CN102873032B - Automatic material separating component - Google Patents
Automatic material separating component Download PDFInfo
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- CN102873032B CN102873032B CN201210345054.2A CN201210345054A CN102873032B CN 102873032 B CN102873032 B CN 102873032B CN 201210345054 A CN201210345054 A CN 201210345054A CN 102873032 B CN102873032 B CN 102873032B
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- light source
- detection platform
- box
- sensor
- rotating shaft
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Abstract
The invention discloses an automatic material separating component. The component comprises light source supporting vertical plates arranged at the bottom of a material receiving box, and the material receiving box comprising a non-defective product box and a defective product box, wherein a light source supporting plate, a light source bracket, a light source and a light source cover are arranged on the material receiving box from bottom to top in sequence; a background plate is horizontally arranged on an inner hole of the light source supporting plate along the diameter direction of the inner hole; a glass detection platform with four sides is arranged below the light source in the light source bracket and connected with one end of a rotating shaft, which is arranged along the horizontal direction, of a motor; the other end of the rotating shaft of the motor is connected with a sensor induction sheet; and the sensor induction sheet and an origin sensor arranged on a sensor bracket are correspondingly arranged. The component can be applied to an automatic chip detection platform in crystal equipment and quickly and automatically classifies and places chips.
Description
Technical field
The present invention relates to automatic turning sub-material assembly.
Background technology
When wafer is carried out to non-defective unit and defective products sorting placement, normally wafer is utilized to the mode of vacuum suction, wafer is drawn from detection position, then utilized barotropic gas to blow and put in the non-defective unit box and defective products box of other position, carry out a series of wafer classification and pick and place.
Along with crystal develops to miniaturization, intracrystalline wafer is more and more less, and to the accurate and quick more and more harshness that requires of detection and sub-material, sub-material mode in the past can not meet instructions for use.
Summary of the invention
The object of the invention is to overcome the deficiency of prior art, a kind of automatic feed dividing assembly that can realize the good fast detecting of little wafer is provided.
In order to achieve the above object, the technical solution used in the present invention is:
Automatic feed dividing assembly of the present invention, it comprises the light source supporting vertical plate that is arranged on rewinding box bottom, the rewinding box that comprises non-defective unit box and defective products box, light source gripper shoe is installed successively from bottom to up on described rewinding box, light source bracket, light source and light source cover, on the endoporus of described light source gripper shoe, along diameter of bore direction, be horizontally installed with background board, in described light source bracket, be positioned at light source below the glass detection platform that comprises 4 surface glass platforms is installed, described glass detection platform has a surface glass to be horizontal as placing wafer inspection outward appearance use all the time, described glass detection platform is connected with one end of the rotating shaft that the along continuous straight runs of motor arranges, the other end of the rotating shaft of described motor is connected with sensor sensing sheet, described sensor sensing sheet and the corresponding setting of origin sensor being arranged on sensor stand.
The invention has the advantages that: this assembly can be applied in crystal equipment for the automatic detecting platform of wafer, the fast automatic wafer sorting placement that carries out.
Accompanying drawing explanation
Fig. 1 is the explosive view of automatic feed dividing assembly of the present invention;
Fig. 2 is the assembling rearview of automatic feed dividing assembly of the present invention.
The specific embodiment
Describe the present invention below.
Automatic feed dividing assembly of the present invention as shown in drawings, it comprises the light source supporting vertical plate 1 that is arranged on rewinding box bottom, the rewinding box 2 that comprises non-defective unit box and defective products box, light source gripper shoe 4 is installed successively from bottom to up on described rewinding box, light source bracket 5, light source 7 and light source cover 8, on the endoporus of described light source gripper shoe, along diameter of bore direction, be horizontally installed with background board 3, in described light source bracket, be positioned at light source below the glass detection platform 6 that comprises 4 surface glass platforms is installed, described glass detection platform is connected with one end of the rotating shaft that the along continuous straight runs of motor 10 arranges, the other end of the rotating shaft of described motor is connected with sensor sensing sheet 11, described sensor sensing sheet and the corresponding setting of origin sensor 13 being arranged on sensor stand 12.Motor described in during installation is connected with glass detection platform by motor mount 9.
Adopt the course of work of this assembly as follows:
Glass detection platform 6 is connected with motor 10, by motor 10, controls 6 rotations of glass detection platform, each 90-degree rotation, and glass detection platform 6 has a surface glass to be horizontal as placing wafer inspection outward appearance use all the time.Fork material fetching mechanism is got a wafer and is placed in detection platform and detects, and detects completely, and motor 10 is controlled glass detection platform 6 90-degree rotations, and to make wafer drop to non-defective unit box (or defective products box) inner in (or counterclockwise) rotation clockwise; Background board 3 is for providing CCD row to comply background; Light source 7 is used to CCD to take pictures provides illumination; Light source cover 8 is for making light source 7 light-dispersing effects better.
Claims (1)
1. automatic feed dividing assembly, it is characterized in that: it comprises the light source supporting vertical plate that is arranged on rewinding box bottom, the rewinding box that comprises non-defective unit box and defective products box, light source gripper shoe is installed successively from bottom to up on described rewinding box, light source bracket, light source and light source cover, on the endoporus of described light source gripper shoe, along diameter of bore direction, be horizontally installed with background board, in described light source bracket, be positioned at light source below the glass detection platform that comprises 4 surface glass platforms is installed, described glass detection platform has a surface glass to be horizontal as placing wafer inspection outward appearance use all the time, described glass detection platform is connected with one end of the rotating shaft that the along continuous straight runs of motor arranges, the other end of the rotating shaft of described motor is connected with sensor sensing sheet, described sensor sensing sheet and the corresponding setting of origin sensor being arranged on sensor stand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210345054.2A CN102873032B (en) | 2012-09-14 | 2012-09-14 | Automatic material separating component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210345054.2A CN102873032B (en) | 2012-09-14 | 2012-09-14 | Automatic material separating component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102873032A CN102873032A (en) | 2013-01-16 |
| CN102873032B true CN102873032B (en) | 2014-04-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210345054.2A Active CN102873032B (en) | 2012-09-14 | 2012-09-14 | Automatic material separating component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102873032B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6695571B1 (en) * | 1998-01-16 | 2004-02-24 | Micron Technology, Inc. | Vertical magazine method for integrated circuit device dispensing, receiving, storing, testing or binning |
| CN201156073Y (en) * | 2007-12-12 | 2008-11-26 | 南京熊猫仪器仪表有限公司 | Visual positioning SMD wafer detection apparatus |
| CN201454870U (en) * | 2009-07-22 | 2010-05-12 | 咸阳文林机电设备制造有限公司 | Fully-automatic LED chip selector |
| CN102500554A (en) * | 2011-10-12 | 2012-06-20 | 浙江大学台州研究院 | Fully-automatic visual inspection machine for wafer |
| CN102553837A (en) * | 2012-01-10 | 2012-07-11 | 梅州市宇通科技有限公司 | Quartz wafer appearance sorting device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011031200A (en) * | 2009-08-04 | 2011-02-17 | Yamato Scale Co Ltd | Inspection sorting system |
| JP5391394B2 (en) * | 2009-12-14 | 2014-01-15 | ハイメカ株式会社 | Electronic component classification device |
-
2012
- 2012-09-14 CN CN201210345054.2A patent/CN102873032B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6695571B1 (en) * | 1998-01-16 | 2004-02-24 | Micron Technology, Inc. | Vertical magazine method for integrated circuit device dispensing, receiving, storing, testing or binning |
| CN201156073Y (en) * | 2007-12-12 | 2008-11-26 | 南京熊猫仪器仪表有限公司 | Visual positioning SMD wafer detection apparatus |
| CN201454870U (en) * | 2009-07-22 | 2010-05-12 | 咸阳文林机电设备制造有限公司 | Fully-automatic LED chip selector |
| CN102500554A (en) * | 2011-10-12 | 2012-06-20 | 浙江大学台州研究院 | Fully-automatic visual inspection machine for wafer |
| CN102553837A (en) * | 2012-01-10 | 2012-07-11 | 梅州市宇通科技有限公司 | Quartz wafer appearance sorting device |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2011-123032A 2011.06.23 |
| JP特开2011-31200A 2011.02.17 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102873032A (en) | 2013-01-16 |
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