CN102891115A - Substrate and preparation method thereof - Google Patents
Substrate and preparation method thereof Download PDFInfo
- Publication number
- CN102891115A CN102891115A CN201210385062XA CN201210385062A CN102891115A CN 102891115 A CN102891115 A CN 102891115A CN 201210385062X A CN201210385062X A CN 201210385062XA CN 201210385062 A CN201210385062 A CN 201210385062A CN 102891115 A CN102891115 A CN 102891115A
- Authority
- CN
- China
- Prior art keywords
- substrate
- glass substrate
- resin film
- film
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The embodiment of the invention provides a substrate and a preparation method of the substrate, relates to the field of display equipment and enables the substrate to have both thinning performance and softening performance. The substrate comprises a glass substrate. At least one side of the glass substrate is provided with a resin film. The substrate and the preparation method both provided by the invention can be used in the display equipment.
Description
Technical field
The present invention relates to field of display devices, relate in particular to a kind of substrate and preparation method thereof.
Background technology
In recent years, the flat-panel monitor development, and more and more pursue slimming and flexibility.The flexible base, board that is applied to flexible display is studied widely and is used.The main Types of flexible base, board and research direction are glass substrate, plastic base and silicon substrate etc.
The most frequently used substrate is glass substrate at present, yet after glass substrate was by slimming, its resistance to impact was very poor, and is very easily broken, and this is because when receiving impact or extruding, glass produces surface stress and extends inward, thereby glass is ftractureed rapidly.Although resin film-like substrate flexibility is good, easily suction, moisture absorption, thereby cause the distortion of substrate, and then so that the circuit performance on the substrate descend.
Summary of the invention
The main purpose of embodiments of the invention is to provide a kind of substrate and preparation method thereof, can make substrate have the performance of slimming and flexibility concurrently.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of substrate comprises:
Glass substrate; At least one side at described glass substrate is provided with resin film.
Concrete, the thickness of described glass substrate can be 20 microns～300 microns, and the thickness of described resin film can be 10 nanometers～10 micron.
Optionally, on the both sides of described glass substrate, all can be provided with resin film;
Can be provided with at least one through hole on described glass substrate, the described resin film of described substrate both sides that is arranged on is by the integrated connection of described through hole.Concrete, the radius of described through hole can be 0.1 millimeter～4 millimeters.
Further alternative, be provided with sealed plastic box on the described substrate, then described through hole can be arranged on the substrate regions of described sealed plastic box periphery.
Further alternative, on described resin film, also can be provided with one or more the combination in polymer insulation film, conductive polymer membrane, inorganic compound film and the pattern metal film.
In addition, embodiments of the invention also adopt following technical scheme:
A kind of preparation method of substrate comprises:
Glass substrate is provided;
At least one side at described glass substrate forms resin film.
Optionally, before at least one side of described glass substrate formed resin film, described method comprised:
Form at least one through hole at described glass substrate;
Then described at least one side formation resin film at described glass substrate comprises:
Both sides at described glass substrate form respectively resin film, and described resin film is by the integrated connection of described through hole.
Further alternative, after the both sides of described glass substrate formed resin film respectively, described method also comprised:
Form sealed plastic box at described glass substrate;
Then describedly form at least one through hole at described glass substrate and comprise:
Substrate regions in described sealed plastic box periphery forms at least one through hole.
Further alternative, after at least one side of described glass substrate formed resin film, described method also comprised:
The combination of one or more in described resin film formation polymer insulation film, conductive polymer membrane, inorganic compound film and pattern metal film.
Substrate that the embodiment of the invention provides and preparation method thereof, at glass substrate resin film is set, the circuit that is deposited on the substrate utilize the performances such as the low water absorption of glass substrate and low morphotropism so that can keep very high performance, the resin film that arranges at glass substrate has increased impact resistance and the pliability of substrate, so that improved the flexibility performance of substrate when guaranteeing substrate slimming performance.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The board structure schematic diagram that Fig. 1 provides for one embodiment of the invention;
The board structure schematic diagram that Fig. 2 provides for another embodiment of the present invention;
The board structure schematic diagram that Fig. 3 provides for another embodiment of the present invention;
The base plate preparation method flow chart that Fig. 4 provides for one embodiment of the invention;
The base plate preparation method flow chart that Fig. 5 provides for another embodiment of the present invention;
The base plate preparation method flow chart that Fig. 6 provides for another embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Below in conjunction with accompanying drawing substrate of the embodiment of the invention and preparation method thereof is described in detail.
The embodiment of the invention provides a kind of substrate 10, and as shown in Figure 1, this substrate comprises:
At least one side at glass substrate 101 is provided with resin film 102.Resin film 102 possesses the characteristics such as high tenacity, insulating properties, flatness, low water absorption and low morphotropism.
Wherein, resin film 102 can be polymer resinous thin film.Optionally, form resin film 102 by in the following material one or more: polyimides (PI), polyamide (PA), PETG (PET), Merlon (PC), polyether-ether-ketone (PEK), polyether sulfone (PES), polyacrylate (PAR), polysulfones (PS), liquid crystal polymer (LCP), modified polyphenylene ether (PPE) etc.Certainly, the resin film 102 of the embodiment of the invention is not limited to the polymer resinous thin film that formed by above-mentioned material, and those skilled in the art also can select other to possess the film of high tenacity, insulating properties, flatness, low water absorption and low morphotropism according to general knowledge known in this field or common technology means.Certainly, the embodiment of the invention is not construed as limiting this, and resin film 102 can also possess for other film of the characteristics such as high tenacity, insulating properties, flatness, low water absorption and low morphotropism.
In embodiments of the present invention, can be only be provided with resin film 102 in the wherein side of glass substrate 101, and opposite side does not arrange other structure sheafs, perhaps can be provided with the structure sheaf different from these resin film 102 functions.Certainly, also can be provided with in the both sides of glass substrate 102 resin film 102.The embodiment of the invention is not construed as limiting this.
The substrate that the embodiment of the invention provides, at glass substrate 101 resin film 102 is set, the circuit that is deposited on the substrate 10 utilize the performances such as the low water absorption of glass substrate 101 and low morphotropism so that can keep very high performance, the resin film 102 that arranges at glass substrate 101 has increased impact resistance and the pliability of substrate 10, so that improved the flexibility performance of substrate 10 when guaranteeing substrate 10 slimming performances.
Preferably, in an embodiment provided by the invention, the thickness of glass substrate 101 is 20 microns～300 microns, and the thickness of resin film 102 is 10 nanometers～10 micron.For example in the substrate 10 shown in Figure 1, the thickness of glass substrate 101 is 90 microns, and the thickness of resin film 102 is 0.01 micron.Certainly, the purpose that substrate 10 shown in Figure 1 only illustrates for example, do not limit the invention process glass substrate 101 and resin film 102 thickness, those skilled in the art can arrange according to general knowledge known in this field or common technology means, can also be 30 microns, 100 microns, 200 microns etc. such as the thickness of glass substrate 101.The thickness of resin film 102 can also be 80 nanometers, 100 nanometers, 0.8 micron, 9 microns etc.
The substrate 10 that the embodiment of the invention provides, the thickness of glass substrate 101 are 20 microns～300 microns, and the thickness of resin film 102 is 10 nanometers～10 micron, can when guaranteeing substrate 10 slimmings, improve the flexibility of substrate.
Further preferred, in an embodiment provided by the invention, as shown in Figure 2, be provided with resin film 102 in the both sides of glass substrate 101.The thickness of two layers of resin film 102 can be the same or different, and the embodiment of the invention is not construed as limiting this.Be provided with at least one through hole 103 at glass substrate 101, be arranged on the two layers of resin film 102 of substrate 10 by through hole 103 integrated connections.Forming in the process of resin film 102 by coating process, the resin solution of coating enters in the through hole 103, and then in the process of film-forming, and the two layers of resin film 102 of glass substrate 10 both sides is formed as one.
Through hole 103 can be set to one or more, in the routine substrate 10 as shown in Figure 2, is provided with among 4 through hole 103(figure and only illustrates two), lay respectively at the Si Jiaochu of substrate 10.Certainly, substrate 10 shown in Figure 2 only is the purpose of example explanation, does not limit quantity and the position of through hole 103 in the invention process, and those skilled in the art can arrange according to general knowledge known in this field or common technology means.
Further preferred, the radius of through hole 103 can be set to 0.1 millimeter～4 millimeters.For example the radius of each through hole 103 among Fig. 2 can be set to 2 millimeters.Certainly, substrate 10 shown in Figure 2 only is the purpose of example explanation, does not limit the radius of through hole 103 in the invention process, and those skilled in the art can arrange according to general knowledge known in this field or common technology means, such as 1 millimeter, 3 millimeters, 3.5 millimeters etc.
Substrate that the embodiment of the invention provides 10 need not other binding agents or fastening means by the resin film 102 integrated connections of through hole 103 with glass substrate 101 both sides, save cost, has guaranteed air-tightness and water proofing property that substrate 10 is good.
Further preferred, in one embodiment of the invention, be provided with sealed plastic box on the described substrate 10, then described through hole 103 is arranged on the substrate regions of described sealed plastic box periphery.In the sealed plastic box periphery through hole 103 is set, has guaranteed air-tightness and water proofing property that substrate 10 is good, can not affect circuit or the element of deposition on the substrate 10 simultaneously.
Further alternative, in one embodiment of the invention, as shown in Figure 3, on resin film 103, also can further be provided with one or more the combination in polymer insulation film, conductive polymer membrane, inorganic compound film and the pattern metal film.In embodiments of the present invention can be only at resin film 103 a kind of in the above-mentioned membrane structure be set, also the said film combination can be successively set on the resin film 103, for example at resin film 103 polymer insulation film 104 is set, then pattern metal film 105 further is set on polymer insulation layer 104.
Wherein, but the formation method of the formation method reference resin film of polymer insulation film repeats no more.The formation of inorganic compound film can be adopted vacuum vapour deposition, oxidation reaction vapour deposition method, sputtering method, ion plating method, plasma chemical vapor phase process etc.Further, if form the inorganic thin film that contains silicon compound, can use the organo-silicon compound such as silane, tetramethoxy-silicane to form by CVD (Chemical Vapor Deposition, chemical vapour deposition (CVD)) method.The substrate 10 that the embodiment of the invention provides also can provide the functions such as other corresponding insulation, conduction when having slimming and flexibility concurrently.
Corresponding with aforesaid substrate, the embodiment of the invention also provides a kind of base plate preparation method, and as shown in Figure 4, the method comprises:
201, provide glass substrate.
In this step, as shown in Figure 1, the glass substrate 101 that provides can be the unorganic glasses such as aluminium borate glass or alkali glass, but the invention is not restricted to this.
202, at least one side at described glass substrate forms resin film.
As shown in Figure 1, described resin film 102 is polymer resinous thin film.The kind of polymer is not being given unnecessary details referring to previous embodiment herein.
In this step, at first prepare polymer resin solution.Then coated polymeric resin solution on glass substrate 101.The coating method of polymer resin solution can for but be not limited to: air-blade type coating, scraper plate coating, scraper for coating, oppositely coating, intaglio plate coating, spraying, slot coated, calendering coating, electro-deposition coating, dip-coating, letterpress, offset printing etc.
At last drying or heat treatment etc. are solidified or carried out to the polymer resin solution of coating and form resin film 102.Such as being fixed on above the unorganic glass by the polymer resin solution film-forming of the methods such as hot curing, ultraviolet light polymerization with coating.Optionally, when adopting hot curing, heating-up temperature is 100～280 ℃, and be 10～90 minutes heating time; When adopting ultraviolet light polymerization, preferred 50～500mJ/cm
2Energy.
Now specify as an example of fluoropolymer resin polyimides (PI) example.At first prepare polyimide solution by adjacent benzene diphenyl ether and adjacent pyromellitic anhydride, then this solution is coated to glass baseplate surface, obtain resin film 102 in 200～230 ℃ of lower hot curings of high temperature.
The base plate preparation method that the embodiment of the invention provides, one glass substrate 101 is provided, at least one side at glass substrate 101 forms resin film 102, the circuit that is deposited on the substrate 10 utilize the performances such as the low water absorption of glass substrate 101 and low morphotropism so that can keep very high performance, the resin film 102 that arranges at glass substrate 101 has increased impact resistance and the pliability of substrate 10, so that improved the flexibility performance of substrate 10 when guaranteeing substrate 10 slimming performances.
In another embodiment provided by the invention, as shown in Figure 5, described method comprises:
301, provide glass substrate.
As shown in Figure 2, glass substrate 101 can referring to preceding method embodiment, not repeat them here to the description of glass substrate 101.
302, form at least one through hole at described glass substrate.
For example, as shown in Figure 2, form four through holes 103 at glass substrate 101, lay respectively at the Si Jiaochu of substrate 10.Optionally, form sealed plastic box if this method also is included on the glass substrate 101, then at least one through hole 103 can be arranged on the substrate regions of sealed plastic box periphery.Optional again, but forming radius is 0.1 millimeter～4 millimeters through hole 103.Certainly, be understandable that foregoing does not limit quantity and the position of through hole 103 in the embodiment of the invention only for illustrating.
303, form respectively resin film in the both sides of described glass substrate, described resin film is by the integrated connection of described through hole.
When coating resin solution, resin solution flows in the through hole 103, and in the film-forming process, the resin solution of substrate 101 both sides and the resin solution in the through hole 103 are cured and are called one, thereby the resin film 102 that connects glass substrate 101 both sides, as shown in Figure 2.
The base plate preparation method that the embodiment of the invention provides need not other binding agents or fastening means by forming through hole 103 with the resin film 102 integrated connections of glass substrate 101 both sides, save cost, has guaranteed air-tightness and water proofing property that substrate 10 is good.
In another embodiment provided by the invention, as shown in Figure 6, after step 202, described method also comprises:
203, the combination of one or more in described resin film formation polymer insulation film, conductive polymer membrane, inorganic compound film and pattern metal film.
After forming resin film 102, can on resin film 102, further form a kind of in polymer insulation film, conductive polymer membrane, inorganic compound film or the pattern metal film, also the said film combination can be successively set on the resin film 102, for example at resin film 102 polymer insulation film 104 is set, then pattern metal film 105 further is set on polymer insulation layer 104.
Wherein, but the formation method of the formation method reference resin film of polymer insulation film repeats no more.The formation of inorganic compound film can be adopted vacuum vapour deposition, oxidation reaction vapour deposition method, sputtering method, ion plating method, plasma chemical vapor phase process etc.Further, if form the inorganic thin film that contains silicon compound, can use the organo-silicon compound such as silane, tetramethoxy-silicane to form by CVD (Chemical Vapor Deposition, chemical vapour deposition (CVD)) method.Base plate preparation method in the embodiment of the invention is so that substrate 10 when having slimming and flexibility concurrently, also can provide the functions such as other corresponding insulation, conduction.Need to prove that step 203 can also be carried out after step 303.
The above; be the specific embodiment of the present invention only, but protection scope of the present invention is not limited to this, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; can expect easily changing or replacing, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (10)
1. a substrate is characterized in that, comprising:
Glass substrate;
At least one side at described glass substrate is provided with resin film.
2. substrate according to claim 1 is characterized in that,
The thickness of described glass substrate is 20 microns～300 microns; The thickness of described resin film is 10 nanometers～10 micron.
3. substrate according to claim 1 is characterized in that,
Both sides at described glass substrate are provided with resin film;
Be provided with at least one through hole at described glass substrate, the described resin film of described substrate both sides that is arranged on is by the integrated connection of described through hole.
4. substrate according to claim 3 is characterized in that, the radius of described through hole is 0.1 millimeter～4 millimeters.
5. substrate according to claim 3 is characterized in that, is provided with sealed plastic box on the described substrate, and described through hole is arranged on the substrate regions of described sealed plastic box periphery.
6. substrate according to claim 1 is characterized in that,
Be provided with one or more combination in polymer insulation film, conductive polymer membrane, inorganic compound film and the pattern metal film at described resin film.
7. the preparation method of a substrate is characterized in that, comprising:
Glass substrate is provided;
At least one side at described glass substrate forms resin film.
8. method according to claim 7 is characterized in that, before at least one side of described glass substrate forms resin film, comprising:
Form at least one through hole at described glass substrate;
Then described at least one side formation resin film at described glass substrate comprises:
Both sides at described glass substrate form respectively resin film, and described resin film is by the integrated connection of described through hole.
9. method according to claim 8 is characterized in that, after the both sides of described glass substrate formed resin film respectively, described method also comprised:
Form sealed plastic box at described glass substrate;
Then describedly form at least one through hole at described glass substrate and comprise:
Substrate regions in described sealed plastic box periphery forms at least one through hole.
10. method according to claim 7 is characterized in that, after at least one side of described glass substrate forms resin film, also comprises:
The combination of one or more in described resin film formation polymer insulation film, conductive polymer membrane, inorganic compound film and pattern metal film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210385062.XA CN102891115B (en) | 2012-10-11 | 2012-10-11 | Substrate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210385062.XA CN102891115B (en) | 2012-10-11 | 2012-10-11 | Substrate and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102891115A true CN102891115A (en) | 2013-01-23 |
| CN102891115B CN102891115B (en) | 2016-08-17 |
Family
ID=47534578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210385062.XA Active CN102891115B (en) | 2012-10-11 | 2012-10-11 | Substrate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102891115B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105185809A (en) * | 2015-08-03 | 2015-12-23 | 深圳市华星光电技术有限公司 | Manufacturing method of flexible display screen, flexible glass substrate and flexible display screen |
| CN113991004A (en) * | 2021-10-26 | 2022-01-28 | 东莞市中麒光电技术有限公司 | LED substrate manufacturing method, LED substrate, LED device manufacturing method and LED device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010044291A1 (en) * | 2008-10-17 | 2010-04-22 | シャープ株式会社 | Display device and method for manufacturing the same |
| CN101954702A (en) * | 2009-07-14 | 2011-01-26 | 比亚迪股份有限公司 | Glass product and production method thereof |
| CN102015287A (en) * | 2008-04-24 | 2011-04-13 | 日东电工株式会社 | Flexible substrate |
| CN102347453A (en) * | 2010-07-28 | 2012-02-08 | 三星移动显示器株式会社 | Display device and organic light emitting diode display device |
| CN202796906U (en) * | 2012-10-11 | 2013-03-13 | 京东方科技集团股份有限公司 | Substrate |
-
2012
- 2012-10-11 CN CN201210385062.XA patent/CN102891115B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102015287A (en) * | 2008-04-24 | 2011-04-13 | 日东电工株式会社 | Flexible substrate |
| WO2010044291A1 (en) * | 2008-10-17 | 2010-04-22 | シャープ株式会社 | Display device and method for manufacturing the same |
| CN101954702A (en) * | 2009-07-14 | 2011-01-26 | 比亚迪股份有限公司 | Glass product and production method thereof |
| CN102347453A (en) * | 2010-07-28 | 2012-02-08 | 三星移动显示器株式会社 | Display device and organic light emitting diode display device |
| CN202796906U (en) * | 2012-10-11 | 2013-03-13 | 京东方科技集团股份有限公司 | Substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105185809A (en) * | 2015-08-03 | 2015-12-23 | 深圳市华星光电技术有限公司 | Manufacturing method of flexible display screen, flexible glass substrate and flexible display screen |
| WO2017020372A1 (en) * | 2015-08-03 | 2017-02-09 | 深圳市华星光电技术有限公司 | Flexible glass substrate, flexible display screen and manufacturing method for flexible display screen |
| CN113991004A (en) * | 2021-10-26 | 2022-01-28 | 东莞市中麒光电技术有限公司 | LED substrate manufacturing method, LED substrate, LED device manufacturing method and LED device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102891115B (en) | 2016-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7279732B2 (en) | Resin composition, adhesive film, printed wiring board and semiconductor device | |
| TWI671352B (en) | Resin composition | |
| TWI749038B (en) | Laminated body with low dielectric adhesive layer | |
| KR102189258B1 (en) | Low dielectric adhesive composition | |
| CN106085100A (en) | Resin combination | |
| KR102656740B1 (en) | Resin sheet with support | |
| KR20080101488A (en) | Flexible substrate for display and device using the same | |
| TWI783989B (en) | resin composition | |
| CN116218140A (en) | Resin composition | |
| TW201702341A (en) | Laminate comprising low dielectric constant adhesive layer | |
| CN104010448B (en) | The manufacture method and semiconductor device of part internally-arranged type circuit board | |
| JP2015074783A (en) | Release layer, substrate structure, and method of producing flexible electronic device | |
| KR20170132680A (en) | Resin composition | |
| KR20160074407A (en) | Three-layer film, method for producing three-layer film, laminated plate and printed circuit board | |
| KR20110004764A (en) | Metalized polyimide film and flexible printed circuit board using the same | |
| CN108570213A (en) | Resin composition layer | |
| KR20100121341A (en) | Composition including benzoxazine based compound for forming board and board fabricated using the same | |
| KR101206352B1 (en) | Fabrication method of flexible board | |
| CN108727837A (en) | Resin combination | |
| CN102891115A (en) | Substrate and preparation method thereof | |
| CN110016203B (en) | Resin composition | |
| Sangermano et al. | Graphene–Epoxy Flexible Transparent Capacitor Obtained By Graphene–Polymer Transfer and UV‐Induced Bonding | |
| JP2021014545A (en) | Resin composition | |
| CN104244603B (en) | The manufacturing method and semiconductor device of component internally-arranged type circuit board | |
| CN102687244A (en) | Fabrication method of flexible board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |