CN102848098A - Special junction-temperature-reducing welding flux for solar diode - Google Patents
Special junction-temperature-reducing welding flux for solar diode Download PDFInfo
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- CN102848098A CN102848098A CN2012103787518A CN201210378751A CN102848098A CN 102848098 A CN102848098 A CN 102848098A CN 2012103787518 A CN2012103787518 A CN 2012103787518A CN 201210378751 A CN201210378751 A CN 201210378751A CN 102848098 A CN102848098 A CN 102848098A
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- scolder
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Abstract
The invention relates to a special junction-temperature-reducing welding flux for a solar diode, which is composed of the following raw materials in percentage by mass: 92.5-93% of lead, 4.5-5.0% of tin and 2.5-3.0% of silver. The melting point of the welding flux is 260-270 DEG C, and the thickness is 0.07-0.1 mm. The welding flux has the advantages that the melting point of the welding flux is reduced from the original 275-280 DEG C to 260-270 DEG C, the consumption of electric energy can be effectively reduced and the service life of equipment can be prolonged.
Description
Technical field
The present invention relates to a kind of diode scolder, particularly a kind of solar diode and fall the special-purpose scolder of junction temperature.
Background technology
The general scolder proportioning that adopts of conventional diode continuous tunnel furnace welding: lead 93%, tin 5%, silver 2%.Its fusing point is about 275-280 ℃, and thickness is 0.05mm.General-purpose diode is low because junction temperature is required, and chip area is little, is subjected to thermal stress lampet situation, and scolder proportioning aspect biases toward the optimum requirement of welding, and uses in the situation of consideration reduction cost, thus exist high-temperature behavior low, the situations such as poor radiation.
Solar diode is multiplex on terminal box at present, and the client is higher for the junction temperature instructions for use of diode, in different about 120-145 ℃ of chip area, so the scolder of general-purpose diode is slightly poor for the heat radiation aspect.
The present invention is directed to the shortcoming of the heat radiation aspect of existing scolder, designed a kind of solar diode and fallen the special-purpose scolder of junction temperature.The silver content that this scolder process increases weld tabs can effectively promote the heat-sinking capability of diode, indirectly is equivalent to promote the high temperature capabilities of diode, can effectively reduce junction temperature 5-10 ℃ according to actual operating position.
Summary of the invention
The special-purpose scolder of junction temperature falls in a kind of solar diode, scolder by following raw material according to the mass percent meter,
Plumbous 92.5-93
Tin 4.5-5.0
Silver 2.5-3.0
This scolder fusing point is 260-270 ℃, and thickness is 0.07-0.1mm.
The coefficient of heat transfer of silver is 429W/m.K, in setting up, diode belongs to high-thermal conductive metal material, the more coefficient of heat transfers of silver content are higher in the scolder, heat conductivility is better, and the diode chip for backlight unit junction temperature is lower, and high-temperature behavior is stronger, but silver content can not be too much, it is excessive that too much silver content easily causes scolder to melt, and forms chip and connect the utmost point, so the silver content of 2.5-3.0% belongs to moderate state in the welding of solar diode.
The scolder fusing point is reduced to 260-270 ℃ by original 275-280 ℃, can effectively reduce electric energy, the use of extension device
The specific embodiment
Embodiment 1
The special-purpose scolder of junction temperature falls in a kind of solar diode, scolder by following raw material according to the mass percent meter,
Lead 92.5, tin 5.0, silver 2.5.
This scolder fusing point is 270 ℃, and thickness is 0.07mm.
Embodiment 2
The special-purpose scolder of junction temperature falls in a kind of solar diode, scolder by following raw material according to the mass percent meter,
Lead 92.5, tin 4.5, silver 3.0.
This scolder fusing point is 260 ℃, and thickness is 0.07mm.
Embodiment 3
The special-purpose scolder of junction temperature falls in a kind of solar diode, scolder by following raw material according to the mass percent meter,
Lead 93, tin 4.5, silver 2.5.
This scolder fusing point is 265 ℃, and thickness is 0.1mm.
Claims (2)
1. the special-purpose scolder of junction temperature falls in a solar diode, it is characterized in that, scolder by following raw material according to the mass percent meter,
Plumbous 92.5-93
Tin 4.5-5.0
Silver 2.5-3.0.
2. fall the special-purpose scolder of junction temperature according to claims 1 described a kind of solar diode, it is characterized in that the scolder fusing point is 260-270 ℃, thickness is 0.07-0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103787518A CN102848098A (en) | 2012-10-09 | 2012-10-09 | Special junction-temperature-reducing welding flux for solar diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103787518A CN102848098A (en) | 2012-10-09 | 2012-10-09 | Special junction-temperature-reducing welding flux for solar diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102848098A true CN102848098A (en) | 2013-01-02 |
Family
ID=47395287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103787518A Pending CN102848098A (en) | 2012-10-09 | 2012-10-09 | Special junction-temperature-reducing welding flux for solar diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102848098A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105499732A (en) * | 2015-12-30 | 2016-04-20 | 连云港丰达电子有限公司 | Welding production process of rectifier diode not easy to be punctured |
| US10421161B2 (en) | 2016-05-06 | 2019-09-24 | Honeywell International Inc. | High quality, void and inclusion free alloy wire |
| CN115781098A (en) * | 2023-01-19 | 2023-03-14 | 广东成利泰科技有限公司 | High-temperature-resistant and antioxidant soldering tin powder and paste containing metal indium and preparation method of soldering tin powder and paste |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60196285A (en) * | 1984-03-19 | 1985-10-04 | Furukawa Electric Co Ltd:The | Solder alloy |
| JPH0496311A (en) * | 1990-08-13 | 1992-03-27 | Nec Corp | Capacitor |
| CN102642096A (en) * | 2011-02-18 | 2012-08-22 | 苏州宇邦新型材料有限公司 | Solder, tin-plated solder strip adopting solder and preparation methods of solder and tin-plated solder strip |
-
2012
- 2012-10-09 CN CN2012103787518A patent/CN102848098A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60196285A (en) * | 1984-03-19 | 1985-10-04 | Furukawa Electric Co Ltd:The | Solder alloy |
| JPH0496311A (en) * | 1990-08-13 | 1992-03-27 | Nec Corp | Capacitor |
| CN102642096A (en) * | 2011-02-18 | 2012-08-22 | 苏州宇邦新型材料有限公司 | Solder, tin-plated solder strip adopting solder and preparation methods of solder and tin-plated solder strip |
Non-Patent Citations (1)
| Title |
|---|
| 王恭年等: "焊料在电子器件中的应用", 《真空电子技术》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105499732A (en) * | 2015-12-30 | 2016-04-20 | 连云港丰达电子有限公司 | Welding production process of rectifier diode not easy to be punctured |
| CN105499732B (en) * | 2015-12-30 | 2018-01-26 | 连云港丰达电子有限公司 | A kind of welding production technique for the commutation diode for being not easy to puncture |
| US10421161B2 (en) | 2016-05-06 | 2019-09-24 | Honeywell International Inc. | High quality, void and inclusion free alloy wire |
| CN115781098A (en) * | 2023-01-19 | 2023-03-14 | 广东成利泰科技有限公司 | High-temperature-resistant and antioxidant soldering tin powder and paste containing metal indium and preparation method of soldering tin powder and paste |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130102 |