CN201156073Y - Visual positioning SMD wafer detection apparatus - Google Patents

Visual positioning SMD wafer detection apparatus Download PDF

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Publication number
CN201156073Y
CN201156073Y CNU2007201309003U CN200720130900U CN201156073Y CN 201156073 Y CN201156073 Y CN 201156073Y CN U2007201309003 U CNU2007201309003 U CN U2007201309003U CN 200720130900 U CN200720130900 U CN 200720130900U CN 201156073 Y CN201156073 Y CN 201156073Y
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CN
China
Prior art keywords
wafer
smd
platform
disk
locating
Prior art date
Application number
CNU2007201309003U
Other languages
Chinese (zh)
Inventor
钟丹秋
徐华军
张秩
周文俊
黄义
孙迎春
Original Assignee
南京熊猫仪器仪表有限公司
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Application filed by 南京熊猫仪器仪表有限公司 filed Critical 南京熊猫仪器仪表有限公司
Priority to CNU2007201309003U priority Critical patent/CN201156073Y/en
Application granted granted Critical
Publication of CN201156073Y publication Critical patent/CN201156073Y/en

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Abstract

A vision locating type SMD wafer detector consists of a transferring unit and an image identifying and processing unit. The transferring unit comprises a feeder, a disc platform and a manipulator transferring device. The image identifying and processing unit comprises a camera and a light source. The wafer to be checked is fed into the disc platform by the feeder. The disc platform is provided with a station used for visually locating and identifying the center position of the wafer. The manipulator transferring device is used as an upper electrode of a testing unit during testing. The manipulator consists of a negative pressure sucker made of metal. The detector has the advantages of high measuring accuracy, high automation, simple structure, easy operation and low failure rate. Compared with the current locating and testing manner adopting index plate, the vision identifying system adopted for locating has the advantages of reliable and accurate locating, accurate judgement and high identification rate, and is suitable for locating and transferring the thin type SMD wafer with small size and high frequency .

Description

Vision localization formula SMD wafer detection device

One, technical field

The utility model relates to a kind of vision localization pick-up unit of smd wafer of device, especially miniaturization, high frequencyization, slimming of vision localization formula SMD wafer inspection.

Two, background technology

Develop rapidly along with applying electronic produce markets such as communication apparatus, mobile phone, computer, household electrical appliances and networks, the market demand of SMD quartz wafer components and parts is growing, the thickness of ultrahigh frequency, ultrathin type and microminiature wafer even below 0.03 millimeter, long and wide minimum dimension is 0.5 * 0.5 millimeter, use conventional methods and carry out sorting because the interference of static causes phenomenons such as suction, empty survey easily, existing sorting method of testing to quartz wafer and potsherd influenced the efficiency of separation, so can not simply be diverted from one use to another in this.

The applicant had applied for that for example Chinese patent CN00240759.0 quartz wafer was located frequency measurement sorting unit, CN03278891.6 sheet type piezoelectric ceramic and the automatic locating test device of related device and CN200520076016.7 wafer separation device automatically to the automatic method and system of measuring of wafer.Existing technology generally is to deliver to the end of straight line feeder after through helical screw feeder scattered wafer being arranged, and mechanical arm carrying wafer is to index plate, and the index plate carry wafer is displaced to the measurement station and measures.The signal that obtains is delivered in the computing machine and is handled.The index plate carry wafer continues to be displaced to the blanking station then, and computing machine is according to the result who handles, and by the display display result and control the blanking part, wafer is sent in the magazine of setting.

Existing technology adopts the helical screw feeder feeding, and wafer vibrates in helical disk for a long time, the phase mutual friction, be easy to generate static, cause away sheet not smooth, adsorption phenomena is serious, cause wafer, particularly the breakage of the smd wafer of high frequencyization, slimming influences product quality.Existing index plate shifts SMD wafer mode, and the patch phenomenon takes place easily, influences measuring accuracy, and existing sorting unit, complex structure, maintenance difficult, failure rate height.

Three, summary of the invention

The utility model purpose is: propose a kind of simple in structure, efficient and vision localization formula SMD wafer detection device reliably, technology and device to the sorting of SMD wafer are optimized: automatic transmission, the carrying of realization SMD wafer, at the measurement station performance index of wafer are measured, automatically send into magazine after measuring sorting, guarantee the stability and the accuracy of whole sorting unit.

The technical solution of the utility model is: vision localization formula SMD wafer detection device, constitute by delivery unit and pattern recognition processing unit, delivery unit comprises feeding device, disk material platform, mechanical arm Handling device, and the pattern recognition processing unit comprises camera, light source; Wafer to be measured at random enters disk material platform behind feeder, the disk material platform of shake or vibration scatters SMD wafer in heaps.Disk material platform is provided with the station that the center of wafer is carried out vision localization identification, this vision localization identification adopts the pattern recognition disposal route to carry out, then mechanical arm with the carrying wafers that identifies to measuring station, measuring station, on, following test electrode is formed resonator cavity, wafer, surveying instrument composition oscillatory circuit is finished the non-contact measurement to this wafer, surveying instrument is distinctive high-precision network tester, carry out frequency, impedance, parasitic isoparametric test, parameter after computing machine will be measured is handled, by the display display result, mechanical arm is removed wafer to the little bucket of turnover magnetic simultaneously, computer control blanking classified part is sent into wafer in the magazine of setting.

Feeder is generally one and has the hydrostatic column that rotates screw thread, by its action of step motor drive.

Disk material platform has a servo electrode, and the clockwise uniform rotation of servo electrode drives disk material platform and the corresponding rotation of wafer on it, and wafer transport to pattern recognition position is discerned.

The static measurement mode of single station non-contact type is adopted in the test of this device, promptly is provided with a test bottom electrode station and the hand type top electrode that can carry wafer.This mechanical arm is the top electrode of test cell when measuring.Before measurement and after test finishes, this hand type top electrode can be realized the carrying to wafer again.Measuring station, the top electrode stationkeeping, the bottom electrode position is adjusted up and down by the electronic digital display micrometer inside caliper, guarantees that upper/lower electrode has fixing relative position, prevents that the SMD wafer from being smashed, damaging.

Mechanical arm generally is the negative pressure suction nozzle formation by a metal (copper) material, by its turnover gas mode of solenoid control, also is the test top electrode of test station simultaneously.Flow process: feeder and platform uniform rotation feed appliance, pattern recognition system carry out the center wafer position to be differentiated, the double-manipulator carrying, and double is measured simultaneously, and straight line is transported to the little bucket of blanking turnover, the classification blanking

The utility model has the advantages that: measurement device precision height, automaticity height, simple in structure, easy to operate, failure rate is low, adopt visual discrimination system location, than existing index plate assignment test mode, the location is accurately reliable, accuracy of judgement, the discrimination height is particularly suitable for the location of the smd wafer of miniaturization, high frequencyization, slimming.Adopt disk platform uniform rotation feeding, abandoned traditional mode of vibration, avoided SMD wafer frequency branch to choose common electrostatic interference, reduced the breakage rate of wafer, improved product quality and qualification rate.Mechanical arm carrying formula top electrode is realized the straight line transportation of feeding, test, blowing, and is both simple and direct, quick, reliable, convenient, guaranteed the monolithic test of SMD wafer again, strengthened stability, the reliability of complete machine work.Feeding partly adopts special-purpose feeder to deposit SMD wafer to be measured, and access is convenient, has reduced and has shut down the time of handling, and has improved running efficiency of system.

Four, description of drawings

Fig. 1 is the utility model general structure synoptic diagram

Fig. 2 is that the utility model send the charging area structural representation

1, feeder, 2, reinforced hopper, 3, disk material platform, 4, light source, 5, negative pressure suction nozzle (top electrode), 6, electronic digital display micrometer inside caliper, 7, the test bottom electrode, 8, magazine, 9, the little bucket that overturns, 10, mechanical arm, 11, camera, 12, magnetic upset disk, 21, disk material platform, 22, Baltimore groove, 23, pulp-collecting box, 24, servomotor

Five, embodiment

Mechanical arm is rectilinear motion on mechanical arm, finishes and draws the SMD wafer, measures, puts down a series of actions of SMD wafer.

The interior SMD wafer of the little bucket that overturns rotates step by step with magnetic upset disk, and when little tipping bucket forwarded corresponding gear place to, PLC accepted the signal that computing machine sends, and controls this little tipping bucket upset, and the SMD wafer is admitted in the corresponding magazine.If magazine is full, system alarm.

Servo electrode drives the uniform rotation of disk material platform, with a collection of SMD wafer transport to the pattern recognition position, after the pattern recognition system receives information, signal is passed to computing machine, computer control material platform stops operating, the center of pattern recognition system looks monolithic SMD wafer, end of identification, the SMD wafer is drawn in mechanical arm work, disk material platform is rotated further simultaneously, carries next group SMD wafer.

The circumferential edge of disk material platform has a circle Baltimore groove, prevents that the SMD wafer is scattering into outside the platform.Be provided with two oval-shaped holes in the Baltimore groove, the SMD processing of wafers that splashes in the groove is arrived in the pulp-collecting box of elliptical aperture below.

Test cell is made up of parts such as upper and lower electrode, electronic digital display micrometer inside caliper, LED light, high precision slide blocks.

Before the SMD wafer batch sorting to same specification, need adjust the gap of the upper and lower electrode on the test station.

The stationkeeping of the utility model test cell top electrode guarantees suitable gap between the upper and lower electrode by the position of adjusting bottom electrode, thereby finishes the measurement to the various parameters of SMD wafer.

The method that the bottom electrode position is adjusted: be connected with a LED light between contact A and the contact B, when they contacted, the LED lamp was bright.The electronic digital display micrometer inside caliper turns clockwise, the internal diameter of milscale slowly stretches out, slide block and contiguous block A are upwards held up, be provided with an extension spring between contiguous block A and the B, under the effect of extension spring, contiguous block B and bottom electrode slowly move up, when last, when bottom electrode is collided, contact A, B separately, the LED lamp goes out, the electronic digital display micrometer inside caliper is passed to computing machine by the data communication mouth with current location, after the Computer Processing, suitable gap is shown on display, the gap of milscale of circling round to computer prompted, can make, fixing gap is arranged between bottom electrode, both guaranteed measuring accuracy, have to prevent that wafer is damaged.

Device comprises: delivery unit comprises that feeding device, platform wheelwork, mechanical arm Handling device, pattern recognition processing unit comprise camera, light source; Auxilliary comprises dedicated network instrument and the oscillatory circuit of forming with tested crystal in test cell, the control module that can constitute with data processing section communication, data processing unit, computing machine and the PLC controller be made up of data collecting card, computing machine; Form blanking classification processing unit and constitute by synchronous motor and driver thereof, magnetic little bucket, magnetic tipping line bag, material stock box or the like the parts that overturn.Thereby the proving installation that constituent ratio is more complete.

The course of work of the present utility model is as follows: when sorting unit is started working, the disk platform of rotation sent into SMD wafer to be measured at random by feeder through reinforced hopper, disk platform shake SMD wafer in heaps scatters, and continues uniform rotation the SMD wafer is carried to the pattern recognition position.This moment, camera was taken pictures, and picture transmission was carried out the identification of SMD center wafer position to computing machine.Then, negative pressure suction nozzle manipulator behavior, hold the monolithic SMD wafer that determines the center through image processing system, mechanical arm is rectilinear motion on mechanical arm, monolithic SMD wafer is removed to the test bottom electrode of test station, and the mechanical arm of drawing the SMD wafer also is the top electrode of test station simultaneously, forms resonator cavity with bottom electrode, SMD wafer, surveying instrument are formed oscillatory circuit, measure the various parameters such as frequency, clutter, parasitism of this SMD wafer.Test parameter is delivered to computing machine by interlock circuit, by computing machine this SMD wafer is classified.Test finishes, mechanical arm with this SMD wafer transport to the little bucket of upset of blanking magnetic upset disk, mechanical arm is got back to initial position then, wait for and draw next SMD wafer, the interior SMD of the survey wafer of little bucket that overturns simultaneously rotates with blanking magnetic brick turning disk, behind assigned address, Computer signal is controlled it and is toppled over, and is poured into corresponding magazine.When system alarm is broken down or magazine when having expired in operation.Repeat above-mentioned action.

Claims (3)

1, vision localization formula SMD wafer detection device, constitute by delivery unit and pattern recognition processing unit, delivery unit comprises that feeder, disk material platform, mechanical arm Handling device constitute, the pattern recognition processing unit comprises camera, light source, wafer to be measured enters disk material platform behind feeder, disk material platform is provided with the station that the center of wafer is carried out vision localization identification, it is characterized in that described mechanical arm Handling device is the top electrode of test cell when measuring, mechanical arm is made of the negative pressure suction nozzle of a metal material.
2, vision localization formula SMD wafer detection device according to claim 1, it is characterized in that: feeding device is one and has the hydrostatic column that rotates screw thread, by its rotation of step motor drive.
3, vision localization formula SMD wafer detection device according to claim 1, it is characterized in that disk material platform has a servomotor, the clockwise uniform rotation of servomotor drives disk material platform and the corresponding rotation of SMD wafer on it, with the SMD wafer transport to the vision localization station.
CNU2007201309003U 2007-12-12 2007-12-12 Visual positioning SMD wafer detection apparatus CN201156073Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CNU2007201309003U CN201156073Y (en) 2007-12-12 2007-12-12 Visual positioning SMD wafer detection apparatus

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CN201156073Y true CN201156073Y (en) 2008-11-26

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101782384B (en) * 2009-12-11 2012-05-09 南京熊猫电子股份有限公司 Surface mount device (SMD) automatic conveying and positioning test mechanism
CN102500554A (en) * 2011-10-12 2012-06-20 浙江大学台州研究院 Fully-automatic visual inspection machine for wafer
CN102873032A (en) * 2012-09-14 2013-01-16 天津必利优科技发展有限公司 Automatic material separating component
CN102896094A (en) * 2012-06-29 2013-01-30 黑龙江大学 Sorting apparatus for cylindrical ball bearing automatic sorting and sleeve matching machine
CN103056114A (en) * 2013-02-01 2013-04-24 浙江大学台州研究院 Quartz crystal wafer thickness sorting machine and method
CN103077422A (en) * 2013-02-01 2013-05-01 浙江大学台州研究院 Quartz wafer counting machine
CN103071630A (en) * 2013-02-01 2013-05-01 浙江大学台州研究院 Quartz wafer frequency sorting machine and sorting method
CN103128057A (en) * 2013-02-01 2013-06-05 浙江大学台州研究院 Quartz crystal wafer thickness sorting machine with wafer arranging function and sorting and wafer arranging method
CN103383574A (en) * 2013-06-03 2013-11-06 上海索广映像有限公司 High-accuracy motion compensation positioning system and high-accuracy motion compensation positioning method
CN103422070A (en) * 2012-05-16 2013-12-04 北京北方微电子基地设备工艺研究中心有限责任公司 PECVD device, carrier board visual identification system and method

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101782384B (en) * 2009-12-11 2012-05-09 南京熊猫电子股份有限公司 Surface mount device (SMD) automatic conveying and positioning test mechanism
CN102500554A (en) * 2011-10-12 2012-06-20 浙江大学台州研究院 Fully-automatic visual inspection machine for wafer
CN103422070A (en) * 2012-05-16 2013-12-04 北京北方微电子基地设备工艺研究中心有限责任公司 PECVD device, carrier board visual identification system and method
CN103422070B (en) * 2012-05-16 2016-03-30 北京北方微电子基地设备工艺研究中心有限责任公司 PECVD device, support plate visual identifying system and method
CN102896094A (en) * 2012-06-29 2013-01-30 黑龙江大学 Sorting apparatus for cylindrical ball bearing automatic sorting and sleeve matching machine
CN102873032A (en) * 2012-09-14 2013-01-16 天津必利优科技发展有限公司 Automatic material separating component
CN102873032B (en) * 2012-09-14 2014-04-09 天津必利优科技发展有限公司 Automatic material separating component
CN103128057A (en) * 2013-02-01 2013-06-05 浙江大学台州研究院 Quartz crystal wafer thickness sorting machine with wafer arranging function and sorting and wafer arranging method
CN103071630A (en) * 2013-02-01 2013-05-01 浙江大学台州研究院 Quartz wafer frequency sorting machine and sorting method
CN103077422A (en) * 2013-02-01 2013-05-01 浙江大学台州研究院 Quartz wafer counting machine
CN103056114A (en) * 2013-02-01 2013-04-24 浙江大学台州研究院 Quartz crystal wafer thickness sorting machine and method
CN103128057B (en) * 2013-02-01 2014-07-09 浙江大学台州研究院 Quartz crystal wafer thickness sorting machine with wafer arranging function and sorting and wafer arranging method
CN103056114B (en) * 2013-02-01 2015-04-01 浙江大学台州研究院 Quartz crystal wafer thickness sorting machine and method
CN103383574A (en) * 2013-06-03 2013-11-06 上海索广映像有限公司 High-accuracy motion compensation positioning system and high-accuracy motion compensation positioning method
CN103383574B (en) * 2013-06-03 2016-08-10 上海索广映像有限公司 A kind of high-precision motion compensating alignment system and high-precision motion compensating localization method

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CB03 Change of inventor or designer information

Inventor after: Zhong Danqiu

Inventor after: Xu Huajun

Inventor after: Zhang Yi

Inventor after: Zhou Wenjun

Inventor after: Huang Yi

Inventor after: Sun Yingchun

Inventor before: Zhong Danqiu

Inventor before: Xu Huajun

Inventor before: Zhang Jie

Inventor before: Zhou Wenjun

Inventor before: Huang Yi

Inventor before: Sun Yingchun;

C53 Correction of patent for invention or patent application
COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: ZHONG DANQIU; XU HUAJUN; ZHANG ZHI; ZHOU WENJUN; HUANG YI; SUN YINGCHUN TO: ZHONG DANQIU; XU HUAJUN; ZHANG YI; ZHOU WENJUN; HUANG YI; SUN YINGCHUN

EXPY Termination of patent right or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20081126

Termination date: 20151212