place electroplate liquid, simple to operate, composition makes things convenient for, preparation cost is low, and be easy to and existing solar cell preparation method compatible (get final product in the brush plating that powers on of back of the body electric field, do not affect the preparation of other parts), it is easy to use in the extensive preparation of solar cell.
Secondly, when forming back electrode, above Brush Plating method preparation avoided the process of high temperature sintering, be conducive to improve the conversion efficiency of solar cell, particularly when high-temperature sintering process was not adopted in the preparation of the back of the body electric field, main grid line and/or secondary grid line, the combination of the method was used and will greatly be improved the conversion efficiency of battery.
Again, on the back electrode that the Brush Plating method forms and the back of the body electric field good adhesion is arranged, avoided the directly structure of sintering formation back electrode on the cell substrate back side of conventional method, back of the body electric field can adopt full back of the body electric field structure, the recombination-rate surface at the back side is low, improves the open circuit voltage (Uoc) of battery.
Above example has mainly illustrated the method for solar cell, the solar cell of preparation formation and the solar cell preparation facilities of employing of preparing of the present invention.Although only the some of them embodiments of the present invention are described, those of ordinary skills should understand, and the present invention can be within not departing from its purport and scope implements with many other forms.Therefore, the example of showing and execution mode are regarded as illustrative and not restrictive, and in situation about not breaking away from such as the defined spirit of the present invention of appended each claim and scope, the present invention may be contained various modifications and replacement.
Claims (34)
1. the preparation method of a solar cell is characterized in that, uses with the electric brushing coating installation of brushing plating pen and ties the back electrode of the described solar cell of composition Brush Plating at the back of the body electric field of described solar cell/aluminium back of the body.
2. preparation method as claimed in claim 1 is characterized in that, before described Brush Plating, also comprises the pre-treatment step that is used to form transition zone.
3. preparation method as claimed in claim 2 is characterized in that, described transition zone places between described back of the body electric field/aluminium back of the body knot and the described back electrode, and it is used for strengthening the adhesion between described back electrode and the back of the body electric field/aluminium back of the body knot.
4. preparation method as claimed in claim 2 or claim 3 is characterized in that the thickness range of described transition zone is 0.5 micron to 2 microns.
5. preparation method as claimed in claim 2 is characterized in that, described preliminary treatment is soaking the zinc processing, chemical nickel plating is processed or spraying conductive paste and the low temperature drying processing of displacement reaction mode.
6. preparation method as claimed in claim 1 or 2, it is characterized in that, described electric brushing coating installation comprises that described negative plate is electrically connected at the negative pole of the power supply of electric brushing coating installation for the negative plate of putting solar cell, and described brushing plating pen is electrically connected at the positive pole of the power supply of electric brushing coating installation.
7. preparation method as claimed in claim 1 is characterized in that, when Brush Plating, described brushing plating pen is contacted with described back of the body electric field/aluminium back of the body knot and moves by set rate with respect to solar cell, is positioned at back electrode on back of the body electric field/aluminium back of the body knot with formation.
8. preparation method as claimed in claim 7 is characterized in that, the rate travel scope of described brushing plating pen is 0.5 m/min to 5 m/mins; The operating voltage range of Brush Plating is 5 volts to 16 volts.
9. such as claim 1 or 7 described preparation methods, it is characterized in that, be provided with the degreasing cotton layer for the store electricity plating bath on the described brushing plating pen.
10. preparation method as claimed in claim 9 is characterized in that, described brushing plating pen comprises conduction handle and anode, and the surface of described anode is provided with the degreasing cotton layer for storage Special electric plating bath.
11. preparation method as claimed in claim 9 is characterized in that, described electroplate liquid is tinning solution or brush silver plating solution.
12. preparation method as claimed in claim 1 or 2 is characterized in that, described solar cell is the N-shaped solar cell, ties the described back electrode of composition Brush Plating at the aluminium back of the body of described solar cell.
13. preparation method as claimed in claim 1 or 2 is characterized in that, described back of the body electric field is full back of the body electric field structure.
14. preparation method as claimed in claim 13 is characterized in that, described back of the body electric field is aluminum back electric field.
15. preparation method as claimed in claim 13 is characterized in that, described back of the body electric field forms by the membrane deposition method that does not rely on sintering process.
16. preparation method as claimed in claim 15 is characterized in that, described membrane deposition method is sputter or evaporation.
17. preparation method as claimed in claim 1 or 2 is characterized in that, described back electrode forms in alignment with the main grid line in solar cell front substantially, and described back electrode is the lines form of continous way or discontinuous.
18. preparation method as claimed in claim 1 or 2 is characterized in that, the Brush Plating back electrode comprises step:
(1) copper brushing plating metal level; And
(2) Brush Plating silver metal layer or tin metal layer.
19. solar cell that preparation method as claimed in claim 1 makes.
20. solar cell as claimed in claim 19, it is characterized in that, described solar cell also comprises the transition zone that is arranged between described back of the body electric field/aluminium back of the body knot and the described back electrode, and described transition zone is used for strengthening the adhesion between described back electrode and the back of the body electric field/aluminium back of the body knot.
21. solar cell as claimed in claim 20 is characterized in that, the thickness range of described transition zone is 0.5 micron to 2 microns.
22., it is characterized in that described solar cell is the N-shaped solar cell such as claim 19 or 20 described solar cells, tie the described back electrode of composition Brush Plating at the aluminium back of the body of described solar cell.
23., it is characterized in that described back of the body electric field is full back of the body electric field structure such as claim 19 or 20 described solar cells.
24. solar cell as claimed in claim 23 is characterized in that, described back of the body electric field is aluminum back electric field.
25. solar cell as claimed in claim 23 is characterized in that, described back of the body electric field forms by the membrane deposition method that does not rely on sintering process.
26., it is characterized in that described back electrode forms in alignment with the main grid line in solar cell front substantially such as claim 19 or 20 described solar cells, described back electrode is the lines form of continous way or discontinuous.
27., it is characterized in that described back electrode is to comprise copper metal layer and cover the silver metal layer of this copper metal layer or the lamination layer structure of tin metal layer such as claim 19 or 20 described solar cells.
28., it is characterized in that the back electrode of described solar cell is contacted with the back of the body electric field of solar cell/aluminium back of the body knot by described brushing plating pen and forms such as claim 19 or 20 described solar cells.
29. such as claim 19 or 20 described solar cells, it is characterized in that, be provided with the degreasing cotton layer for the store electricity plating bath on the described brushing plating pen.
30. solar cell as claimed in claim 29 is characterized in that, described brushing plating pen comprises conduction handle and anode, and the surface of described anode is provided with the degreasing cotton layer for storage Special electric plating bath.
31. an application rights requires 1 described preparation method's solar cell preparation facilities, it is characterized in that, the solar cell preparation facilities comprises:
Solar cell, and
With the electric brushing coating installation of brushing plating pen, described electric brushing coating installation comprises be used to the negative plate of putting described solar cell;
Wherein, the front of described solar cell is fixed on the described negative plate opposite to each other, and described brushing plating pen is operationally tied at the back of the body electric field of described solar cell/aluminium back of the body and mobilely formed described back electrode with composition.
32. solar cell preparation facilities as claimed in claim 31 is characterized in that, described brushing plating pen is electrically connected at the positive pole of power module by positive wire, and described negative plate is connected in the negative pole of power module by cathode conductor.
33. solar cell preparation facilities as claimed in claim 31 is characterized in that, is provided with the degreasing cotton layer for the store electricity plating bath on the described brushing plating pen.
34. solar cell preparation facilities as claimed in claim 32 is characterized in that, described brushing plating pen comprises conduction handle and anode, and the surface of described anode is provided with the degreasing cotton layer for storage Special electric plating bath.
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| CN2011102063618A CN102891209A (en) | 2011-07-22 | 2011-07-22 | Solar cell as well as preparation method and device thereof |
| PCT/CN2011/001230 WO2013013339A1 (en) | 2011-07-22 | 2011-07-27 | Solar cell and method and device for preparing same |
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| CN2011102063618A CN102891209A (en) | 2011-07-22 | 2011-07-22 | Solar cell as well as preparation method and device thereof |
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