CN202826124U - Sapphire X-axis directional bonding device - Google Patents
Sapphire X-axis directional bonding device Download PDFInfo
- Publication number
- CN202826124U CN202826124U CN 201220503823 CN201220503823U CN202826124U CN 202826124 U CN202826124 U CN 202826124U CN 201220503823 CN201220503823 CN 201220503823 CN 201220503823 U CN201220503823 U CN 201220503823U CN 202826124 U CN202826124 U CN 202826124U
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- sapphire
- location
- fixed
- support
- base
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Abstract
A sapphire X-axis directional bonding device belongs to the field of sapphire processing equipment and comprises a base, a bottom plate and a location mechanism. The sapphire X-axis directional bonding device is characterized in that a slide rail is arranged on the base, the bottom plate is positioned on the slide rail, and the location mechanism is fixed at the end and on one side of the base. The location mechanism comprises a support, a location block and a location column, wherein the location block is fixed at the top of the support, the location column is arranged on the location block, and an adjusting meter is fixed on the support on the lateral side of the base. The sapphire X-axis directional bonding device is simple in structure and reasonable in design, uses three-point location to confirm bonding positions of sapphire wafers, is accurate in bonding, high in accuracy and quick in speed, saves time and improves work efficiency.
Description
Technical field
The utility model relates to sapphire process equipment field, relates in particular to the directed sizing device of a kind of sapphire X-axis.
Background technology
Jewel has dividing of broad sense and narrow sense.The jewel of broad sense is made a general reference all beautiful and precious building stones, and Chinese scholar substitutes with " expensive U.S. stone " word.The jewel of narrow sense then specially refers to can be used for making the building stones of valuable jewellery.It is generally acknowledged that it should have magnificent, rare and durable three characteristics.Sapphire claims again white stone, and it has good thermal conductance, fabulous electrical characteristic and dielectric property, and translucidus can be strong, and wear-resisting wiping, stable chemical nature; Hardness reaches 9 grades of Mohs, is only second to diamond, and fusing point is 2030 ℃, at high temperature still has fabulous stability, so it is widely used in industry, national defence, scientific research, the field such as civilian.Increasing raw material as all multi-products such as Solid State Laser, infrared window, Semiconductor substrate sheet, light emitting diode substrate slice, accurate anti-friction bearing, 3G mobile panel, high-grade watch faces.Being made into above-mentioned product needed cuts sapphire, sapphire is when cutting, crystal orientation to sapphire wafer requires very high, at present all be to adopt the X-ray direction finder to measure the position, crystal orientation that sapphire wafer crystal orientation deviation or wafer to be processed will be processed crystal face, if determine just to make mark, then just paste according to the mark of making, when the deviation that stickup angle generation naked eyes can't be seen, will affect the cut quality of sapphire wafer, therefore the shortcoming of this method is that efficient is low, and sapphire wafer is pasted with error and causes the wafer cutting accuracy not high.
The utility model content
Technical problem to be solved in the utility model is to provide the directed sizing device of sapphire X-axis of a kind of reasonable in design, registration.
Technical problem to be solved in the utility model realizes by the following technical solutions:
The directed sizing device of a kind of sapphire X-axis comprises pedestal, base plate and detent mechanism, and it is characterized in that: described pedestal is provided with slide rail, is mounted with base plate on the slide rail, and described base ends and a side are fixed with detent mechanism;
Described detent mechanism comprises support, locating piece and locating dowel, and described locating piece is fixed on a top of the trellis, and described locating piece is provided with locating dowel;
Be fixed with adjusting apparatus on the support of described pedestal side.
Described locating piece top is provided with screw, regulates locating dowel by screw and moves forward and backward.
Described adjusting apparatus is arranged with two in parallel.
The beneficial effects of the utility model are: the utility model is simple in structure, reasonable in design, determines the sizing position of sapphire wafer by three-point fix, and sizing is accurate, and precision is high, and speed is fast, has saved the time, has improved operating efficiency.
Description of drawings
Fig. 1 is the structural representation of the directed sizing device of a kind of sapphire X-axis of the utility model.
Wherein: the 1-pedestal; The 2-base plate; The 3-slide rail; The 4-support; The 5-locating piece; The 6-locating dowel; The 7-adjusting apparatus; The 8-screw.
The specific embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
As shown in Figure 1, the directed sizing device of a kind of sapphire X-axis comprises pedestal 1, base plate 2 and detent mechanism, and pedestal 1 is provided with slide rail 3, is mounted with base plate 2 on the slide rail 3, and pedestal 1 end and a side are fixed with detent mechanism; Detent mechanism comprises support 4, locating piece 5 and locating dowel 6, locating piece 5 is fixed on support 4 tops, locating piece 5 is provided with locating dowel 6, locating piece 8 tops are provided with screw 8, regulating locating dowel 6 by screw 8 moves forward and backward, be fixed with adjusting apparatus 7 on the support 4 of pedestal 1 side, adjusting apparatus 7 is arranged with two in parallel, and purpose is the location that makes things convenient for the different length sapphire wafer.
The utility model is to realize like this, sapphire wafer is placed on the bonding plate, bonding plate is installed on the base plate 2, determine the exact position of sizing by X-ray, be placed on the sapphire wafer on the bonding plate in the situation that do not reach requirement, regulate by adjusting apparatus 7, until the numerical value that X-ray shows is when being the optimum position of sizing, locating dowel 6 by pedestal 1 top and side and adjusting apparatus 7 form the three sizing positions of naming a person for a particular job to be fixed, and at this moment, flitch is removed, carry out sizing, after sizing is finished flitch is placed on the base plate 2 again, because anchor point is fixed, the numerical value that X-ray shows must be the optimum position of sizing.
Above demonstration and described basic principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that describes in above-described embodiment and the specification just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (3)
1. the directed sizing device of sapphire X-axis comprises pedestal, base plate and detent mechanism, and it is characterized in that: described pedestal is provided with slide rail, is mounted with base plate on the slide rail, and described base ends and a side are fixed with detent mechanism;
Described detent mechanism comprises support, locating piece and locating dowel, and described locating piece is fixed on a top of the trellis, and described locating piece is provided with locating dowel;
Be fixed with adjusting apparatus on the support of described pedestal side.
2. the directed sizing device of described sapphire X-axis according to claim 1, it is characterized in that: described locating piece top is provided with screw.
3. the directed sizing device of described sapphire X-axis according to claim 1, it is characterized in that: described adjusting apparatus is arranged with two in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220503823 CN202826124U (en) | 2012-09-27 | 2012-09-27 | Sapphire X-axis directional bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220503823 CN202826124U (en) | 2012-09-27 | 2012-09-27 | Sapphire X-axis directional bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202826124U true CN202826124U (en) | 2013-03-27 |
Family
ID=47937910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220503823 Expired - Fee Related CN202826124U (en) | 2012-09-27 | 2012-09-27 | Sapphire X-axis directional bonding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202826124U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102862243A (en) * | 2012-09-27 | 2013-01-09 | 铜陵市琨鹏光电科技有限公司 | Sapphire X-axis oriented adhering device |
| CN104101276A (en) * | 2014-06-26 | 2014-10-15 | 中磁科技股份有限公司 | Adhesive material tooling precision detection auxiliary tooling and detection method |
-
2012
- 2012-09-27 CN CN 201220503823 patent/CN202826124U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102862243A (en) * | 2012-09-27 | 2013-01-09 | 铜陵市琨鹏光电科技有限公司 | Sapphire X-axis oriented adhering device |
| CN104101276A (en) * | 2014-06-26 | 2014-10-15 | 中磁科技股份有限公司 | Adhesive material tooling precision detection auxiliary tooling and detection method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20130927 |