CN201927613U - Pill type diode with pressure mounting base - Google Patents
Pill type diode with pressure mounting base Download PDFInfo
- Publication number
- CN201927613U CN201927613U CN2011200184609U CN201120018460U CN201927613U CN 201927613 U CN201927613 U CN 201927613U CN 2011200184609 U CN2011200184609 U CN 2011200184609U CN 201120018460 U CN201120018460 U CN 201120018460U CN 201927613 U CN201927613 U CN 201927613U
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- CN
- China
- Prior art keywords
- diode
- silicon wafer
- copper sheet
- press
- seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The utility model relates to a diode, in particular to a pill type diode with a pressure mounting base. The technical scheme provided by the utility model is that the pill type diode with the pressure mounting base comprises a diode silicon wafer and a conducting copper sheet, wherein a soldering tin sheet is arranged between the diode silicon wafer and the conducting copper sheet. The pill type diode is characterized in that the pressure mounting base is arranged at the other end of the diode silicon wafer relative to one end of the diode silicon wafer facing to the conducting copper sheet; and the soldering tin sheet is arranged between the pressure mounting base and the diode silicon wafer. With the adoption of the technical scheme, the pill type diode with the pressure mounting base provided can resist high temperature, radiate heat and save cost.
Description
Technical field
The utility model relates to a kind of diode, and particularly a kind of band press-fits the pill formula diode of seat.
Background technology
The automobile current generator rectifier bridge can divide three kinds with diode from chip structure, a kind of for CELL(pill formula) structure, a kind ofly be the GPP(glassivation) structure, a kind of be an OJ, a GPP and an once welding of OJ system, CELL is a secondary welding.Because the CELL structure need secondary welding, the scolder fusing point of secondary welding is the same scarcely, and the scolding tin of welding is than for the first time much lower for the second time, otherwise when welding for the second time melting away again of welding for the first time.
General now the employing used 285 ℃ of scolder fusing points for the first time, uses 220 ℃ of scolders for the second time, guarantee to make in 250 ℃ of soldering furnaces the CELL that welds for the first time not influence, and solder melts fully for the second time, and welding reliably.Because present scolder uses leypewter basically, thermal resistance is big, weak heat-dissipating in addition.
The CELL diode has two kinds at present, and a kind of is common CELL diode, a kind of band lead-in wire CEL diode.In the course of processing, all be to put the scolder solder plate earlier on the copper sheet down, after put the diode silicon wafer, put solder plate on the diode silicon wafer again, put copper sheet at last, in soldering furnace, weld, weld diode silicon wafer side PN junction is corroded cleaning, test then, the carrying out of test passes solidified side PN junction envelope silica gel.
Above-mentioned CELL diode must carry out secondary welding to the CELL diode in the process of making the pressing type single tube.In the single tube shell, put solder plate and put the CELL diode chip for backlight unit again, put solder plate again at the CELL diode chip for backlight unit and put lead-in wire again, weld the test sealing then.At last pressing type CELL single tube is pressed on the heat-dissipating aluminium plate, because CELL single tube and heat-dissipating aluminium plate adopt interference fit, the stress that produces is delivered on the chip by epoxy resin easily, and chip hurt was lost efficacy.
Summary of the invention
At the deficiency that prior art exists, the utility model provides a kind of band that improves heatproof, heat radiation, saving cost to press-fit the pill formula diode of seat.
For achieving the above object, the utility model provides following technical scheme: a kind of band press-fits the pill formula diode of seat, include diode silicon wafer, conductive copper sheet, be provided with solder plate between described diode silicon wafer and the conductive copper sheet, it is characterized in that: the other end place of described diode silicon wafer relative orientation conducting copper sheet one end is provided with and press-fits seat, this press-fit the seat and the diode silicon wafer between be provided with solder plate.
Wherein, press-fit seat and include link and installation end, its link is and the adaptive pedestal of diode silicon wafer cross section, installation end be connected with pedestal and cross section greater than the mount pad of pedestal.
Adopt technique scheme, press-fit seat by being provided with towards the other end place of conductive copper sheet one end at the diode silicon wafer, replaced traditional copper sheet, after being provided with like this, only need once weld simultaneously, promptly in the course of processing, only need to implement once welding and can finish processing pill formula diode to two solder plates; Improved the temperature tolerance of diode, simultaneously because welding for once so reduced weld layer, has improved thermal diffusivity.This pill formula diode press-fit seat and directly contact with heat-dissipating aluminium plate, and then to injecting resin in it, the pressure of heat-dissipating aluminium plate can not be delivered on the diode like this, has effectively prevented the damage of diode, has improved quality in being mounted to the process of heat-dissipating aluminium plate; And have the diode that press-fits seat and need not just to implement assembling, reduced parts, saved production cost with heat-dissipating aluminium plate by the single tube shell.
The utility model further is set to: conductive copper sheet is the copper sheet of band lead-in wire.
Adopt technique scheme, be provided with rational in infrastructure like this.
Below in conjunction with accompanying drawing the utility model is further described.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the structural representation that the utility model embodiment combines with heat-dissipating aluminium plate.
Embodiment
As Fig. 1-a kind of band shown in Figure 2 press-fit the seat pill formula diode, include diode silicon wafer 1, conductive copper sheet 2, be provided with solder plate 3 between diode silicon wafer 1 and the conductive copper sheet 2.The other end place of diode silicon wafer 1 relative orientation conducting copper sheet 2 one ends is provided with and press-fits seat 4, and this press-fits between seat 4 and the diode silicon wafer 1 and is provided with solder plate 3, need to prove, conductive copper sheet 2 is provided with rational in infrastructure for having 21 the copper sheet 22 of going between like this.In the such scheme, press-fit seat 4 by being provided with towards the other end place of conductive copper sheet 2 one ends at diode silicon wafer 1, replaced traditional copper sheet, after being provided with like this, only need once weld simultaneously, promptly in the course of processing, only need to implement once welding and can finish processing pill formula diode to two solder plates 3; Improved the temperature tolerance of diode, simultaneously because welding for once so reduced weld layer, has improved thermal diffusivity.This pill formula diode is in the process that is mounted to heat-dissipating aluminium plate 5, press-fit seat 4 and directly contact, and then to injecting resin in it, the pressure of heat-dissipating aluminium plate 5 can not be delivered on the diode like this with heat-dissipating aluminium plate 5, effectively prevent the damage of diode, improved quality; And have the diode that press-fits seat 4 and need not just to implement assembling, reduced parts, saved production cost with heat-dissipating aluminium plate 5 by the single tube shell.
In the utility model embodiment, press-fit seat and 4 include link and installation end, its link is the pedestal 41 adaptive with diode silicon wafer 1 cross section, installation end be connected with pedestal 41 and cross section greater than the mount pad 42 of pedestal 41.Certainly, need to prove, allow that press-fiting seat 4 also is feasible by its mount pad 42 with the 1 enforcement welding of diode silicon wafer directly if design.
Claims (3)
1. a band press-fits the pill formula diode of seat, include diode silicon wafer, conductive copper sheet, be provided with solder plate between described diode silicon wafer and the conductive copper sheet, it is characterized in that: the other end place of described diode silicon wafer relative orientation conducting copper sheet one end is provided with and press-fits seat, this press-fit the seat and the diode silicon wafer between be provided with solder plate.
2. band according to claim 1 press-fits the pill formula diode of seat, it is characterized in that:
Describedly press-fit seat and include link and installation end, its link is and the adaptive pedestal of diode silicon wafer cross section, installation end be connected with pedestal and cross section greater than the mount pad of pedestal.
3. band according to claim 1 and 2 press-fits the pill formula diode of seat, its feature
Be: described conductive copper sheet is the copper sheet of band lead-in wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200184609U CN201927613U (en) | 2011-01-21 | 2011-01-21 | Pill type diode with pressure mounting base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200184609U CN201927613U (en) | 2011-01-21 | 2011-01-21 | Pill type diode with pressure mounting base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201927613U true CN201927613U (en) | 2011-08-10 |
Family
ID=44431450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200184609U Expired - Fee Related CN201927613U (en) | 2011-01-21 | 2011-01-21 | Pill type diode with pressure mounting base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201927613U (en) |
-
2011
- 2011-01-21 CN CN2011200184609U patent/CN201927613U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110810 Termination date: 20150121 |
|
| EXPY | Termination of patent right or utility model |