CN102886926A - 抗菌镀膜件及其制备方法 - Google Patents

抗菌镀膜件及其制备方法 Download PDF

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CN102886926A
CN102886926A CN2011102036184A CN201110203618A CN102886926A CN 102886926 A CN102886926 A CN 102886926A CN 2011102036184 A CN2011102036184 A CN 2011102036184A CN 201110203618 A CN201110203618 A CN 201110203618A CN 102886926 A CN102886926 A CN 102886926A
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copper
zinc
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composite bed
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张新倍
陈文荣
陈正士
李聪
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to TW100125891A priority patent/TW201305358A/zh
Priority to US13/210,756 priority patent/US20130022835A1/en
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Abstract

本发明提供一种抗菌镀膜件，其包括基材，形成于基材表面的铜层，形成于铜层表面的铜锌复合层及形成于铜锌复合层表面的氧化锌层。所述铜层与基材附着牢固；所述氧化锌层对铜锌复合层中铜和锌离子的快速溶出起到阻碍作用，从而可缓释铜和锌离子的溶出，使铜锌复合层具有长效的抗菌效果，相应延长了抗菌镀膜件的使用寿命；且在有光照的条件下，所述氧化锌层可进一步加强所述抗菌镀膜件的抗菌效果。此外，本发明还提供一种所述抗菌镀膜件的制备方法。

Description

抗菌镀膜件及其制备方法
技术领域
本发明涉及一种抗菌镀膜件及其制备方法。
背景技术
有害细菌的传播和感染严重威胁着人类的健康，尤其是近年来SARS病毒、禽流感等的传播和感染，使抗菌材料在日常生活中的应用迅速发展起来。目前常用的抗菌材料有两种，金属抗菌材料和光催化抗菌材料。常见的金属抗菌材料为铜、锌及银等，它们的抗菌机理是﹕抗菌金属缓慢释放出金属离子如Cu2+、Zn2+，当微量的具有杀菌性的金属离子与细菌等微生物接触时，该金属离子依靠库伦力与带有负电荷的微生物牢固吸附，金属离子穿透细胞壁与细菌体内蛋白质上的巯基、氨基发生反应，使蛋白质活性破坏，使细胞丧失分裂增殖能力而死亡，从而达到杀菌的目的。常见的光催化抗菌材料为二氧化钛(TiO2)和氧化锌(ZnO)。二氧化钛的抗菌原理是：在水和空气的体系中，太阳光、紫外线的照射下，二氧化钛表面产生强氧化性的活性物质·OH和O2·，能起到杀死细菌的作用。
但是随着金属离子的消耗流失，金属抗菌材料的抗菌效果会逐渐减低。而光催化抗菌材料只有在光照射的条件下，才能较好地发挥其抗菌效果。
发明内容
有鉴于此，有必要提供一种抗菌效果持久且适用多种环境下使用的抗菌镀膜件。
另外，还有必要提供一种上述抗菌镀膜件的制备方法。
一种抗菌镀膜件，其包括基材，形成于基材表面的铜层，形成于铜层表面的铜锌复合层及形成于铜锌复合层表面的氧化锌层。
一种抗菌镀膜件的制备方法，其包括如下步骤：
提供基材；
在该基材的表面形成铜层；
在该铜层的表面形成铜锌复合层；
在该铜锌复合层的表面形成氧化锌层。
本发明抗菌镀膜件在基材表面依次溅镀铜层、铜锌复合层和氧化锌层，所述铜层与基材附着牢固；所述铜锌复合层采用双相抗菌元素加强了铜锌复合层的抗菌效果，且克服了PVD制备的单一锌层于基材上附着力差，易脱落的缺陷；所述氧化锌层对铜锌复合层中铜和锌离子的快速溶出起到阻碍作用，从而可缓释铜和锌离子的溶出，使铜锌复合层具有长效的抗菌效果，相应延长了抗菌镀膜件的使用寿命；且在有光照的条件下，所述氧化锌层由于具有光催化性能，能分解细菌死后释放出的复合物，从而进一步加强所述抗菌镀膜件的抗菌效果。
附图说明
图1为本发明一较佳实施例的抗菌镀膜件的剖视图；
图2为本发明一较佳实施例真空镀膜机的俯视示意图。
主要元件符号说明
抗菌镀膜件 10
基材 11
铜层 13
铜锌复合层 15
氧化锌层 17
真空镀膜机 20
镀膜室 21
铜靶 23
锌靶 24
轨迹 25
真空泵 30
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明一较佳实施方式的抗菌镀膜件10包括基材11、形成于基材11表面的铜层13，形成于铜层13表面的铜锌 (Cu-Zn) 复合层15和氧化锌 (ZnO) 层17。
该基材11的材质优选为不锈钢，但不限于不锈钢。
该铜层13可以磁控溅射的方式形成，其厚度为100～250nm。
该铜锌复合层15可以磁控溅射的方式形成，其厚度为500～800nm。
该氧化锌层17可以磁控溅射的方式形成，其厚度为70～250nm。
本明一较佳实施方式的抗菌镀膜件10的制备方法，其包括如下步骤：
请参阅图2，提供一真空镀膜机20，该真空镀膜机20包括一镀膜室21及连接于镀膜室21的一真空泵30，真空泵30用以对镀膜室21抽真空。该镀膜室21内设有转架(未图示)、相对设置的二铜靶23和相对设置的二锌靶24。转架带动基材11沿圆形的轨迹25公转，且基材11在沿轨迹25公转时亦自转。
提供基材11，该基材11的材质优选为不锈钢，但不限于不锈钢。
对该基材11进行表面预处理。该表面预处理可包括常规的对基材11进行无水乙醇超声波清洗及烘干等步骤。
采用磁控溅射法在经清洗后的基材11的表面溅镀铜层13。溅镀该铜层13在所述真空镀膜机20中进行。将基材11放入镀膜室21内，将该镀膜室21抽真空至3×10-3Pa，并加热所述镀膜室21至温度为50～200℃。溅镀时，开启铜靶23的电源，设置铜靶23的电源功率为0.5～5kw，通入工作气体氩气，氩气流量为50～300sccm，对基材11施加-50～-400V的偏压，镀膜时间为1～5min。该铜层13的厚度为100～250nm。
继续采用磁控溅射法在所述铜层13的表面溅镀铜锌复合层15。继续使用铜靶23，设置铜靶23的电源功率为0.5～5kw；并开启锌靶24的电源，设置锌靶24的电源功率为2～12kw；保持氩气流量、偏压、温度等不变，镀膜时间为10～90min。该铜锌复合层15的厚度为400～800nm。
继续采用磁控溅射法在所述铜锌复合层15的表面溅镀氧化锌层17。溅镀时，关闭铜靶23的电源，继续使用锌靶24，设置锌靶24的电源功率为2～12kw；通入反应气体氧气，氧气流量为50～300sccm，保持氩气流量、偏压、温度等不变，镀膜时间为1～15min。该氧化锌层17的厚度为70～250nm。
下面通过实施例来对本发明进行具体说明。
实施例1
本实施例所使用的真空镀膜机20为中频磁控溅射镀膜机。
本实施例所使用的基材11的材质为不锈钢。
溅镀铜层13：铜靶23的功率为5kw，氩气流量为300sccm，基材11的偏压为-200V，镀膜温度为100℃，镀膜时间为5min；该铜层13的厚度为250nm；
溅镀铜锌复合层15：铜靶23的功率为5kw，锌靶24的功率为8kw，氩气流量、偏压等其他工艺参数与溅镀铜层13的相同，镀膜时间为50min；该铜锌复合层15的厚度为650nm。
溅镀氧化锌层17：锌靶24的功率为8kw，氧气流量为250sccm，氩气流量、偏压等其他工艺参数与溅镀铜层13的相同，镀膜时间为5min；该氧化锌层17的厚度为70nm。
实施例2
本实施例所使用的真空镀膜机20为中频磁控溅射镀膜机。
本实施例所使用的基材11的材质为不锈钢。
溅镀铜层13：铜靶23的功率为5kw，氩气流量为300sccm，基材11的偏压为-200V，镀膜温度为100℃，镀膜时间为5min；该铜层13的厚度为250nm；
溅镀铜锌复合层15：铜靶23的功率为3kw，锌靶24的功率为10kw，氩气流量、偏压等其他工艺参数与溅镀铜层13的相同，镀膜时间为50min；该铜锌复合层15的厚度为700nm。
溅镀氧化锌层17：锌靶24的功率为8kw，氧气流量为250sccm，氩气流量、偏压等其他工艺参数与溅镀铜层13的相同，镀膜时间为5min；该氧化锌层17的厚度为70nm。
抗菌性能测试
将上述制得的抗菌镀膜件10进行抗菌性能测试，抗菌测试参照HG/T3950-2007标准进行，具体测试方法如下：取适量菌液滴于实施例1、2所制得的抗菌镀膜件10和未处理的不锈钢样品上，用灭菌覆盖膜覆盖抗菌镀膜件10和未处理的不锈钢样品，置于灭菌培养皿中，在温度为37±1℃，相对湿度为RH>90%的条件下培养24h。然后取出，用20ml洗液反复冲洗样品及覆盖膜，摇匀后取洗液接种于营养琼脂培养基中，在温度为37±1℃下培养24~48h后进行活菌计数。
将6种霉菌制成孢子悬液，将抗菌镀膜件10浸泡在所述孢子悬液中，在温度为28℃，相对湿度RH>90%的条件下培养28天。
测试结果：实施例1和2所制得的抗菌镀膜件10对大肠杆菌、沙门氏菌、金黄色葡萄球菌的杀菌率均达到99.9%，长霉等级均为1级。
抗菌持久性测试：经过在温度为37±1 ℃的恒温水溶液中浸泡3个月后的抗菌抗菌镀膜件10，再次进行抗菌性能测试，实施例1和2所制得的抗菌抗菌镀膜件10对大肠杆菌、沙门氏菌、金黄色葡萄球菌的杀菌率依然达到98.2%，长霉等级均为1级。
本发明抗菌镀膜件10在基材11表面依次溅镀铜层13、铜锌复合层15和氧化锌层17，所述铜层13与基材11附着牢固；所述铜锌复合层15采用双相抗菌元素加强了铜锌复合层15的抗菌效果，且克服了PVD制备的单一锌层于基材上附着力差，易脱落的缺陷；所述氧化锌层17对铜锌复合层15中铜和锌离子的快速溶出起到阻碍作用，从而可缓释铜和锌离子的溶出，使铜锌复合层15具有长效的抗菌效果，相应延长了抗菌镀膜件10的使用寿命；且在有光照的条件下，所述氧化锌层17由于具有光催化性能，能分解细菌死后释放出的复合物，从而进一步加强所述抗菌镀膜件10的抗菌效果。

Claims (9)

1.一种抗菌镀膜件，其包括基材，其特征在于：该抗菌镀膜件还包括形成于基材表面的铜层，形成于铜层表面的铜锌复合层及形成于铜锌复合层表面的氧化锌层。
2.如权利要求1所述的抗菌镀膜件，其特征在于：所述基材的材质为不锈钢。
3.如权利要求1所述的抗菌镀膜件，其特征在于：所述铜层的厚度为100～250nm。
4.如权利要求1所述的抗菌镀膜件，其特征在于：所述铜锌复合层的厚度为400～800nm。
5.如权利要求1所述的抗菌镀膜件，其特征在于：所述氧化锌层的厚度为70～250nm。
6.一种抗菌镀膜件的制备方法，其包括如下步骤：
提供基材；
在该基材的表面形成铜层；
在该铜层的表面形成铜锌复合层；
在该铜锌复合层的表面形成氧化锌层。
7.如权利要求6所述抗菌镀膜件的制备方法，其特征在于：形成所述铜层的步骤采用如下方式实现：采用磁控溅射法，使用铜靶，设置铜靶的电源功率为0.5～5kw，以氩气为工作气体，氩气流量为50～300sccm，对基材施加偏压为-50～-400V，镀膜温度为50～200℃，镀膜时间为1～5min。
8.如权利要求6所述抗菌镀膜件的制备方法，其特征在于：形成所述铜锌复合层的步骤采用如下方式实现：采用磁控溅射法，使用铜靶和锌靶，设置所述铜靶的电源功率为0.5～5kw，设置所述锌靶的电源功率为2～12kw，以氩气为工作气体，氩气流量为50～300sccm，对基材施加偏压为-50～-400V，镀膜温度为50～200℃，镀膜时间为10～90min。
9.如权利要求6所述抗菌镀膜件的制备方法，其特征在于：形成所述氧化锌层的步骤采用如下方式实现：采用磁控溅射法，使用锌靶，设置所述锌靶的电源功率为2～12kw，以氧气为工作气体，氧气流量为50～300sccm，以氩气为工作气体，氩气流量为50～300sccm，对基材施加偏压为-50～-400V，镀膜温度为50～200℃，镀膜时间为1～15min。
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