CN102873645B - One cuts sheet - Google Patents
One cuts sheet Download PDFInfo
- Publication number
- CN102873645B CN102873645B CN201210376005.5A CN201210376005A CN102873645B CN 102873645 B CN102873645 B CN 102873645B CN 201210376005 A CN201210376005 A CN 201210376005A CN 102873645 B CN102873645 B CN 102873645B
- Authority
- CN
- China
- Prior art keywords
- plane
- polishing
- cutting
- card
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
One cuts sheet, and matrix is cross section is the card of U shape, and the two ends of U shape are for cutting face, the face of cutting comprises polishing plane and cutting inclined-plane, polishing plane fixes polishing material with cutting on inclined-plane, card outer end edges is gathered to polish and expected, polishing plane place is according to a bunch some ring-type arrangement; Every cluster point shape is circular, area 2.5��4mm2, gather in bunch some diamond, adjacent Liang Cu dot center spacing 8��15mm, adjacent two circumferential spaces 6��10mm, form bevel angle �� between cutting inclined-plane and polishing plane, and the scope of �� is 15 to 25 ��, the outer end on cutting inclined-plane is for falling fillet, and the radius of fillet is the half cutting sheet thickness. Provided by the invention cutting sheet, it is possible to be applicable to the preparation of the superhard instrument of soldering preferably, diamond polishing material arrangement profile is attractive in appearance, and efficiency height is cost-saving, and polishing object is had excellent adaptability, can realize cutting and polishing simultaneously.
Description
Technical field
The present invention relates to diamond tool technical field, particularly relate to one and cut sheet.
Background technology
The industry development of China's shipbuilding in recent years is rapid, and in shipbuilding flow process, wherein a crucial job is by smooth, clean for the welding surface cleaning of whole hull. Owing to whole hull is mainly welded together through special by High Strength Structural Steel, weld seam is many, weld seam length, solder joint are close and is difficult to polish and becomes a difficult point of hull manufacture processing.
Conventional polishing trimming at present is that the polishing work hand operated grinding wheel machine having installed resin grinding wheels carries out hand sand with the method for weldering scar. Resin grinding wheels belongs to resinoid bond and makes. and take resin as matrix material, it is blended into bonding agent taking metal-powder, metal oxide, conventional abrasive material as weighting material. Abrasive material and bonding agent are mixed and made into molding mass according to the requirement of concentration, make goods base substrate through hot pressing institute type, solidification, through following process finished product. Hull resin grinding wheels used of polishing utilizes the principle of resin solidification that the super hard abrasives such as silicon carbide are consolidated into plate-like to be made. It obtains a large amount of application in hull industry of polishing, but finds through prolonged application and research, and resin grinding wheels in use exists bigger shortcoming, and these shortcomings exactly preparation principle and feature with resin grinding wheels is inseparable. Its shortcoming is as follows: 1, resin grinding wheels poor water resistance, alkali resistance are poor, and preservation period is short. 2, at the bottom of bonding strength, abrasive material consumption is fast. 3, bruting process spark is big, and smell is big, and dust is big, and environment has bigger harm. 4, grinding efficiency is low.
Summary of the invention
For above-mentioned defect and the problem of prior art, it is an object of the invention to provide a kind of grinding efficiency height, life-span length, pollution-free cut sheet.
In order to achieve the above object, the present invention provides following technical scheme: one cuts sheet, comprise matrix, matrix is cross section is the card of U shape, the two ends of card U shape are for cutting face, the face of cutting comprises polishing plane and cutting inclined-plane, the edge tilt of polishing plane forms cutting inclined-plane, described polishing plane and fixing polishing material on cutting inclined-plane, the U shape bottom of card is fixed orifices, and polishing expects that distributing mode arrangement is distinguished in employing, and card outer end edges is evenly gathered to polish and expected, polishing plane place is according to a bunch some ring-type arrangement, does not arrange to polish and expect in other position; Every cluster point shape of described polishing material is circular, area 2.5��4mm2Gather in bunch some diamond, adjacent Liang Cu dot center spacing 8��15mm, adjacent two circumferential spaces 6��10mm, the edge of described polishing plane forms cutting inclined-plane by the mode tilted downwards, forms bevel angle �� between described cutting inclined-plane and polishing plane, and the scope of �� is 15 to 25 ��, the outer end on described cutting inclined-plane for falling fillet, described fall fillet radius be described in cut the half of sheet thickness.
Preferably, described matrix card is circular.
Preferably, described polishing material is diamond.
One provided by the invention cuts sheet, matrix contour structures is simple, is easy to processing, it is possible to be applicable to the preparation of the superhard instrument of soldering preferably, designed diamond polishing material arrangement profile is attractive in appearance, efficiency height, cost-saving, and polishing object is had excellent adaptability, play grinding efficiency height, the polishing life-span is long, the final utilization effect that feel is light, obtains good application in metal polishing field.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, it is briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 present configuration schematic diagram;
Cloth arrangement schematic diagram distinguished by Fig. 2 matrix card polishing material;
The schematic diagram of the sander that Fig. 3 is connected with present configuration.
Embodiment
Below in conjunction with the accompanying drawing of the present invention, the technical scheme of the present invention is clearly and completely described, it is clear that described embodiment is only the present invention's part embodiment, instead of whole embodiments. Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
One of the present invention cuts sheet, matrix cross sections is the card of U shape, and the two ends of card U shape are respectively to extending into the face of being polished flat outward, and the edge tilt of polishing plane forms cutting inclined-plane, described polishing plane and fixing polishing material on cutting inclined-plane, the U shape bottom of card is fixed orifices.
Below by embodiment, above content being specifically described, the soldering that embodiment is a polishing hull surface rust mark and solder joint cuts sheet, matrix external diameter 100mm, selects scorching 65Mn steel board of not quenching, thickness 1.1mm, the matrix external diameter r of falling fillet is 0.5, cut face width degree 6mm, bevel angle �� is 15 degree, whole height 12mm, more owing to being polished position plane, polishing intensity is lower, it is 13 15mm that polishing plane width is selected, bottom polishing plane and U shape, the punching press bevel edge r of falling fillet between recessed plane is 4mm, cut after sheet carries out punching press by press tool, matrix after punching press is carried out chamfering, then deoil, the surface treatments such as sandblasting, sheet can be cut as soldering to use, polishing material is selected granularity 35 height of eye grade to cut and is spilt cutting the even cloth in sheet outer end with diamond, polishing plane place arranges according to circular cluster point. bunch some diameter 3mm, same circumference adjacent cluster dot center spacing 10mm. adjacent circumferential spacing 6mm, enters stove carry out soldering by adding solder on the matrix of the polishing material arranged, be fixed on matrix by polishing material.
According to Fig. 1, described in cut the card that sheet cross section is U shape, matrix card is circular, and the U shape bottom of card is fixed orifices 1, described in cut sheet diameter range between 80mm��230mm, it is preferable that diameter be 100mm.
The described height cutting sheet is at least not less than human body palm thickness, and matrix height is greater than 10mm.
The described height cutting sheet is determined by the rotational inertia of abrasive disc and the requirement reducing vibration, and concrete theory is: the system one being had to multiple particle, and its rotational inertia can be calculated by lower formula 1.
In formula formula 1, mi is the quality of single particle, and ri is the distance of single particle apart from central shaft, and I represents its rotational inertia.
If this system is made up of rigid body, it is possible to the rotational inertia of unlimited particle and, namely with its rotational inertia of integral and calculating, such as formula 2, owing to abrasive disc can regard continuous particle body as, therefore, it is possible to carry out integration by formula 2 and seek its rotational inertia.
Iz=�� r2Dm=�� �� r2DV formula 2
In formula 2, Iz is rotational inertia, and r is the distance of particle apart from central shaft.
Can learning by formula 2, when card external diameter is constant, card height is more high, then overall volume is more big, then rotational inertia is more big, then the probability of sharpening machine vibration when adding polishing and amplitude. Then the height of mill is more low more good, but also to be considered human engineering factor, when using hand operated grinding wheel machine to polish, operator hold sharpening machine handle, its hand needs certain terrain clearance, if Grinding wheel disc mill is for being disk shape, then during handle, hand easily contacts polishing surface, easily cause unnecessary injury, and hand-held posture is unfavorable for long-term operation. Therefore in conjunction with hand operated grinding wheel machine, described in cut sheet height should at least be not less than human body palm thickness, i.e. h > 10mm.
Described body material is selected high strength and is had certain elastic steel, to meet at follow-up matrix in soldering processes, through high-temperature heating process, it is possible to the elasticity keeping matrix certain and intensity, most preferred embodiment of the present invention selects 65Mn steel.
The described face 2 that cuts comprises polishing plane 3 and cutting inclined-plane 4, the thickness cutting sheet is not more than 3.0mm, scope of embodiments is 1mm��3mm, the best is 1.1mm, the scope that embodiment is pointed out ensure that the economy cutting sheet become by punch ram, take into account simultaneously and ensure punching press effect, and reduce hand-held weight as far as possible.
According to Fig. 3, the edge of described polishing plane is formed slopely cutting inclined-plane downwards, and the scope forming bevel angle �� between described cutting inclined-plane and polishing plane is 15 to 25 ��, and best bevel angle �� is 20 ��. What use best bevel angle �� making cuts sheet, operator are when using sander 10 operation installed and cut sheet, cutting inclined-plane and polishing plane keep certain angle, can make to cut sheet and can obtain a thrust forward, this bevel angle �� can ensure that cutting sheet cuts the weld seam of projection, and can ensure that cutting sheet blade edges when polishing welding seams can be discharged abrasive dust by inclined-plane.
Described polishing plane width minimum value can be consistent with cutting surface width, and polishing plane surface arranges polishing material, and the main effect that this structure place arranges polishing material has two: one to be when cutting sheet level and polish, it is possible to play ablation; Two is when cutting sheet cutting inclined-plane and polish, and plays assistance chip removal, the effect of assistant grinding.
The width on described cutting inclined-plane and chip removal, heat radiation are inversely proportional to, and are directly proportional to grinding efficiency, according to the parameter of three, require to determine funtcional relationship, and determine optimum Cutting inclined-plane further, and institute's optimized choice interval range is 3.5mm��12mm, optimum value 6mm.
Width and chip removal, heat radiation, the grinding efficiency parameter three on cutting inclined-plane determine that funtcional relationship principle is: in bruting process, cut sheet grinding hull welding surface, owing to there being material to remove, create a large amount of heats, wherein major part heat is by chip discharge, part heat is absorbed by hull steel, owing to diamond heat-conduction coefficient is the highest, is transmitted to the heat cutting on sheet less. In order to abrasive dust can be discharged smoothly when ensureing polishing, and being taken away by heat, carry out the width on cutting inclined-plane polished and be an inverse relation between chip removal, heat radiation, namely cut surface width more little, heat radiation, chip removal effect are more good; But on the other hand, in unit surface, abrasive particle number is more many, the abrasive particle number participating in grinding is more many, but in the unit time, polishing removal amount is more big, it is possible to grinding efficiency and abrasive particle number are regarded as the relation of a linear increase. And the abrasive particle number in unit surface is consistent with cutting inclined-plane, therefore cutting inclined-plane and grinding efficiency can regard the relation of a linear increase as.
The described outer end, cutting inclined-plane cutting sheet is for falling fillet 6, best fillet radius cuts the half of sheet thickness described in being, this is due in use, cut sheet outer end edges high-speed rotation limit to push ahead, therefore cut sheet outermost end by power maximum, then require that diamond brazing intensity is higher, bonding surface is applicable to cutting processing, if not carrying out chamfering, being then easy to, at rib limit, edge place, diamond drop-off phenomenon occurs, reducing grinding efficiency.
According to Fig. 2, described cutting fixes polishing material 7 in sheet polishing plane, polishing material adopts distinguishes distributing mode arrangement, card outer end edges is densely covered material of polishing evenly, and polishing plane place is according to a bunch some ring-type arrangement, does not arrange to polish and expect in other position, described polishing material is diamond, described polishing material is in a bunch some ring-type arrangement in polishing plane, and every cluster point shape of described polishing material is circular, area 2.5��4mm2Gather in bunch some diamond, the adjacent Liang Cu dot center spacing 8��15mm of described circle, the best is 10mm, adjacent two circumferential spaces 6��10mm, the best is 6mm, the uniform diamond of outer end edges, polishing plane carries out the chip space that tufted annular arrangement improves polishing plane polishing, ensures heat-dissipating space, also improve grinding efficiency, thus ensure that the job requirement cutting sheet butt welding seaming and cutting, mill. Described polishing material is fixed in polishing plane by soldering tech, and soldering tech together heats with solder more low-melting than mother metal and weldment, soaks and fill up the gap that mother metal connects after making brazing filler metal melts, and solder mutually diffuses to form the method being firmly connected with mother metal. Utilize the adamantine principle of soldering tech set be by diamond with cutting sheet regard mother metal as, centre adds solder, diamond and matrix is welded together through heat solder fusing. The maximum feature of this kind of adamantine mode of set there occurs enhanced primary treatment before being solder and abrasive material, abrasive material welding strength height, therefore abrasive material just can be gripped tightly when exposure is higher, and therefore grinding is sharp, chip space is big, and grinding temperature also can corresponding reduce.
The described sheet that cuts is punching press part, bottom described polishing plane and U shape, punching press bevel edge between recessed plane 8 all needs fillet 9, fillet radius scope 2.5��5mm, optimum value 4mm, matrix is made to be unlikely to concentrate at corner stress in punching press making processes to cause matrix cracking, the phenomenons such as cracking.
The above; it is only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any it is familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention. Therefore, protection scope of the present invention should described be as the criterion with the protection domain of claim.
Claims (3)
1. one kind cuts sheet, comprising matrix, matrix is cross section is the card of U shape, and the two ends of card U shape are for cutting face, the face of cutting comprises polishing plane and cutting inclined-plane, the edge tilt of polishing plane forms cutting inclined-plane, described polishing plane and fixing polishing material on cutting inclined-plane, and the U shape bottom of card is fixed orifices, polishing material adopts distinguishes distributing mode arrangement, card outer end edges is densely covered material of polishing evenly, and polishing plane place is according to a bunch some ring-type arrangement, does not arrange to polish and expect in other position; Every cluster point shape of described polishing material is circular, area 2.5��4mm2Gather in bunch some diamond, adjacent Liang Cu dot center spacing 8��15mm, adjacent two circumferential spaces 6��10mm, it is characterized in that: the edge of described polishing plane forms cutting inclined-plane by the mode tilted downwards, forming bevel angle �� between described cutting inclined-plane and polishing plane, the scope of �� is 15 to 25 ��, the outer end on described cutting inclined-plane for falling fillet, described fall fillet radius be described in cut the half of sheet thickness.
2. according to claim 1 cut sheet, it is characterised in that: card is circular.
3. according to claim 1 cut sheet, it is characterised in that: described polishing material is diamond.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210376005.5A CN102873645B (en) | 2012-10-08 | 2012-10-08 | One cuts sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210376005.5A CN102873645B (en) | 2012-10-08 | 2012-10-08 | One cuts sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102873645A CN102873645A (en) | 2013-01-16 |
CN102873645B true CN102873645B (en) | 2016-06-01 |
Family
ID=47475276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210376005.5A Active CN102873645B (en) | 2012-10-08 | 2012-10-08 | One cuts sheet |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102873645B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108515468A (en) * | 2018-05-09 | 2018-09-11 | 湖北昌利超硬材料有限公司 | A kind of novel soldering diamond abrasive tool and its preparation process |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102896590A (en) * | 2012-09-21 | 2013-01-30 | 南京航空航天大学 | Process for distributing grinding materials of grinding disc of ship body made of brass solder super-hard grinding material |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4243017A1 (en) * | 1992-12-18 | 1994-06-23 | Hilti Ag | Disc-shaped grinding tool |
CN2342933Y (en) * | 1998-07-20 | 1999-10-13 | 车锺培 | Composite tool for cutting and abrading |
JP4269018B2 (en) * | 1998-10-09 | 2009-05-27 | 三京ダイヤモンド工業株式会社 | Diamond cutter manufacturing method and diamond cutter |
TWI238753B (en) * | 2002-12-19 | 2005-09-01 | Miyanaga Kk | Diamond disk for grinding |
CN102029560B (en) * | 2010-10-27 | 2012-07-25 | 江西洪都航空工业集团有限责任公司 | Tool and method for repairing composite laminated sheet structural member |
CN202317264U (en) * | 2011-11-04 | 2012-07-11 | 江苏华昌工具制造有限公司 | Wind power razing saw blade |
CN202804967U (en) * | 2012-10-08 | 2013-03-20 | 上海磐锋超硬工具科技有限公司 | Cutting-grinding disc |
-
2012
- 2012-10-08 CN CN201210376005.5A patent/CN102873645B/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102896590A (en) * | 2012-09-21 | 2013-01-30 | 南京航空航天大学 | Process for distributing grinding materials of grinding disc of ship body made of brass solder super-hard grinding material |
Also Published As
Publication number | Publication date |
---|---|
CN102873645A (en) | 2013-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102896590B (en) | Process for distributing grinding materials of grinding disc of ship body made of brass solder super-hard grinding material | |
CN103522206B (en) | The distributing technique of one-shot forming Study on Brazed Superabrasive Tools | |
CN202106052U (en) | Welding lathe tool for production of mould | |
CN102528304B (en) | Plate butt welding method and welding groove | |
CN104875131A (en) | Diamond millstone | |
CN102873645B (en) | One cuts sheet | |
CN105945657A (en) | Multifunctional ultrasonic vibration grinding mechanism | |
CN105108301A (en) | Deburring friction stir welding tool | |
CN202804967U (en) | Cutting-grinding disc | |
CN102794680B (en) | Grinding method and grinding wheel for nickel-based high-temperature alloy turbine front sealing disc | |
CN108515468A (en) | A kind of novel soldering diamond abrasive tool and its preparation process | |
CN203945271U (en) | Multiple bonding agent joint piece combination super-abrasive grinding wheel | |
CN111136590A (en) | Brazing diamond grinding tool suitable for casting flash grinding and preparation method thereof | |
CN104416229B (en) | PCD saw blades and preparation method thereof | |
WO2015169171A1 (en) | Highly efficient, anti-vibration, durable rotating file with variable pitch | |
CN207087654U (en) | A kind of solder type diamond-impregnated wheel | |
CN202622508U (en) | Abrasion cutting tool | |
CN209887412U (en) | Grinding wheel structure for grinding end face of spring | |
CN204278265U (en) | One draws excellent cutter | |
CN204934853U (en) | A kind of can the combined type friction stir welding tools of deburring | |
CN201346748Y (en) | Cutter for turning grinding wheels | |
TWI526267B (en) | Diamond tool | |
CN219403942U (en) | Diamond grinding wheel beneficial to chip removal | |
CN215848660U (en) | Special saw blade for flame-retardant plywood | |
CN210452379U (en) | Consumable material for polishing and grinding cutter face |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |