CN112420766A - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
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- CN112420766A CN112420766A CN202011268391.7A CN202011268391A CN112420766A CN 112420766 A CN112420766 A CN 112420766A CN 202011268391 A CN202011268391 A CN 202011268391A CN 112420766 A CN112420766 A CN 112420766A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 33
- 239000010959 steel Substances 0.000 claims abstract description 33
- 238000007639 printing Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000002096 quantum dot Substances 0.000 claims description 14
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 239000000314 lubricant Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000003086 colorant Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000007641 inkjet printing Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- -1 specifically Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention discloses a display panel and a preparation method thereof, wherein the preparation method of the display panel comprises the steps of providing a substrate; preparing a plurality of through holes on the upper surface of the substrate; and preparing an excellent conversion layer in the through hole by using a steel mesh printing technology. The technical effect of the present invention is to realize fine patterning of the color conversion layer.
Description
Technical Field
The invention relates to the field of display, in particular to a display panel and a preparation method thereof.
Background
With the high quality requirement of people on display, luminescent materials with excellent optical color purity such as perovskite and quantum dot become a new favorite for current display application, and have excellent application in various display scenes such as backlight of liquid crystal display, color conversion and the like, wherein the color conversion application is a leading-edge higher application requirement. In the aspect of color conversion application, perovskite or quantum dots are mainly matched with blue light Micro-light emitting diodes (Micro-LEDs) or organic electroluminescent devices (OLEDs) to be used in full color.
However, although the conventional color conversion layer or light emitting layer is usually produced by an ink jet printing method, and the ink jet printing technique can improve the patterning accuracy of the color conversion material, the conventional ink jet printing method is time-consuming, has a high demand for stability of an ink jet printer, and tends to cause phenomena such as ink offset and satellite droplets during long-term printing, which in turn affects the quality of the display panel.
Disclosure of Invention
The invention aims to solve the technical problems that the distribution density of a light-emitting layer is not high enough and the precision is not high enough in the patterning preparation process of the light-emitting layer in the prior art.
In order to achieve the above object, the present invention provides a method for manufacturing a display panel, comprising the steps of: providing a substrate; preparing a plurality of through holes on the upper surface of the substrate; and preparing an excellent conversion layer in the through hole by using a steel mesh printing technology.
Further, preparing a plurality of through holes on the upper surface of the substrate includes: coating a layer of photoresist material on the upper surface of the substrate; and exposing the photoresist material by using a mask plate to form a plurality of through holes.
Furthermore, the mask plate comprises a plurality of opening areas distributed in an array manner and a shielding area surrounding the opening areas; each opening area is correspondingly provided with a through hole.
Further, preparing an excellent conversion layer within the via hole includes the steps of: placing the substrate on a printing machine table to enable the substrate to be aligned to the steel mesh; dripping a color conversion material above the steel mesh; performing steel mesh printing; and performing a post-treatment step to form a color conversion layer.
Further, the color conversion material contains at least one of quantum dots, a resin, and a lubricant.
Further, the viscosity of the color conversion material is 10 to 100 pascal-seconds.
Further, the steel mesh is provided with a plurality of openings; each opening corresponds to each via.
Furthermore, the aperture of the open pore is 20-500 microns.
To achieve the above object, the present invention also provides a display panel including: a substrate; the light resistance layer is arranged on the surface of one side of the substrate and comprises a plurality of through holes; and the color conversion layer is filled in the through hole.
Further, the through holes are distributed in an array; the color conversion layer includes color conversion materials of three colors; each color converting material is located in a row or column.
The invention has the technical effects that the through holes required by the color conversion layer are prepared on the substrate, the color conversion layer is prepared in the through holes in a steel mesh printing mode, the fine patterning of the color conversion layer is realized, the quality of the display panel is improved, meanwhile, the phenomena of material deviation and material accumulation are not easy to occur in the printing process, the steel mesh printing time is shorter, the process time is saved, a printer in the Micro-LED preparation process can be continuously used on equipment, and the equipment cost is not increased additionally.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention;
FIG. 2 is a schematic view of the steel mesh and the substrate being aligned according to the embodiment of the present invention;
FIG. 3 is a top view of the steel net according to the embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 5 is a top view of a display panel according to an embodiment of the invention.
Some of the components are identified as follows:
1. a substrate; 2. a photoresist layer; 3. a color conversion layer;
21. a through hole;
100. a steel mesh; 110. a steel mesh body; 120. and (6) opening holes.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "thickness", "upper", "lower", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Specifically, as shown in fig. 1 to 3, the embodiment of the invention provides a method for manufacturing a display panel, including steps S1 to S3.
S1 provides a substrate, which is an array substrate including devices such as thin film transistors, and is not described in detail herein.
S2, forming a plurality of through holes on the upper surface of the substrate, specifically, coating a layer of photoresist material on the upper surface of the substrate, and exposing and developing the photoresist material with a mask to form a plurality of through holes. The mask plate comprises a plurality of opening areas distributed in an array mode and a shielding area surrounding the opening areas, each opening area corresponds to one through hole formed in the substrate, the opening areas are oval, circular, square and the like, and the through holes correspond to the opening areas in shape. The partial photoresist material covered by the shielding area of the mask plate is not etched to form a retaining wall, and the retaining wall can prevent liquid between two adjacent through holes from overflowing to cause the problem of color mixing of the color conversion material.
S3 excellent conversion layers were prepared within the through-holes 21 using a steel mesh printing technique (see fig. 2 to 4).
Specifically, the substrate is placed on a printing machine, so that the substrate is aligned with a steel mesh 100, the steel mesh 100 is generally square (see fig. 3), alignment holes (not shown) are formed in four corners of the steel mesh 100, the alignment holes are arranged opposite to the alignment holes in the four corners of the substrate, and the substrate is tightly attached to the steel mesh and aligned, which is beneficial to printing the substrate by the steel mesh. The steel mesh 100 includes a steel mesh body 110 and a plurality of openings 120, the openings 120 penetrate through the steel mesh body 110, the openings 120 are oval, circular, square and the like, and conform to the shape of the through holes as much as possible, the aperture of the openings 120 is 20-500 micrometers, each opening corresponds to each through hole, so that liquid can be printed into the through holes as much as possible, and the phenomena of waste and the like are prevented.
And dripping a color conversion material above the steel mesh, wherein the color conversion material contains at least one of quantum dots, resin and lubricant. The viscosity of the color conversion material is from 10 Pascal-seconds (Pa.s) to 100 Pascal-seconds (Pa.s). The quantum dots are red and green quantum dots, the quantum dots are uniformly dispersed in the resin and can emit light after being excited, and the lubricant is used for enhancing the lubrication degree of the color conversion material so that the color conversion material can be better printed in the through holes.
The color conversion materials have three different colors, namely a red color conversion material (R), a green color conversion material (G) and a blue color conversion material (B), the color conversion materials of each color are positioned in a row or a column and are sequentially arranged according to the RGB sequence, and each row or each column is independently printed in the printing process to form the RGB light emitting array.
The method comprises the steps of carrying out steel mesh printing, carrying out patterning treatment on the color conversion material, adopting articles such as a steel knife or a scraper to uniformly print the color conversion material dropped on the steel mesh into the through hole, preparing the color conversion layer in the through hole by adopting a steel mesh printing mode, realizing fine patterning of the color conversion layer, completing the process of ink-jet printing for several hours only in a few seconds, and greatly saving the process time and the time cost.
And performing a post-treatment step, namely curing the color conversion material by adopting a heating curing or ultraviolet curing mode to form a color conversion layer (see fig. 4), wherein the color conversion layer is a light emitting layer, and quantum dots in the color conversion layer are excited to emit light.
The manufacturing method of the display panel has the technical effects that through holes needed by the color conversion layer are manufactured on the substrate, the color conversion layer is manufactured in the through holes in a steel mesh printing mode, fine patterning of the color conversion layer is achieved, the quality of the display panel is improved, meanwhile, the phenomena of material deviation and material accumulation are not prone to occurring in the printing process, the steel mesh printing time is short, the process time is saved, a printer in the manufacturing process of the blue light Micro-light emitting diode (Micro-LED) can be used on equipment, and the equipment cost is not increased additionally.
As shown in fig. 4 and fig. 5, the present embodiment further provides a display panel, which includes a substrate 1, a photoresist layer 2 and a color conversion layer 3.
The substrate 1 is an array substrate, and includes devices such as thin film transistors, which are not described in detail herein.
The photoresist layer 2 is disposed on the upper surface of the substrate 1 and functions as a retaining wall, a plurality of through holes 21 are disposed in the photoresist layer 2 in an array, the through holes 21 penetrate through the photoresist layer 2, and the through holes 21 are used for filling the color conversion layer. The through holes 21 are oval, round, square and the like, and the aperture is 20-500 microns.
The color conversion layer 3 is provided in the through hole 21, and the material of the color conversion layer 3 is a color conversion material containing at least one of quantum dots, resin, and lubricant. The viscosity of the color conversion material is from 10 Pascal-seconds (Pa.s) to 100 Pascal-seconds (Pa.s). The quantum dots are red and green quantum dots generally, the quantum dots are uniformly dispersed in the resin, the quantum dots can emit light after being excited, and the lubricant is used for enhancing the lubrication degree of the color conversion material so that the color conversion material can be better printed in the through hole 21.
The color conversion materials have three different colors, namely a red color conversion material (R), a green color conversion material (G) and a blue color conversion material (B), and the color conversion materials of each color are positioned in a row or a column and are sequentially arranged according to the RGB sequence to form an RGB light emitting array (see figure 5).
The display panel has the technical effects that the plurality of through holes are formed in the substrate, the color conversion layer is arranged in the through holes, fine patterning of the color conversion layer is achieved, the quality of the display panel is improved, and the yield of the display panel is improved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display panel and the manufacturing method thereof provided by the embodiment of the invention are described in detail above, and the principle and the embodiment of the invention are explained by applying specific examples, and the description of the embodiment is only used for helping to understand the technical scheme and the core idea of the invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A preparation method of a display panel is characterized by comprising the following steps:
providing a substrate;
preparing a plurality of through holes on the upper surface of the substrate; and
using a steel screen printing technique, an excellent conversion layer is prepared within the via.
2. The method of manufacturing a display panel according to claim 1, wherein the manufacturing of the plurality of through holes on the upper surface of the substrate comprises:
coating a layer of photoresist material on the upper surface of the substrate;
and exposing the photoresist material by using a mask plate to form a plurality of through holes.
3. The method for manufacturing a display panel according to claim 2,
the mask plate comprises a plurality of opening areas distributed in an array manner and a shielding area surrounding the opening areas;
each opening area is correspondingly provided with a through hole.
4. The method of manufacturing a display panel according to claim 1, wherein the manufacturing of the color conversion layer in the via hole includes the steps of:
placing the substrate on a printing machine table to enable the substrate to be aligned to the steel mesh;
dripping a color conversion material above the steel mesh;
performing steel mesh printing; and
and carrying out a post-treatment step to form a color conversion layer.
5. The method for manufacturing a display panel according to claim 4,
the color conversion material contains at least one of quantum dots, a resin, and a lubricant.
6. The method for manufacturing a display panel according to claim 4,
the viscosity of the color conversion material is 10 Pascal s to 100 Pascal s.
7. The method for manufacturing a display panel according to claim 4,
the steel mesh is provided with a plurality of openings;
each opening corresponds to each via.
8. The method for manufacturing a display panel according to claim 7,
the aperture of the open pore is 20-500 microns.
9. A display panel, comprising:
a substrate;
the light resistance layer is arranged on the surface of one side of the substrate and comprises a plurality of through holes; and
and the color conversion layer is filled in the through hole.
10. The display panel of claim 9,
the through holes are distributed in an array;
the color conversion layer includes color conversion materials of three colors;
each color converting material is located in a row or column.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113488456A (en) * | 2021-06-25 | 2021-10-08 | 深圳市华星光电半导体显示技术有限公司 | Display device and manufacturing method thereof |
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