JP2001291584A - Manufacturing method of optoelectronic device component - Google Patents
Manufacturing method of optoelectronic device componentInfo
- Publication number
- JP2001291584A JP2001291584A JP2000105998A JP2000105998A JP2001291584A JP 2001291584 A JP2001291584 A JP 2001291584A JP 2000105998 A JP2000105998 A JP 2000105998A JP 2000105998 A JP2000105998 A JP 2000105998A JP 2001291584 A JP2001291584 A JP 2001291584A
- Authority
- JP
- Japan
- Prior art keywords
- ink
- substrate
- manufacturing
- pixel
- liquid material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 230000005693 optoelectronics Effects 0.000 title abstract 2
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000001035 drying Methods 0.000 claims abstract description 24
- 239000011344 liquid material Substances 0.000 claims abstract description 17
- 238000009751 slip forming Methods 0.000 claims abstract description 3
- 239000011159 matrix material Substances 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 238000005401 electroluminescence Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 239000000976 ink Substances 0.000 description 55
- 238000005192 partition Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 9
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、カラーフィルタ、
エレクトロルミネセンス素子マトリクス等の、電気光学
装置部品の製造方法に関する。特に、基板上の各画素が
形成される位置にそれぞれ微小インク滴等の液状物を吐
出して製造される電気光学装置部品について、乾燥速度
を制御することによって、乾燥後の表面を平坦化する技
術に関する。TECHNICAL FIELD The present invention relates to a color filter,
The present invention relates to a method for manufacturing an electro-optical device component such as an electroluminescence element matrix. In particular, for a component of an electro-optical device manufactured by discharging a liquid material such as a minute ink droplet at a position where each pixel is formed on a substrate, the surface after drying is flattened by controlling a drying speed. About technology.
【０００２】[0002]
【従来の技術】カラーフィルタ等の電気光学装置部品の
製造方法として、インクジェット法を応用した方法が提
案されている。この方法では、透明基板上に仕切りをマ
トリクス状に形成した後、インクジェット法を用いて液
状物を仕切り内に塗布する。2. Description of the Related Art As a method for manufacturing an electro-optical device component such as a color filter, a method using an ink jet method has been proposed. In this method, after partitions are formed in a matrix on a transparent substrate, a liquid material is applied to the inside of the partitions using an inkjet method.
【０００３】かかる従来の電気光学装置部品の製造方法
においては、液状物吐出時には基板上の仕切りより上方
に盛り上がる程度に液状物を付与する。これを所定温度
でベークし乾燥および硬化させると体積が減り、平坦化
する。In such a conventional method of manufacturing a component of an electro-optical device, a liquid material is applied such that the liquid material is raised above a partition on a substrate when the liquid material is discharged. When this is baked at a predetermined temperature, dried and cured, the volume is reduced and the surface is flattened.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、例えば
カラーフィルタにおいて、吐出するインクのレベリング
性の制御が不十分であると、乾燥時のインクの体積が大
きすぎて基板上より上方に盛り上がってしまったり、乾
燥時の体積が小さすぎてへこんだ形状になってしまった
りすることがある。However, for example, in a color filter, if the leveling property of the ink to be ejected is insufficiently controlled, the volume of the ink at the time of drying is too large and may rise above the substrate. In some cases, the volume when dried is too small, resulting in a dented shape.
【０００５】図１は、インク吐出直後および乾燥後にお
ける画素のインク面の状態を示す断面図である。図１
（ａ）〜（ｃ）の各図において、符号２１はインク吐出
直後のインク面であり、符号２２はインクを乾燥および
固化させた場合のインク面である。各図に示されるよう
に、インク吐出直後のインク面２１の盛り上がりは、図
1（ａ）〜（ｃ）で違いが無い。しかし、インクを乾燥
および固化させた場合のインク面２２は、図１（ａ）で
は画素の仕切りより上側に盛り上がっており、図１
（ｂ）では画素の仕切りの上端より下方に凹んでおり、
図１（ｃ）では仕切りの上端とほぼ同じ高さで、インク
面も平坦である。FIG. 1 is a sectional view showing the state of the ink surface of a pixel immediately after ink ejection and after drying. FIG.
In each of the drawings (a) to (c), reference numeral 21 denotes an ink surface immediately after ink ejection, and reference numeral 22 denotes an ink surface when the ink is dried and solidified. As shown in each figure, the swelling of the ink surface 21 immediately after the ink ejection is
There is no difference between 1 (a) to (c). However, when the ink is dried and solidified, the ink surface 22 rises above the pixel partition in FIG.
In (b), the pixel is recessed below the upper end of the partition,
In FIG. 1C, the height is almost the same as the upper end of the partition, and the ink surface is flat.
【０００６】このように乾燥後のインク面に差が生じる
のは、インク量および濃度が同一でも、乾燥条件が異な
るからである。例えばインクを吐出後、高温条件下で乾
燥させると、乾燥が速く進み、図1（ｂ）のようにイン
クの体積が小さくなる傾向にある。逆に低温条件下で乾
燥させると、乾燥が遅くなり、図1（ａ）のように乾燥
後のインク体積がさほど小さくならない傾向にある。The reason for the difference in the dried ink surface is that the drying conditions are different even if the ink amount and the density are the same. For example, if the ink is ejected and then dried under a high temperature condition, the drying proceeds rapidly, and the volume of the ink tends to decrease as shown in FIG. Conversely, when drying is performed under low-temperature conditions, the drying is slowed down, and the ink volume after drying tends not to become so small as shown in FIG.
【０００７】そこで、乾燥後のインク面を図１（ｃ）に
示すような所望の状態にするには、インクの乾燥条件の
制御が必要となる。しかしながら、同じカラーフィルタ
基板上の画素間にもインク面のばらつきが生じることが
ある。特に、画素領域内の隣接画素に複数のインクドッ
トが存在する場合、画素間の膜厚にばらつきが生じてい
る。これは、当該画素が、隣接画素のドットからのイン
ク溶媒蒸発の影響を受けて乾燥速度がばらつくことに起
因すると考えられる。このような画素毎のレベリング性
の差は、色むら、色調差の原因となって好ましくない。In order to bring the ink surface after drying into a desired state as shown in FIG. 1C, it is necessary to control the drying conditions of the ink. However, variations in the ink surface may occur between pixels on the same color filter substrate. In particular, when a plurality of ink dots exist in adjacent pixels in a pixel region, the film thickness varies between pixels. This is considered to be due to the fact that the pixel is affected by the evaporation of the ink solvent from the dot of the adjacent pixel and the drying speed varies. Such a difference in leveling property for each pixel is not preferable because it causes color unevenness and color tone difference.
【０００８】この乾燥速度の違いを解決するためには、
画素毎の乾燥を速めるためのメカニカルな工夫も考えら
れるが、その設計は必ずしも容易ではない。In order to solve this difference in drying speed,
A mechanical device to speed up the drying of each pixel can be considered, but the design is not always easy.
【０００９】本発明は、上記問題点に鑑みてなされたも
ので、その課題とするところは、ドット塗布順序の簡単
な構成で液状物の乾燥条件の差を抑え、色むら、色調む
ら、光度むらのない電気光学装置部品の製造方法を提供
すること である。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. An object of the present invention is to suppress the difference in drying conditions of a liquid material with a simple configuration of a dot application sequence, and to realize color unevenness, color tone unevenness, and luminous intensity. An object of the present invention is to provide a method for manufacturing electro-optical device parts without unevenness.
【００１０】[0010]
【課題を解決するための手段】本発明の電気光学装置部
品の製造方法は、複数の画素が所定間隔をもって連続形
成される画素形成領域を備える基板上の当該画素形成領
域に所定の液状物を吐出する工程と、前記吐出した液状
物を乾燥させる工程とを備える。According to a method of manufacturing an electro-optical device component of the present invention, a predetermined liquid material is applied to a pixel forming region on a substrate having a pixel forming region in which a plurality of pixels are continuously formed at predetermined intervals. The method includes a step of discharging and a step of drying the discharged liquid.
【００１１】また、本発明の電気光学装置部品の製造方
法において、前記基板はカラーフィルタ基板であって、
前記液状物としてインクを吐出することを特徴とする。In the method for manufacturing an electro-optical device component according to the present invention, the substrate is a color filter substrate,
The method is characterized in that ink is ejected as the liquid material.
【００１２】また、本発明の電気光学装置部品の製造方
法において、前記基板はエレクトロルミネセンス素子マ
トリックス基板であって、前記液状物としてインクを吐
出することを特徴とする。Further, in the method for manufacturing an electro-optical device component according to the present invention, the substrate is an electroluminescent element matrix substrate, and ink is ejected as the liquid material.
【００１３】さらに本発明の電気光学装置部品の製造方
法であって、前記複数の画素各々について、隣接する画
素形成領域に非連続に前記インクを吐出することを特徴
とする。Further, in the method of manufacturing an electro-optical device component according to the present invention, for each of the plurality of pixels, the ink is discontinuously discharged to an adjacent pixel forming region.
【００１４】[0014]
【発明の実施の形態】まず、本発明の第一の実施の形態
によるエレクトロルミネッセンス素子の製造方法につい
て説明する。First, a method for manufacturing an electroluminescent device according to a first embodiment of the present invention will be described.
【００１５】インクジェット方式によるエレクトロルミ
ネッセンス素子の製造方法とは、素子を形成する有機物
からなる正孔注入／輸送材料ならびに発光材料を溶媒に
溶解または分散させたインク組成物を、インクジェット
ヘッドから吐出させて透明電極基板上に塗布し、正孔注
入／輸送層ならびに発光材層を形成する方法である。か
かるインクジェットプリンティング方式によれば、微細
なパターニングを簡便にかつ短時間で行うことができ、
多色化が可能である。また、必要な場所に必要量の材料
を塗布すればいいので大面積の基板になっても材料を無
駄にすることは無い。The method of manufacturing an electroluminescent device by the ink jet method is to discharge an ink composition in which a hole injecting / transporting material composed of an organic substance forming the device and a luminescent material are dissolved or dispersed in a solvent from an ink jet head. This is a method in which a hole injection / transport layer and a luminescent material layer are formed by coating on a transparent electrode substrate. According to such an inkjet printing method, fine patterning can be performed easily and in a short time,
Multicoloring is possible. In addition, since a necessary amount of material may be applied to a necessary place, the material is not wasted even if the substrate has a large area.
【００１６】（基板形成および基板表面処理工程）図２
に示したＴＦＴ付きの基板を用いた。図３は、図２の符
号Ａで示す円内の拡大図である。(Process of Forming Substrate and Processing Surface of Substrate) FIG.
Was used. FIG. 3 is an enlarged view of the inside of the circle indicated by the symbol A in FIG.
【００１７】図２に示されるように、素子基板１２は、
１枚のパネルチップ１１が、平面上に複数並べられた状
態となっている。この実施形態では、１枚の素子基板１
２は、８×１２＝９６枚のパネルチップ１１から構成さ
れている表示装置の製造時には、これら複数のパネルチ
ップ１１に対してまとめてインクの吐出および乾燥の処
理を行い、その後、パネルチップ単位に切り離して、表
示装置とする。As shown in FIG. 2, the element substrate 12
One panel chip 11 is in a state of being plurally arranged on a plane. In this embodiment, one element substrate 1
2 is that when manufacturing a display device including 8 × 12 = 96 panel chips 11, the plurality of panel chips 11 are subjected to ink ejection and drying processes collectively, and then, And a display device.
【００１８】図３は、図２の符号Ａで示す円内の拡大図
である。図３に示されるように、パネルチップ１１は、
マトリクス上に並んだ画素１３を備え、画素と画素の境
目は仕切り（バンク）１４によって区切られている。本
実施の形態では、画素の開口は横５０ミクロン、縦７０
ミクロンで、画素ピッチは横７０ミクロン、縦９０ミク
ロンである。FIG. 3 is an enlarged view of the inside of the circle indicated by the symbol A in FIG. As shown in FIG. 3, the panel chip 11
Pixels 13 are arranged in a matrix, and boundaries between pixels are separated by partitions (banks) 14. In the present embodiment, the opening of the pixel is 50 microns wide and 70 microns long.
In micron, the pixel pitch is 70 microns in width and 90 microns in height.
【００１９】表示素子の製造の際には、上記画素１３の
一つ一つに赤、緑、青のいずれかのインクを所定量吐出
する。所定量は単一のインクドットあるいは、複数のイ
ンクドットよりなる。図３の例では、赤、緑、青の配置
をいわゆるモザイク型としたが、３色が均等に配置され
ていればストライプ型、デルタ型など、その他の配置で
も構わない。In manufacturing the display element, a predetermined amount of any one of red, green and blue inks is discharged to each of the pixels 13. The predetermined amount consists of a single ink dot or a plurality of ink dots. In the example of FIG. 3, the arrangement of red, green, and blue is a so-called mosaic type, but other arrangements such as a stripe type and a delta type may be used as long as the three colors are arranged evenly.
【００２０】図４は、図３のＢ−Ｂ’線断面図である。
素子基板を構成するパネルチップ１１は、透光層１５
と、遮光層である仕切り（バンク）１４とそ備えてい
る。仕切り１４が形成されていない（除去された）部分
は、上記画素１３を形成する。この画素１３に各色の液
状インクを吐出し、乾燥および固化させることにより、
エレクトロルミネセンス表示素子となる。FIG. 4 is a sectional view taken along line BB 'of FIG.
The panel chip 11 constituting the element substrate includes a light-transmitting layer 15
And a partition (bank) 14 as a light shielding layer. The portion where the partition 14 is not formed (removed) forms the pixel 13. By discharging the liquid ink of each color to the pixel 13 and drying and solidifying it,
It becomes an electroluminescent display element.
【００２１】画素電極としてＩＴＯをフォトリソグラフ
ィーによりパターン形成した。画素電極としては透明な
ものが好ましく、構成する材料としては、酸化スズ膜、
ＩＴＯ膜、酸化インジウムと酸化亜鉛との複合酸化物膜
等が挙げられる。As a pixel electrode, ITO was patterned by photolithography. The pixel electrode is preferably transparent, and the constituent materials thereof include a tin oxide film,
Examples include an ITO film and a composite oxide film of indium oxide and zinc oxide.
【００２２】図４のように仕切り（バンク）を非感光性
ポリイミドでフォトリソグラフィーにより形成し、上記
の各透明画素電極間を埋めた。隔壁の高さは２ミクロン
である。隔壁を構成する材料としては、エレクトロルミ
ネセンス材料の溶媒に対し耐久性を有するものえあれば
特に限定されないが、フロロカーボンガスプラズマ処理
によりテフロン（登録商標）化できることから、例えば
アクリル樹脂、エポキシ樹脂、ノボラック樹脂などのレ
ジスト材料として使われる有機材料でよい。もともとフ
ッ素系の樹脂を含んだ材料であっても良い、また、隔壁
は上記材料にカーボンブラック等を混入してブラックレ
ジストとしてもよい。更に、ガラス等の無機材料を下層
にした積層隔壁であってもよい。As shown in FIG. 4, partitions (banks) were formed by photolithography using non-photosensitive polyimide, and the spaces between the transparent pixel electrodes were filled. The height of the partition is 2 microns. The material constituting the partition is not particularly limited as long as it has durability to the solvent of the electroluminescent material. However, since it can be converted to Teflon (registered trademark) by fluorocarbon gas plasma treatment, for example, acrylic resin, epoxy resin, An organic material used as a resist material such as a novolak resin may be used. Originally, a material containing a fluorine-based resin may be used. Further, the partition may be formed as a black resist by mixing carbon black or the like into the above-described material. Further, a laminated partition wall in which an inorganic material such as glass is used as a lower layer may be used.
【００２３】（バンク表面処理工程）正孔注入／輸送層
用インク組成物を塗布する直前に、上記基板の酸素ガス
とフロロカーボンガスプラズマの連続プラズマ処理を行
った。プラズマ条件は、大気圧下で、パワー３００Ｗ、
電極−基板間距離１ｍｍ、酸素プラズマ処理では、酸素
ガス流量８０ｃｃｍ、ヘリウムガス流量１０ＳＬＭ、テ
ーブル搬送速度１０ｍｍ/ｓで行い、続けてＣＦ4プラズ
マ処理では、 ＣＦ4ガス流量１００ｃｃｍ、ヘリウムガ
ス流量１０ＳＬＭ、テーブル搬送速度５ｍｍ/ｓで行っ
た。これによりポリイミド表面は撥水化、ＩＴＯ表面は
親水化され、インクジェット液滴を微細にパターニング
するための基板側の濡れ性の制御ができる。プラズマを
発生する装置としては、真空中でプラズマを発生する装
置でも、大気中でプラズマを発生する装置でも同様に用
いることができる。(Bank Surface Treatment Step) Immediately before applying the ink composition for hole injection / transport layer, the substrate was subjected to a continuous plasma treatment of oxygen gas and fluorocarbon gas plasma. The plasma conditions are as follows: under atmospheric pressure, power 300W,
The distance between the electrode and the substrate is 1 mm, the oxygen plasma processing is performed at an oxygen gas flow rate of 80 ccm, the helium gas flow rate is 10 SLM, and the table transfer speed is 10 mm / s. The test was performed at a speed of 5 mm / s. Thereby, the polyimide surface is made water-repellent and the ITO surface is made hydrophilic, so that the wettability on the substrate side for finely patterning the inkjet droplets can be controlled. As a device for generating plasma, a device for generating plasma in a vacuum or a device for generating plasma in the atmosphere can be used in the same manner.
【００２４】（正孔注入／輸送層形成工程）次に、正孔
注入／輸送層用インク組成物をインクジェットプリント
装置のヘッド（エプソン社製ＭＪ−９３０Ｃ）から吐出
し、各画素電極上にパターニング塗布を行った。その
際、図３のＲＧＢの各色の画素に対応する位置に連続的
にインクを塗布することは無いようにしてインク吐出を
行った。この場合、少なくとも1画素以上の間隔を隔て
てインク吐出を行えば、吐出画素の間隔は限定されるも
のではない。塗布後、真空中（１ｔｏｒｒ）、室温、２
０分という条件で溶媒を除去し、その後、大気中、２０
０℃（ホットプレート上）、１０分の熱処理により、正
孔注入／輸送層を形成した。膜厚は３０ｎｍであった。
本実施例では各画素とも共通の正孔注入／輸送層を形成
したが、場合によっては各発光層毎で発光層に適した正
孔注入または正孔輸送材料を用いて形成しても良い。(Hole Injection / Transport Layer Forming Step) Next, the ink composition for the hole injection / transport layer is discharged from the head (MJ-930C manufactured by Epson Corporation) of an ink jet printing apparatus, and is patterned on each pixel electrode. Application was performed. At that time, the ink was ejected such that the ink was not continuously applied to the positions corresponding to the pixels of each color of RGB in FIG. In this case, the interval between the ejection pixels is not limited as long as the ink is ejected at an interval of at least one pixel. After coating, in vacuum (1 torr), room temperature, 2
The solvent was removed under the condition of 0 minutes, and then,
A hole injection / transport layer was formed by heat treatment at 0 ° C. (on a hot plate) for 10 minutes. The thickness was 30 nm.
In this embodiment, a common hole injection / transport layer is formed for each pixel. However, in some cases, a hole injection or hole transport material suitable for the light emitting layer may be formed for each light emitting layer.
【００２５】（発光層形成工程）さらにＲ，Ｇ，Ｂ発光
層用インク組成物をインクジェット方式により正孔注入
／輸送層上にパターニング塗布した。その際、図３のＲ
ＧＢ画素を、インクジェット吐出1工程につき１色ず
つ、複数回に分けてインク吐出をするようパターンを設
定した。こうして隣接する画素に連続的にインクを塗布
することは無いようにインク吐出を行った。図3では例
としてG（緑）のドット配置を示している。この場合、
少なくとも1画素以上の間隔を隔ててインク吐出を行え
ば、吐出画素の間隔は限定されるものではない。塗布
後、室温条件で赤色発光層、青色発光層、緑色発光層を
形成した。膜厚は１００ｎｍであった。(Light Emitting Layer Forming Step) Further, the R, G, and B light emitting layer ink compositions were patterned and applied on the hole injection / transport layer by an ink jet method. At that time, R in FIG.
The pattern was set so that the GB pixels could be ejected a plurality of times, one color at a time, for each inkjet ejection process. Thus, the ink was ejected so that the ink was not continuously applied to the adjacent pixels. FIG. 3 shows a dot arrangement of G (green) as an example. in this case,
As long as ink is ejected at least one pixel apart, the interval between the ejected pixels is not limited. After the application, a red light emitting layer, a blue light emitting layer, and a green light emitting layer were formed at room temperature. The thickness was 100 nm.
【００２６】かかるインクジェット方式によれば、微細
なパターニングを簡便にかつ短時間で行うことができ
る。また、インク組成物の固型分濃度および吐出量を変
えることにより膜厚を変えることが可能である。According to such an ink jet system, fine patterning can be performed easily and in a short time. Further, the film thickness can be changed by changing the solid component concentration and the ejection amount of the ink composition.
【００２７】（陰極、封止工程）最後に、陰極（対向電
極）を形成した。陰極としては金属薄膜電極が好まし
く、陰極を構成する金属としては、例えばＭｇ、Ａｇ、
Ａｌ、Ｌｉ等が挙げられる。また、これらの他に仕事関
数の小さい材料を用いることができ、例えばアルカリ金
属や、Ｃａ等のアルカリ土類金属およびこれらを含む合
金を用いることができる。また金属のフッ素化物も適応
できる。このような陰極１１３は蒸着法およびスパッタ
法等により形成することができる。本実施例では、Ｌｉ
Ｆ層２ｎｍ、Ｃａ層を２０ｎｍ、Ａｌ層を２００ｎｍ、
それぞれを真空加熱蒸着法で積層して陰極とした。(Cathode, sealing step) Finally, a cathode (counter electrode) was formed. As the cathode, a metal thin film electrode is preferable, and as the metal constituting the cathode, for example, Mg, Ag,
Al, Li and the like can be mentioned. In addition to these, a material having a small work function can be used. For example, an alkali metal, an alkaline earth metal such as Ca, and an alloy containing these can be used. Fluoride of metal is also applicable. Such a cathode 113 can be formed by an evaporation method, a sputtering method, or the like. In this embodiment, Li
F layer 2 nm, Ca layer 20 nm, Al layer 200 nm,
Each was laminated by a vacuum heating evaporation method to form a cathode.
【００２８】さらに陰極上にエポキシ樹脂で保護膜を形
成することにより、陰極および各発光層劣化、損傷およ
び剥離等を防止しすることができた。Further, by forming a protective film with an epoxy resin on the cathode, deterioration, damage and peeling of the cathode and each light emitting layer could be prevented.
【００２９】このような保護膜の構成材料としては、エ
ポキシ樹脂、アクリル樹脂、液状ガラス等が挙げられ
る。また、保護膜の形成方法としては、例えばスピンコ
ート法、キャスティング法、ディッピング法、バーコー
ト法、ロールコート法、キャピラリー法等が挙げられ
る。The constituent materials of such a protective film include epoxy resin, acrylic resin, liquid glass and the like. Examples of the method for forming the protective film include a spin coating method, a casting method, a dipping method, a bar coating method, a roll coating method, and a capillary method.
【００３０】このようにして正孔注入／輸送層および発
光層の膜厚ばらつきが、連続的にインクを塗布する従来
の方法では１０％であったが、本実施形態では３％以下
に抑制することができ、結果として６４階調表示のエレ
クトロルミネセンス表示装置を得ることができた。得ら
れたエレクトロルミネセンス表示装置は、熱サイクル耐
久試験、紫外線照射試験、加湿試験等の耐久試験に合格
し、実用的な表示装置として十分用い得ることを確認し
た。As described above, the variation in the film thickness of the hole injection / transport layer and the light emitting layer is 10% in the conventional method of continuously applying the ink, but is suppressed to 3% or less in the present embodiment. As a result, an electroluminescence display device of 64 gradation display was obtained. The obtained electroluminescent display device passed durability tests such as a heat cycle durability test, an ultraviolet irradiation test, and a humidification test, and was confirmed to be sufficiently usable as a practical display device.
【００３１】（他の電気光学装置部品の例）上記の実施
形態は、電気光学装置部品としてエレクトロルミネセン
ス表示装置を例にとって説明したが、これに限らず、液
晶表示装置に用いられるカラーフィルタ、ＭＬＡ（マイ
クロレンズアレイ）など、液状物を塗布して乾燥させる
工程を備えた種々の電気光学装置部品に、本発明を適用
することができる。(Examples of Other Electro-Optical Device Parts) In the above embodiment, an electroluminescent display device has been described as an example of an electro-optical device component. However, the present invention is not limited to this, and a color filter used in a liquid crystal display device may be used. The present invention can be applied to various electro-optical device components including a step of applying and drying a liquid material such as an MLA (microlens array).
【００３２】[0032]
【発明の効果】本発明によれば、液状物の乾燥条件を画
素間で均一化することにより、色むら、色調むら、光度
むらのない電気光学装置部品の製造方法を提供すること
ができる。According to the present invention, it is possible to provide a method for manufacturing an electro-optical device component having no color unevenness, color tone unevenness, and luminous intensity unevenness by making the drying conditions of the liquid material uniform among the pixels.
【図１】インク吐出後および乾燥後における画素のイン
ク面の状態を示す断面図である。FIG. 1 is a cross-sectional view illustrating a state of an ink surface of a pixel after ink ejection and drying.
【図２】本発明の実施の形態でエレクトロルミネセンス
表示装置を製造する際に用いられるエレクトロルミネセ
ンス素子基板の平面図である。FIG. 2 is a plan view of an electroluminescent element substrate used when manufacturing an electroluminescent display device according to an embodiment of the present invention.
【図３】図２の符号Ａで示す円内の拡大図である。FIG. 3 is an enlarged view of the inside of a circle indicated by reference numeral A in FIG. 2;
【図４】図３のＢ−Ｂ’線断面図である。FIG. 4 is a sectional view taken along line B-B ′ of FIG. 3;
１３ 画素 １７ 液状物 ２１ インク吐出直後のインク面 ２２ インク乾燥後のインク面 １２ 基板 １１ パネルチップ １４ 仕切り（バンク） １５ 透光層 DESCRIPTION OF SYMBOLS 13 Pixel 17 Liquid material 21 Ink surface immediately after ink discharge 22 Ink surface after ink drying 12 Substrate 11 Panel chip 14 Partition (bank) 15 Translucent layer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｂ 33/14 Ｈ０５Ｂ 33/14 Ａ (72)発明者 森井 克行 長野県諏訪市大和３丁目３番５号 セイコ ーエプソン株式会社内 Ｆターム(参考） 2H048 BA02 BA64 BB02 BB22 BB37 BB41 2H091 FA02Y FC01 FD24 GA03 LA16 3K007 AB04 AB18 BA06 CA01 CB01 DA01 DB03 EB00 FA01 5G435 AA02 AA04 BB05 GG12 KK05 KK07 KK10 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H05B 33/14 H05B 33/14 A (72) Inventor Katsuyuki Morii 3-5-3 Yamato, Suwa-shi, Nagano Prefecture F term in Seiko Epson Corporation (reference) 2H048 BA02 BA64 BB02 BB22 BB37 BB41 2H091 FA02Y FC01 FD24 GA03 LA16 3K007 AB04 AB18 BA06 CA01 CB01 DA01 DB03 EB00 FA01 5G435 AA02 AA04 BB05 GG12 KK05 KK07 KK07KK10
Claims (4)
れる画素形成領域を備える基板上の当該画素形成領域に
所定の液状物を吐出する工程と、前記吐出した液状物を
乾燥させる工程とを備える、電気光学装置部品の製造方
法。A step of discharging a predetermined liquid onto the pixel formation region on a substrate having a pixel formation region in which a plurality of pixels are continuously formed at predetermined intervals; and a step of drying the discharged liquid. A method for manufacturing an electro-optical device component.
トリックス基板であって、前記液状物としてインクを吐
出する、請求項1に記載の電気光学装置部品の製造方
法。2. The method according to claim 1, wherein the substrate is an electroluminescence element matrix substrate, and ejects ink as the liquid material.
前記液状物としてインクを吐出する、請求項1に記載の
電気光学装置部品の製造方法。3. The substrate according to claim 1, wherein the substrate is a color filter substrate,
2. The method for manufacturing an electro-optical device component according to claim 1, wherein ink is ejected as the liquid material.
素形成領域に非連続に前記インクを吐出する、請求項２
または請求項３に記載の電気光学装置部品の製造方法。4. The method according to claim 2, wherein the ink is discontinuously ejected to an adjacent pixel forming area for each of the plurality of pixels.
A method for manufacturing an electro-optical device component according to claim 3.
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|---|---|---|---|
| JP2000105998A JP2001291584A (en) | 2000-04-07 | 2000-04-07 | Manufacturing method of optoelectronic device component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000105998A JP2001291584A (en) | 2000-04-07 | 2000-04-07 | Manufacturing method of optoelectronic device component |
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|---|---|
| JP2001291584A true JP2001291584A (en) | 2001-10-19 |
Family
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| Country | Link |
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