CN102842637A

CN102842637A - Substrate treatment device and substrate treatment method

Info

Publication number: CN102842637A
Application number: CN2011101666444A
Authority: CN
Inventors: 李一成; 汪宇澄; 陈亮; 陶成钢
Original assignee: Ideal Energy Equipment Shanghai Ltd
Current assignee: Ideal Energy Equipment Shanghai Ltd
Priority date: 2011-06-20
Filing date: 2011-06-20
Publication date: 2012-12-26

Abstract

The invention provides a substrate treatment device and a substrate treatment method. The device comprises a first load cavity, a first valve and a treatment cavity, wherein the first valve is arranged between the first load cavity and the treatment cavity, and is used for connecting the first load cavity with the treatment cavity, the substrate treatment device further comprises an air pressure regulation unit, so when the first valve is opened, the air pressure of the first load cavity is higher than the pressure of the treatment cavity. During the conveying process of a substrate, through controlling the air pressures of the first load cavity and the treatment cavity, the air in the treatment cavity cannot enter the first load cavity, so a film cannot be precipitated on the surface of a device in the first load cavity, accordingly, the service life of the first load cavity is prolonged, and the maintenance cost of the first load cavity is reduced.

Description

Lining processor and Method of processing a substrate

Technical field

The present invention relates to a kind of substrate-treating apparatus and method, particularly a kind of lining processor and Method of processing a substrate that is used to make thin-film solar cells.

Background technology

In many solar cell application technology, thin-film solar cells is because of pollution-free, and less energy consumption is with low cost, can large-scale production etc. series of advantages, be widely used in Aeronautics and Astronautics and the daily life.Common thin-film solar cells comprises: amorphous silicon thin-film solar cell, copper-indium-galliun-selenium film solar cell and cadmium telluride diaphragm solar battery.At publication number is in the Chinese invention patent file of CN101027749A and CN101226967A, can find the formation method of more how above-mentioned thin-film solar cells.

In the manufacturing of thin-film solar cells, transparent conductive oxide (TCO, transparent conductive oxide) depositing of thin film is important process procedure.Said transparent conductive oxide film is used to make the electrode of thin-film solar cells, and common said transparent conductive oxide film is a Zinc oxide film.The deposition of said transparent conductive oxide film is accomplished in low-pressure chemical vapor deposition (LPCVD, low pressure chemical vapor deposition) device usually.

The LPCVD device of prior art comprises load cavity, process chamber and is arranged between said load cavity and the process chamber and connects the valve of said load cavity and process chamber.The deposition step of transparent conductive oxide film comprises: pending glass substrate is loaded in the said load cavity; Said load cavity is carried out exhaust, so that said load cavity reaches vacuum state; In exhaust or exhaust finish the back and said glass substrate is heated make said glass substrate reach uniform temperature, in some concrete prior art, said glass substrate is heated the infrared heating device of said load cavity capable of using and accomplishes; After said load cavity reaches vacuum state and said glass substrate and reaches uniform temperature, open said valve; Said glass substrate is transferred to the said process chamber from said load cavity; Close said valve; In said process chamber, feed reacting gas such as diethyl zinc (DEZ; Diethylzinc) and water vapour, the glass substrate in the said process chamber is handled, to form said transparent conductive oxide film at said glass substrate upper surface; Particularly, to form Zinc oxide film.

Yet; There is following problem in existing LPCVD device: be sent to the process of process chamber from load cavity at glass substrate; The required diethyl zinc (DEZ) of film forming can get into load cavity with water vapour in the process chamber, and owing to the heater element that infrared lamp that the usefulness of preheating is arranged in the load cavity and reflecting plate etc. constitute, this heater element self also has higher temperature; Therefore; And then the diethyl zinc (DEZ) that gets into load cavity and water vapour will react and generate zinc oxide and be deposited on the said heater element, and through after a while after, finally the surface of heater elements such as infrared lamp and reflecting plate can be plated Zinc oxide film; Certainly will influence the efficiency of heating surface of heater elements such as infrared lamp and reflecting plate like this, shorten its useful life.Therefore need carry out frequent shutdown to heater elements such as infrared lamp and reflecting plates and safeguard, influence the running time and the maintenance cost of equipment.

In addition; Because the reactivity of diethyl zinc is very strong; Can not directly enter it in the atmosphere; Therefore need to lay special discharge duct and specific emission-control equipment, carry out exhaust-gas treatment in this emission-control equipment so that the diethyl zinc in the load cavity is discharged into through this discharge duct, thereby increased the cost of equipment.

Summary of the invention

The purpose of this invention is to provide a kind of lining processor and Method of processing a substrate, to prolong the useful life of load cavity.

For addressing the above problem; The invention provides a kind of lining processor, comprise first load cavity, first valve and process chamber, said first valve is arranged between said first load cavity and the said process chamber; Be used to connect said first load cavity and said process chamber; Said lining processor also comprises the first air pressure adjustment unit, so that during said first valve open, the air pressure of said first load cavity is greater than the air pressure of said process chamber.

Preferably, during said first valve open, the draught head between said first load cavity and the said process chamber is greater than 0 and be less than or equal to 50mbar.

Preferably, during said first valve open, the draught head between said first load cavity and the said process chamber is more than or equal to 1mbar and be less than or equal to 10mbar.

Preferably, said process chamber is the low-pressure chemical vapor deposition chamber that is used for the depositing zinc oxide nesa coating, and the air pressure range of said process chamber is more than or equal to 0.1mbar and is less than or equal to 1mbar.

Preferably, during said first valve open, the air pressure range of said first load cavity is for more than or equal to 1mbar and be less than or equal to 50mbar.

Preferably, during said first valve closing, the air pressure of said first load cavity is greater than the air pressure of said process chamber.

Preferably, said first load cavity comprises: preheating apparatus is used for the substrate of said first load cavity is preheated.

Preferably, said preheating apparatus comprises: infrared heating fluorescent tube and reflecting plate, and wherein, said infrared heating fluorescent tube is arranged on the top of said first load cavity, and said reflecting plate is arranged between the roof of said infrared heating fluorescent tube and said first load cavity.

Preferably; The said first air pressure adjustment unit comprises first pneumatic control system that is arranged at first load cavity; Said first pneumatic control system is used for controlling the air pressure of said first load cavity; Said first pneumatic control system comprises: the first pressure regulation gas input device is used for to said first load cavity input pressure regulation gas; First exhaust apparatus is used for discharging the gas of said first load cavity.

Preferably, the said first pressure regulation gas input device comprises: the first flow controller is used for controlling the flow of importing the said first load cavity pressure regulation gas.

Preferably, said first flow controller is first needle-valve.

Preferably, the said first air pressure adjustment unit also comprises: the first air pressure monitor device, it detects the air pressure in said first load cavity and the said process chamber, and controls said first pneumatic control system, to control the air pressure in said first load cavity.

Preferably, the said first air pressure monitor device comprises: first baroceptor, be arranged in said first load cavity, and be used for detecting the air pressure of said first load cavity; Second baroceptor is arranged in the said process chamber, is used for detecting the air pressure of said process chamber.

Preferably; The said first air pressure monitor device also comprises: first processing controller; Said first processing controller connects first baroceptor and second baroceptor, is used to receive the air pressure in the said process chamber that air pressure and second baroceptor in said first load cavity that first baroceptor obtains obtain; Said first processing controller also connects the first pressure regulation gas input device and/or first exhaust apparatus; Be used to control the said first pressure regulation gas input device is discharged gas to the pressure regulation gas flow and/or said first exhaust apparatus of said first load cavity input from said first load cavity flow; Make that the air pressure of first load cavity is greater than the air pressure of said process chamber when said first valve open.

Preferably; Said lining processor also comprises: second valve and second load cavity; Said second valve is arranged between said process chamber and said second load cavity; Said lining processor also comprises the second air pressure adjustment unit, so that during said second valve open, the air pressure of said second load cavity is greater than the air pressure of said process chamber.

Preferably, the air pressure range of said second load cavity is more than or equal to 1mbar and is less than or equal to 50mbar.

Preferably, during said second valve closing, the air pressure of said second load cavity is greater than the air pressure of said process chamber.

Preferably; The said second air pressure adjustment unit comprises second pneumatic control system that is arranged at second load cavity; Said second pneumatic control system is used for controlling the air pressure of said second load cavity; Said second pneumatic control system comprises: the second pressure regulation gas input device is used for to said second load cavity input pressure regulation gas; Second exhaust apparatus is used for discharging the gas of said second load cavity.

Preferably, the said second pressure regulation gas input device comprises: second flow controller is used for controlling the flow of importing the said second load cavity pressure regulation gas.

Preferably, said second flow controller is second needle-valve.

Preferably, the said second air pressure adjustment unit also comprises: the second air pressure monitor device is used for detecting the air pressure of said second load cavity and said process chamber; And control said second pneumatic control system, to control the air pressure in said second load cavity.

Preferably, the said second air pressure monitor device comprises: second baroceptor, be arranged in the said process chamber, and be used for detecting the air pressure of said process chamber; The 3rd baroceptor is arranged in said second load cavity, is used for detecting the air pressure of said second load cavity.

Preferably; The said second air pressure monitor device also comprises: second processing controller; Said second processing controller connects second baroceptor and the 3rd baroceptor respectively, is used to receive the air pressure in said second load cavity that air pressure and the 3rd baroceptor in the said process chamber that second baroceptor obtains obtain; Said second processing controller also connects the second pressure regulation gas input device and/or second exhaust apparatus; Be used to control the said second pressure regulation gas input device is discharged gas to the pressure regulation gas flow and/or said second exhaust apparatus of said second load cavity input from said second load cavity flow; Make that the air pressure in said second load cavity is greater than the air pressure in the said process chamber when said second valve open.

Preferably, said pressure regulation gas packet contains one or more combinations in nitrogen, hydrogen, the inert gas.

Preferably, said pressure regulation gas is identical with the carrier gas of reacting gas in the said process chamber.

Preferably, said lining processor is a chemical gas-phase deposition system.

Preferably, said first load cavity comprises LOADED CAVITY; Said second load cavity comprises the unloading chamber; Said process chamber comprises deposit cavity.

Preferably, said process chamber comprises the deposit cavity that a plurality of LINEAR CONTINUOUS are provided with, and said first load cavity and said second load cavity are connected two deposit cavities of head and the tail of said a plurality of deposit cavities respectively.

Preferably, said a plurality of deposit cavities are the first, second, third and the 4th deposit cavity that is provided with continuously, and said first load cavity connects said first deposit cavity, and said second load cavity connects said the 4th deposit cavity.

In order to address the above problem, the present invention also provides a kind of Method of processing a substrate, comprising:

One lining processor is provided, and said lining processor comprises first load cavity, first valve and process chamber, and said first valve is arranged between said first load cavity and the said process chamber, is used to connect said first load cavity and said process chamber;

With pending board transport in said first load cavity;

Adjust the pressure of said first load cavity, make the air pressure of said first load cavity greater than the air pressure of said process chamber;

Open said first valve, said substrate is transferred to said process chamber from said first load cavity.

Preferably, said substrate is transferred to the said process chamber process from said first load cavity, keeps the air pressure of the air pressure of said first load cavity greater than said process chamber.

Preferably, the draught head between said first load cavity and the said process chamber is greater than 0 and be less than or equal to 50mbar.

Preferably, the draught head between said first load cavity and the said process chamber is more than or equal to 1mbar and be less than or equal to 10mbar.

Preferably, said Method of processing a substrate also comprises: said board transport vacuumizes said first load cavity behind said first load cavity, and the step that said substrate is heated.

Preferably, said first load cavity comprises preheating apparatus, and said first load cavity preheats the substrate in said first load cavity through said preheating apparatus.

Preferably, said Method of processing a substrate also comprises: said board transport is closed said first valve behind said process chamber, in said process chamber, said substrate is carried out processed steps.

Preferably, in said process chamber, said substrate handled and comprise to said process chamber and feed the reacting gas that comprises diethyl zinc and steam that the air pressure range of said process chamber is more than or equal to 0.1mbar and is less than or equal to 1mbar.

Preferably; Said Method of processing a substrate also comprises: accomplish in said process chamber after the processing to said substrate; Or in said process chamber in the processing procedure to said substrate; Regulate the pressure of said first load cavity, make the air pressure of said first load cavity greater than the step of the air pressure of said process chamber.

Preferably, in the process of in said process chamber, said substrate being handled, keep the air pressure of the air pressure of said first load cavity greater than said process chamber.

Preferably, said Method of processing a substrate also comprises: in said process chamber, after the processing to said substrate, open said first valve in completion, said substrate is transferred to the step of said first load cavity from said process chamber.

Preferably, said substrate is transferred to the said first load cavity process from said process chamber, keeps the air pressure of the air pressure of said first load cavity greater than said process chamber.

Preferably, the pressure of said first load cavity of said adjustment comprises, to said first load cavity input pressure regulation gas.

Preferably, said pressure regulation gas be with said process chamber in the identical gas of carrier gas of reacting gas.

Preferably, said lining processor also comprises: second valve and second load cavity; Said second valve is arranged between said process chamber and said second load cavity, is used to connect said first load cavity and said process chamber; Said Method of processing a substrate also comprises: accomplish in said process chamber after the processing to said substrate; Or in said process chamber in the processing procedure to said substrate; Regulate the pressure of said second load cavity, make the air pressure of said second load cavity greater than the step of the air pressure of said process chamber.

Preferably, said Method of processing a substrate also comprises: in said process chamber, after the processing to said substrate, open said second valve in completion, said substrate is transferred to the step of said second load cavity from said process chamber.

Preferably, said substrate is transferred to the said second load cavity process from said process chamber, keeps the air pressure of the air pressure of said second load cavity greater than said process chamber.

Preferably, the draught head between said second load cavity and the said process chamber is greater than 0 and be less than or equal to 50mbar.

Preferably, the pressure of regulating said second load cavity comprises, to said second load cavity input pressure regulation gas.

Compared with prior art, the present invention has the following advantages:

1) during said first valve open; The air pressure of said first load cavity is greater than the air pressure of said process chamber; In the process that substrate transmits,, make that the gas in the process chamber can not get into first load cavity through controlling the air pressure size of first load cavity and process chamber; So can be in first load cavity deposit film, thereby prolonged useful life of first load cavity.

2) during said first valve closing, the air pressure of said first load cavity is also greater than the air pressure of said process chamber, and the air pressure that promptly guarantees first load cavity can stop the Gas Exchange of said first load cavity and said process chamber all the time greater than the air pressure of process chamber.

3) said first load cavity comprises first pneumatic control system; Said first pneumatic control system comprises: the first pressure regulation gas input device and first exhaust apparatus; Discharge the gas of said first load cavity through controlling the said first pressure regulation gas input device to said first load cavity input gas and said first exhaust apparatus, thereby can well control the air pressure size in said first load cavity.

4) the said first pressure regulation gas input device comprises the first flow controller, thereby can accurately control the flow of pressure regulation gas in said first load cavity of input.

5) said pressure regulation gas can be selected one or more combinations in nitrogen, hydrogen, the inert gas, also can be directly identical with the carrier gas of reacting gas in the said process chamber, thus making that the range of choice of said pressure regulation gas is wide, flexibility is good.

6) said device also comprises the first air pressure monitor device; It comprises: be arranged on first baroceptor in first load cavity and be arranged on second baroceptor in the process chamber; Can detect the air pressure in first load cavity in real time through first baroceptor; Can detect the air pressure in the process chamber in real time through second baroceptor, and then can make the air pressure of the air pressure of first load cavity through of the control of first pneumatic control system to the first load cavity air pressure greater than process chamber.

7) the said first air pressure monitor device also comprises first processing controller; Said first processing controller connects the first pressure regulation gas input device and/or first exhaust apparatus; Discharge the flow of gas to the pressure regulation gas flow of said first load cavity input and/or said first exhaust apparatus from said first load cavity through controlling the said first pressure regulation gas input device, make the air pressure of the air pressure of the load cavity of winning greater than process chamber.

Description of drawings

Fig. 1 is the structural representation of the lining processor that provides of the embodiment of the invention one;

Fig. 2 is the schematic flow sheet of the Method of processing a substrate that provides of the embodiment of the invention one;

Fig. 3 is the structural representation of the lining processor that provides of the embodiment of the invention two;

Fig. 4 is the schematic flow sheet of the Method of processing a substrate that provides of the embodiment of the invention two;

Fig. 5 is the structural representation of the lining processor that provides of the embodiment of the invention three;

Fig. 6 is the schematic flow sheet of the Method of processing a substrate that provides of the embodiment of the invention three.

Embodiment

For make above-mentioned purpose of the present invention, feature and advantage can be more obviously understandable, does detailed explanation below in conjunction with the accompanying drawing specific embodiments of the invention.

Set forth a lot of details in the following description so that make much of the present invention, implement but the present invention can also adopt other to be different from alternate manner described here, so the present invention has not received the restriction of following disclosed specific embodiment.

Said as the background technology part; Existing TCO film deposition apparatus is sent to the process of process chamber at glass substrate from load cavity; Reacting gas such as diethyl zinc can spill into load cavity from process chamber; Thereby form Zinc oxide film on the surface of heater elements such as infrared lamp that can be in load cavity and reflecting plate, and then need carry out frequent shutdown to heater element such as infrared lamp and reflecting plate in the load cavity and safeguard, increased the shutdown preventive maintenance time and the maintenance cost of equipment; And also need lay special discharge duct and specific emission-control equipment, directly be drained in the atmosphere to prevent diethyl zinc, thereby further increased the cost of equipment for the diethyl zinc in the load cavity.In existing other lining processors, the gas in the process chamber also can get into load cavity, thereby produces same defective.

For overcoming above-mentioned defective, the invention provides a kind of lining processor and Method of processing a substrate, the valve opening between load cavity and process chamber; Substrate is sent to the process of process chamber from load cavity; The air pressure in proof load chamber is greater than the air pressure of process chamber, thereby the gas in the process chamber just can not get into load cavity, has eliminated the possibility of above-mentioned gas infringement load cavity; Finally prolong the useful life of load cavity, reduced the maintenance cost of load cavity.

Be example with said lining processor and Method of processing a substrate for being used on glass substrate, depositing the TCO film below, be elaborated in conjunction with accompanying drawing.

Embodiment one

Fig. 1 is the structural representation of present embodiment lining processor.As shown in Figure 1; The described lining processor of present embodiment comprises: first load cavity 100, first valve 200, process chamber 300 and the first air pressure adjustment unit; Wherein, Said first valve 200 is arranged between said first load cavity 100 and the said process chamber 300, is used to connect said first load cavity 100 and said process chamber 300; The said first air pressure adjustment unit makes that the air pressure of said first load cavity 100 was greater than the air pressure of said process chamber 300 when said first valve 200 was opened.

Particularly, when said first valve 200 was opened, the draught head between said first load cavity 100 and the said process chamber 300 was greater than 0 and be less than or equal to 50mbar, as: 0.5mbar, 25mbar, 50mbar etc.Preferably, when said first valve 200 was opened, the draught head between said first load cavity 100 and the said process chamber 300 was more than or equal to 1mbar and be less than or equal to 10mbar, as: 1mbar, 4mbar, 7mbar, 10mbar etc.

In the present embodiment, said first load cavity 100 is the load/unload chamber, is used for loading and the unloading glass substrate.Preferably, said first load cavity 100 has said glass substrate is carried out pre-warmed function.Said first load cavity 100 comprises: preheating apparatus 110 is used for the glass substrate of said first load cavity 100 is preheated.

Particularly; Said preheating apparatus 110 comprises: infrared heating fluorescent tube and reflecting plate (not shown); Wherein, said infrared heating fluorescent tube is arranged on the top of said first load cavity 100, is used for providing infrared ray to realize the heating to the glass substrate that is loaded into first load cavity; Said reflecting plate is arranged between the roof of said infrared heating fluorescent tube and said first load cavity 100, with infrared reflection to glass substrate, thereby further realize heating to glass substrate.Need to prove that in other embodiments of the invention, said preheating apparatus 110 can should not limit protection scope of the present invention at this for any heater in the prior art.

The said first air pressure adjustment unit comprises first pneumatic control system 120 and the first air pressure monitor device 400 that is arranged in first load cavity 100.Said first pneumatic control system 120 is regulated the air pressure of said first load cavity 100, and when the valve 200 of winning was opened, the air pressure of first load cavity 100 was greater than the air pressure of process chamber 300.The said first air pressure monitor device 400 is used for detecting the air pressure of said first load cavity 100 and said process chamber 300, and controls the air pressure that said first pneumatic control system 120 is regulated in first load cavity 100 according to said first load cavity 100 and the air pressure in the said process chamber 300.

Said first pneumatic control system 120 comprises: the first pressure regulation gas input device 121 is used for to said first load cavity, 100 input pressure regulation gases; First exhaust apparatus 122 is used for discharging the gas of said first load cavity 100; Wherein, said pressure regulation gas can be one or more combinations in nitrogen, hydrogen, the inert gas, also can be identical with the carrier gas of reacting gas in the said process chamber 300.Because when first valve 200 is opened; The air pressure of first load cavity 100 is greater than the air pressure of process chamber 300; Therefore the gas of process chamber 300 can not get into first load cavity 100; But the gas of first load cavity 100 can get into process chamber 300, react so the pressure regulation gas of selecting for use can not influence process chamber 300 reacting gass at least, and pressure regulation gas is preferably selected gas nonflammable, non-explosive, that need not subsequent treatment for use.The pressure regulation gas of selecting for use in the present embodiment is nitrogen (N ₂).Through regulating the said first pressure regulation gas input device 121 and said first exhaust apparatus 122, the air pressure of said first load cavity 100 is in the scope of 1mbar～50mbar, as: 1mbar, 10mbar, 30mbar, 50mbar etc.

The said first pressure regulation gas input device 121 comprises first flow controller (not shown), is used for controlling the flow of said first load cavity, the 100 pressure regulation gases of input.The controller of first flow described in the present embodiment is first needle-valve, and in other embodiments of the invention, said first flow controller also can be selected other volume control device for use.

In the present embodiment, said process chamber 300 is a deposit cavity, is used for deposition TCO film on glass substrate.Said deposit cavity is specially the low-pressure chemical vapor deposition chamber, and said TCO film is zinc oxide (ZnO) nesa coating.

Because when said first valve 200 is opened; Draught head described in the present embodiment between first load cavity 100 and the said process chamber 300 is greater than 0 and be less than or equal to 50mbar; The air pressure of said first load cavity 100 is in more than or equal to 1mbar and is less than or equal in the scope of 50mbar; Therefore under the situation that guarantees said process chamber 300 operate as normal, the air pressure of said process chamber 300 should be controlled at more than or equal to 0.1mbar and be less than or equal in the scope of 1mbar.

The said first air pressure monitor device 400 comprises: first baroceptor 410, second baroceptor 420 and first processing controller 430.Wherein, Said first baroceptor 410 is arranged in said first load cavity 100; And be electrically connected said first processing controller 430; Said first baroceptor 410 is used for detecting the air pressure of said first load cavity 100, and sends the atmospheric pressure value of detected first load cavity 100 to said first processing controller 430; Said second baroceptor 420 is arranged in the said process chamber 300; And be electrically connected said first processing controller 430; Said second baroceptor 420 is used for detecting the air pressure of said process chamber 300, and sends the atmospheric pressure value in the detected process chamber 300 to said first processing controller 430; Said first processing controller 430 is electrically connected the said first pressure regulation gas input device 121 and first exhaust apparatus 122.Atmospheric pressure value in the process chamber 300 that the atmospheric pressure value in first load cavity 100 that first baroceptor 410 that said first processing controller, 430 bases receive obtains and second baroceptor 420 obtain; Control the said first pressure regulation gas input device 121 is discharged gas to the pressure regulation gas flow and said first exhaust apparatus 122 of 100 inputs of said first load cavity from said first load cavity 100 flow; Make when said first valve 200 is opened; The air pressure of first load cavity 100 is greater than the air pressure of said process chamber 300, as: the air pressure of first load cavity 100 is than the big 10mbar of air pressure, 20mbar or the 50mbar etc. of process chamber 300.

In another embodiment of the present invention, when said first valve 200 was closed, the air pressure of said first load cavity 100 was also greater than the air pressure of said process chamber 300.The air pressure that promptly guarantees first load cavity 100 is all the time greater than the air pressure of process chamber 300, as long as make this moment the air pressure of said first load cavity 100 and said process chamber 300 all be in the Gas Exchange that stable state can stop said first load cavity 100 and said process chamber 300 all the time.

In the said first air pressure monitor device 400; Said first baroceptor 410 and second baroceptor 420 can send to first processing controller 430 with the pressure information of gathering in real time, also can regularly the pressure information of gathering be sent to first processing controller 430.

Need to prove; In other embodiments of the invention; Said first processing controller 430 can only connect the said first pressure regulation gas input device 121 or only connect said first exhaust apparatus 122; Promptly discharge the flow of gases to the pressure regulation gas flow of said first load cavity 100 input or said first exhaust apparatus 122 from said first load cavity 100, reach the purpose of the air pressure of first load cavity 100 when said first valve 200 is opened greater than the air pressure of said process chamber 300 through only controlling the said first pressure regulation gas input device 121.

In other embodiments of the invention; The said first air pressure monitor device 400 can also comprise: warning device; Like buzzer and/or alarm lamp, said warning device is electrically connected said first processing controller 430, under the situation that first valve 200 is opened; When the difference of the air pressure of the air pressure of first load cavity 100 and process chamber 300 during less than certain threshold value, the said warning device of said first processing controller, 430 controls gives the alarm.The said first air pressure monitor device can also comprise: display unit; Said display unit is electrically connected said first processing controller 430, be used for showing respectively first baroceptor 410 atmospheric pressure value or/and the atmospheric pressure value of second baroceptor 420 or/and the air pressure difference between first baroceptor 410 and second baroceptor 420.

Referring to shown in Figure 2, the Method of processing a substrate that present embodiment provides (being the course of work of device shown in Figure 1) comprising:

S11, with pending board transport in said first load cavity 100;

S12 vacuumizes first load cavity 100, and said substrate is preheated processing;

S13 adjusts the pressure of said first load cavity 100, makes the air pressure of said first load cavity 100 greater than the air pressure of said process chamber 300;

S14 opens said first valve 200, and said substrate is transferred to said process chamber 300 from said first load cavity 100;

S15 closes said first valve 200, in said process chamber 300, said substrate is handled;

S16 adjusts the pressure of said first load cavity 100, makes the air pressure of said first load cavity 100 greater than the air pressure of said process chamber 300;

S17 opens said first valve 200, and said substrate is transferred to said first load cavity 100 from said process chamber 300;

S18, said first valve 200 is closed, and the air pressure in said first load cavity 100 is increased to atmospheric pressure;

S19 takes out said substrate from said first load cavity 100.

Concrete, in said step S11, said first valve 200 is closed, and after pending glass substrate is cleaned, under atmospheric pressure environment, is transferred in said first load cavity 100.

In said step S12; Load said pending glass substrate behind said first load cavity 100; Start first exhaust apparatus 122 in said first load cavity 100; Gas in said first load cavity 100 of said first exhaust apparatus 122 emptyings makes said first load cavity 100 reach vacuum state, in the gas in said first load cavity 100 of said first exhaust apparatus 122 emptyings or after said first load cavity 100 reaches vacuum state; Start the said preheating apparatus 110 in said first load cavity 100,110 pairs of said glass substrates of said preheating apparatus heat makes said glass substrate reach uniform temperature.

In said step S13; Make said first baroceptor 410 and second baroceptor 420 in the said first air pressure monitor device 400 detect the air pressure of first load cavity 100 and said process chamber 300 respectively, and will detected first load cavity 100 and the air pressure of process chamber 300 convert pressure information to and be sent to first processing controller 430.430 pairs of pressure informations that receive of said first processing controller carry out analyzing and processing; And control the said first pressure regulation gas input device 121 to first load cavity 100 input pressure regulation gases and/or control the extraction flow of 122 pairs first load cavities 100 of said first exhaust apparatus, to regulate the air pressure of said first load cavity 100.Said adjusting makes the air pressure of said first load cavity 100 greater than the air pressure of process chamber 300, preferably, reaches a preset draught head, as: 1mbar, 4mbar, 7mbar or 10mbar.

In said step S14, make after the air pressure of air pressure greater than process chamber 300 of said first load cavity 100, open said first valve 200, said substrate is transferred to said process chamber 300 from said first load cavity 100.In the transmission course; Make the air pressure in said said first load cavity 100 of the first air pressure monitor device, 400 monitoring and the said process chamber 300; And through controlling the said first pressure regulation gas input device 121 to first load cavity 100 input pressure regulation gases and/or control the extraction flow of 122 pairs first load cavities 100 of said first exhaust apparatus; Keep the air pressure of the air pressure of said first load cavity 100, make that the reacting gas in the said process chamber 300 does not flow to said first load cavity 100 greater than process chamber 300; Preferably, keep the air pressure of said first load cavity 100 and the draught head of said process chamber 300 to reach a preset draught head, as: 1mbar, 4mbar, 7mbar or 10mbar.

In said step S15, said board transport behind said process chamber 300, is closed said first valve 200.In said process chamber 300, feed reacting gas, in this execution mode, said reacting gas comprises diethyl zinc (DEZ), steam and impurity gas diborane.Said reacting gas is in the surface reaction of said substrate and at least one surface deposition one deck of said substrate zinc oxide transparent conducting film (TCO).

In said step S16; After the processing of accomplishing substrate; In this execution mode; Promptly after at least one surface deposition of said glass substrate is accomplished one deck zinc oxide transparent conducting film, adjust the air pressure of said first load cavity 100, said substrate is passed back in said first load cavity 100 with preparation.The method of the pressure of said first load cavity 100 of concrete adjusting is identical with above-mentioned steps S13, repeats no more here; Among this step S16; Adjust the pressure of said first load cavity 100 and also can in the processing procedure of 300 pairs of said substrates of said process chamber, carry out, or in the whole process that 300 pairs of said substrates of said process chamber are handled, keep pressure in said first load cavity 100 greater than the air pressure of process chamber 300; So, when said process chamber 300 was accomplished said processing substrate, the air pressure in said first load cavity 100 had been in suitable air pressure, can shorten the processing time to substrate.

In said step S17, after regulating the suitable air pressure of said first load cavity 100 arrival, open said first valve 200, said substrate is transferred to said first load cavity 100 from said process chamber 300.Make the air pressure in said said first load cavity 100 of the first air pressure monitor device, 400 monitoring and the said process chamber 300 in the transmission course; And through controlling the said first pressure regulation gas input device 121 to first load cavity 100 input pressure regulation gases and/or control the extraction flow of 122 pairs first load cavities 100 of said first exhaust apparatus; Keep the air pressure of the air pressure of said first load cavity 100, make that the reacting gas in the said process chamber 300 does not flow to said first load cavity 100 greater than process chamber 300; Preferably, keep the air pressure of said first load cavity 100 and the draught head of said process chamber 300 to reach a preset draught head, as: 1mbar, 4mbar, 7mbar or 10mbar.

In said step S18 and S19, close said first valve 200, the air pressure in said first load cavity 100 that raises is to atmospheric pressure; Then, said substrate is taken out from said first load cavity 100.

In above-mentioned processing procedure, reacting gas diethyl zinc gas in the process chamber 300 and water vapour just can not get into first load cavity 100, thereby have reduced the infringement to first load cavity 100.

Need to prove; The described lining processor of present embodiment can also be applied in other lining processors that comprise first load cavity, first valve and process chamber; As: in the lining processor of the film formation of semiconductor device, dry ecthing, plasma etching etc., should not limit protection scope of the present invention at this.When not hoping that pernicious gas in the process chamber gets into first load cavity, as long as when guaranteeing to be arranged on first valve opening between first load cavity and the process chamber, the air pressure of first load cavity gets final product greater than the air pressure of process chamber.Thereby need not the device in frequent change first load cavity, improved its utilization rate, need not that more first load cavity is carried out frequent shutdown and safeguard, can significantly prolong the maintenance period of equipment, improve the useful life of equipment.Simultaneously, owing to stopped pernicious gas and get into first load cavity, therefore also need not to have practiced thrift the cost of equipment to the pernicious gas in first load cavity arrange special discharge duct and waste gas treatment equipment.

Embodiment two

Fig. 3 is the structural representation of present embodiment lining processor.Compare with embodiment one; The described lining processor of present embodiment also comprises: second valve 500, second load cavity 600 and the said first air pressure adjustment unit; Wherein: said second valve 500 is arranged between said process chamber 300 and said second load cavity 600, is used to connect said second load cavity 600 and said process chamber 300; The said first air pressure adjustment unit makes that the air pressure of said first load cavity 100 was greater than the air pressure of said process chamber 300 when said first valve 200 was opened.

In the present embodiment, said first load cavity 100 is a LOADED CAVITY, only is used for the glass-loaded substrate; Said second load cavity 600 is used to unload glass substrate for the unloading chamber.Said second load cavity 600 has the cooling device (figure does not show) that can be used for cooling base and use.

The said second air pressure adjustment unit comprises second pneumatic control system 610 and the second air pressure monitor device 700 that is arranged in second load cavity 600.Said second pneumatic control system 610 is regulated the air pressure of said first load cavity, makes that the air pressure of second load cavity 600 was greater than the air pressure of process chamber 300 when second valve 500 was opened.The said second air pressure monitor device 700 is used for detecting the air pressure of said second load cavity 600 and said process chamber 300, and controls the air pressure that said second pneumatic control system 620 is regulated in second load cavity 600 according to said second load cavity 600 and the air pressure in the said process chamber 300.

In the present embodiment, said second pneumatic control system 610 comprises: the second pressure regulation gas input device 611 is used for to said second load cavity, 600 input pressure regulation gases; Second exhaust apparatus 612 is used for discharging the gas of said second load cavity 600; Wherein, said pressure regulation gas can be one or more combinations in nitrogen, hydrogen, the inert gas, also can be identical with the carrier gas of reacting gas in the said process chamber 300.Because when second valve 500 is opened; The air pressure of second load cavity 600 is greater than the air pressure of process chamber 300; Therefore the gas of process chamber 300 can not get into second load cavity 600; But the gas of second load cavity 600 can get into process chamber 300, react so the pressure regulation gas of selecting for use can not influence process chamber 300 reacting gass at least, and pressure regulation gas is preferably selected gas nonflammable, non-explosive, that need not subsequent treatment for use.The pressure regulation gas of selecting for use in the present embodiment is nitrogen (N ₂).Through regulating the said second pressure regulation gas input device 611 and said second exhaust apparatus 612, the air pressure of said second load cavity 600 is in the scope of 1mbar～50mbar, as: 1mbar, 10mbar, 30mbar, 50mbar etc.

The said second pressure regulation gas input device 611 comprises the second flow controller (not shown), is used for controlling the flow of said second load cavity, the 600 pressure regulation gases of input.Second flow controller described in the present embodiment is second needle-valve, and in other embodiments of the invention, said second flow controller also can be selected other volume control device for use.

The second air pressure monitor device 700 comprises described in the present embodiment: the 3rd baroceptor 710, the 4th baroceptor 720 and second processing controller 730.Wherein, Said the 3rd baroceptor 410 is arranged in the said process chamber 300; And be electrically connected said second processing controller 730; Said the 3rd baroceptor 710 is used for detecting the air pressure of said process chamber 300, and sends the atmospheric pressure value of detected process chamber 300 to said second processing controller 730; Said the 4th baroceptor 720 is arranged in said second load cavity 600; And be electrically connected said second processing controller 730; Said the 4th baroceptor 720 is used for detecting the air pressure of said second load cavity 600, and sends the atmospheric pressure value in detected second load cavity 600 to said second processing controller 730; Said second processing controller 730 is electrically connected the said second pressure regulation gas input device 611 and second exhaust apparatus 612.Atmospheric pressure value in second load cavity 600 that atmospheric pressure value in the process chamber 300 that the 3rd baroceptor 710 that said second processing controller, 730 bases receive obtains and the 4th baroceptor 720 obtain; Control the said second pressure regulation gas input device 611 is discharged gas to the pressure regulation gas flow and said second exhaust apparatus 612 of 600 inputs of said second load cavity from said second load cavity 600 flow; Make that the air pressure of second load cavity 600 is greater than the air pressure of said process chamber 300 when said second valve 500 is opened.

In the said second air pressure monitor device 700; Said the 3rd baroceptor 710 and the 4th baroceptor 720 can send to second processing controller 730 with the pressure information of gathering in real time, also can regularly the pressure information of gathering be sent to second processing controller 730.

In another embodiment of the present invention, the said second air pressure monitor device can with shared second baroceptor that is arranged in process chamber of the first air pressure monitor device, thereby need not to be provided with the 3rd baroceptor, finally can save the cost of equipment.

Need to prove; In other embodiments of the invention; Said second processing controller 730 can only connect the said second pressure regulation gas input device 611 or only connect said second exhaust apparatus 612; Promptly discharge the flow of gases to the pressure regulation gas flow of said second load cavity 600 input or said second exhaust apparatus 612 from said second load cavity 600, reach the purpose of the air pressure of second load cavity 600 when said second valve 500 is opened greater than the air pressure of said process chamber 300 through only controlling the said second pressure regulation gas input device 611.

Particularly, when said second valve 500 was opened, the draught head between said second load cavity 600 and the said process chamber 300 was greater than 0 and be less than or equal to 50mbar (hundred handkerchiefs), as: 0.5mbar, 25mbar, 50mbar etc.Preferably, when said second valve 500 was opened, the draught head between said second load cavity 600 and the said process chamber 300 was more than or equal to 1mbar and be less than or equal to 10mbar, as: 1mbar, 4mbar, 7mbar, 10mbar etc.

In another embodiment of the present invention, when said second valve 500 was closed, the air pressure of said second load cavity 600 was also greater than the air pressure of said process chamber 300.The air pressure that promptly guarantees second load cavity 600 is all the time greater than the air pressure of process chamber 300, as long as make this moment the air pressure of said second load cavity 600 and said process chamber 300 all be in the Gas Exchange that stable state can stop said second load cavity 600 and said process chamber 300 all the time.

In other embodiments of the invention, the said second air pressure monitor device 700 also can comprise: warning device and/or display unit etc., its with embodiment 1 in the first air pressure monitor device 400 identical, repeat no more at this.

Referring to shown in Figure 4, the Method of processing a substrate that present embodiment provides (being the course of work of device shown in Figure 3) comprising:

S21, with board transport in said first load cavity 100;

S22 vacuumizes first load cavity 100, and said substrate is preheated processing;

S23 adjusts the pressure of said first load cavity 100, makes the air pressure of said first load cavity 100 greater than the air pressure of said process chamber 300;

S24 opens said first valve 200, and said substrate is transferred to said process chamber 300 from said first load cavity 100;

S25 closes said first valve 200, in said process chamber 300, said substrate is handled;

S26 adjusts the pressure of said second load cavity 600, makes the air pressure of said second load cavity 600 greater than the air pressure of said process chamber 300;

S27 opens said second valve 500, and said substrate is transferred to said second load cavity 600 from said process chamber 300;

S28, said second valve 500 is closed, and the air pressure in said second load cavity 600 is increased to atmospheric pressure;

S29 takes out said substrate from said second load cavity 600.

Wherein, step S21 is identical to step S15 with step S11 among the embodiment one to step S25, repeats no more at this.Specify step S26 below to step S29.

In said step S26; After the processing of accomplishing substrate, in this execution mode, promptly after at least one surface deposition of said glass substrate is accomplished one deck zinc oxide transparent conducting film; Adjust the air pressure of said second load cavity 600, said substrate is passed in said second load cavity 600 with preparation.Concrete method of regulating the pressure of said second load cavity 600 is: make said the 3rd baroceptor 710 and the 4th baroceptor 720 in the said second air pressure monitor device 700 detect the air pressure of said process chamber 300 and said second load cavity 600 respectively, and convert the air pressure of detected said process chamber 300 and said second load cavity 600 to pressure information and be sent to second processing controller 730.730 pairs of pressure informations that receive of said second processing controller carry out analyzing and processing; And control the said second pressure regulation gas input device 611 to second load cavity 600 input pressure regulation gases and/or control the extraction flow of 612 pairs second load cavities 600 of said second exhaust apparatus, to regulate the air pressure of said second load cavity 600.Said adjusting makes the air pressure of said second load cavity 600 greater than the air pressure of process chamber 300, preferably, reaches a preset draught head, as: 1mbar, 4mbar, 7mbar or 10mbar.Among this step S26; The pressure of adjusting said second load cavity 600 also can be carried out in the process of the processing of 300 pairs of said substrates of said process chamber; When said process chamber 300 is accomplished said processing substrate; Air pressure in said second load cavity 600 has been in suitable air pressure, can shorten the processing time to substrate.

In said step S27, make after the said air pressure of air pressure that makes second load cavity 100 greater than process chamber 300, open said second valve 500, said substrate is transferred to said second load cavity 600 from said process chamber 300.In the transmission course; Make the air pressure in said said second load cavity 600 of the second air pressure monitor device, 700 monitoring and the said process chamber 300; And through controlling the said second pressure regulation gas input device 611 to second load cavity 600 input pressure regulation gases and/or control the extraction flow of 612 pairs second load cavities 600 of said second exhaust apparatus; Keep the air pressure of the air pressure of said second load cavity 600, make that the reacting gas in the said process chamber 300 does not flow to said second load cavity 600 greater than process chamber 300; Preferably, keep the air pressure of said second load cavity 600 and the draught head of said process chamber 300 to reach a preset draught head, as: 1mbar, 4mbar, 7mbar or 10mbar.

In said step S28 and S29, close said second valve 500, the air pressure in said second load cavity 600 that raises is to atmospheric pressure; Then, said substrate is taken out from said second load cavity 600.

In the present embodiment, first load cavity 100, process chamber 300 and second load cavity 600 constitute linear structures, can carry out successive sedimentation to raise the efficiency to the multi-disc glass substrate; In the present embodiment, can prevent simultaneously that the pernicious gas in the process chamber 300 from getting into first load cavity 100 and second load cavity 600, thereby reduce infringement simultaneously first load cavity 100 and second load cavity 600.

Embodiment three

Fig. 5 is the structural representation of present embodiment lining processor.Compare with embodiment two; Process chamber 300 described in the described lining processor of present embodiment comprises first deposit cavity 310, second deposit cavity 320, the 3rd deposit cavity 330 and the 4th deposit cavity 340 of continuous setting; Wherein: said first load cavity 100 connects first deposit cavity 310 through first valve 200; Said first deposit cavity 310 connects second deposit cavity 320; Said second deposit cavity 320 connects the 3rd deposit cavity 330, and said the 3rd deposit cavity 330 connects the 4th deposit cavity 340, and said the 4th deposit cavity 340 connects second load cavity 600 through second valve 500.Need to prove that in other embodiments of the invention, said process chamber can also comprise the deposit cavity of other arbitrary numbers, should not limit protection scope of the present invention at this.

Because said process chamber 300 comprises four deposit cavities; The concrete air pressure of each deposit cavity possibly there are differences; Therefore second baroceptor 420 is arranged in said first deposit cavity 310 described in the present embodiment; Be used to detect the air pressure of said first deposit cavity 310; And send the atmospheric pressure value in detected first deposit cavity 310 to said first processing controller 430, thereby make that the air pressure of first load cavity 100 is greater than the air pressure of said first deposit cavity 310 when said first valve 200 is opened; Said the 3rd baroceptor 710 is arranged in said the 4th deposit cavity 340; Be used to detect the air pressure of said the 4th deposit cavity 340; And send the atmospheric pressure value in detected the 4th deposit cavity 340 to said second processing controller 730; Thereby make that the air pressure of second load cavity 600 is greater than the air pressure of said the 4th deposit cavity 340 when said second valve 500 is opened.All the other are identical with embodiment two, repeat no more at this.

Referring to shown in Figure 6, the Method of processing a substrate that present embodiment provides (being the course of work of device shown in Figure 5) comprising:

S31, with board transport in said first load cavity 100;

S32 vacuumizes first load cavity 100, and said substrate is preheated processing;

S33 adjusts the pressure of said first load cavity 100, makes the air pressure of said first load cavity 100 greater than the air pressure of said first deposit cavity 310;

S34 opens said first valve 200, and said substrate is transferred to said first deposit cavity 310 from said first load cavity 100;

S35 closes said first valve 200, in said first deposit cavity 310, second deposit cavity 320, the 3rd deposit cavity 330 and the 4th deposit cavity 340, said substrate is handled successively;

S36 adjusts the pressure of said second load cavity 600, makes the air pressure of said second load cavity 600 greater than the air pressure of said the 4th deposit cavity 340;

S37 opens said second valve 500, and said substrate is transferred to said second load cavity 600 from said the 4th deposit cavity 340;

S38, said second valve 500 is closed, and the air pressure in said second load cavity 600 is increased to atmospheric pressure;

S39 takes out said substrate from said second load cavity 600.

Present embodiment is compared with embodiment two; Step S31, S32, S38 and S39 are identical with step S21, S22, S28 and S29 among the embodiment two; Because this moment, process chamber 300 comprised four deposit cavities; Therefore step S33, S34, S35, S36 and S37 have taken place partly to change, and only describe changing part below.

In said step S33; Make said first baroceptor 410 and second baroceptor 420 in the said first air pressure monitor device 400 detect the air pressure of first load cavity 100 and said first deposit cavity 310 respectively, and convert the air pressure of detected first load cavity 100 and first deposit cavity 310 to pressure information and be sent to first processing controller 430.430 pairs of pressure informations that receive of said first processing controller carry out analyzing and processing; And control the said first pressure regulation gas input device 121 of first processing controller 430 control to first load cavity, 100 input pressure regulation gases and/or control the extraction flow of 122 pairs first load cavities 100 of said first exhaust apparatus, to regulate the air pressure of said first load cavity 100.Said adjusting makes the air pressure of said first load cavity 100 greater than the air pressure of first deposit cavity 310, preferably, reaches a preset draught head, as: 1mbar, 4mbar, 7mbar or 10mbar.

In said step S34, make after the air pressure of air pressure greater than first deposit cavity 310 of said first load cavity 100, open said first valve 200, said substrate is transferred to said first deposit cavity 310 from said first load cavity 100.In the transmission course; Make the air pressure in said said first load cavity 100 of the first air pressure monitor device, 400 monitoring and said first deposit cavity 310; And through controlling the said first pressure regulation gas input device 121 to first load cavity 100 input pressure regulation gases and/or control the extraction flow of 122 pairs first load cavities 100 of said first exhaust apparatus; Keep the air pressure of the air pressure of said first load cavity 100, make that the reacting gas in said first deposit cavity 310 does not flow to said first load cavity 100 greater than first deposit cavity 310; Preferably, keep the air pressure of said first load cavity 100 and the draught head of said first deposit cavity 310 to reach a preset draught head, as: 1mbar, 4mbar, 7mbar or 10mbar.

In said step S35, said board transport behind said first deposit cavity 310, is closed said first valve 200.In first deposit cavity 310, second deposit cavity 320, the 3rd deposit cavity 330 and the 4th deposit cavity 340, glass substrate is carried out thin film deposition successively, thereby accomplish thin film deposition glass substrate.The process of specifically carrying out thin film deposition is same as the previously described embodiments, repeats no more at this.

In said step S36, after the processing of accomplishing substrate, adjust the air pressure of said second load cavity 600, with preparation said substrate is passed in said second load cavity 600.Concrete method of regulating the pressure of said second load cavity 600 is: make said the 3rd baroceptor 710 and the 4th baroceptor 720 in the said second air pressure monitor device 700 detect the air pressure of said the 4th deposit cavity 340 and said second load cavity 600 respectively, and convert the air pressure of detected said the 4th deposit cavity 340 and said second load cavity 600 to pressure information and be sent to second processing controller 730.730 pairs of pressure informations that receive of said second processing controller carry out analyzing and processing; And control the said second pressure regulation gas input device 611 to second load cavity 600 input pressure regulation gases and/or control the extraction flow of 612 pairs second load cavities 600 of said second exhaust apparatus, to regulate the air pressure of said second load cavity 600.Said adjusting makes the air pressure of said second load cavity 600 greater than the air pressure of the 4th deposit cavity 340, preferably, reaches a preset draught head, as: 1mbar, 4mbar, 7mbar or 10mbar.Among this step S26; The pressure of adjusting said second load cavity 600 also can be carried out in the process of the processing of 340 pairs of said substrates of said the 4th deposit cavity; When said the 4th deposit cavity 340 is accomplished said processing substrate; Air pressure in said second load cavity 600 has been in suitable air pressure, can shorten the processing time to substrate.

In said step S37, make after the said air pressure of air pressure that makes second load cavity 100 greater than the 4th deposit cavity 340, open said second valve 500, said substrate is transferred to said second load cavity 600 from said the 4th deposit cavity 340.In the transmission course; Make the air pressure in said said second load cavity 600 of the second air pressure monitor device, 700 monitoring and said the 4th deposit cavity 340; And through controlling the said second pressure regulation gas input device 611 to second load cavity 600 input pressure regulation gases and/or control the extraction flow of 612 pairs second load cavities 600 of said second exhaust apparatus; Keep the air pressure of the air pressure of said second load cavity 600, make that the reacting gas in said the 4th deposit cavity 340 does not flow to said second load cavity 600 greater than the 4th deposit cavity 340; Preferably, keep the air pressure of said second load cavity 600 and the draught head of said the 4th deposit cavity 340 to reach a preset draught head, as: 1mbar, 4mbar, 7mbar or 10mbar.

Present embodiment can prevent simultaneously that equally the pernicious gas in the process chamber 300 from getting into first load cavity 100 and second load cavity 600, thereby has reduced the infringement to first load cavity 100 and second load cavity 600; Have a plurality of deposit cavities in the present embodiment simultaneously, thereby can improve the output of thin film deposition greatly.

Though oneself discloses the present invention as above with preferred embodiment, the present invention is defined in this.Any those skilled in the art are not breaking away from the spirit and scope of the present invention, all can do various changes and modification, so protection scope of the present invention should be as the criterion with claim institute restricted portion.

Claims

1. lining processor; Comprise first load cavity, first valve and process chamber, said first valve is arranged between said first load cavity and the said process chamber, is used to connect said first load cavity and said process chamber; It is characterized in that; Said lining processor also comprises the first air pressure adjustment unit, so that during said first valve open, the air pressure of said first load cavity is greater than the air pressure of said process chamber.

2. lining processor as claimed in claim 1 is characterized in that, during said first valve open, the draught head between said first load cavity and the said process chamber is greater than 0 and be less than or equal to 50mbar.

3. lining processor as claimed in claim 1 is characterized in that, during said first valve open, the draught head between said first load cavity and the said process chamber is more than or equal to 1mbar and be less than or equal to 10mbar.

4. lining processor as claimed in claim 1 is characterized in that, said process chamber is the low-pressure chemical vapor deposition chamber that is used for the depositing zinc oxide nesa coating, and the air pressure range of said process chamber is more than or equal to 0.1mbar and is less than or equal to 1mbar.

5. lining processor as claimed in claim 4 is characterized in that, during said first valve open, the air pressure range of said first load cavity is for more than or equal to 1mbar and be less than or equal to 50mbar.

6. lining processor as claimed in claim 1 is characterized in that, during said first valve closing, the air pressure of said first load cavity is greater than the air pressure of said process chamber.

7. lining processor as claimed in claim 1 is characterized in that, said first load cavity comprises: preheating apparatus is used for the substrate of said first load cavity is preheated.

8. lining processor as claimed in claim 7; It is characterized in that; Said preheating apparatus comprises: infrared heating fluorescent tube and reflecting plate; Wherein, said infrared heating fluorescent tube is arranged on the top of said first load cavity, and said reflecting plate is arranged between the roof of said infrared heating fluorescent tube and said first load cavity.

9. lining processor as claimed in claim 1; It is characterized in that; The said first air pressure adjustment unit comprises first pneumatic control system that is arranged at first load cavity; Said first pneumatic control system is used for controlling the air pressure of said first load cavity, and said first pneumatic control system comprises: the first pressure regulation gas input device is used for to said first load cavity input pressure regulation gas; First exhaust apparatus is used for discharging the gas of said first load cavity.

10. lining processor as claimed in claim 9 is characterized in that, the said first pressure regulation gas input device comprises: the first flow controller is used for controlling the flow of importing the said first load cavity pressure regulation gas.

11. lining processor as claimed in claim 10 is characterized in that, said first flow controller is first needle-valve.

12. lining processor as claimed in claim 9; It is characterized in that; The said first air pressure adjustment unit also comprises: the first air pressure monitor device; It detects the air pressure in said first load cavity and the said process chamber, and controls said first pneumatic control system, to control the air pressure in said first load cavity.

13. lining processor as claimed in claim 12 is characterized in that, the said first air pressure monitor device comprises: first baroceptor, be arranged in said first load cavity, and be used for detecting the air pressure of said first load cavity; Second baroceptor is arranged in the said process chamber, is used for detecting the air pressure of said process chamber.

14. lining processor as claimed in claim 13; It is characterized in that; The said first air pressure monitor device also comprises: first processing controller; Said first processing controller connects first baroceptor and second baroceptor, is used to receive the air pressure in the said process chamber that air pressure and second baroceptor in said first load cavity that first baroceptor obtains obtain; Said first processing controller also connects the first pressure regulation gas input device and/or first exhaust apparatus; Be used to control the said first pressure regulation gas input device is discharged gas to the pressure regulation gas flow and/or said first exhaust apparatus of said first load cavity input from said first load cavity flow; Make that the air pressure of first load cavity is greater than the air pressure of said process chamber when said first valve open.

15. like any described lining processor in the claim 1 to 14; It is characterized in that; Also comprise: second valve and second load cavity, said second valve are arranged between said process chamber and said second load cavity, and said lining processor also comprises the second air pressure adjustment unit; So that during said second valve open, the air pressure of said second load cavity is greater than the air pressure of said process chamber.

16. lining processor as claimed in claim 15 is characterized in that, the air pressure range of said second load cavity is more than or equal to 1mbar and is less than or equal to 50mbar.

17. lining processor as claimed in claim 15 is characterized in that, during said second valve closing, the air pressure of said second load cavity is greater than the air pressure of said process chamber.

18. lining processor as claimed in claim 15; It is characterized in that; The said second air pressure adjustment unit comprises second pneumatic control system that is arranged at second load cavity; Said second pneumatic control system is used for controlling the air pressure of said second load cavity, and said second pneumatic control system comprises: the second pressure regulation gas input device is used for to said second load cavity input pressure regulation gas; Second exhaust apparatus is used for discharging the gas of said second load cavity.

19. lining processor as claimed in claim 18 is characterized in that, the said second pressure regulation gas input device comprises: second flow controller is used for controlling the flow of importing the said second load cavity pressure regulation gas.

20. lining processor as claimed in claim 19 is characterized in that, said second flow controller is second needle-valve.

21. lining processor as claimed in claim 18 is characterized in that, the said second air pressure adjustment unit also comprises: the second air pressure monitor device is used for detecting the air pressure of said second load cavity and said process chamber; And control said second pneumatic control system, to control the air pressure in said second load cavity.

22. lining processor as claimed in claim 21 is characterized in that, the said second air pressure monitor device comprises: second baroceptor, be arranged in the said process chamber, and be used for detecting the air pressure of said process chamber; The 3rd baroceptor is arranged in said second load cavity, is used for detecting the air pressure of said second load cavity.

23. lining processor as claimed in claim 22; It is characterized in that; The said second air pressure monitor device also comprises: second processing controller; Said second processing controller connects second baroceptor and the 3rd baroceptor respectively, is used to receive the air pressure in said second load cavity that air pressure and the 3rd baroceptor in the said process chamber that second baroceptor obtains obtain; Said second processing controller also connects the second pressure regulation gas input device and/or second exhaust apparatus; Be used to control the said second pressure regulation gas input device is discharged gas to the pressure regulation gas flow and/or said second exhaust apparatus of said second load cavity input from said second load cavity flow; Make that the air pressure in said second load cavity is greater than the air pressure in the said process chamber when said second valve open.

24. lining processor as claimed in claim 18 is characterized in that, said pressure regulation gas packet contains one or more combinations in nitrogen, hydrogen, the inert gas.

25. lining processor as claimed in claim 18 is characterized in that, said pressure regulation gas is identical with the carrier gas of reacting gas in the said process chamber.

26. lining processor as claimed in claim 15 is characterized in that, said lining processor is a chemical gas-phase deposition system.

27. lining processor as claimed in claim 26 is characterized in that, said first load cavity comprises LOADED CAVITY; Said second load cavity comprises the unloading chamber; Said process chamber comprises deposit cavity.

28. lining processor as claimed in claim 27 is characterized in that, said process chamber comprises the deposit cavity that a plurality of LINEAR CONTINUOUS are provided with, and said first load cavity and said second load cavity are connected two deposit cavities of head and the tail of said a plurality of deposit cavities respectively.

29. lining processor as claimed in claim 28; It is characterized in that; Said a plurality of deposit cavity is the first, second, third and the 4th deposit cavity that is provided with continuously, and said first load cavity connects said first deposit cavity, and said second load cavity connects said the 4th deposit cavity.

30. a Method of processing a substrate, it comprises:

One lining processor is provided, and said lining processor comprises first load cavity, first valve and process chamber, and said first valve is arranged between said first load cavity and the said process chamber, is used for connecting

Said first load cavity and said process chamber;

With pending board transport in said first load cavity;

31. Method of processing a substrate as claimed in claim 30 is characterized in that, said substrate is transferred to the said process chamber process from said first load cavity, keeps the air pressure of the air pressure of said first load cavity greater than said process chamber.

32., it is characterized in that the draught head between said first load cavity and the said process chamber is greater than 0 and be less than or equal to 50mbar like claim 30 or 31 described Method of processing a substrate.

33., it is characterized in that the draught head between said first load cavity and the said process chamber is more than or equal to 1mbar and be less than or equal to 10mbar like claim 30 or 31 described Method of processing a substrate.

34. Method of processing a substrate as claimed in claim 30 is characterized in that, comprises that also said board transport behind said first load cavity, vacuumizes said first load cavity, and the step that said substrate is heated.

35. Method of processing a substrate as claimed in claim 34 is characterized in that, it is characterized in that, said first load cavity comprises preheating apparatus, and said first load cavity preheats the substrate in said first load cavity through said preheating apparatus.

36. Method of processing a substrate as claimed in claim 35 is characterized in that, said preheating apparatus comprises:

Infrared heating fluorescent tube and reflecting plate, wherein, said infrared heating fluorescent tube is arranged on the top of said first load cavity, and said reflecting plate is arranged between the roof of said infrared heating fluorescent tube and said first load cavity.

37. Method of processing a substrate as claimed in claim 30 is characterized in that, comprises that also said board transport behind the said process chamber, closes said first valve, in said process chamber, said substrate is carried out processed steps.

38. Method of processing a substrate as claimed in claim 37; It is characterized in that; In said process chamber, said substrate handled and comprise to said process chamber and feed the reacting gas that comprises diethyl zinc and steam that the air pressure range of said process chamber is more than or equal to 0.1mbar and is less than or equal to 1mbar.

39. Method of processing a substrate as claimed in claim 37; It is characterized in that; Also be included in completion in said process chamber after the processing to said substrate; Or in said process chamber, in the process to the processing of said substrate, regulate the pressure of said first load cavity, make the air pressure of said first load cavity greater than the step of the air pressure of said process chamber.

40. Method of processing a substrate as claimed in claim 37 is characterized in that, in the process of in said process chamber, said substrate being handled, keeps the air pressure of the air pressure of said first load cavity greater than said process chamber.

41. like claim 39 or 40 described Method of processing a substrate; It is characterized in that; Also be included in completion and in said process chamber, after the processing to said substrate, open said first valve, said substrate is transferred to the step of said first load cavity from said process chamber.

42. Method of processing a substrate as claimed in claim 41 is characterized in that, said substrate is transferred to the said first load cavity process from said process chamber, keeps the air pressure of the air pressure of said first load cavity greater than said process chamber.

43. Method of processing a substrate as claimed in claim 41 is characterized in that, the draught head between said first load cavity and the said process chamber is greater than 0 and be less than or equal to 50mbar.

44., it is characterized in that the pressure of regulating said first load cavity comprises, to said first load cavity input pressure regulation gas like claim 30 or 31 described Method of processing a substrate.

45. Method of processing a substrate as claimed in claim 44 is characterized in that, said pressure regulation gas packet contains one or more combinations in nitrogen, hydrogen, the inert gas.

46. Method of processing a substrate as claimed in claim 44 is characterized in that, said pressure regulation gas be with said process chamber in the identical gas of carrier gas of reacting gas.

47. Method of processing a substrate as claimed in claim 37 is characterized in that, said lining processor also comprises: second valve and second load cavity; Said second valve is arranged between said process chamber and said second load cavity, is used to connect said first load cavity and said process chamber; Said Method of processing a substrate also comprises: accomplish in said process chamber after the processing to said substrate; Or in said process chamber in the process to said substrate; Regulate the pressure of said second load cavity, make the air pressure of said second load cavity greater than the step of the air pressure of said process chamber.

48. Method of processing a substrate as claimed in claim 47 is characterized in that, also is included in completion and in said process chamber, after the processing to said substrate, opens said second valve, said substrate is transferred to the step of said second load cavity from said process chamber.

49. Method of processing a substrate as claimed in claim 48 is characterized in that, said substrate is transferred to the said second load cavity process from said process chamber, keeps the air pressure of the air pressure of said second load cavity greater than said process chamber.

50., it is characterized in that the draught head between said second load cavity and the said process chamber is greater than 0 and be less than or equal to 50mbar like claim 47 or 49 described Method of processing a substrate.

51. Method of processing a substrate as claimed in claim 47 is characterized in that, the pressure of regulating said second load cavity comprises, to said second load cavity input pressure regulation gas.