CN102500554A - Fully-automatic visual inspection machine for wafer - Google Patents

Fully-automatic visual inspection machine for wafer Download PDF

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Publication number
CN102500554A
CN102500554A CN2011103080216A CN201110308021A CN102500554A CN 102500554 A CN102500554 A CN 102500554A CN 2011103080216 A CN2011103080216 A CN 2011103080216A CN 201110308021 A CN201110308021 A CN 201110308021A CN 102500554 A CN102500554 A CN 102500554A
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CN
China
Prior art keywords
rotating disk
wafer
visual inspection
inspection machine
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011103080216A
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Chinese (zh)
Inventor
王维锐
林斌
陈浙泊
王辉
梅武军
刘木林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Research Institute of Zhejiang University Taizhou
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Research Institute of Zhejiang University Taizhou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Research Institute of Zhejiang University Taizhou filed Critical Research Institute of Zhejiang University Taizhou
Priority to CN2011103080216A priority Critical patent/CN102500554A/en
Publication of CN102500554A publication Critical patent/CN102500554A/en
Pending legal-status Critical Current

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Abstract

The invention provides a fully-automatic visual inspection machine for a wafer, which belongs to the technical field of the machinery and solves the technical problems of low working efficiency and the like in the prior art. The fully-automatic visual inspection machine for the wafer comprises a rack, wherein the rack is provided with a wafer fetching turnplate, a detection turnplate and a material receiving box; a feeding mechanism capable of conveying the wafer to the wafer fetching turnplate is arranged between the rack and the wafer fetching turnplate; a material moving mechanism capable of transferring the wafer on the wafer fetching turnplate to a preset position on the detection turnplate is arranged between the detection turnplate and the wafer fetching turnplate; and an imaging mechanism 1 and an imaging mechanism 2 are arranged above and below the detection turnplate, respectively. The fully-automatic visual inspection machine also comprises an analysis computer connected with the imaging mechanism 1 and the imaging mechanism 2; and a discharging mechanism capable of placing the wafer on the detection turnplate onto different positions in the material receiving box according to a detection result is arranged between the material receiving box and the detection turnplate. Compared with the traditional manual visual inspection mode, the fully-automatic visual inspection machine realizes fully-automatic detection and can improve the working efficiency.

Description

The full-automatic visual inspection machine of a kind of wafer
Technical field
The invention belongs to field of mechanical technique, relate to a kind of visual inspection machine, the full-automatic visual inspection machine of particularly a kind of wafer.
Background technology
Crystal resonator is meant the quartz-crystal resonator made from quartz material, is commonly called as crystal oscillator, in electronic equipment, plays the effect that produces frequency, has the characteristics stable, that interference free performance is good, is widely used in the various electronic products.
Through evolving development for many years, present worldwide quartz wafer factory commercial treaty concentrates within Chinese territory more than 90%.We can say,, occupied domestic market and just occupied world market in this field of quartz wafer production testing equipment.
The quartz wafer that uses in the industry is processed through series of processes by quartzy bar dicing again.Because the particularity of service condition; Quartz wafer must satisfy strict quality requirement; Satisfy CF; A certain size breakage of surface: like cut (comprising limit cut and inner cut), slight crack, collapse the limit, collapse the angle, defective such as out-of-shape and surface are dirty, all can directly influence the performance of wafer.Single wafer needs through frequency screening after moulding, carries out the surface again and detects, and just can be used for making crystal resonator.And current domestic crystal industry wafer surface detection operation relies on Manual Visual Inspection fully, and efficient is lower, and quality can not get guaranteeing, and also becomes the pressure of enterprise than higher cost of labor.
Summary of the invention
The objective of the invention is the problems referred to above of existing to existing technology, provide a kind of wafer full-automatic visual inspection machine, technical problem to be solved by this invention is to realize whether full automatic detection wafer exists defective and it is classified.
The object of the invention can be realized through following technical proposal: the full-automatic visual inspection machine of a kind of wafer; Comprise a frame; It is characterized in that; Described frame is provided with and gets the sheet rotating disk, detects rotating disk and rewinding box; Described frame and getting is provided with between the sheet rotating disk can be with wafer transport to the feeding mechanism of getting on the sheet rotating disk; Described detection rotating disk and getting is provided with between the sheet rotating disk and can puts on the described detection rotating disk with the below and be respectively equipped with imaging mechanism one and imaging mechanism two getting wafer transfer on the sheet rotating disk to the Material moving device that detects predeterminated position on the rotating disk, and this visual inspection machine also comprises an anacom that links to each other with imaging mechanism two with described imaging mechanism one; Described anacom can judge whether this wafer is qualified according to the image of imaging mechanism one and imaging mechanism two gained, is provided with between described rewinding box and the detection rotating disk will to detect the discharge mechanism that wafer on the rotating disk is placed on diverse location in the rewinding box according to testing result.
The operation principle of this device is following: feeding mechanism to getting on the sheet rotating disk, is got wafer transport sheet rotating disk drive wafer and is accurately turned an angle at every turn, in order to picking up piecewise; Material moving device picks up to be got the wafer on the sheet rotating disk and places it on the predeterminated position that detects rotating disk; Detecting rotating disk rotates according to certain angle; The obverse and reverse of imaging mechanism one and two pairs of wafers of imaging mechanism is carried out to picture; And view data passed to anacom, anacom draws comprehensive testing result through the outline data and the surface data of certain Algorithm Analysis wafer; Discharge mechanism is placed on the diverse location in the rewinding box according to the wafer classification that testing result will detect.This device is realized full-automatic the detection, compares the Manual Visual Inspection mode of passing through at present, and this device can be increased work efficiency; Adopt the obverse and reverse of imaging mechanism one and two pairs of wafers of imaging mechanism to detect, improved the accuracy that detects, simultaneously the profile and the surface data of wafer are analyzed, realize that binary detects, and has more reliability.
In the full-automatic visual inspection machine of above-mentioned a kind of wafer, described feeding mechanism comprises design on frame and be positioned at the feeding cylinder of getting sheet rotating disk one side, and the port of export of described feeding cylinder is provided with one can be sprinkling upon the flinger of getting on the sheet rotating disk at random with this place's wafer.Wafer is placed in the feeding cylinder in advance, the wafer transport in the feeding cylinder is got on to getting the sheet rotating disk through flinger.
In the full-automatic visual inspection machine of above-mentioned a kind of wafer; Described Material moving device comprises and is arranged on the location camera of getting sheet rotating disk top; Described location camera is connected on the frame; Described location camera links to each other with anacom, and a described side of getting the sheet rotating disk is provided with an ability and will gets the wafer taking-up on the sheet rotating disk and be placed into the manipulator one that detects predeterminated position on the rotating disk.The location camera is taken pictures to the wafer of getting on the sheet rotating disk, and image information is passed in the anacom, and the anacom analysis draws wafer in the position of getting on the sheet rotating disk, corresponding wafer is taken out and is placed into the detection rotating disk through the control manipulator and get on.
In the full-automatic visual inspection machine of above-mentioned a kind of wafer; Described manipulator one comprises the slide rail one that is installed on the frame and is slidingly connected at the transverse arm one on this slide rail one; Described slide rail one is positioned at a side of getting the sheet rotating disk, and the front end of described transverse arm one is provided with the suction nozzle one that can adsorb wafer.Transverse arm one slide on the slide rail one make suction nozzle one move to wafer above; Suction nozzle one is drawn wafer; Transverse arm one reverse slide on slide rail one makes transverse arm one be returned to initial position; At this moment suction nozzle one is positioned at and detects the rotating disk top, and suction nozzle one puts down wafer, and wafer just has been transported to and has detected on the rotating disk.
In the full-automatic visual inspection machine of above-mentioned a kind of wafer, described imaging mechanism one comprise be installed on the frame and be positioned at the camera one and lighting source one that detects the rotating disk top, described camera one links to each other with anacom.The a pair of wafer illumination of lighting source, a pair of wafer of camera is taken a picture.
In the full-automatic visual inspection machine of above-mentioned a kind of wafer, described imaging mechanism two comprise be installed on the frame and be positioned at the camera two and lighting source two that detects the rotating disk below, described camera two links to each other with anacom.
In the full-automatic visual inspection machine of above-mentioned a kind of wafer; Described discharge mechanism comprises the slide rail two that is installed on the frame and is slidingly connected at the transverse arm two on this slide rail two; Described slide rail two is positioned at a side that detects rotating disk; The front end of described transverse arm two is provided with the suction nozzle two that can adsorb wafer, and described suction nozzle two is positioned at the top of detecting rotating disk, and can make suction nozzle two be positioned at the top of rewinding box through moving transverse arm two.The initial position of suction nozzle two is above the detection rotating disk; When detecting dial rotation, drive wafer from imaging mechanism one and imaging mechanism two forward to suction nozzle two under; Suction nozzle two is drawn wafer come out from detecting rotating disk; Through transverse arm two mobile on the slide rail two make suction nozzle two move to the rewinding box directly over, according to the testing result control suction nozzle two of anacom wafer is placed on the diverse location in the rewinding box according to the acceptance or rejection classification.
In the full-automatic visual inspection machine of above-mentioned a kind of wafer, the disk body of described detection rotating disk is transparent.Disk body is transparent, and light can pass through more, improves the visuality of wafer.
In the full-automatic visual inspection machine of above-mentioned a kind of wafer, described rewinding box comprises at least two interlayers.These two interlayers are used for placing qualified and underproof wafer respectively.
In the full-automatic visual inspection machine of above-mentioned a kind of wafer, also be provided with a touch display on the described frame, this touch display links to each other with anacom.
Compared with prior art, this device is realized full-automatic the detection, compares the Manual Visual Inspection mode of passing through at present, and this device can be increased work efficiency; Adopt the obverse and reverse of imaging mechanism one and two pairs of wafers of imaging mechanism to detect, improved the accuracy that detects, simultaneously the profile and the surface data of wafer are analyzed, realize that binary detects, and has more reliability.
Description of drawings
Fig. 1 is the overall structure sketch map of the full-automatic visual inspection machine of this wafer.
Fig. 2 is the structural representation of imaging mechanism one and imaging mechanism two.
Among the figure, 1, frame; 2, get the sheet rotating disk; 3, detect rotating disk; 4, rewinding box; 5, feeding cylinder; 6, flinger; 7, location camera; 8, transverse arm one; 9, suction nozzle one; 10, slide rail one; 11, camera one; 12, camera two; 13, slide rail two; 14, transverse arm two; 15, suction nozzle two; 16, touch display.
The specific embodiment
Below be specific embodiment of the present invention and combine accompanying drawing, technical scheme of the present invention is done further to describe, but the present invention is not limited to these embodiment.
As depicted in figs. 1 and 2, the full-automatic visual inspection machine of this wafer comprises a frame 1, and frame 1 is provided with and gets sheet rotating disk 2, detects rotating disk 3 and rewinding box 4, and rewinding box 4 comprises at least two interlayers, and these two interlayers are used for placing qualified and underproof wafer respectively.The disk body that detects rotating disk 3 is transparent, and disk body is transparent, and light can pass through more, improves the visuality of wafer.Frame 1 and getting is provided with between the sheet rotating disk 2 can be with wafer transport to the feeding mechanism of getting on the sheet rotating disk 2; Feeding mechanism comprises design on frame 1 and be positioned at the feeding cylinder 5 of getting sheet rotating disk 2 one sides, and the port of export of feeding cylinder 5 is provided with one can be sprinkling upon the flinger of getting on the sheet rotating disk 26 at random with this place's wafer.Wafer is placed in the feeding cylinder 5 in advance, the wafer transport in the feeding cylinder 5 is got on to getting sheet rotating disk 2 through flinger 6.
Detect rotating disk 3 and get that be provided with between the sheet rotating disk 2 can be with getting wafer transfer on the sheet rotating disk 2 to the Material moving device that detects predeterminated position on the rotating disk 3; Material moving device comprises and is arranged on the location camera 7 of getting sheet rotating disk 2 tops; Location camera 7 is connected on the frame 1; Location camera 7 links to each other with anacom, and a side of getting sheet rotating disk 2 is provided with an ability and will gets the wafer taking-up on the sheet rotating disk 2 and be placed into the manipulator one that detects predeterminated position on the rotating disk 3.Camera 7 pairs of wafers of getting on the sheet rotating disk 2 in location are taken pictures; And image information is passed in the anacom; The anacom analysis draws wafer in the position of getting on the sheet rotating disk 2, corresponding wafer is taken out and is placed into detection rotating disk 3 through the control manipulator and get on.Manipulator one comprises the slide rail that is installed on the frame 11 and is slidingly connected at the transverse arm 1 on this slide rail 1, and slide rail 1 is positioned at a side of getting sheet rotating disk 2, and the front end of transverse arm 1 is provided with the suction nozzle 1 that can adsorb wafer.Transverse arm 1 slide on the slide rail 1 make suction nozzle 1 move to wafer above; Suction nozzle 1 is drawn wafer; Transverse arm 1 reverse slide on slide rail 1 makes transverse arm 1 be returned to initial position; At this moment suction nozzle 1 is positioned at and detects rotating disk 3 tops, and suction nozzle 1 puts down wafer, and wafer just has been transported to and has detected on the rotating disk 3.
Put with the below on the detection rotating disk 3 and be respectively equipped with imaging mechanism one and imaging mechanism two; This visual inspection machine also comprises an anacom that links to each other with imaging mechanism two with imaging mechanism one; Anacom can judge whether this wafer is qualified according to the image of imaging mechanism one and imaging mechanism two gained; Imaging mechanism one comprise be installed on the frame 1 and be positioned at the camera 1 and lighting source one that detects rotating disk 3 tops, camera 1 links to each other with anacom.The a pair of wafer illumination of lighting source, one 11 pairs of wafers of camera are taken a picture.Imaging mechanism two comprise be installed on the frame 1 and be positioned at the camera 2 12 and lighting source two that detects rotating disk 3 belows, camera 2 12 links to each other with anacom.
Rewinding box 4 and detect is provided with between the rotating disk 3 and can will detects the discharge mechanism that wafer on the rotating disk 3 is placed on rewinding box 4 interior diverse locations according to testing result.Discharge mechanism comprises the slide rail 2 13 that is installed on the frame 1 and is slidingly connected at the transverse arm 2 14 on this slide rail 2 13; Slide rail 2 13 is positioned at a side that detects rotating disk 3; The front end of transverse arm 2 14 is provided with the suction nozzle 2 15 that can adsorb wafer; Suction nozzle 2 15 is positioned at the top of detecting rotating disk 3, and can make suction nozzle 2 15 be positioned at the top of rewinding box 4 through moving transverse arm 2 14.The initial position of suction nozzle 2 15 is above detection rotating disk 3; When detect drive when rotating disk 3 rotates wafer forward to from imaging mechanism one and imaging mechanism two suction nozzle 2 15 under; Suction nozzle 2 15 is drawn wafer come out from detecting rotating disk 3; Through transverse arm 2 14 mobile on the slide rail 2 13 make suction nozzle 2 15 move to rewinding box 4 directly over, according to the testing result control suction nozzle 2 15 of anacom wafer is placed on the diverse location in the rewinding box 4 according to the acceptance or rejection classification.
Also be provided with a touch display 16 on the frame 1, this touch display 16 links to each other with anacom.
The operation principle of this device is following: feeding mechanism to getting on the sheet rotating disk 2, is got wafer transport sheet rotating disk 2 drive wafers and is accurately turned an angle at every turn, in order to picking up piecewise; Material moving device picks up to be got the wafer on the sheet rotating disk 2 and places it on the predeterminated position that detects rotating disk 3; Detecting rotating disk 3 rotates according to certain angle; The obverse and reverse of imaging mechanism one and two pairs of wafers of imaging mechanism is carried out to picture; And view data passed to anacom, anacom draws comprehensive testing result through the outline data and the surface data of certain Algorithm Analysis wafer; Discharge mechanism is placed on the diverse location in the rewinding box 4 according to the wafer classification that testing result will detect.This device is realized full-automatic the detection, compares the Manual Visual Inspection mode of passing through at present, and this device can be increased work efficiency; Adopt the obverse and reverse of imaging mechanism one and two pairs of wafers of imaging mechanism to detect, improved the accuracy that detects, simultaneously the profile and the surface data of wafer are analyzed, realize that binary detects, and has more reliability.
Specific embodiment described herein only is that the present invention's spirit is illustrated.Person of ordinary skill in the field of the present invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.

Claims (10)

1. full-automatic visual inspection machine of wafer; Comprise a frame (1); It is characterized in that; Described frame (1) is provided with and gets sheet rotating disk (2), detects rotating disk (3) and rewinding box (4); Described frame (1) and getting is provided with between the sheet rotating disk (2) can be with wafer transport to the feeding mechanism of getting on the sheet rotating disk (2); Described detection rotating disk (3) and getting is provided with between the sheet rotating disk (2) and can the wafer transfer of getting on the sheet rotating disk (2) be gone up the Material moving device of predeterminated position to detecting rotating disk (3), puts on the described detection rotating disk (3) with the below and is respectively equipped with imaging mechanism one and imaging mechanism two, and this visual inspection machine also comprises an anacom that links to each other with imaging mechanism two with described imaging mechanism one; Described anacom can judge whether this wafer is qualified according to the image of imaging mechanism one and imaging mechanism two gained, is provided with between described rewinding box (4) and the detection rotating disk (3) will to detect the discharge mechanism that wafer on the rotating disk (3) is placed on the interior diverse location of rewinding box (4) according to testing result.
2. the full-automatic visual inspection machine of a kind of wafer according to claim 1; It is characterized in that; Described feeding mechanism comprises that design goes up and be positioned at the feeding cylinder (5) of getting sheet rotating disk (2) one sides in frame (1), and the port of export of described feeding cylinder (5) is provided with one can be sprinkling upon the flinger of getting on the sheet rotating disk (2) (6) at random with this place's wafer.
3. the full-automatic visual inspection machine of a kind of wafer according to claim 2; It is characterized in that; Described Material moving device comprises and is arranged on the location camera (7) of getting sheet rotating disk (2) top; Described location camera (7) is connected on the frame (1), and described location camera (7) links to each other with anacom, and a described side of getting sheet rotating disk (2) is provided with an ability and will gets the wafer taking-up on the sheet rotating disk (2) and be placed into the manipulator one that detection rotating disk (3) is gone up predeterminated position.
4. the full-automatic visual inspection machine of a kind of wafer according to claim 3; It is characterized in that; Described manipulator one comprises the slide rail one (10) that is installed on the frame (1) and is slidingly connected at the transverse arm one (8) on this slide rail one (10); Described slide rail one (10) is positioned at a side of getting sheet rotating disk (2), and the front end of described transverse arm one (8) is provided with the suction nozzle one (9) that can adsorb wafer.
5. according to claim 1 or the full-automatic visual inspection machine of 2 or 3 or 4 described a kind of wafers; It is characterized in that; Described imaging mechanism one comprise be installed on the frame (1) and be positioned at camera one (11) and the lighting source one that detects rotating disk (3) top, described camera one (11) links to each other with anacom.
6. according to claim 1 or the full-automatic visual inspection machine of 2 or 3 or 4 described a kind of wafers; It is characterized in that; Described imaging mechanism two comprise be installed on the frame (1) and be positioned at camera two (12) and the lighting source two that detects rotating disk (3) below, described camera two (12) links to each other with anacom.
7. according to claim 1 or the full-automatic visual inspection machine of 2 or 3 or 4 described a kind of wafers; It is characterized in that; Described discharge mechanism comprises the slide rail two (13) that is installed on the frame (1) and is slidingly connected at the transverse arm two (14) on this slide rail two (13); Described slide rail two (13) is positioned at a side that detects rotating disk (3); The front end of described transverse arm two (14) is provided with the suction nozzle two (15) that can adsorb wafer, and described suction nozzle two (15) is positioned at the top of detecting rotating disk (3), and can make suction nozzle two (15) be positioned at the top of rewinding box (4) through moving transverse arm two (14).
8. according to claim 1 or the full-automatic visual inspection machine of 2 or 3 or 4 described a kind of wafers, it is characterized in that the disk body of described detection rotating disk (3) is transparent.
9. according to claim 1 or the full-automatic visual inspection machine of 2 or 3 or 4 described a kind of wafers, it is characterized in that described rewinding box (4) comprises at least two interlayers.
10. according to claim 1 or the full-automatic visual inspection machine of 2 or 3 or 4 described a kind of wafers, it is characterized in that also be provided with a touch display (16) on the described frame (1), this touch display (16) links to each other with anacom.
CN2011103080216A 2011-10-12 2011-10-12 Fully-automatic visual inspection machine for wafer Pending CN102500554A (en)

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Cited By (10)

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Publication number Priority date Publication date Assignee Title
CN102873032A (en) * 2012-09-14 2013-01-16 天津必利优科技发展有限公司 Automatic material separating component
CN103077422A (en) * 2013-02-01 2013-05-01 浙江大学台州研究院 Quartz wafer counting machine
CN103090795A (en) * 2013-01-22 2013-05-08 铜陵晶越电子有限公司 Visual detection device of sizes and defects of quartz wafers
CN103926258A (en) * 2014-04-30 2014-07-16 台州振皓自动化科技有限公司 Device for detecting surface quality of transparent optical element
CN104384110A (en) * 2014-11-21 2015-03-04 无锡传奇科技有限公司 Full automatic rubber plug detecting machine
CN104567669A (en) * 2014-12-15 2015-04-29 苏州市昌星模具机械有限公司 High-efficiency and high-precision imaging detector
CN104900574A (en) * 2015-06-10 2015-09-09 苏州均华精密机械有限公司 Positioning device for wafer processing and positioning method thereof
CN106311637A (en) * 2016-08-31 2017-01-11 浙江金洲管道科技股份有限公司 Online pipeline visual inspection and sorting line
CN106596569A (en) * 2016-12-14 2017-04-26 中国计量大学 Automatic detection device for welding defects based on red copper pipe
CN106871794A (en) * 2016-12-20 2017-06-20 铜陵市多元微分科技有限公司 A kind of crystal oscillator cover plate appearance and size automatic detection device

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CN106311637A (en) * 2016-08-31 2017-01-11 浙江金洲管道科技股份有限公司 Online pipeline visual inspection and sorting line
CN106596569A (en) * 2016-12-14 2017-04-26 中国计量大学 Automatic detection device for welding defects based on red copper pipe
CN106596569B (en) * 2016-12-14 2019-05-03 中国计量大学 Based on copper tube welding defect automatic detection device
CN106871794A (en) * 2016-12-20 2017-06-20 铜陵市多元微分科技有限公司 A kind of crystal oscillator cover plate appearance and size automatic detection device

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Application publication date: 20120620