CN102862243A - Sapphire X-axis oriented adhering device - Google Patents
Sapphire X-axis oriented adhering device Download PDFInfo
- Publication number
- CN102862243A CN102862243A CN2012103693648A CN201210369364A CN102862243A CN 102862243 A CN102862243 A CN 102862243A CN 2012103693648 A CN2012103693648 A CN 2012103693648A CN 201210369364 A CN201210369364 A CN 201210369364A CN 102862243 A CN102862243 A CN 102862243A
- Authority
- CN
- China
- Prior art keywords
- sapphire
- adhering
- axis oriented
- fixed
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention relates to a sapphire X-axis oriented adhering device and belongs to the field of sapphire processing equipment. The sapphire X-axis oriented adhering device comprises a base, a bottom plate and a positioning mechanism, and is characterized in that a slide rail is arranged on the base, the bottom plate is arranged on the slide rail, the positioning mechanism is fixed on one side of one end of the base and comprises a support, a positioning block and a positioning column, the positioning block is fixed on the top of the support and provided with the positioning column, and regulators are arranged on a support on one lateral side of the base. The sapphire X-axis oriented adhering device is simple in structure and reasonable in design, adhering position of sapphire chips can be determined by means of three-point positioning, adhering can be completed accurately and quickly, adhering precision is high, time is saved, and working efficiency is increased.
Description
Technical field
The present invention relates to sapphire process equipment field, relate in particular to the directed sizing device of a kind of sapphire X-axis.
Background technology
Jewel has dividing of broad sense and narrow sense.The jewel of broad sense is made a general reference all beautiful and precious building stones, and Chinese scholar substitutes with " expensive U.S. stone " word.The jewel of narrow sense then specially refers to can be used for making the building stones of valuable jewellery.It is generally acknowledged that it should have magnificent, rare and durable three characteristics.Sapphire claims again white stone, and it has good thermal conductance, fabulous electrical characteristic and dielectric property, and translucidus can be strong, and wear-resisting wiping, stable chemical nature; Hardness reaches 9 grades of Mohs, is only second to diamond, and fusing point is 2030 ℃, at high temperature still has fabulous stability, so it is widely used in industry, national defence, scientific research, the field such as civilian.Increasing raw material as all multi-products such as Solid State Laser, infrared window, Semiconductor substrate sheet, light emitting diode substrate slice, accurate anti-friction bearing, 3G mobile panel, high-grade watch faces.Being made into above-mentioned product needed cuts sapphire, sapphire is when cutting, crystal orientation to sapphire wafer requires very high, at present all be to adopt the X-ray direction finder to measure the position, crystal orientation that sapphire wafer crystal orientation deviation or wafer to be processed will be processed crystal face, if determine just to make mark, then just paste according to the mark of making, when the deviation that stickup angle generation naked eyes can't be seen, will affect the cut quality of sapphire wafer, therefore the shortcoming of this method is that efficient is low, and sapphire wafer is pasted with error and causes the wafer cutting accuracy not high.
Summary of the invention
Technical problem to be solved by this invention is to provide the directed sizing device of sapphire X-axis of a kind of reasonable in design, registration.
Technical problem to be solved by this invention realizes by the following technical solutions:
The directed sizing device of a kind of sapphire X-axis comprises pedestal, base plate and detent mechanism, and it is characterized in that: described pedestal is provided with slide rail, is mounted with base plate on the slide rail, and described base ends and a side are fixed with detent mechanism;
Described detent mechanism comprises support, locating piece and locating dowel, and described locating piece is fixed on a top of the trellis, and described locating piece is provided with locating dowel;
Be fixed with adjusting apparatus on the support of described pedestal side.
Described locating piece top is provided with screw, regulates locating dowel by screw and moves forward and backward.
Described adjusting apparatus is arranged with two in parallel.
The invention has the beneficial effects as follows: the present invention is simple in structure, reasonable in design, determines the sizing position of sapphire wafer by three-point fix, and sizing is accurate, and precision is high, and speed is fast, has saved the time, has improved operating efficiency.
Description of drawings
Fig. 1 is the directed sizing apparatus structure of a kind of sapphire X-axis of the present invention schematic diagram.
Wherein: the 1-pedestal; The 2-base plate; The 3-slide rail; The 4-support; The 5-locating piece; The 6-locating dowel; The 7-adjusting apparatus; The 8-screw.
The specific embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the present invention.
As shown in Figure 1, the directed sizing device of a kind of sapphire X-axis comprises pedestal 1, base plate 2 and detent mechanism, and pedestal 1 is provided with slide rail 3, is mounted with base plate 2 on the slide rail 3, and pedestal 1 end and a side are fixed with detent mechanism; Detent mechanism comprises support 4, locating piece 5 and locating dowel 6, locating piece 5 is fixed on support 4 tops, locating piece 5 is provided with locating dowel 6, locating piece 8 tops are provided with screw 8, regulating locating dowel 6 by screw 8 moves forward and backward, be fixed with adjusting apparatus 7 on the support 4 of pedestal 1 side, adjusting apparatus 7 is arranged with two in parallel, and purpose is the location that makes things convenient for the different length sapphire wafer.
The present invention realizes like this, sapphire wafer is placed on the bonding plate, bonding plate is installed on the base plate 2, determine the exact position of sizing by X-ray, the sapphire wafer that is placed on the bonding plate is not reaching in the situation of requirement, regulate by adjusting apparatus 7, until the numerical value that X-ray shows is when being the optimum position of sizing, locating dowel 6 by pedestal 1 top and side and adjusting apparatus 7 form the three sizing positions of naming a person for a particular job to be fixed, and at this moment, flitch is removed, carry out sizing, after sizing is finished flitch is placed on the base plate 2 again, because anchor point is fixed, the numerical value that X-ray shows must be the optimum position of sizing.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that describes in above-described embodiment and the specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (3)
1. the directed sizing device of sapphire X-axis comprises pedestal, base plate and detent mechanism, and it is characterized in that: described pedestal is provided with slide rail, is mounted with base plate on the slide rail, and described base ends and a side are fixed with detent mechanism;
Described detent mechanism comprises support, locating piece and locating dowel, and described locating piece is fixed on a top of the trellis, and described locating piece is provided with locating dowel;
Be fixed with adjusting apparatus on the support of described pedestal side.
2. the directed sizing device of described sapphire X-axis according to claim 1, it is characterized in that: described locating piece top is provided with screw.
3. the directed sizing device of described sapphire X-axis according to claim 1, it is characterized in that: described adjusting apparatus is arranged with two in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103693648A CN102862243A (en) | 2012-09-27 | 2012-09-27 | Sapphire X-axis oriented adhering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103693648A CN102862243A (en) | 2012-09-27 | 2012-09-27 | Sapphire X-axis oriented adhering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102862243A true CN102862243A (en) | 2013-01-09 |
Family
ID=47441506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103693648A Pending CN102862243A (en) | 2012-09-27 | 2012-09-27 | Sapphire X-axis oriented adhering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102862243A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107932766A (en) * | 2017-12-26 | 2018-04-20 | 常州市好利莱光电科技有限公司 | One kind orientation frock and orientation system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201275811Y (en) * | 2008-10-29 | 2009-07-22 | 西安华晶电子技术有限公司 | Locator for binder material |
| CN101502986A (en) * | 2009-03-27 | 2009-08-12 | 英利能源（中国）有限公司 | Positioning apparatus for bonding silicon block |
| CN201456253U (en) * | 2009-06-16 | 2010-05-12 | 宁晋赛美港龙电子材料有限公司 | Special fixture for use in cutting of monocrystalline silicon for making seed crystals |
| CN201792431U (en) * | 2010-05-18 | 2011-04-13 | 云南蓝晶科技股份有限公司 | Sapphire crystal axial positioning bonding device |
| CN201979618U (en) * | 2011-01-12 | 2011-09-21 | 浙江瑞迪硅谷新能源科技有限公司 | Bonding clamp for single crystal rod |
| CN202114826U (en) * | 2011-04-07 | 2012-01-18 | 苏州协鑫光伏科技有限公司 | Positioner |
| KR20120084859A (en) * | 2011-01-21 | 2012-07-31 | 주식회사 다우빔 | Fixing jig of supporting plate and slicing apparatus for silicon ingot using thereof |
| CN202826124U (en) * | 2012-09-27 | 2013-03-27 | 铜陵市琨鹏光电科技有限公司 | Sapphire X-axis directional bonding device |
-
2012
- 2012-09-27 CN CN2012103693648A patent/CN102862243A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201275811Y (en) * | 2008-10-29 | 2009-07-22 | 西安华晶电子技术有限公司 | Locator for binder material |
| CN101502986A (en) * | 2009-03-27 | 2009-08-12 | 英利能源（中国）有限公司 | Positioning apparatus for bonding silicon block |
| CN201456253U (en) * | 2009-06-16 | 2010-05-12 | 宁晋赛美港龙电子材料有限公司 | Special fixture for use in cutting of monocrystalline silicon for making seed crystals |
| CN201792431U (en) * | 2010-05-18 | 2011-04-13 | 云南蓝晶科技股份有限公司 | Sapphire crystal axial positioning bonding device |
| CN201979618U (en) * | 2011-01-12 | 2011-09-21 | 浙江瑞迪硅谷新能源科技有限公司 | Bonding clamp for single crystal rod |
| KR20120084859A (en) * | 2011-01-21 | 2012-07-31 | 주식회사 다우빔 | Fixing jig of supporting plate and slicing apparatus for silicon ingot using thereof |
| CN202114826U (en) * | 2011-04-07 | 2012-01-18 | 苏州协鑫光伏科技有限公司 | Positioner |
| CN202826124U (en) * | 2012-09-27 | 2013-03-27 | 铜陵市琨鹏光电科技有限公司 | Sapphire X-axis directional bonding device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107932766A (en) * | 2017-12-26 | 2018-04-20 | 常州市好利莱光电科技有限公司 | One kind orientation frock and orientation system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200536695A (en) | Scribe head and scriber | |
| CN105814669B (en) | The cutting-off method and work holding fixture.In of workpiece | |
| CN202826124U (en) | Sapphire X-axis directional bonding device | |
| TWI472050B (en) | Production of integrated thin film solar cells | |
| CN102632555A (en) | Cutting method of crystal blank | |
| JP2009535224A (en) | Precision slicing method for large workpieces | |
| CN102862243A (en) | Sapphire X-axis oriented adhering device | |
| CN102837372B (en) | Worktable of multi-wire sawing machine | |
| CN101530951A (en) | Brittle substrate and laser cutting method therefor | |
| CN207630298U (en) | A kind of ultra high efficiency multi-wire saw diamond wire | |
| CN209570109U (en) | A kind of crystal ranging verifying attachment of removable adjusting | |
| CN202764052U (en) | Multi-line cutting machine for processing crisp and hard material curved surfaces | |
| CN105108921A (en) | Arc-length-variable wire cutting saw for machining crisp and hard materials | |
| CN102873771A (en) | Method for cutting sapphire by cutting wire | |
| CN207155898U (en) | A kind of manual Fast trim frock of EVA adhesive film | |
| CN202826126U (en) | Locating clamp of sapphire binder materials | |
| CN102862244A (en) | Sapphire binder positioning clamp | |
| CN109449195A (en) | A kind of display panel motherboard and preparation method thereof | |
| CN101870850A (en) | Mortar cutting fluid for cutting sapphire wafers | |
| CN210025870U (en) | Multi-wire saw workstation correcting unit | |
| CN202748019U (en) | Mechanical calibration machine | |
| CN202826123U (en) | Sapphire machining clamp | |
| CN103171059B (en) | Clamp for real-time crystal orientation measurement of sapphire processing and measuring method thereof | |
| CN102581974B (en) | Crystal cutting, positioning and bonding platform | |
| CN202656229U (en) | Optical filter right angle aligning device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130109 |