CN102856656A - Metamaterial and preparation method thereof - Google Patents
Metamaterial and preparation method thereof Download PDFInfo
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- CN102856656A CN102856656A CN2012102687264A CN201210268726A CN102856656A CN 102856656 A CN102856656 A CN 102856656A CN 2012102687264 A CN2012102687264 A CN 2012102687264A CN 201210268726 A CN201210268726 A CN 201210268726A CN 102856656 A CN102856656 A CN 102856656A
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Abstract
The invention provides a metamaterial. The metamaterial comprises at least one metamaterial slice, each metamaterial slice comprises a substrate and a plurality of artificial micro-structures distributed on the substrate, and the substrate is made from a benzocyclobutene resin material. According to the metamaterial, the substrate made from benzocyclobutene resin material has better dielectric property compared wit the existing metamaterial, the dielectric property is very stable even at high temperature, and therefore, the metamaterial produced by the substrate can also have high stability of dielectric property at high temperature.
Description
Technical field
The invention belongs to the artificial composite material field, relate in particular to a kind of super material and preparation method thereof.
Background technology
Super material refers to artificial composite structure or the composite material that some have the not available extraordinary physical property of natural material.Structurally ordered design by on the key physical yardstick of material can break through the restriction of some apparent natural law, thereby maybe must exceed the meta-materials function of the intrinsic common character of nature.Super material generally includes substrate and cycle and is arranged in a plurality of artificial micro-structural on the substrate, and the part substrate that each artificial micro-structural is adhered to it can be regarded a super material cell as.The characteristic that super material character and function are arranged in the artificial micro-structural on the substrate by the characteristic of substrate and cycle determines jointly.Corresponding to the electromagnetic wave of characteristic frequency, each super material cell shows an effective dielectric constant and magnetic permeability, and these two physical parameters corresponding respectively electric field response and the magnetic responsiveness of material.
The present employed substrate of super material mostly is the polymer composites such as FR-4, F4b.Therefore unstable as substrate dielectric property under higher temperature that material makes, namely under higher temperature, the dielectric constant of this substrate is unstable, by the less stable of the prepared super dielectric material performance of this class material.
The dielectric loss of benzocyclobutane olefine resin can be less than 0.0008 in the 1kHz-1MHz scope, dielectric constant is 2.7, and this value is almost constant between 25-200 ℃, and after frequency surpasses 20GHz, the dielectric constant of its room temperature can also remain on 2.5, and loss is lower than 0.002 when 10GHz.Because its remarkable dielectric property, make it in the advanced microelectronic device, obtain application, comprise multilayer wiring, the embedding artificial lamp overlay film of the medium internal layer of aluminium and GaAs, the salient point of flip chip bonding and wiring, CSP encapsulation, high-frequency element and passive component uses as critical material.This material also has low hydroscopicity, high thermal stability and chemical stability (glass transition temperature Tg＞350 ℃), and the advantage such as high film evenness (general＞95%).
The above-mentioned good characteristic of benzocyclobutane olefine resin is so that it can be as the substrate of super material.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of dielectric property stable super material.
The present invention is that the technical scheme that the above-mentioned technical problem of solution adopts is: a kind of super material, comprise at least one super sheet of material, each super sheet of material comprises substrate and is arranged in a plurality of artificial micro-structural on the substrate, and described substrate is made by the benzocyclobutene resin material.
Further, described artificial micro-structural is metal micro structure, and described metal micro structure is comprised of one or more metal wire.
Further, described metal wire is copper cash, silver-colored line or aluminum steel.
Further, described artificial micro-structural is the alabastrine metal micro structure in plane, described metal micro structure has the first metal wire and the second metal wire of mutually vertically dividing equally, described the first metal wire is identical with the length of the second metal wire, described the first metal wire two ends are connected with two the first metal branches of equal length, described the first metal wire two ends are connected on the mid point of two the first metal branches, described the second metal wire two ends are connected with two the second metal branches of equal length, described the second metal wire two ends are connected on the mid point of two the second metal branches, the equal in length of described the first metal branch and the second metal branch.
Further, each the first metal branch of the alabastrine metal micro structure in described plane and the two ends of each the second metal branch also are connected with identical the 3rd metal branch, and the mid point of corresponding the 3rd metal branch links to each other with the end points of the first metal branch and the second metal branch respectively.
Further, the first metal wire of the alabastrine metal micro structure in described plane and the second metal wire are provided with two kinks, and the alabastrine metal micro structure in described plane all overlaps with former figure with intersection point figure to any direction 90-degree rotation in metal micro structure plane of living in of the second metal wire around the first metal wire.
According to super material of the present invention, substrate is made by the benzocyclobutene resin material, with respect to existing super material, the dielectric property of substrate are better, therefore dielectric property very stable all under very high temperature also can be shown the high stability of dielectric property when the high temperature by the prepared super material of this substrate.
The present invention also provides a kind of super material preparation method in addition, and the method comprises the steps:
S1, preparation benzocyclobutene substrate;
S2, on described benzocyclobutene substrate copper membrane;
S3, etching obtains a plurality of artificial micro-structural of particular geometric pattern on copper film.
Further, the idiographic flow of step S1 is as follows:
At first, the benzocyclobutane olefine resin is placed on the mould hot-forming, hot pressing temperature is 200-300 ℃, and hot pressing pressure is 30-80MPa, and the dwell time looks hot pressing temperature and changes; When hot pressing temperature is 200-250 ℃, pressurize 1-5.5h; When hot pressing temperature is 250-270 ℃, pressurize 20-80min, hot pressing temperature is 270-300 ℃, pressurize 5-40min;
Then, mould is removed to cold pressing device, cold pressing pressure and hot pressing pressure are consistent, and naturally cool to the demoulding after the room temperature, obtain the benzocyclobutene substrate.
Further, the idiographic flow of step S2 is as follows:
The pre-treatment of benzocyclobutene substrate; The benzocyclobutene substrate that step S1 is obtained carries out blasting treatment, and the sand that sandblast is used is the 40-250 order as resin sand, quartz sand, ceramic sand, steel sand, copper sand, iron sand, silicon carbide sand or emergy, order number, and pressure is 1kg/cm
2-10kg/cm
2
And one of them surface of cyclobutane substrate on coating hot-melt adhesive, copper film is placed on the PUR, utilize hot press with copper film with and the cyclobutane substrate press together, in the hot pressing, hot pressing temperature is 90-185 ℃, hot pressing pressure is 8-18kg/cm2, and hot pressing time is 30-90min, and vacuum degree is below 25mbar.
Further, the thickness of described copper film is 0.005-0.1mm, and the thickness of PUR is 0.01-0.2mm, and the thickness of described benzocyclobutene substrate is 0.1-5mm.
Description of drawings
Fig. 1 is the structural representation of super material of the present invention;
Fig. 2 is the stack schematic diagram of super its super sheet of material of material of the present invention;
Fig. 3 is the schematic diagram of the alabastrine metal micro structure in plane of the present invention;
Fig. 4 is a kind of derived structure of the alabastrine metal micro structure in plane shown in Figure 3;
Fig. 5 is a kind of distressed structure of the alabastrine metal micro structure in plane shown in Figure 3.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
As shown in Figure 1, super material 100 of the present invention comprises at least one super sheet of material 10, and each super sheet of material 10 comprises substrate 11 and be arranged in a plurality of artificial micro-structural 12 on the substrate 11, and described substrate 11 described substrates are made by the benzocyclobutene resin material.Among Fig. 1, super material has three super sheet of material 10, and the quantity of super sheet of material 10 can arrange flexibly according to different needs.As shown in Figure 2, a plurality of super sheet of material 10 can utilize PUR RJ to bond together.
According to super material of the present invention, substrate is made by the benzocyclobutene resin material, with respect to existing super material, the dielectric property of substrate are better, therefore dielectric property very stable all under very high temperature also can be shown the high stability of dielectric property when the high temperature by the prepared super material of this substrate.In addition, the benzocyclobutane olefine resin also has good high-temperature stability and chemical stability, so resistance to elevated temperatures and the weather resistance of the substrate made of benzocyclobutene resin are also fine, the characteristic that these are good, so that should can be widely used in the fields such as antenna, radome by super material.
Wherein, should be applied in field of antenna by super material, and only need the arranging of artificial micro-structural on the design substrate to get final product.
Among the present invention, described artificial micro-structural is preferably metal micro structure, and described metal micro structure is comprised of one or more metal wire, and described metal wire is preferably copper cash, silver-colored line or aluminum steel.
Among the present invention, described artificial micro-structural can be the alabastrine metal micro structure in plane as shown in Figure 3, described alabastrine metal micro structure has the first metal wire J1 and the second metal wire J2 that mutually vertically divides equally, described the first metal wire J1 is identical with the length of the second metal wire J2, described the first metal wire J1 two ends are connected with two the first F1 of metal branch of equal length, described the first metal wire J1 two ends are connected on the mid point of two the first F1 of metal branch, described the second metal wire J2 two ends are connected with two the second F2 of metal branch of equal length, described the second metal wire J2 two ends are connected on the mid point of two the second F2 of metal branch, the equal in length of described the first F1 of metal branch and the second F2 of metal branch.
Fig. 4 is a kind of derived structure of the alabastrine metal micro structure in plane shown in Figure 3.Its two ends at each first F1 of metal branch and each the second F2 of metal branch all are connected with identical the 3rd F3 of metal branch, and the mid point of corresponding the 3rd F3 of metal branch links to each other with the end points of the first F1 of metal branch and the second F2 of metal branch respectively.The rest may be inferred, and the present invention can also derive the metal micro structure of other form.
Fig. 5 is a kind of distressed structure of the alabastrine metal micro structure in plane shown in Figure 3, the metal micro structure of this kind structure, the first metal wire J1 and the second metal wire J2 are not straight lines, but folding line, the first metal wire J1 and the second metal wire J2 are provided with two kink WZ, but the first metal wire J1 remains vertical with the second metal wire J2 to be divided equally, by arrange kink towards with the relative position of kink on the first metal wire and the second metal wire all overlap with former figure so that metal micro structure shown in Figure 5 winds perpendicular to the axis of the first metal wire and the second metal wire intersection point figure to any direction 90-degree rotation.In addition, other distortion can also be arranged, for example, the first metal wire J1 and the second metal wire J2 all arrange a plurality of kink WZ.
The present invention also provides a kind of super material preparation method in addition, and the method comprises the steps:
S1, preparation benzocyclobutene substrate; At first, the benzocyclobutane olefine resin is placed on the mould hot-forming, hot pressing temperature is 200-300 ℃, and hot pressing pressure is 30-80MPa, and the dwell time looks hot pressing temperature and changes; When hot pressing temperature is 200-250 ℃, pressurize 1-5.5h; When hot pressing temperature is 250-270 ℃, pressurize 20-80min, hot pressing temperature is 270-300 ℃, pressurize 5-40min; Then, mould is removed to cold pressing device, cold pressing pressure and hot pressing pressure are consistent, and naturally cool to the demoulding after the room temperature, obtain the benzocyclobutene substrate.
S2, on described benzocyclobutene substrate copper membrane; At first, carry out the pre-treatment of benzocyclobutene substrate; The benzocyclobutene substrate that step S1 is obtained carries out blasting treatment, and the sand that sandblast is used is the 40-250 order as resin sand, quartz sand, ceramic sand, steel sand, copper sand, iron sand, silicon carbide sand or emergy, order number, and pressure is 1kg/cm
2-10kg/cm
2Then, and one of them surface of cyclobutane substrate on coating hot-melt adhesive, copper film is placed on the PUR, utilize hot press with copper film with and the cyclobutane substrate press together, in the hot pressing, hot pressing temperature is 90-185 ℃, hot pressing pressure is 8-18kg/cm
2, hot pressing time is 30-90min, vacuum degree is below 25mbar.
S3, etching obtains a plurality of artificial micro-structural of particular geometric pattern on copper film.Will etching area the diaphragm in (zones beyond a plurality of artificial micro-structurals) remove, the contact chemical solution reaches the effect of dissolved corrosion when etching, the final remaining a plurality of artificial micro-structural of arranging at substrate that is that we need.
In the said method, the thickness of described copper film is 0.005-0.1mm, and the thickness of PUR is 0.01-0.2mm, and the thickness of described benzocyclobutene substrate is 0.1-5mm.
Among the present invention, PUR can use TPU PUR, PU PUR, PO PUR, EVA PUR etc.
Above disclosed only is preferred embodiment of the present invention, certainly can not limit with this interest field of the present invention, and the equivalent variations of therefore doing according to claim of the present invention still belongs to the scope that the present invention is contained.
Claims (10)
1. a super material is characterized in that, comprises at least one super sheet of material, and each super sheet of material comprises substrate and be arranged in a plurality of artificial micro-structural on the substrate, and described substrate is made by the benzocyclobutene resin material.
2. super material according to claim 1 is characterized in that, described artificial micro-structural is metal micro structure, and described metal micro structure is comprised of one or more metal wire.
3. super material according to claim 2 is characterized in that, described metal wire is copper cash, silver-colored line or aluminum steel.
4. super material according to claim 3, it is characterized in that, described artificial micro-structural is the alabastrine metal micro structure in plane, described metal micro structure has the first metal wire and the second metal wire of mutually vertically dividing equally, described the first metal wire is identical with the length of the second metal wire, described the first metal wire two ends are connected with two the first metal branches of equal length, described the first metal wire two ends are connected on the mid point of two the first metal branches, described the second metal wire two ends are connected with two the second metal branches of equal length, described the second metal wire two ends are connected on the mid point of two the second metal branches, the equal in length of described the first metal branch and the second metal branch.
5. super material according to claim 4, it is characterized in that, each the first metal branch of the alabastrine metal micro structure in described plane and the two ends of each the second metal branch also are connected with identical the 3rd metal branch, and the mid point of corresponding the 3rd metal branch links to each other with the end points of the first metal branch and the second metal branch respectively.
6. super material according to claim 4, it is characterized in that, the first metal wire of the alabastrine metal micro structure in described plane and the second metal wire are provided with two kinks, and the alabastrine metal micro structure in described plane all overlaps with former figure with intersection point figure to any direction 90-degree rotation in metal micro structure plane of living in of the second metal wire around the first metal wire.
7. a super material preparation method is characterized in that, comprises the steps:
S1, preparation benzocyclobutene substrate;
S2, on described benzocyclobutene substrate copper membrane;
S3, etching obtains a plurality of artificial micro-structural of particular geometric pattern on copper film.
8. super material preparation method according to claim 7 is characterized in that, the idiographic flow of step S1 is as follows:
At first, the benzocyclobutane olefine resin is placed on the mould hot-forming, hot pressing temperature is 200-300 ℃, and hot pressing pressure is 30-80MPa, and the dwell time looks hot pressing temperature and changes; When hot pressing temperature is 200-250 ℃, pressurize 1-5.5h; When hot pressing temperature is 250-270 ℃, pressurize 20-80min, hot pressing temperature is 270-300 ℃, pressurize 5-40min;
Then, mould is removed to cold pressing device, cold pressing pressure and hot pressing pressure are consistent, and naturally cool to the demoulding after the room temperature, obtain the benzocyclobutene substrate.
9. super material preparation method according to claim 7 is characterized in that, the idiographic flow of step S2 is as follows:
The pre-treatment of benzocyclobutene substrate; The benzocyclobutene substrate that step S1 is obtained carries out blasting treatment, and the sand that sandblast is used is the 40-250 order as resin sand, quartz sand, ceramic sand, steel sand, copper sand, iron sand, silicon carbide sand or emergy, order number, and pressure is 1kg/cm
2-10kg/cm
2
And one of them surface of cyclobutane substrate on coating hot-melt adhesive, copper film is placed on the PUR, utilize hot press with copper film with and the cyclobutane substrate press together, in the hot pressing, hot pressing temperature is 90-185 ℃, hot pressing pressure is 8-18kg/cm
2, hot pressing time is 30-90min, vacuum degree is below 25mbar.
10. super material preparation method according to claim 9 is characterized in that, the thickness of described copper film is 0.005-0.1mm, and the thickness of PUR is 0.01-0.2mm, and the thickness of described benzocyclobutene substrate is 0.1-5mm.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108615975A (en) * | 2018-05-03 | 2018-10-02 | 合肥光博量子科技有限公司 | A kind of radome of breakage-proof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480001A (en) * | 2011-03-25 | 2012-05-30 | 深圳光启高等理工研究院 | Preparation method of metamaterial |
| CN202259698U (en) * | 2011-10-25 | 2012-05-30 | 哈尔滨理工大学 | Fractal structure-based multi-tape polarization insensitive terahertz metamaterial absorber |
| CN202275915U (en) * | 2011-07-29 | 2012-06-13 | 深圳光启高等理工研究院 | Resonant cavity |
| CN102570044A (en) * | 2011-09-29 | 2012-07-11 | 深圳光启高等理工研究院 | Base station antenna |
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2012
- 2012-07-31 CN CN201210268726.4A patent/CN102856656B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480001A (en) * | 2011-03-25 | 2012-05-30 | 深圳光启高等理工研究院 | Preparation method of metamaterial |
| CN202275915U (en) * | 2011-07-29 | 2012-06-13 | 深圳光启高等理工研究院 | Resonant cavity |
| CN102570044A (en) * | 2011-09-29 | 2012-07-11 | 深圳光启高等理工研究院 | Base station antenna |
| CN202259698U (en) * | 2011-10-25 | 2012-05-30 | 哈尔滨理工大学 | Fractal structure-based multi-tape polarization insensitive terahertz metamaterial absorber |
Non-Patent Citations (1)
| Title |
|---|
| LI-MING SI ET AL.: "Characterization and application of planar terahertz narrow bandpass filter with metamaterial resonators", 《METAMATERIALS, 2008 INTERNATIONAL WORKSHOP ON》, 12 November 2008 (2008-11-12), pages 351 - 352 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108615975A (en) * | 2018-05-03 | 2018-10-02 | 合肥光博量子科技有限公司 | A kind of radome of breakage-proof |
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Effective date of registration: 20210422 Address after: 518057 2 / F, software building, No.9, Gaoxin Middle Road, Nanshan District, Shenzhen, Guangdong Province Patentee after: KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Address before: 518034. A, 18B, CIC international business center, 1061 Mei Xiang Road, Shenzhen, Guangdong, Futian District Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |