CN102453849B - 镀膜件及其制备方法 - Google Patents
镀膜件及其制备方法 Download PDFInfo
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- CN102453849B CN102453849B CN201010511538.0A CN201010511538A CN102453849B CN 102453849 B CN102453849 B CN 102453849B CN 201010511538 A CN201010511538 A CN 201010511538A CN 102453849 B CN102453849 B CN 102453849B
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- layer
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- tio
- coated part
- prime coat
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Abstract
本发明提供一种具有持久抗菌效果的镀膜件,其包括基材、形成于基材表面的打底层,该打底层为Ti层,该镀膜件还包括形成于打底层表面的若干TiO2层和若干Cu-Zn合金层,该若干TiO2层和若干Cu-Zn合金层交替排布。本发明所述镀膜件利用TiO2层疏松多孔的结构,使Cu-Zn合金层的部分嵌入到该TiO2层中,对Cu-Zn金属离子的快速溶出起到阻碍作用,从而可缓释Cu-Zn金属离子的溶出,使Cu-Zn合金层具有长效的抗菌效果;同时TiO2层中的TiO2本身具有抗菌效果,可强化镀膜件的抗菌效果。此外,本发明还提供一种所述镀膜件的制备方法。
Description
技术领域
本发明涉及一种镀膜件及其制备方法。
背景技术
有害细菌的传播和感染严重威胁着人类的健康,尤其是近年来SARS病毒、禽流感等的传播和感染,使抗菌材料在日常生活中的应用迅速发展起来。将抗菌金属(Cu、Zn、Ag等)涂覆于基材上形成抗菌镀膜件在目前市场上有着广泛的应用。该抗菌镀膜件的杀菌机理是:镀膜件在使用过程中,抗菌金属涂层会缓慢释放出金属离子如Cu2+、Zn2+,当微量的具有杀菌性的金属离子与细菌等微生物接触时,该金属离子依靠库伦力与带有负电荷的微生物牢固吸附,金属离子穿透细胞壁与细菌体内蛋白质上的巯基、氨基发生反应,使蛋白质活性破坏,使细胞丧失分裂增殖能力而死亡,从而达到杀菌的目的。
但是该类金属抗菌涂层厚度通常比较薄,且表面硬度较低容易磨损,从而降低了金属抗菌涂层的抗菌持久性。
发明内容
有鉴于此,有必要提供一种抗菌效果较为持久的镀膜件。
另外,还有必要提供一种上述镀膜件的制备方法。
一种镀膜件,其包括基材、形成于基材表面的打底层,该打底层为Ti层,该镀膜件还包括形成于打底层表面的若干TiO2层和若干Cu-Zn合金层,该若干TiO2层和若干Cu-Zn合金层交替排布。
一种镀膜件的制备方法,其包括如下步骤:
提供一基材;
在该基材的表面形成打底层,该打底层为Ti层;
在该打底层的表面形成TiO2层;
在该TiO2层的表面形成Cu-Zn合金层;
重复交替形成TiO2层和Cu-Zn合金层以形成最外层为TiO2层的镀膜件。
本发明所述镀膜件在基材表面交替溅镀TiO2层和Cu-Zn合金层,TiO2层形成为疏松多孔的结构,而使Cu-Zn合金层的部分嵌入到TiO2层中,对Cu-Zn合金层中Cu-Zn金属离子的快速溶出起到阻碍作用,从而可缓释Cu-Zn金属离子的溶出,使Cu-Zn合金层具有长效的抗菌效果;同时TiO2层中的TiO2本身具有抗菌效果,可强化镀膜件的抗菌效果,相应地延长镀膜件的使用寿命。
附图说明
图1为本发明一较佳实施例的镀膜件的剖视图。
主要元件符号说明
镀膜件100
基材10
打底层20
TiO2层30
Cu-Zn合金层40
具体实施方式
请参阅图1,本发明一较佳实施方式的镀膜件100包括基材10、形成于基材10表面的打底层20,形成于打底层20表面的若干TiO2层30和若干Cu-Zn合金层40,该若干TiO2层30和若干Cu-Zn合金层40交替排布,其中与所述打底层20直接相结合的是的TiO2层30,最外层为TiO2层30。本实施例中,所述若干TiO2层30和若干Cu-Zn合金层40的层数可分别为5~20层。
该基材10的材质可为钛或钛合金。
该打底层20可以磁控溅射的方式形成。该打底层为Ti层。该打底层20的厚度可为100~200nm。
该若干TiO2层30可以磁控溅射的方式形成。所述每一TiO2层30的厚度可为50~100nm。溅镀该TiO2层30时采用较低的沉积温度和沉积偏压,使TiO2层30具有更好的疏松多孔的结构,可使所述Cu-Zn合金层40的部分嵌入到该TiO2层30中。
该若干Cu-Zn合金层40可以磁控溅射的方式形成。所述每一Cu-Zn合金层40的厚度可为200~300nm。在每一Cu-Zn合金层40与相邻的每一TiO2层30的界面处,有部分Cu-Zn合金层40嵌入到TiO2层30中,从而对Cu-Zn合金层40起到固持的作用,并可缓释Cu-Zn金属离子的溶出,使Cu-Zn合金层40具有长效的抗菌效果。
本发明一较佳实施方式的镀膜件100的制备方法,其包括如下步骤:
提供一基材10,该基材10的材质可为钛或钛合金。
对该基材10进行表面预处理。该表面预处理可包括常规的对基材10进行抛光、无水乙醇超声波清洗及烘干等步骤。
对经上述处理后的基材10的表面进行氩气等离子体清洗,以进一步去除基材10表面残留的杂质,以及改善基材10表面与后续镀层的结合力。具体操作及工艺参数为:将基材10放入一磁控溅射镀膜机(图未示)的镀膜室内,将该镀膜室抽真空至3×10~5torr,然后向镀膜室内通入流量为100~300sccm(标准状态毫升/分钟)的氩气(纯度为99.999%),并施加-200~-800V的偏压于基材10,对基材10表面进行氩气等离子体清洗,清洗时间为3~10min。
采用磁控溅射法在经氩气等离子体清洗后的基材10的表面溅镀一打底层20,该打底层20可为一Ti层。溅镀该打底层20在所述磁控溅射镀膜机中进行。使用金属钛靶,所述钛靶采用直流磁控电源。溅镀时,开启钛靶,通入氩气为工作气体,氩气流量可为300~500sccm,对基材施加-50~-150V的偏压,镀膜室的温度可为100~150℃,镀膜时间可为5~8min。该打底层20的厚度可为100~200nm。
继续采用磁控溅射法在所述打底层20的表面溅镀一TiO2层30。使用金属钛靶,所述钛靶采用直流磁控电源。溅镀时,开启钛靶,通入反应气体氧气,氧气流量可为20~40sccm,通入工作气体氩气,氩气流量可为200~350sccm,对基材10施加直流偏压,直流偏压大小可为-50~-150V,基材10的温度可为70~130℃,镀膜时间可为2~3min。该TiO2层30的厚度可为50~100nm。溅镀该TiO2层30采用较低的沉积温度和较低的沉积偏压,可使TiO2层30达到较好的疏松多孔的结构。
继续采用磁控溅射法在所述TiO2层30的表面溅镀一Cu-Zn合金层40。使用铜锌合金靶,所述铜锌合金靶中铜的质量百分含量为80%~90%,所述铜锌合金靶采用射频磁控电源。溅镀时,开启铜锌合金靶,通入工作气体氩气,氩气流量可为20~50sccm,对基材施加耦合脉冲偏压,耦合脉冲偏压大小可为-180~-350V,脉冲频率为10KHz,脉冲宽度为20μs,基材10的温度可为70~130℃,镀膜时间可为2~3min。该Cu-Zn合金层40的厚度可为200~300nm。
参照上述步骤,重复交替溅镀TiO2层30和Cu-Zn合金层40,且最外层为TiO2层30。交替溅镀的次数总共可为5~20次。所述若干TiO2层30和若干Cu-Zn合金层40的总厚度可为1~8μm。
所述镀膜件100在基材10表面交替溅镀TiO2层30和Cu-Zn合金层40,TiO2层30形成为疏松多孔的结构,可使Cu-Zn合金层40的部分嵌入到该TiO2层30中,对Cu-Zn合金层40中Cu-Zn金属离子的快速溶出起到阻碍作用,从而可缓释Cu-Zn金属离子的溶出,使Cu-Zn合金层40具有长效的抗菌效果;同时TiO2层30中的TiO2本身具有抗菌效果,可强化镀膜件100的抗菌效果,相应地延长镀膜件100的使用寿命。
Claims (12)
1.一种镀膜件,其包括基材、形成于基材表面的打底层,该打底层为Ti层,其特征在于:该镀膜件还包括形成于打底层表面的若干TiO2层和若干Cu-Zn合金层,该若干TiO2层和若干Cu-Zn合金层交替排布。
2.如权利要求1所述的镀膜件,其特征在于:所述基材的材质为钛或钛合金。
3.如权利要求1所述的镀膜件,其特征在于:所述打底层以磁控溅射的方式形成,该打底层的厚度为100~200nm。
4.如权利要求1所述的镀膜件,其特征在于:所述若干TiO2层以磁控溅射的方式形成,所述每一TiO2层的厚度为50~100nm。
5.如权利要求1所述的镀膜件,其特征在于:所述若干Cu-Zn合金层以磁控溅射的方式形成,所述每一Cu-Zn合金层的厚度为200~300nm。
6.如权利要求1所述的镀膜件,其特征在于:该镀膜件中与所述打底层直接相结合的是TiO2层,且该镀膜件的最外层为TiO2层。
7.如权利要求1所述的镀膜件,其特征在于:所述若干TiO2层和若干Cu-Zn合金层的总厚度为1~8μm。
8.一种镀膜件的制备方法,其包括如下步骤:
提供一基材;
在该基材的表面形成打底层,该打底层为Ti层;
在该打底层的表面形成TiO2层;
在该TiO2层的表面形成Cu-Zn合金层;
重复交替形成TiO2层和Cu-Zn合金层以形成最外层为TiO2层的镀膜件。
9.如权利要求8所述镀膜件的制备方法,其特征在于:形成所述打底层的步骤采用如下方式实现:采用磁控溅射法,使用金属钛靶,以氩气为工作气体,氩气流量为300~500sccm,对基材施加偏压为-50~-150V,镀膜室的温度为100~150,镀膜时间为5~8min。
10.如权利要求8所述镀膜件的制备方法,其特征在于:形成所述TiO2层的步骤采用如下方式实现:采用磁控溅射法,使用金属钛靶,以氧气为反应气体,氧气流量为20~40sccm,以氩气为工作气体,氩气流量为200~350sccm,对基材施加直流偏压为-50~-150V,镀膜室的温度为70~130℃,镀膜时间为2~3min。
11.如权利要求8所述镀膜件的制备方法,其特征在于:形成所述Cu-Zn合金层的步骤采用如下方式实现:采用磁控溅射法,使用铜锌合金靶,所述铜锌合金靶中铜的质量百分含量为80%~90%,以氩气为工作气体,氩气流量为20~50sccm,对基材施加耦合脉冲偏压为-180~-350V,脉冲频率为10KHz,脉冲宽度为20μs,镀膜室的温度为70~130℃,镀膜时间为2~3min。
12.如权利要求8所述镀膜件的制备方法,其特征在于:所述交替形成TiO2层和Cu-Zn合金层的次数总共为5~20次。
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