CN102011025A - Ultrahigh-temperature-resistant lead-free solder - Google Patents
Ultrahigh-temperature-resistant lead-free solder Download PDFInfo
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- CN102011025A CN102011025A CN 201010504437 CN201010504437A CN102011025A CN 102011025 A CN102011025 A CN 102011025A CN 201010504437 CN201010504437 CN 201010504437 CN 201010504437 A CN201010504437 A CN 201010504437A CN 102011025 A CN102011025 A CN 102011025A
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Abstract
The invention discloses ultrahigh-temperature-resistant lead-free solder prepared from the following elements in percentage by weight: 45-55 percent of tin, 25-35 percent of zinc, 0.5-2 percent of tungsten-silver alloy, 6-10 percent of aluminum-antimony, 2-5 percent of bismuth, 0.01-0.06 percent of nickel, 0.005-0.01 percent of gallium and 0.1-0.5 percent of copper by uniformly melting various raw metal materials in a melting furnace and casting the melted alloy into ingots or filaments. By adding an aluminum-silver alloy system to solder manufacture materials, the invention has the advantages of ultrahigh-temperature resistance, favorable conductivity and thermal conductivity, and the like.
Description
Technical field
The present invention relates to soldering tin material, be specifically related to a kind of Pb-free solder of superhigh temperature resistant.
Background technology
At present along with development of science and technology, high power acoustics power amplifier on the market, super bath, instant electric water heater, the high-power illumination lamp, the weld of electronic components such as storage battery generator generates heat easily, causes scolding tin to come off, and significantly reduces work-ing life.Though plumbous antimony class scolding tin is with low cost, temperature can reach the 500-600 degree, because lead is extensively paid attention to the pollution of environment, all electronic components and product in the worldwide progressively ban use of leaded class scolding tin.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of heatproof can reach the above Pb-free solder material of 850 degree.
For solving the problems of the technologies described above, the present invention is achieved through the following technical solutions: a kind of Pb-free solder of superhigh temperature resistant, comprise tin, and mass percent is 45-55%; Zinc, mass percent are 25-35%; Tungsten-silver alloys, mass percent are 0.5-2%; Aluminium-antimony alloy, mass percent are 6-10%; Bismuth, mass percent are 2-5%; Nickel, mass percent are 0.01-0.06%; Gallium, mass percent are 0.005-0.01%; Copper, mass percent are 0.1-0.5%; Each raw metal is placed in smelting furnace fusing evenly, the alloy that is melted is burnt forms ingot or bar is thread.
Below such scheme is described further: the making mass percent of described tungsten-silver alloys is tungsten 20-25%, silver-colored 75-80%, and its manufacture craft is to solidify with the fusing of powder metallurgic method and crucible manufacture method peace ratio to make.
The mass percent that described aluminium-antimony alloy is made is aluminium 50-70%, antimony 30-50%, and its manufacture craft is to solidify with powder metallurgic method and the fusing of crucible manufacture method peace ratio to make.
The present invention makes at scolding tin and has added tungsten-silver alloys system in the material, superhigh temperature resistant is arranged, advantage such as good electrical conductivity and thermal conductivity, make final finished product and high temperature resistant, be specially adapted to the circuit in electric current and the high-power electronic product, and this scolding tin production material does not always add the lead metal material, satisfies unleaded environmental requirement.
Embodiment
Following examples elaborate to the present invention, and each metallic substance and per-cent peace weight are calculated.
Embodiment one
Each metallic substance and the per-cent that use are as follows: zinc, mass percent are 30%; Tungsten-silver alloys, mass percent are 2%; Aluminium-antimony alloy, mass percent are 8%; Bismuth, mass percent are 5%; Nickel, mass percent are 0.05%; Gallium, mass percent are 0.005%; Copper, mass percent are 0.3%; All the other are tin and inevitable trace impurity, prepare the 1kg Pb-free solder in proportion, and each raw metal is placed in smelting furnace fusing evenly, the alloy that is melted are burnt form ingot or bar is thread.The mass percent of tungsten-silver alloys is a tungsten 20%, silver 80%; Aluminium-antimony alloy mass percent is an aluminium 63%, antimony 37%.
Embodiment two
The per-cent of this Pb-free solder material is preparation like this: zinc, mass percent are 28%; Tungsten-silver alloys, mass percent are 1%; Aluminium-antimony alloy, mass percent are 6%; Bismuth, mass percent are 4%; Nickel, mass percent are 0.06%; Gallium, mass percent are 0.008%; Copper, mass percent are 0.4%; All the other are tin and inevitable trace impurity, prepare the 1kg Pb-free solder in proportion, and each raw metal is placed in smelting furnace fusing evenly, the alloy that is melted are burnt form ingot or bar is thread.The mass percent of tungsten-silver alloys is a tungsten 24%, silver 76%; Aluminium-antimony alloy mass percent is an aluminium 62%, antimony 38%.
Embodiment three
The per-cent of this Pb-free solder material is preparation like this: zinc, mass percent are 33%; Tungsten-silver alloys, mass percent are 1.5%; Aluminium-antimony alloy, mass percent are 9%; Bismuth, mass percent are 4%; Nickel, mass percent are 0.04%; Gallium, mass percent are 0.009%; Copper, mass percent are 0.4%; All the other are tin and inevitable trace impurity, prepare the 1kg Pb-free solder in proportion, and each raw metal is placed in smelting furnace fusing evenly, the alloy that is melted are burnt form ingot or bar is thread.The mass percent of tungsten-silver alloys is a tungsten 22%, silver 78%; Aluminium-antimony alloy mass percent is an aluminium 65%, antimony 35%.
Then the scolding tin that bakes is put in the high-temperature electric resistance furnace, heats to the temperature more than 850, scolding tin does not melt.
Claims (3)
1. the Pb-free solder of a superhigh temperature resistant, it is characterized in that: comprise tin, mass percent is 45-55%; Zinc, mass percent are 25-35%; Tungsten-silver alloys, mass percent are 0.5-2%; Aluminium-antimony alloy, mass percent are 6-10%; Bismuth, mass percent are 2-5%; Nickel, mass percent are 0.01-0.06%; Gallium, mass percent are 0.005-0.01%; Copper, mass percent are 0.1-0.5%; Each raw metal is placed in smelting furnace fusing evenly, the alloy that is melted is burnt forms ingot or bar is thread.
2. the Pb-free solder of superhigh temperature resistant according to claim 1, it is characterized in that: the making mass percent of described tungsten-silver alloys is tungsten 20-25%, silver-colored 75-80%, and its manufacture craft is to solidify with powder metallurgic method and the fusing of crucible manufacture method peace ratio to make.
3. the Pb-free solder of superhigh temperature resistant according to claim 1, it is characterized in that: the mass percent that described aluminium-antimony alloy is made is aluminium 50-70%, antimony 30-50%, and its manufacture craft is to solidify with powder metallurgic method and the fusing of crucible manufacture method peace ratio to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010504437 CN102011025A (en) | 2010-10-11 | 2010-10-11 | Ultrahigh-temperature-resistant lead-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010504437 CN102011025A (en) | 2010-10-11 | 2010-10-11 | Ultrahigh-temperature-resistant lead-free solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102011025A true CN102011025A (en) | 2011-04-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010504437 Pending CN102011025A (en) | 2010-10-11 | 2010-10-11 | Ultrahigh-temperature-resistant lead-free solder |
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| CN (1) | CN102011025A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107234361A (en) * | 2017-06-16 | 2017-10-10 | 东莞市锡达焊锡制品有限公司 | A kind of high temperature lead-free solder silk |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1175956A (en) * | 1995-02-20 | 1998-03-11 | 雪印乳业株式会社 | Novel protein and method for production of same |
| CN1818110A (en) * | 2006-03-21 | 2006-08-16 | 戴国水 | Lead-free golden-plating materials |
| CN101096730A (en) * | 2006-06-26 | 2008-01-02 | 日立电线株式会社 | Pb-free sn-based material, wiring conductor, terminal connecting assembly, and pb-free solder alloy |
-
2010
- 2010-10-11 CN CN 201010504437 patent/CN102011025A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1175956A (en) * | 1995-02-20 | 1998-03-11 | 雪印乳业株式会社 | Novel protein and method for production of same |
| CN1818110A (en) * | 2006-03-21 | 2006-08-16 | 戴国水 | Lead-free golden-plating materials |
| CN101096730A (en) * | 2006-06-26 | 2008-01-02 | 日立电线株式会社 | Pb-free sn-based material, wiring conductor, terminal connecting assembly, and pb-free solder alloy |
Non-Patent Citations (1)
| Title |
|---|
| 《华南理工大学硕士学位论文》 20110331 陈可茂 Sn-Zn无铅钎料的电沉积工艺研究 第9-10页 1-3 , 1 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107234361A (en) * | 2017-06-16 | 2017-10-10 | 东莞市锡达焊锡制品有限公司 | A kind of high temperature lead-free solder silk |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20110413 |