CN102841404A - Planar lightwave circuit - Google Patents
Planar lightwave circuit Download PDFInfo
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- CN102841404A CN102841404A CN2012102112248A CN201210211224A CN102841404A CN 102841404 A CN102841404 A CN 102841404A CN 2012102112248 A CN2012102112248 A CN 2012102112248A CN 201210211224 A CN201210211224 A CN 201210211224A CN 102841404 A CN102841404 A CN 102841404A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12002—Three-dimensional structures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3502—Optical coupling means having switching means involving direct waveguide displacement, e.g. cantilever type waveguide displacement involving waveguide bending, or displacing an interposed waveguide between stationary waveguides
- G02B6/3508—Lateral or transverse displacement of the whole waveguides, e.g. by varying the distance between opposed waveguide ends, or by mutual lateral displacement of opposed waveguide ends
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12159—Interferometer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12033—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for configuring the device, e.g. moveable element for wavelength tuning
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
Abstract
In an integrated optical receiver or transmitter, both the displacement of an optical axis caused by thermal changes and the property degradation of an optical functional circuit are inhibited. A planar lightwave circuit having a substrate and a waveguide-type optical functional circuit formed thereon composed of a material different from that of the substrate, and includes a waveguide region formed only of an optical wavelength that is in contact with a side forming an emission-end face of the optical waveguide for propagating the light emitted from the optical functional circuit or an incident-end face of an optical waveguide for propagating the light incident on the optical functional circuit. The planar lightwave circuit is fixed to a fixing mount only at the bottom of the substrate where the waveguide region is formed.
Description
Technical field
The present invention relates to light-emitting component or photo detector integrated and constitute the plane light wave circuit of optical transceiver.
Background technology
Along with the development of optical communication technique, the exploitation of optics becomes and becomes more and more important.Particularly, the transmission speed of optical transceiver and the high speed of reaction velocity are being studied, and message capacity constantly enlarges.General transceiver by with the light-emitting component of photosemiconductor made or photo detector and output with or the optical fiber of input usefulness constitute their optically-coupled that is situated between by lens.For example, for optical receiver, from the light scioptics of the optical fiber outgoing of input side and form images, directly carry out detection (intensity detection) to photo detector.
Then pay close attention to the modulation treatment technology in the optical transmission system, use the signal of phase modulation method to transmit extensively practicability of quilt.The strong control of phase shift (PSK) mode is the mode that a kind of phase place through light modulated is come transmission signals, through many-valuedization of modulation, and compare transmission capacity in the past and is able to tremendous expansion.
In order to receive such psk signal, need carry out detection to the phase place of light.Photo detector can carry out detection to the signal light intensity, but can't carry out detection to the phase place of light.Therefore, need with the phase tranformation of light the means of light intensity.About this, have through using interference of light phase differential to be carried out methods such as detection.Through making flashlight and (reference light) interference of other light and the light intensity of this interference light is carried out detection, thereby can access the phase information of light by photo detector.Have and use the light source of preparation in addition to be used as the coherent detection of reference light, and make the part of flashlight self depart from the differential detection that makes flashlight and reference wave interference with ripple as a reference again.Like this, compare with only using the photoreceiver of intensity modulated mode in the past, the photoreceiver of PSK mode in recent years need be transformed to phase information the interference of light loop of strength information through interference of light.
Such interference of light loop can use the plane light wave circuit to realize.The advantage that the plane light wave circuit has high volume production, low cost and high trust aspect can realize various interference of light loop.As the interference of light loop of the photoreceiver that is used for the PSK mode, light delay interferometer loop, 90 degree mixed circuits etc. is implemented and practicability.Such plane light wave circuit is that imaging method, etching technique and the FHD glass deposition technology such as (Flame Hydrolysis Deposition, i.e. flame hydrolysis depositions) through standard is made.
The manufacturing process that general survey is concrete makes with quartz glass etc. to be the under-clad layer of main material and to have more than covering that the sandwich layer of high index of refraction is deposited in the silicon substrates such as (Si) at first.Afterwards, form various waveguide modes, will bury by the waveguide that sandwich layer forms through top covering at last at sandwich layer.Be made into the light functional loop of waveguide type through such technology.Flashlight is closed in the waveguide that above-mentioned technology is produced, in the inner transmission of propagation plane type light wave circuit.
Fig. 1 shows plane light wave circuit and the light method of attachment of optical receiver in the past.Then the plane light wave circuit in the concern PSK mode photoreceiver and the light method of attachment of optical receiver, these basic methods of attachment are attempted simple optical fiber such shown in 1 and are connected.The plane light wave circuit 1 that input/output terminal has been connected optical fiber 3a, 3b carries out optically-coupled with the optical receiver with input optical fibre 3b 2 through linking to each other with optical fiber.The radical of optical fiber that is used for optically-coupled is many sometimes by the quantity decision from the output light of plane light wave circuit output.Yet, used the formation of the photoreceiver of such optical fiber connection to exist size to become big problem.About this,, will all be integrated into an encapsulation, thereby can try hard to miniaturization through the coupling of lens direct sunshine is used in the output of plane light wave circuit and the input of optical receiver.The optical receiver of the form of such plane light wave circuit and optical receiver direct sunshine coupling is called the integrated-type photoreceiver.
In order to realize the integrated-type optical receiver, the fixing means of the plane light wave circuit particular importance that becomes.When making when the light of plane light wave circuit output transmits also scioptics etc. and is optically coupled to photo detector the space; If the position of the exit end of light, lens, photo detector relation changes; Then no longer can receive all light, cause damage through photo detector.Particularly when the temperature of the encapsulation of holding photoreceiver, environment temperature, each component temperature etc. changed, the influence of thermal expansion caused their shift in position, so that such problem becomes is remarkable.Therefore, in order to realize the optically-coupled of low loss, even need make each position relation when environment temperature etc. changes, also not change relatively at least.
Plane light wave circuit particularly, for environment temperature, the change in shape that thermal expansion causes is compared very big with photo detector etc.In addition, plane light wave circuit shared area in optical receiver, than photo detector big several times to tens times, the change in shape that thermal expansion causes also big several times to tens times.In addition, constitute the substrate of plane light wave circuit and the film glass that is deposited, owing to have bigger coefficient of thermal expansion differences, so temperature variation can cause warpage largely.Therefore, with respect to photo detector, change from the change in location of the emergent light of plane light wave circuit and shooting angle and to become the problem that can not be ignored.These two variations cause that position or the angle from the emergent light of plane light wave circuit changes, and optical axis deviation takes place.Optical axis deviation makes and the optically-coupled deterioration of photo detector, loses.For the realization of integrated-type photoreceiver, eliminate such optical axis deviation or make such optical axis deviation innoxious very important.
Fig. 2 shows the internal structure of integrated-type optical receiver in the past.Is known in order to make the optical axis deviation that is caused by temperature variation as above-mentioned not take place with almost whole the firmly fixed method in the bottom surface of plane light wave circuit.In the integrated-type optical receiver shown in Figure 2, the plane light wave circuit 13, lens 14 and the photo detector 15 that have formed interference of light loop as the light functional loop are fixed to base substrate 11 with mounting 12a, 12b and 12c as supporting member with fixing respectively.Optical fiber 16 is situated between with plane light wave circuit 13 and is connected by fiber-optic component fixing 17.In the integrated-type photoreceiver, after the light of optical fiber 16 outputs was interfered plane light wave circuit 13, scioptics 14 were coupled to photo detector 15.
Fix and fix through bonding agent 18 or scolding tin with mounting 12a and plane light wave circuit 13.Use mounting through the almost whole face in the bottom surface of plane light wave circuit 13 firmly being fixed to fix, thereby the expansion or the warpage that suppress to be caused by temperature change.In addition, use mounting through lens 14, photo detector 15 also being fixed to fix, thereby make the optical axis deviation that causes by temperature variation not take place.
Yet for formation shown in Figure 2, though though can be suppressed the optical axis deviation that caused by temperature variation greatly, but then, the characteristic variations of the plane light wave circuit that temperature variation causes becomes remarkable.As stated, plane light wave circuit 13, owing to be made up of Si substrate 13a with very big coefficient of thermal expansion differences and quartz glass layer 13b, the warpage that temperature variation causes variation or thermal expansion meeting are very greatly.For formation shown in Figure 2,,, thermal expansion or warpage be able to suppress so changing because the bottom surface of plane light wave circuit 13 is fixing by whole.
On the other hand, in the case, produce very big thermal stress between Si substrate 13a and the quartz glass layer 13b.Stress causes variations in refractive index through the photoelasticity effect in quartz glass layer 13b inside.The interference of light loop that in plane light wave circuit 13, constitutes, in order to control interference pattern, the length of waveguide and refractive index are by adjustment correctly.Jie brings the long variation of equivalent circuit by the variations in refractive index that stress takes place, and makes interferometric characteristic variations, therefore makes the deterioration in characteristics in interference of light loop.
For this; If suppress change of optical property through the generation that suppresses thermal stress and use the bonding agent of softness such as elastic adhesive, paste or fix and (for example be used as bonding agent 18 with paste; With reference to Japanese patent application TOHKEMY 2009-175364 patent gazette); Then the influence of aforesaid optical axis deviation can become significantly, loses.
General introduction
The problem that the present invention will solve
The object of the present invention is to provide the plane light wave circuit of the deterioration in characteristics of the optical axis deviation that in integrated-type photoreceiver or optical transmitter, can suppress simultaneously to cause and light functional loop by temperature variation.
Be used to solve the means of above-mentioned problem
In order to reach such purpose; An embodiment of the present invention does; Plane light wave circuit with light functional loop of the waveguide type that in substrate, forms; It is characterized in that; Comprise the waveguide field that only formed optical waveguide with having formed that outgoing end face or one side of incident end face of being able to the optical waveguide of incident to the incident light of said smooth functional loop that emergent light from said smooth functional loop is able to the optical waveguide of outgoing join, only be fixed in the bottom surface of the said substrate of the part that has formed said waveguide field keep said plane light wave circuit fixedly use mounting.
Other embodiment does; Plane light wave circuit with light functional loop of the waveguide type that in substrate, forms; It is characterized in that; Be able to from the emergent light of said smooth functional loop outgoing optical waveguide the outgoing end face or be fixed to center fixed to the incident end face that the incident light of said smooth functional loop is able to the optical waveguide of incident and use mounting; This center fixed is processed by the material that said emergent light or incident light are seen through with mounting, and said center fixed is fixed to mounting and fixedly uses mounting.
Also have other embodiment to be; Plane light wave circuit with light functional loop of the waveguide type that forms in the substrate; It is characterized in that; Be able to from the emergent light of said smooth functional loop outgoing optical waveguide the outgoing end face or be fixed to center fixed to the incident end face that the incident light of said smooth functional loop is able to the optical waveguide of incident and use mounting; This center fixed is formed with the window of being processed by the material that said emergent light or incident light are seen through, the breach that perhaps said emergent light or incident light is seen through with the part of mounting, and said center fixed is fixed to mounting and fixedly uses mounting.
The effect of invention
As discussed above in only with the light circuit on the plane light wave circuit the special waveguide field of must powerful fixing light input and output in order to prevent optical axis deviation using be fixed in the fixing integrated-type photoreceiver or optical transmitter with mounting, can suppress the optical axis deviation of temperature variation initiation and the deterioration in characteristics of light functional loop simultaneously.
The accompanying drawing summary
Fig. 1 is the figure that the light method of attachment of in the past plane light wave circuit and optical receiver is shown;
Fig. 2 is the in-built figure that integrated-type photoreceiver in the past is shown;
Fig. 3 is the in-built figure that the related integrated-type optical receiver of embodiments of the invention 1 is shown;
Fig. 4 A is the figure that the fixing means of the related plane light wave circuit of embodiment 1 is shown;
Fig. 4 B is the figure that the fixing means of the related plane light wave circuit of embodiment 1 is shown;
Fig. 4 C is the figure that the fixing means of the related plane light wave circuit of embodiment 1 is shown;
Fig. 4 D is the figure that the fixing means of the related plane light wave circuit of embodiment 1 is shown;
Fig. 5 is the in-built figure that the related integrated-type optical receiver of embodiments of the invention 2 is shown;
Fig. 6 A is the figure that the fixing means of the related plane light wave circuit of embodiment 3 is shown;
Fig. 6 B is the figure that the fixing means of the related plane light wave circuit of embodiment 3 is shown;
Fig. 7 A is the figure that the stress analysis result of the plane light wave circuit in embodiment 1 and 3 is shown;
Fig. 7 B is the figure that the stress analysis result of the plane light wave circuit in embodiment 1 and 3 is shown;
Fig. 8 A is the figure that the fixing means of the related plane light wave circuit of embodiment 4 is shown;
Fig. 8 B is the figure that the fixing means of the related plane light wave circuit of embodiment 4 is shown;
Fig. 9 A is the figure that the fixing means of the related plane light wave circuit of embodiment 5 is shown;
Fig. 9 B is the figure that the fixing means of the related plane light wave circuit of embodiment 5 is shown;
Figure 10 A is the figure that the fixing means of the related plane light wave circuit of embodiment 6 is shown;
Figure 10 B is the figure that the fixing means of the related plane light wave circuit of embodiment 6 is shown;
Figure 10 C is the figure that the fixing means of the related plane light wave circuit of embodiment 6 is shown;
Figure 11 is the in-built figure that the related integrated-type optical receiver of embodiments of the invention 7 is shown.
Embodiment
Below, with reference to drawing embodiment of the present invention is elaborated.Though in this embodiment, be that example describes with the integrated-type photoreceiver, for example photo detector is replaced with light-emitting component, emergent light is replaced with incident light, the outgoing end face is replaced with incident end face obviously, then also go for optical transmitter.
In this embodiment, only the special waveguide field of must the powerful light input and output of fixing in order to prevent optical axis deviation using in the light circuit on the plane light wave circuit is fixed to and fixedly uses mounting.The field that will not form the light functional loops such as interference of light loop of easy affected by force is fixed to fixedly uses mounting.Thus, even temperature variation causes distortion or warpage, the stress influence of light functional loop part is minimum getting final product, and can suppress the deterioration in characteristics of light functional loop.In addition, use mounting,,, can obtain bigger action leeway to temperature variation as optical transceiver so can suppress the optical axis deviation that temperature variation causes because the waveguide field is fixed to fix.
In addition, if become big, then because the requirement of the thermostats such as Palt element that are provided with in the optical transceiver is obtained relaxing, so can try hard to subdue the cost of optical transceiver and reduce consumed power to the action leeway of temperature variation.
(embodiment 1)
Fig. 3 shows the internal structure of the related integrated-type photoreceiver of embodiments of the invention 1.Form plane light wave circuit 33, lens 34 and the photo detector 35 in interference of light loop as the light functional loop, be fixed to base substrate 31 with mounting 32a, 32b and 32c as supporting member with fixing respectively.Optical fiber 36 is situated between with plane light wave circuit 33 and is connected by optical fiber fixation kit 37.In the integrated-type photoreceiver, from the light of optical fiber 36 input 33 li of plane light wave circuits interfere wait the light signal processing after, scioptics 34 are coupled to photo detector 35.Lamination the quartz glass layer 33b that has formed the waveguide type light functional loop that is made up of sandwich layer, covering on the Si of plane light wave circuit 33 substrate 33a.
Fig. 4 A-4D shows the fixing means of the related plane light wave circuit of embodiment 1.Show in detail the fixing means of plane light wave circuit 33 shown in Figure 3.In the quartz glass layer 33b of plane light wave circuit 33, be formed with; Formed the field 33y in interference of light loop as the light functional loop, one side and with formed to the emergent light of lens 34 be able to outgoing optical waveguide joining of outgoing end face and only formed the waveguide field 33x (with reference to Fig. 4 D) of optical waveguide (not forming interference of light loop).Fix with mounting 32a shown in Fig. 4 A, 4B, see from the side, be word shape of falling L or hook-type, only the waveguide field 33x (with reference to Fig. 4 D) in the light circuit on the plane light wave circuit 33 is fixed through bonding agent 38.
At this moment, the bottom surface of the substrate of the bottom of the waveguide field 33x of plane light wave circuit 33 is parallel with the upper surface of fixing fixed part with mounting 32a.In addition, fix,, give prominence to (in Fig. 4 A-4C to right-hand) laterally with about 100 times length of the thickness of bonding agent 38 while make comparing of the outgoing end face formed waveguide field 33x fixing fixed part with mounting 32a.Thus; The warpage of the plane light wave circuit 33 that is caused by temperature variation changes (with reference to Fig. 4 A, 4B); The change in location of court (with respect to the plane, loop of the plane light wave circuit 33) horizontal direction that does not receive to cause, the fixedly position of the exit end of waveguide field 33x by thermal expansion.Because lens 34, photo detector 35 also are fixed to fixing with mounting (with reference to Fig. 3), so the optical axis deviation that caused by temperature variation does not take place.
The field 33y in the interference of light loop of plane light wave circuit 33 is not fixed to the fixing mounting 32a that uses, and is suspended state with respect to fixing with mounting 32a.Even temperature variation causes plane light wave circuit 33 and produces warpage, owing to can freely change (with reference to Fig. 4 A, 4B), is not subject to stress influence.
The birefringence that stress that produces because of installation or STRESS VARIATION cause optical waveguide changes.Because it is responsive that interference of light loop changes birefringence, is subject to deterioration in characteristics, fixingly do not use mounting 32a so the field 33y in interference of light loop is not fixed to, can try hard to the stabilization of characteristic thus.On the other hand,, change the stress influence that causes by the warpage of plane light wave circuit 33 and compare lessly with the situation of having fixed whole, therefore can reduce the deterioration in characteristics that causes by the birefringence variation though waveguide field 33x is fixed to the fixing mounting 32a that use.
Fixing with the part of fixed pan type light wave circuit 33 (non-fixed portions) not among the mounting 32a; Even take place in order to make the warpage of the plane light wave circuit 33 that causes by temperature variation change, plane light wave circuit 33 do not contact with the upper surface of non-fixed portions yet, adds difference of height between needs and the fixed part.This is because when having produced the warpage variation, if plane light circuit 33 contacts with mounting 32a with fixing, then produces the stress to substrate, can cause deterioration in characteristics.When plane light wave circuit 33 was the glass material making by Si substrate and quartz, the section difference h (with reference to Fig. 4 A) of non-fixed portions and fixed part need be set to about hundreds of um.
The outgoing end face of waveguide field 33x consistent with the side of fixing fixed part with mounting 32a or slightly partially the outside (in Fig. 4 C, plane light wave circuit 33 departs to right-hand from the side of fixing fixed part with mounting 32a) be preferably.The outgoing end face also can produce same effect than the side of fixed part inboard partially (in Fig. 4 C, plane light wave circuit 33 departs to left from the side of fixing fixed part with mounting 32a).But, in the case,,, perhaps to do one's utmost to be coated with thin bonding agent 38 it is not extruded or the like so need the substrate thickness of thickening plane light wave circuit 33 because fixedly the bonding agent 38 of the usefulness possibility that wraps the outgoing end face can uprise, it is difficult that installation can become.
On the other hand; (5 ~ 20um) the length more than 1000 times is given prominence to laterally with the thickness of bonding agent 38 if the outgoing end face that makes waveguide field 33x is with respect to the side of fixing fixed part with mounting 32a; Then when the warpage of the plane light wave circuit 33 that has taken place to be caused by temperature variation changed, the deviation of the outgoing end face of waveguide field 33x can't be ignored for its size of optical axis.Therefore, make the outgoing end face length outstanding laterally with respect to the side of fixed part, the standard extrusion capacity of bonding back bonding agent 38 gets final product less than 1000 times more than or equal to 0 times with respect to the thickness of bonding agent 38.More than or equal to 10 times less than 500 times, especially can not receive the influence of warpage, try hard to prevent that bonding agent from wrapping the outgoing end face really.
In addition, though be that the situation that glass material is processed is described to plane light wave circuit 33 by Si substrate and quartz, by semiconductor material or glass based material formation also can, by LiNbO
3Deng dielectric material etc. constitute and also can.Which kind of situation no matter, the stress influence in the time of can both suppressing mounting plane type light wave circuit during with the system temperature variation.
(embodiment 2)
Fig. 5 shows the internal structure of the related integrated-type photoreceiver of the embodiment of the invention 2.Be plane light wave circuit 43 with the difference of the integrated-type photoreceiver of embodiment 1.The outgoing end face in the waveguide field of plane light wave circuit 43 is the processing of tilting of vertical direction with respect to the plane, loop of plane light wave circuit 43.Through the processing of tilting, can suppress the reflection of outgoing end face.At this moment, the position relation of the bottom of the outgoing end face in waveguide field and the side of fixing fixed part with mounting 32a accordings to embodiment 1 and gets final product.
(embodiment 3)
Fig. 6 A, 6B show the fixing means of the related plane light wave circuit of embodiment 3.In order to make temperature variation or characteristic deterioration not when installing, can further limit plane loop and fixing fixed part with mounting.Particularly, shown in Fig. 6 A, fixing different with mounting 32a with the embodiment 1 shown in Fig. 4 A-4D are used the fixing mounting 52a that uses of the shape that defines fixed part.Shown in Fig. 6 B; The waveguide field 53x of plane light circuit 53 corresponding to the shape of fixing fixed part with mounting 52a, be limited to the part on one side of outgoing end face; So; Do not receive the change in location that causes by thermal expansion, fixedly the position of the exit end of waveguide field 53x to horizontal direction.Thus, compare stress in the time of further to suppress to install or the caused STRESS VARIATION of temperature variation with embodiment 1,2.
In addition, the position relation of the outgoing end face of waveguide field 53x and the side of fixing fixed part with mounting 52a accordings to embodiment 1 and gets final product.
Fig. 7 A, 7B show the stress analysis result of the plane light wave circuit in embodiment 1 and 3.Fig. 7 A is the analysis result of the fixing means of the embodiment 1 shown in Fig. 4 A-4D, and Fig. 7 B is the analysis result of the fixing means of the embodiment 3 shown in Fig. 6 A, the 6B.Plane light wave circuit 33 is squares of length of side 22.5mm, and the size of fixing fixed part with mounting 32a is 22.5mmx3.0mm, non-fixed portions and fixed part section differ from h=0.1mm.Plane light wave circuit 53 also is the square of length of side 22.5mm, and the size of fixing fixed part with mounting 52a is 5.0mmx3.0mm, non-fixed portions and fixed part section differ from h=0.1mm.Both are fixing all to be processed by Covar (Kovar) with mounting, and the plane light wave circuit has deposited the thick quartz glass layer of 40um in the thick Si substrate of 1mm.
Fig. 7 A, 7B show and make environment temperature spend the STRESS VARIATION to the plane light wave circuit that when 85 degree change, produces from 25.Can know that shown in the analysis result of Fig. 7 A through being limited to the waveguide field the plane light wave circuit being fixed to fixing part with mounting, stress influence does not arrive the field in interference of light loop.In addition, can know,, make stress influence can diminish and be confined to the qualification field through limiting the waveguide field and limiting fixed part with reference to Fig. 7 B.The characteristic variations in the interference of light loop in the time of from the above mentioned, can suppressing mounting plane type light wave circuit, during temperature variation.
(embodiment 4)
In embodiment 1-3, the plane light wave circuit directly is fixed to fixedly uses mounting.Generally speaking, fixingly constitute by metal with mounting.Because Si substrate etc. is used in the substrate of plane light wave circuit mostly, so both thermal expansivity are different.Therefore, when environment temperature changes, because the amount of each self-expanding or contraction is different, so be distorted.Embodiment 1-3 is fixed to the fixing mounting of using in the waveguide field of the plane light wave circuit that is not subject to twist influence; And when needs further reduce deviation; As embodiment 4; Jie uses mounting by being different to fix with the made center fixed of the material of mounting, fixes the plane light wave circuit and fixedly uses mounting.
Fig. 8 A, 8B show the fixing means of the related plane light wave circuit of embodiment 4.Shown in Fig. 8 A, plane light wave circuit 73 is situated between and uses mounting 72d by center fixed, is fixed to fixing with mounting 72.Center fixed is with the thermal expansivity of mounting 72d, gets with respect to fixing hot expansion system with mounting 72a more near the value of the thermal expansivity of the substrate (for example, Si substrate) of plane light wave circuit 73.In addition, the value of the thermal expansivity of the substrate of plane light wave circuit 73 and the centre of the fixing thermal expansivity that uses mounting 72a, or with the identical value of thermal expansivity of the substrate of plane light wave circuit 73 be preferred.
If the value in the middle of center fixed is made as with the value of the thermal expansivity of mounting 72d, then fixing distortion with mounting 72a and 73 generations of plane light wave circuit is with tailing off respectively.
On the other hand; If the deterioration in characteristics with the interference of light loop that prevents plane light wave circuit 73 serves as preferential; Then, form center fixed with material and use mounting 72d with thermal expansivity identical with the substrate of plane light wave circuit 73 in order to do one's utmost to avoid distortion to interference of light loop side.Typically, center fixed with the substrate of mounting 72d and plane light wave circuit 73 with same material.The deterioration in characteristics in optical axis deviation that thus, can prevent to cause or the interference of light loop when installing by temperature variation.
As stated, for the reflection of the outgoing end face in the waveguide field that suppresses the plane light wave circuit, also can be shown in Fig. 8 B such plane light wave circuit 83 that will tilt to process the outgoing end face be fixed to center fixed and use mounting 72d.
The outgoing end face in the waveguide field of plane light wave circuit 73,83 and center fixed with the side of mounting 72d consistent or slightly partially the outside (in Fig. 8 A, 8B, plane light wave circuit 73,83 is fixing from the centre to be departed to right-hand with the side of mounting 72d) for preferably.The outgoing end face with the side of mounting 72d inboard partially (in Fig. 8 A, 8B, plane light wave circuit 73,83 is fixing from the centre to be departed to left with the side of mounting 72d), also can obtain same effect than center fixed.But, in the case,,, perhaps do one's utmost to be coated with thin bonding agent 78a it is not extruded etc. so need the substrate thickness of thickening plane light wave circuit 73,83 because fixedly the bonding agent 78a of the usefulness possibility that wraps the outgoing end face uprises, install and become difficult.
On the other hand; If the outgoing end face in waveguide field that makes plane light wave circuit 73,83 with respect to center fixed with the side of the fixed part of mounting 72d, (5 ~ 20um) the length more than 1000 times is given prominence to laterally with the thickness of bonding agent 78a; Then when having taken place to cause that by temperature variation the warpage of plane light wave circuit 73,83 changes once more, the deviation of the outgoing end face in waveguide field can't be ignored for its size of optical axis.Therefore, make the outgoing end face length outstanding laterally, be getting final product less than 1000 times of the thickness of the corresponding bonding agent 78a of the standard extrusion capacity of bonding back bonding agent 78a more than or equal to 0 times with respect to the side of fixed part.More than or equal to 10 times less than 500 times, especially can not receive warpage influence, can try hard to really prevent that bonding agent from wrapping the outgoing end face.
(embodiment 5)
Fig. 9 A, 9B show the fixing means of the related plane light wave circuit of embodiment 5.Make embodiment 4 employed center fixed use mounting to be transparent material,, the outgoing end face in the waveguide field of plane light wave circuit is fixed to center fixed uses mounting based on this.Shown in Fig. 9 A, center fixed is fixed with mounting 92d through bonding agent 98b with the upper surface of mounting 92a fixing.The outgoing end face in the waveguide field of plane light wave circuit 93 directly is fixed to the side of center fixed with mounting 92d through bonding agent 98a.Use mounting 92d from the light transmission center fixed of plane light wave circuit 93 outgoing, be coupled in lens and photo detector.
According to the method, the stress during mounting plane type light wave circuit is minimum, can suppress the deterioration in characteristics of plane light wave circuit.In addition, be to change also minimum the constituting of optical axis deviation that causes by warpage.Transparent material is near the use optical wavelength of plane light wave circuit, not absorb the material that waits loss, and quartz etc. are preferred.
As stated, for the reflection of the outgoing end face in the waveguide field that suppresses the plane light wave circuit, can also be shown in Fig. 9 B such plane light wave circuit 103 that will tilt to process the outgoing end face be fixed to center fixed and use mounting 92e.
(embodiment 6)
Figure 10 A-10C shows the fixing means of the related plane light wave circuit of embodiment 6.Formed the window that the transparent material that makes the outgoing light transmission is processed in embodiment 4 employed center fixed with the part of mounting.The exit end face in the waveguide field of plane light wave circuit is fixed with the window of mounting corresponding to center fixed.At fixing upper surface, center fixed is fixed with mounting 92f through bonding agent 98b with mounting 92a.Exit end with the waveguide field of plane light wave circuit 93 directly is fixed to the side of center fixed with mounting 92f through bonding agent 98a.From the light of plane light wave circuit 93 outgoing, see through the window 99 of center fixed with mounting 92f, be coupled in lens and photo detector.
According to the method, the stress during mounting plane type light wave circuit is minimum, can suppress the deterioration in characteristics of plane light wave circuit.In addition, be that warpage changes the also minimum formation of optical axis deviation that causes.Transparent material is near the use optical wavelength of plane light wave circuit, not absorb the material that waits loss, can use quartz etc.In addition, if can fixed pan type light wave circuit 93 use mounting 92f with center fixed, the window 99 that then adopts hollow structure also can, in center fixed cuts out the space of breach with the one side of mounting 92f, light signal is able to through also can.In addition, embodiment 6 has formed window in center fixed with the part of mounting, also can center fixed be replaced with fixing fixed part with mounting with mounting, uses the window in fixing fixed part formation with mounting.
(embodiment 7)
According to the kind in interference of light loop, need phase shifter in the interferometer sometimes.Generally speaking, phase shifter is realized through the well heater that forms on waveguide top.The action of phase shifter does, brings out variations in refractive index through spot heating is carried out in waveguide, makes the phase shifts through the light of waveguide.In that such phase shifter configuration is arrived under the situation in interference of light loop, need make the heat of generation diffuse to the outside efficiently.Reason is that if the heat that produces can not diffuse to plane light wave circuit outside, then the temperature of plane light wave circuit self can rise too high, and the danger above heat resisting temperature is arranged.
Figure 11 shows the internal structure of the related integrated-type photoreceiver of embodiments of the invention 7.Plane light wave circuit 113, lens 114 and photo detector 115 are fixed to base substrate 111 with mounting 112a, 112b and 112c as support component with fixing respectively.Optical fiber 116 is situated between with plane light wave circuit 113 and is connected by fiber-optic component fixing 117.In addition, between the upper surface of the substrate of the bottom surface that utilizes the field in the interference of light loop of plane light wave circuit 113 and fixing non-fixed portions with mounting 112a, dispose the high paste 119 of heat conductivity.
Thus, the heat that produces on the plane light wave circuit 113, being situated between is discharged to the package outside of integrated-type photoreceiver with mounting 112a with fixing by heat conduction paste 119.In addition, heat conduction paste 119, its shape is variable, and the warpage of following the plane light wave circuit 113 that is caused by variation of ambient temperature changes, and its shape changes.Therefore, can be decreased to the unnecessary stress of plane light wave circuit 113.Though used the heat conduction paste among the embodiment 6,, be not limited to the heat conduction paste as long as heat conductivity is high and paste, rubber-like or the gelatinous material of the shape of change freely itself to a certain degree.
In addition; Heat conductivity is high and paste, rubber-like or the gelatinous material that can freely change its shape to a certain degree diffuses to the formation that the material of outside usefulness uses as the heat that is used for making the plane light wave circuit through fixing with mounting as present embodiment, also goes for the formation of other embodiment.
(possibility of utilizing on the industry)
The present invention can be used in the optical communication apparatus of optical transmission system.Especially can be used in the integrated-type receiver that receives position phase modulated light signal.
Claims (11)
1. have the plane light wave circuit of the light functional loop that is formed at suprabasil waveguide type, it is characterized in that,
Comprise the waveguide field that only formed optical waveguide with having formed that outgoing end face or one side of incident end face of being able to the optical waveguide of incident to the incident light of said smooth functional loop that emergent light from said smooth functional loop is able to the optical waveguide of outgoing join,
Only be fixed in the bottom surface of the said substrate of the part that has formed said waveguide field keep said plane light wave circuit fixedly use mounting.
2. plane light wave circuit as claimed in claim 1 is characterized in that,
Fix and make the one side formed said outgoing end face consistent with one side of the part of said fixing fixing said plane light wave circuit with mounting; Perhaps make the one side formed said outgoing end face give prominence to laterally, give prominence to length less than said plane light wave circuit being fixed to 1000 times of said fixing bed thickness with the used cementing agent of mounting than one side of the part of said fixing fixing said plane light wave circuit with mounting.
3. plane light wave circuit as claimed in claim 1 is characterized in that,
Said plane light wave circuit and said fixing Jie with mounting are fixed with mounting by center fixed; Said center fixed is identical with the thermal expansivity of said substrate with the thermal expansivity of mounting, perhaps is more near the value of the thermal expansivity of said substrate than said fixing thermal expansivity with mounting.
4. plane light wave circuit as claimed in claim 3 is characterized in that,
Fix and make that the one side that has formed said outgoing end face is consistent with one side of the part of the fixing said plane light wave circuit of mounting with said center fixed; Perhaps make the one side formed said outgoing end face give prominence to laterally with one side of the part of the fixing said plane light wave circuit of mounting, give prominence to length less than said plane light wave circuit being fixed to said center fixed 1000 times with the bed thickness of the used cementing agent of mounting than said center fixed.
5. plane light wave circuit as claimed in claim 1 is characterized in that,
Said plane light wave circuit and said fixing Jie with mounting are fixed with mounting by center fixed, and said center fixed is used with the material identical materials of said substrate with mounting and made.
6. plane light wave circuit as claimed in claim 5 is characterized in that,
Fix and make that the one side that has formed said outgoing end face is consistent with one side of the part of the fixing said plane light wave circuit of mounting with said center fixed; Perhaps make the one side formed said outgoing end face give prominence to laterally with one side of the part of the fixing said plane light wave circuit of mounting, give prominence to length less than said plane light wave circuit being fixed to said center fixed 1000 times with the bed thickness of the used cementing agent of mounting than said center fixed.
7. have the plane light wave circuit of the light functional loop that is formed at suprabasil waveguide type, it is characterized in that,
Be able to from the emergent light of said smooth functional loop outgoing optical waveguide the outgoing end face or be fixed to center fixed to the incident end face that the incident light of said smooth functional loop is able to the optical waveguide of incident and use mounting,
This center fixed is processed by the material that said emergent light or incident light are seen through with mounting, and said center fixed is fixed to mounting and fixedly uses mounting.
8. have the plane light wave circuit of the light functional loop that is formed at suprabasil waveguide type, it is characterized in that,
Be able to from the emergent light of said smooth functional loop outgoing optical waveguide the outgoing end face or be fixed to center fixed to the incident end face that the incident light of said smooth functional loop is able to the optical waveguide of incident and use mounting,
Be formed with the breach of being processed window or said emergent light or incident light being seen through by the material that said emergent light or incident light are seen through in this center fixed with the part of mounting, said center fixed is fixed to mounting and fixedly uses mounting.
9. plane light wave circuit as claimed in claim 1 is characterized in that,
In the bottom surface that has formed the said substrate beyond the part of said waveguide field, be situated between and carry out thermal coupling with mounting by heat conductivity paste and said fixing.
10. plane light wave circuit as claimed in claim 7 is characterized in that,
In the bottom surface that has formed the said substrate beyond the part of said waveguide field, be situated between and carry out thermal coupling with mounting by heat conductivity paste and said fixing.
11. plane light wave circuit as claimed in claim 8 is characterized in that,
In the bottom surface that has formed the said substrate beyond the part of said waveguide field, be situated between and carry out thermal coupling with mounting by heat conductivity paste and said fixing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011138924A JP5390562B2 (en) | 2011-06-22 | 2011-06-22 | Planar lightwave circuit |
| JP2011-138924 | 2011-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102841404A true CN102841404A (en) | 2012-12-26 |
| CN102841404B CN102841404B (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201220299782XU Expired - Lifetime CN202693841U (en) | 2011-06-22 | 2012-06-21 | Planar optical wave loop |
| CN201210211224.8A Active CN102841404B (en) | 2011-06-22 | 2012-06-21 | Planar lightwave circuit |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201220299782XU Expired - Lifetime CN202693841U (en) | 2011-06-22 | 2012-06-21 | Planar optical wave loop |
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| Country | Link |
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| US (2) | US9116317B2 (en) |
| JP (1) | JP5390562B2 (en) |
| CN (2) | CN202693841U (en) |
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| CN103926662A (en) * | 2013-01-10 | 2014-07-16 | Ntt电子股份有限公司 | Optical Module |
| CN106066510A (en) * | 2015-04-22 | 2016-11-02 | 富士通光器件株式会社 | Optical module and optical fiber component |
| CN110199174A (en) * | 2017-01-25 | 2019-09-03 | 奥林巴斯株式会社 | Light measuring device |
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| JP5390562B2 (en) | 2011-06-22 | 2014-01-15 | 日本電信電話株式会社 | Planar lightwave circuit |
| US9213138B2 (en) * | 2013-03-26 | 2015-12-15 | Lumentum Operations Llc | Packaging an arcuate planar lightwave circuit |
| CN103676035A (en) * | 2013-12-17 | 2014-03-26 | 昂纳信息技术（深圳）有限公司 | Packaging method for planar optical waveguide chip |
| JP2017032629A (en) * | 2015-07-29 | 2017-02-09 | 住友電気工業株式会社 | Optical module |
| JP6500750B2 (en) | 2015-11-05 | 2019-04-17 | 住友電気工業株式会社 | Semiconductor optical device, semiconductor assembly |
| WO2017151416A2 (en) * | 2016-03-02 | 2017-09-08 | Corning Optical Communications LLC | Interposer assemblies and arrangements for coupling at least one optical fiber to at least one optoelectronic device |
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| CN113424087B (en) * | 2019-02-08 | 2023-10-10 | 古河电气工业株式会社 | Optical module |
| WO2021214897A1 (en) * | 2020-04-22 | 2021-10-28 | 日本電信電話株式会社 | Wavelength conversion apparatus |
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Also Published As
| Publication number | Publication date |
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| US20120328236A1 (en) | 2012-12-27 |
| CN202693841U (en) | 2013-01-23 |
| JP5390562B2 (en) | 2014-01-15 |
| CN102841404B (en) | 2015-08-19 |
| US9116317B2 (en) | 2015-08-25 |
| US9459417B2 (en) | 2016-10-04 |
| US20150205042A1 (en) | 2015-07-23 |
| JP2013007797A (en) | 2013-01-10 |
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