CN105870112A - Mixed wavelength violet LED and manufacturing method thereof - Google Patents
Mixed wavelength violet LED and manufacturing method thereof Download PDFInfo
- Publication number
- CN105870112A CN105870112A CN201610293878.8A CN201610293878A CN105870112A CN 105870112 A CN105870112 A CN 105870112A CN 201610293878 A CN201610293878 A CN 201610293878A CN 105870112 A CN105870112 A CN 105870112A
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- glue
- groove
- purple light
- substrate
- purple
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses a mixed wavelength violet LED and a manufacturing method thereof. The LED comprises a substrate. A groove is formed in the center of the substrate. Two violet chips which are arranged side by side are fixed to the bottom wall face of the groove through die bond glue and connected in parallel through a gold bonding wire to form a loop. After the two violet chips are fixed, the groove is filled with the inner glue till the whole groove is full of the inner glue, and outer glue which is semispherical after being solidified is packaged outside the groove. The violet chip with middle power of 365 nm and the violet chip with middle power of 405 nm are put in one packaging body, so the two light sources form a mixed wave combination; by adding fluorescent powder to the inner glue, mixed waves are more uniform; due to a convex-top lens formed by the outer glue, the excitation of mixed wave power can be enhanced; this, due to dual-wavelength ultraviolet emitted by the mixed wavelength violet LED, polymer glue chain reaction can happen to UV phototherapy glue more easily.
Description
Technical field
The present invention relates to LED light source technical field, more specifically a kind of mixed wavelengths purple LED and
Manufacture method.
Background technology
At present, in high-end manicure field of phototherapy, using more is UV mercury lamp and matching used UV light
Treat glue.The ultraviolet spectra that UV mercury lamp sends is the continuous crest with 365nm as main peak, and it is general for UV phototherapy glue
Light trigger containing dual wavelength.The purple LED of single wavelength can not make UV phototherapy glue generation macromolecule glue chain
Reaction (manicure light is solid), and the UV mercury lamp life-span is short, and power consumption is big, transport inconvenience, particularly can be to environment
Pollute.
Summary of the invention
It is an object of the invention to overcome prior art disadvantages described above, it is provided that a kind of life-span length, power consumption are little, fortune
Defeated facility, the mixed wavelengths purple LED of energy-conserving and environment-protective and manufacture method thereof.
In order to reach object above, the present invention is achieved by the following technical solutions: a kind of mixed wavelengths is purple
Light LED, including a substrate, it is characterised in that described substrate be provided centrally with a groove, described groove
Being fixed with two purple light chips being arranged side by side by crystal-bonding adhesive on wall surface, the height of described crystal-bonding adhesive is every
The 1/3～1/2 of described purple light chip height, two described purple light chips are formed back by bonding gold wire parallel connection
Road, after fixing two described purple light chips, glue in filling in described groove, described interior glue is full of whole
Groove, described groove covering is equipped with outer glue hemispherical after a solidification.
As preferably, in two described purple light chips, a 20mil using peak wavelength to be 365nm hangs down
Straight chip, another is the 20mil vertical chip of peak wavelength 405nm.
As preferably, crystal-bonding adhesive is the elargol being stirred manufacture by silver powder and organic gel, wherein silver powder 10 weight portion,
Organic gel 10 weight portion；Interior glue is silica gel and white fluorescence powder mixture, wherein silica gel 50 weight portion, in vain
Emitting phosphor 1 weight portion, the particle diameter of white emitting fluorescent powder is 7～15 μm；Outer glue is silica gel.
The manufacture method of a kind of mixed wavelengths purple LED, it is characterised in that comprise the following steps:
(1) by the most arranged apart in the groove of substrate center for two purple light chips, then crystal-bonding adhesive is put
Carrying out die bond operation in bonder, fix two purple light chips simultaneously, the height of crystal-bonding adhesive is purple light core
The 1/3～1/2 of sheet height；
(2) being put in baking box by the substrate fixing two purple light chips and toast, baking temperature is
170 DEG C, the time is 120 minutes；
(3) substrate fixing two purple light chips is placed on bonding equipment carries out bonding wire operation, by two purples
Optical chip forms loop by bonding gold wire parallel connection；
(4) by silica gel and white emitting fluorescent powder silica gel 50 weight portion in proportion, white emitting fluorescent powder 1 weight portion falls
Enter in container, stir 15～30 minutes so that it is be sufficiently mixed uniformly, make interior glue；
(5) deployed interior glue is placed on point gum machine carries out a glue operation, the full whole substrate of interior glue point recessed
Groove；
(6) being put in baking box by the substrate after encapsulating and toast, baking is divided into two stages, first stage
Baking temperature is 100 DEG C, and the time is 60 minutes, makes the reaction suppressor in interior glue volatilize, and second stage is dried
Roasting temperature is 150 DEG C, and the time is 120 minutes, makes interior adhesive curing；
(7) outer glue is placed in moulding press carries out molding operation, form hemispheric convex top lens.
Beneficial effect: the present invention 365nm purple light chip by middle power and the 405nm purple light chip of middle power
Share and be placed in a packaging body, so that two light sources form smear combination, by adding in interior glue
Fluorescent material make smear more uniform, finally smear power can be made to strengthen from the convex top lens that outer glue is formed and swash
Sending out, so far, the dual wavelength ultraviolet luminous energy that it contains makes UV phototherapy glue generation macromolecule glue chain reaction more easily.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the structural representation of A-A in Fig. 1.
In figure: 1-substrate, 2-crystal-bonding adhesive, 3-purple light chip, 4-bonding gold wire, glue in 5-, the outer glue of 6-.
Detailed description of the invention
Understand with reaching purpose and being readily apparent to make the technological means of the present invention, creation characteristic, below in conjunction with
Specific embodiment is expanded on further the present invention.
Embodiment: as depicted in figs. 1 and 2, a kind of mixed wavelengths purple LED, including a substrate 1, substrate
1 be provided centrally with a groove, the wall surface of groove is fixed with two purples being arranged side by side by crystal-bonding adhesive 2
Optical chip 3, the height of crystal-bonding adhesive 2 is the 1/3～1/2 of every purple light chip 3 height, two purple light chips 3
Loop is formed by bonding gold wire 4 is in parallel, after fixing two purple light chips 3, glue 5 in filling in a groove,
Interior glue 5 is full of whole groove, and groove covering is equipped with outer glue 6 hemispherical after a solidification.
In two purple light chips, a 20mil vertical chip using peak wavelength to be 365nm, another
20mil vertical chip for peak wavelength 405nm.
Crystal-bonding adhesive 2 is to be stirred the elargol manufactured, wherein silver powder 10 weight portion, organic gel by silver powder and organic gel
10 weight portions；Interior glue 5 is silica gel and white fluorescence powder mixture, wherein silica gel 50 weight portion, white fluorescence
Powder 1 weight portion, the particle diameter of white emitting fluorescent powder is 7～15 μm；Outer glue 6 is silica gel.
The manufacture method of a kind of mixed wavelengths purple LED, comprises the following steps:
(1) by the most arranged apart in the groove of substrate center for two purple light chips, then crystal-bonding adhesive is put
Carrying out die bond operation in bonder, fix two purple light chips simultaneously, the height of crystal-bonding adhesive is purple light core
The 1/3～1/2 of sheet height；
(2) being put in baking box by the substrate fixing two purple light chips and toast, baking temperature is
170 DEG C, the time is 120 minutes；
(3) substrate fixing two purple light chips is placed on bonding equipment carries out bonding wire operation, by two purples
Optical chip forms loop by bonding gold wire parallel connection；
(4) by silica gel and white emitting fluorescent powder silica gel 50 weight portion in proportion, white emitting fluorescent powder 1 weight portion falls
Enter in container, stir 15～30 minutes so that it is be sufficiently mixed uniformly, make interior glue；
(5) deployed interior glue is placed on point gum machine carries out a glue operation, the full whole substrate of interior glue point recessed
Groove；
(6) being put in baking box by the substrate after encapsulating and toast, baking is divided into two stages, first stage
Baking temperature is 100 DEG C, and the time is 60 minutes, makes the reaction suppressor in interior glue volatilize, and second stage is dried
Roasting temperature is 150 DEG C, and the time is 120 minutes, makes interior adhesive curing；
(7) outer glue is placed in moulding press carries out molding operation, form hemispheric convex top lens.
Use: the 365nm purple light chip of middle power and the 405nm purple light chip of middle power are shared by the present invention
It is placed in a packaging body, so that two light sources form smear combination, glimmering by add in interior glue
Light powder makes smear more uniform, finally smear power can be made to strengthen from the convex top lens that outer glue is formed and excite,
So far, the dual wavelength ultraviolet luminous energy that it contains makes UV phototherapy glue generation macromolecule glue chain reaction more easily.
Claims (4)
1. a mixed wavelengths purple LED, including a substrate, it is characterised in that the center of described substrate sets
It is equipped with a groove, the wall surface of described groove is fixed with two purple light chips being arranged side by side by crystal-bonding adhesive,
The height of described crystal-bonding adhesive is the 1/3～1/2 of every described purple light chip height, and two described purple light chips pass through
Bonding gold wire parallel connection forms loop, after fixing two described purple light chips, and glue in filling in described groove,
Described interior glue is full of whole groove, and described groove covering is equipped with outer glue hemispherical after a solidification.
The manufacture method of mixed wavelengths purple LED the most according to claim 1, it is characterised in that two
In described purple light chip, a 20mil vertical chip using peak wavelength to be 365nm, another is peak
The 20mil vertical chip of value wavelength 405nm.
The manufacture method of mixed wavelengths purple LED the most according to claim 1 or claim 2, it is characterised in that
Crystal-bonding adhesive is to be stirred the elargol manufactured, wherein silver powder 10 weight portion, organic gel 10 weight by silver powder and organic gel
Amount part；Interior glue is silica gel and white fluorescence powder mixture, wherein silica gel 50 weight portion, white emitting fluorescent powder 1 weight
Amount part, the particle diameter of white emitting fluorescent powder is 7～15 μm；Outer glue is silica gel.
4., according to the manufacture method of mixed wavelengths purple LED described in claims 1 to 3 any one, it is special
Levy and be, comprise the following steps:
(1) by the most arranged apart in the groove of substrate center for two purple light chips, then crystal-bonding adhesive is put
Carrying out die bond operation in bonder, fix two purple light chips simultaneously, the height of crystal-bonding adhesive is purple light core
The 1/3～1/2 of sheet height；
(2) being put in baking box by the substrate fixing two purple light chips and toast, baking temperature is
170 DEG C, the time is 120 minutes；
(3) substrate fixing two purple light chips is placed on bonding equipment carries out bonding wire operation, by two purples
Optical chip forms loop by bonding gold wire parallel connection；
(4) by silica gel and white emitting fluorescent powder silica gel 50 weight portion in proportion, white emitting fluorescent powder 1 weight portion falls
Enter in container, stir 15～30 minutes so that it is be sufficiently mixed uniformly, make interior glue；
(5) deployed interior glue is placed on point gum machine carries out a glue operation, the full whole substrate of interior glue point recessed
Groove；
(6) being put in baking box by the substrate after encapsulating and toast, baking is divided into two stages, first stage
Baking temperature is 100 DEG C, and the time is 60 minutes, makes the reaction suppressor in interior glue volatilize, and second stage is dried
Roasting temperature is 150 DEG C, and the time is 120 minutes, makes interior adhesive curing；
(7) outer glue is placed in moulding press carries out molding operation, form hemispheric convex top lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610293878.8A CN105870112A (en) | 2016-04-30 | 2016-04-30 | Mixed wavelength violet LED and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610293878.8A CN105870112A (en) | 2016-04-30 | 2016-04-30 | Mixed wavelength violet LED and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105870112A true CN105870112A (en) | 2016-08-17 |
Family
ID=56631068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610293878.8A Pending CN105870112A (en) | 2016-04-30 | 2016-04-30 | Mixed wavelength violet LED and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN105870112A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571419A (en) * | 2016-11-07 | 2017-04-19 | 深圳市源磊科技有限公司 | Method for manufacturing flashlight |
| CN106997879A (en) * | 2017-03-21 | 2017-08-01 | 江苏稳润光电有限公司 | A kind of adjustable ultraviolet leds and preparation method |
| CN107195760A (en) * | 2017-04-26 | 2017-09-22 | 安徽欧瑞特照明有限公司 | A kind of LED packaging technologies |
| CN107277941A (en) * | 2017-06-16 | 2017-10-20 | 中山市光圣半导体科技有限责任公司 | A kind of manicure light source |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN109411587A (en) * | 2018-12-10 | 2019-03-01 | 邱凡 | A kind of purple LED production method and its purple LED containing silica-gel lens |
| CN109856860A (en) * | 2019-03-29 | 2019-06-07 | 深圳创维－Rgb电子有限公司 | A kind of liquid crystal display die set and display device |
| CN110808244A (en) * | 2019-10-29 | 2020-02-18 | 长春希龙显示技术有限公司 | LED display unit surface packaging method based on modeling technology |
| CN111883631A (en) * | 2020-08-21 | 2020-11-03 | 连云港光鼎电子有限公司 | Preparation method of UVC-LED light-emitting device |
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| CN102881684A (en) * | 2012-10-15 | 2013-01-16 | 南昌绿扬光电科技有限公司 | LED (light-emitting diode) packaging structure and method |
| CN103579460A (en) * | 2013-11-11 | 2014-02-12 | 中山市晶得光电有限公司 | High-brightness white light LED and manufacturing method thereof |
| CN205564742U (en) * | 2016-04-30 | 2016-09-07 | 浙江单色电子科技有限公司 | Mix wavelength purple light LED |
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| WO2009157999A1 (en) * | 2008-06-25 | 2009-12-30 | Cree, Inc. | Solid state lighting devices including light mixtures |
| CN102290411A (en) * | 2011-07-16 | 2011-12-21 | 珠海市万州光电科技有限公司 | Light interference resistant infrared receiving module and manufacture method thereof |
| CN102881684A (en) * | 2012-10-15 | 2013-01-16 | 南昌绿扬光电科技有限公司 | LED (light-emitting diode) packaging structure and method |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571419A (en) * | 2016-11-07 | 2017-04-19 | 深圳市源磊科技有限公司 | Method for manufacturing flashlight |
| CN106571419B (en) * | 2016-11-07 | 2019-04-30 | 深圳市源磊科技有限公司 | A kind of production method of flash lamp |
| CN106997879A (en) * | 2017-03-21 | 2017-08-01 | 江苏稳润光电有限公司 | A kind of adjustable ultraviolet leds and preparation method |
| CN107195760A (en) * | 2017-04-26 | 2017-09-22 | 安徽欧瑞特照明有限公司 | A kind of LED packaging technologies |
| CN107277941A (en) * | 2017-06-16 | 2017-10-20 | 中山市光圣半导体科技有限责任公司 | A kind of manicure light source |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN109411587A (en) * | 2018-12-10 | 2019-03-01 | 邱凡 | A kind of purple LED production method and its purple LED containing silica-gel lens |
| CN109411587B (en) * | 2018-12-10 | 2020-11-27 | 浙江单色电子科技有限公司 | Production method of purple light LED containing silica gel lens and purple light LED |
| CN109856860A (en) * | 2019-03-29 | 2019-06-07 | 深圳创维－Rgb电子有限公司 | A kind of liquid crystal display die set and display device |
| CN109856860B (en) * | 2019-03-29 | 2022-04-19 | 深圳创维－Rgb电子有限公司 | Liquid crystal display module and display device |
| CN110808244A (en) * | 2019-10-29 | 2020-02-18 | 长春希龙显示技术有限公司 | LED display unit surface packaging method based on modeling technology |
| CN111883631A (en) * | 2020-08-21 | 2020-11-03 | 连云港光鼎电子有限公司 | Preparation method of UVC-LED light-emitting device |
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Application publication date: 20160817 |
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