CN102881684A - LED (light-emitting diode) packaging structure and method - Google Patents
LED (light-emitting diode) packaging structure and method Download PDFInfo
- Publication number
- CN102881684A CN102881684A CN2012103886566A CN201210388656A CN102881684A CN 102881684 A CN102881684 A CN 102881684A CN 2012103886566 A CN2012103886566 A CN 2012103886566A CN 201210388656 A CN201210388656 A CN 201210388656A CN 102881684 A CN102881684 A CN 102881684A
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- led
- fluid sealant
- pothole
- base plate
- ultraviolet
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- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
- A45D29/00—Manicuring or pedicuring implements
Abstract
The invention discloses an LED (light-emitting diode) packaging structure and a method. Through adopting the irradiating mode of an ultraviolet LED light source, high-purity monochrome ultraviolet is emitted, the energy is highly concentrated on an ultraviolet spectrum section with an effective curing effect, can rapidly cure nail polish within a plurality of seconds and even a shorter time, and has a sterilization effect. As each LED chip is placed into a corresponding concave hole, and meanwhile is packaged on a ceramic base plate integrally, the LED packaging structure has the advantages of each chip in packaging, the intervals among the chips are increased, and the central accumulation of heat is reduced; moreover, the LED packaging structure has the advantages of multi-chip integral packaging. As the invention adopts at least two types of chips with different wave lengths, the types of curable nail polish can be increased, and the problem that the reaction by different ingredients of the nail polish to different wave lengths of ultraviolet is not uniform is solved. The LED packaging structure has the advantages of energy source conservation, high efficiency and long service life.
Description
Technical field
The present invention relates to a kind of LED encapsulation technology, particularly a kind of for solidifying LED encapsulating structure and the method for nail polish
.
Background technology
Along with the raising of people's living standard, manicure has become current a kind of fashion.Refer generally to nail polish after coating, need a period of time could be dry.Traditional method is to use mercury lamp to be cured nail polish, but mercury lamp solidifies that to have energy consumption high, and speed is slow, and solidification effect is not good, and the shortcoming that useful life is short can not meet the demand of modern technologies development.
At present, all adopt the ultraviolet leds device to be cured nail polish both at home and abroad, it makes it carry out rapid draing by the UV-irradiation nail polish, with traditional mercury lamp, compares, the advantage such as ultraviolet leds has environmental protection, energy-conservation, long service life, efficiency is high, wavelength is pure.China Patent No. is 200920305111.8, it is 201020247498.9 with China Patent No. that name is called " solidify the nail polish hand and treat lamp ", the patent that name is called " a kind of LED phototherapy lamp for beautifying nails " is a kind of device that uses ultraviolet leds to be cured nail polish, but the ultraviolet leds that above-mentioned two patents are used adopts single chips encapsulation, its LED chip only contains a kind of wavelength, therefore can only use the ultraviolet light of single wavelength to be irradiated, and the ultraviolet light of single wavelength can only cured portion nail polish, and to other nail inoperative.Can't solve the problem that the heterogeneity in nail polish is had various reactions and caused the different wave length of ultraviolet light.
Summary of the invention
Technical problem to be solved by this invention is, be for top described defect, provide a kind of for solidifying the multi-chip ultraviolet leds packaging system of nail polish, solve the problem that the heterogeneity in nail polish is had various reactions and caused the different wave length of ultraviolet light, and a kind of LED method for packing is provided.
The objective of the invention is to be achieved by the following technical programs, a kind of LED encapsulating structure, it is characterized in that: it comprises:
One base plate, this base plate is divided into by it pothole that at least two unique spacer are opened by separating part;
At least two UV LED chips are placed on respectively in the pothole faced mutually, and the wavelength that the ultraviolet-ray diode chip sends is all lower than 410nm, and at least differ 10nm between wavelength, and the wavelength shorter one is the first wavelength, than the elder, is second wave length;
Light-emitting diode chip for backlight unit in pothole is fixed by fluid sealant.
The material of described base plate is pottery.
The cross sectional shape of described separating part is inverted trapezoidal or square or arc or triangle or polygon.
On described base plate, the shape of set pothole is identical and position is symmetrical.
The ultraviolet-ray diode chip fluid sealant of described the first wavelength is the first fluid sealant, and the ultraviolet-ray diode chip fluid sealant of second wave length is the second fluid sealant, and the first fluid sealant and the second fluid sealant are silica gel.
The relative index of refraction scope of described the first fluid sealant is 1.3-1.4.
The relative index of refraction scope of described the second fluid sealant is 1.4-1.5.
Be connected in series or be connected in parallel between UV LED chips in described pothole.
A kind of LED method for packing is characterized in that: comprise the following steps:
1) complete the shaping processing of base plate;
2) oxidation processes is carried out in the front of base plate;
3) carry out the welding of LED chip, routing on the base plate of the step 2 completed;
4) adopt the automatic moulding technology, pour into fluid sealant in pothole.
Described perfusion fluid sealant, be perfusion the first fluid sealant or the second fluid sealant in the first pothole, corresponding perfusion the second fluid sealant or the first fluid sealant in the second pothole.
The invention has the beneficial effects as follows: the present invention adopts the radiation modality of ultraviolet leds light source, what send is high-purity monochromatic ultraviolet light, its energy height concentrates on the ultraviolet light spectral coverage with effective solidification, can be within tens seconds even shorter time the rapid curing nail polish, and there is bactericidal action.Because every LEDs chip is all to be placed in corresponding pothole, collective is encapsulated on ceramic substrate again simultaneously, and the advantage while having had single chips encapsulation, increased the interval between chip, reduced the concentrated accumulation of heat, increased light-emitting area simultaneously; And there is the multi-chip integration packaging simultaneously.The LED of the chip package of two kinds of different wave lengths of employing can increase the kind of curable nail polish, can solve the problem that reactions vary of the heterogeneity of nail polish to the ultraviolet light different wave length.Have advantages of that energy savings, efficiency are high, long service life.
The accompanying drawing explanation
The overall structure schematic diagram that Fig. 1 is light-emitting diode of the present invention (LED) packaging system.
The A-A that Fig. 2 is Fig. 1 is to cutaway view.
The structural representation that Fig. 3, Fig. 4, Fig. 5 are three kinds of different cross section shapes of separating part in the embodiment of the present invention.
The connected in electrical series connection diagram that Fig. 6 is light-emitting diode in the embodiment of the present invention (LED) packaging system.
Fig. 7 is the corresponding circuit theory diagrams of Fig. 6.
The electric schematic diagram that is connected in parallel that Fig. 8 is light-emitting diode in the embodiment of the present invention (LED) packaging system.
Fig. 9 is the corresponding circuit theory diagrams of Fig. 8.
Reference numeral: 11, LED encapsulating structure, 12, base plate, 13A, the first wavelength, 13B, second wave length, 14, separating part, 15A, the first pothole, 15B, the second pothole, 16A, the first LED chip, 16B, the second LED chip, the 21, first fluid sealant, 21 ', the second fluid sealant, 22, the first electric connecting point, the 23, second electric connecting point, 24, total electric connecting point.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described further.Referring to Fig. 1 to Fig. 9, a kind of LED encapsulating structure 11, it is characterized in that: it comprises:
One base plate 12, this base plate 12 is divided into by it pothole that at least two unique spacer are opened by separating part 14;
At least two UV LED chips are placed on respectively in the pothole faced mutually, and the wavelength that the ultraviolet-ray diode chip sends is all lower than 410nm, and at least differ 10nm between wavelength, and the wavelength shorter one is the first wavelength 13A, than the elder, is second wave length 13B.
The material of described base plate 12 is pottery.
The cross sectional shape of described separating part 14 is inverted trapezoidal or square or arc or triangle or polygon.
On described base plate 12, the shape of set pothole is identical and position is symmetrical.
The ultraviolet-ray diode chip fluid sealant of described the first wavelength 13A is the first fluid sealant 21, the ultraviolet-ray diode chip fluid sealant of second wave length 13B be the second fluid sealant 21 ', the first fluid sealant 21 and the second fluid sealant 21 ' be silica gel.
The relative index of refraction scope of described the first fluid sealant 21 is 1.3-1.4.
Described the second fluid sealant 21 ' the relative index of refraction scope be 1.4-1.5.
Be connected in series or be connected in parallel between LED chip in described pothole.
A kind of LED method for packing is characterized in that: comprise the following steps:
1) complete the shaping processing of base plate 12;
2) oxidation processes is carried out in the front of base plate 12;
3) carry out the welding of LED chip, routing on the base plate 12 of the step 2 completed;
4) adopt the automatic moulding technology, pour into fluid sealant in pothole.
Described perfusion fluid sealant, be perfusion the first fluid sealant 21 or the second fluid sealant 21 in the first pothole 15A ', corresponding perfusion the second fluid sealant 21 in the second pothole 15B ' or the first fluid sealant 21.
embodiment:a kind of LED encapsulating structure 11, the LED chip that comprises two kinds of different wave lengths: the first LED chip 16A and the second LED chip 16B, a base plate for LED chip 12, by a separating part 14, it is divided into to the first pothole 15A and the second pothole 15B that two unique spacer are opened, the cross sectional shape of separating part 14 is arc, as Fig. 5.Each LED chip is placed on the bottom of pothole, places first a LED chip 16A in the first pothole 15A, and the second pothole 15B places second a LED chip 16B.The first fluid sealant 21 adopts silica gel to be injected in the first pothole 15A for sealing the first LED chip 16A; The second fluid sealant 21 ＇ adopt silica gel to be injected in pothole 15B for sealing the second LED chip 16B.The first fluid sealant 21 and the second fluid sealant 21 ＇ are isolated from each other and come by separating part 14.Because ultraviolet light can produce and destroy and embrittlement for silica gel, the ultraviolet light-emitting diode of different wave length (LED) chip has corresponding silica gel refractive index.If the first wavelength 13A wavelength that the first LED chip 16A sends is shorter than the second wave length 13B that the second LED chip 16B sends, the relative index of refraction of the first fluid sealant 21 is greater than the relative index of refraction of the second fluid sealant 21 ＇.
The structural representation of the cross sectional shape that Fig. 3-Fig. 5 is separating part 14.In order to make the different LED chip reach better light mixing effect, the cross sectional shape of separating part 14 can be inverted trapezoidal (as Fig. 3) or square (as Fig. 4) or arc (as Fig. 5) or triangle or polygon.
Fig. 6 and Fig. 8 are two kinds of different electrical connection schematic diagrames in the LED encapsulating structure.Fig. 7 is the circuit diagram corresponding with Fig. 6 and Fig. 8 with Fig. 9.In Fig. 6, the LED chip of two different wave lengths is connected in series, in the first pothole 15A and the second pothole 15B, the N utmost point of the first electric connecting point 22 and LED chip 16A is connected, the second electric connecting point 23 extremely is connected with the P of LED chip 16B, negative electrode or the anode of total electric connecting point 24 and external power supply are connected, and different electric connecting points connect by metal wire.In Fig. 7, the LED chip of two different wave lengths is connected in parallel, in the first pothole 15A and the second pothole 15B, the N utmost point of the first electric connecting point 22 and LED chip 16A is connected, the second electric connecting point 23 extremely is connected with the P of LED chip 16B, the positive pole of total electric connecting point 24 extremely is connected with the P of LED chip 16A by the second electric connecting point 23, the negative pole of total electric connecting point 24 is connected by the N utmost point of the first electric connecting point 22 and LED chip 16A, and the LED chip of two different wave lengths is connected in parallel.Simultaneously total electric connecting point 24 also is connected with negative electrode or the anode of external power supply.
The relative index of refraction scope of the first fluid sealant 21 is 1.3～1.4.
The second fluid sealant 21 ' the relative index of refraction scope be 1.4～1.5.
A kind of LED method for packing comprises the following steps:
1) complete the shaping processing of base plate 12, comprise the shaping of pothole, improved the chip sides light emission rate.
2) oxidation processes is carried out in the front of base plate 12, long-lasting with the reflection that keeps reflecting interface.
3) carry out the welding of a plurality of LED chips, routing on the base plate 12 of the step 2 completed.
4) adopt the automatic moulding technology, utilize accurate semiconductor dies to pour into fluid sealant on each LED chip, play a protective role, play again lensing.
What more than enumerate is only a specific embodiment of the present invention.Obviously, the invention is not restricted to above embodiment, many shapes that similarly change can also be arranged.All distortion that those of ordinary skill in the art can directly derive or associate from content disclosed by the invention, all should think invention which is intended to be protected.
Claims (10)
1. a LED encapsulating structure, it is characterized in that: it comprises:
One base plate, this base plate is divided into by it pothole that at least two unique spacer are opened by separating part;
At least two UV LED chips are placed on respectively in the pothole faced mutually, the wavelength that two ultraviolet-ray diode chips send is all lower than 410nm, and at least differ 10nm between two wavelength, the wavelength shorter one is the first wavelength, than the elder, is second wave length;
Light-emitting diode chip for backlight unit in pothole is fixed by fluid sealant.
2. LED encapsulating structure according to claim 1 is characterized in that: the material of described base plate is pottery.
3. LED encapsulating structure according to claim 1, it is characterized in that: the cross sectional shape of described separating part is polygon or arc or triangle or trapezoidal.
4. LED encapsulating structure according to claim 1 is characterized in that: on described base plate, the shape of set pothole is identical and position is symmetrical.
5. LED encapsulating structure according to claim 1, it is characterized in that: the ultraviolet-ray diode chip fluid sealant of described the first wavelength is the first fluid sealant, the ultraviolet-ray diode chip fluid sealant of second wave length is the second fluid sealant, and first and second fluid sealant is silica gel.
6. LED encapsulating structure according to claim 5, it is characterized in that: the relative index of refraction scope of described the first fluid sealant is 1.3-1.4.
7. LED encapsulating structure according to claim 5, it is characterized in that: the relative index of refraction scope of described the second fluid sealant is 1.4-1.5.
8. a kind of LED encapsulating structure according to claim 1, is characterized in that: between the UV LED chips in described pothole, be connected in series or be connected in parallel.
9. the method that a kind of LED as claimed in claim 1 encapsulates is characterized in that: comprise the following steps:
1) complete the shaping processing of base plate;
2) oxidation processes is carried out in the front of base plate;
3) carry out the welding of LED chip, routing on the base plate of the step 2 completed;
4) adopt the automatic moulding technology, pour into fluid sealant in pothole.
10. the method that a kind of LED according to claim 9 encapsulates is characterized in that: described perfusion fluid sealant is perfusion the first fluid sealant or the second fluid sealant in the first pothole, corresponding perfusion the second fluid sealant or the first fluid sealant in the second pothole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012103886566A CN102881684A (en) | 2012-10-15 | 2012-10-15 | LED (light-emitting diode) packaging structure and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103886566A CN102881684A (en) | 2012-10-15 | 2012-10-15 | LED (light-emitting diode) packaging structure and method |
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| CN102881684A true CN102881684A (en) | 2013-01-16 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870112A (en) * | 2016-04-30 | 2016-08-17 | 浙江单色电子科技有限公司 | Mixed wavelength violet LED and manufacturing method thereof |
| CN109856860A (en) * | 2019-03-29 | 2019-06-07 | 深圳创维－Rgb电子有限公司 | A kind of liquid crystal display die set and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2867596Y (en) * | 2005-11-02 | 2007-02-07 | 李洲科技股份有限公司 | Modified luminous diode modular structure |
| US20090108271A1 (en) * | 2007-10-31 | 2009-04-30 | Wei-Jen Chou | Light emitting diode package |
| CN101599442A (en) * | 2008-06-04 | 2009-12-09 | 富准精密工业(深圳)有限公司 | Manufacturing method for LED |
| CN202839607U (en) * | 2012-10-15 | 2013-03-27 | 南昌绿扬光电科技有限公司 | Light-emitting diode (LED) packaging structure |
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2012
- 2012-10-15 CN CN2012103886566A patent/CN102881684A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2867596Y (en) * | 2005-11-02 | 2007-02-07 | 李洲科技股份有限公司 | Modified luminous diode modular structure |
| US20090108271A1 (en) * | 2007-10-31 | 2009-04-30 | Wei-Jen Chou | Light emitting diode package |
| CN101599442A (en) * | 2008-06-04 | 2009-12-09 | 富准精密工业(深圳)有限公司 | Manufacturing method for LED |
| CN202839607U (en) * | 2012-10-15 | 2013-03-27 | 南昌绿扬光电科技有限公司 | Light-emitting diode (LED) packaging structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870112A (en) * | 2016-04-30 | 2016-08-17 | 浙江单色电子科技有限公司 | Mixed wavelength violet LED and manufacturing method thereof |
| CN109856860A (en) * | 2019-03-29 | 2019-06-07 | 深圳创维－Rgb电子有限公司 | A kind of liquid crystal display die set and display device |
| CN109856860B (en) * | 2019-03-29 | 2022-04-19 | 深圳创维－Rgb电子有限公司 | Liquid crystal display module and display device |
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Application publication date: 20130116 |