CN102840474A - LED lamp and production method thereof - Google Patents
LED lamp and production method thereof Download PDFInfo
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- CN102840474A CN102840474A CN201210208318XA CN201210208318A CN102840474A CN 102840474 A CN102840474 A CN 102840474A CN 201210208318X A CN201210208318X A CN 201210208318XA CN 201210208318 A CN201210208318 A CN 201210208318A CN 102840474 A CN102840474 A CN 102840474A
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- led lamp
- interarea
- conductor layer
- led light
- pedestal portion
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Abstract
The invention provides an LED lamp and a production method thereof. The LED lamp is provided with a base body; a bench seat part (3), which is supported by the base body, and is made of insulation materials; a conductive layer (4), which is directly overlapped on the bench seat part (3); a plurality of LED lamp sources (5). The bench seat part (3) is provided with a first main surface (311) and a second main surface (312), which face different directions. Any one of the plurality of LED lamp sources (5) is disposed the first main surface (311) through the conductive layer (4), and any one of the plurality of LED lamp sources (5) is disposed the first main surface (312) through the conductive layer (4).
Description
Technical field
The present invention relates to the manufacturing approach of LED lamp and LED lamp.
Background technology
All the time, the LED lamp that uses as the substitute of incandescent lamp bulb is well-known.The LED light fixture of record is equipped with base portion, flexible base, board and a plurality of led module in patent documentation 1.Base portion has the part of frustum.The part of this frustum is formed by aluminium, has a plurality of towards different each other directions.Flexible base, board is disposed at above-mentioned a plurality of of base portion.On above-mentioned a plurality of of base portion, dispose led module respectively across flexible base, board.Since above-mentioned a plurality of each other towards different directions, the direction of light of therefore sending from led module is also different.Therefore, the LED lamp of such prior art can shine wider scope.
In the LED of prior art lamp, between base portion and led module, have flexible base, board.Thus, the heat that is produced by led module arrives base portion before via flexible base, board.That is the heat that, is produced by led module is not directly delivered to base portion.In addition, in existing LED lamp, the major part of the heat that is produced by led module is discharged into the outside of LED lamp from base portion.Therefore, in existing LED lamp, be difficult to promptly be discharged into the outside of LED lamp by the heat of led module generation.
The prior art document
Patent documentation
Patent documentation 1: specially permit communique No. 4642129
Summary of the invention
The problem that invention will solve
The present invention accomplishes in view of above-mentioned problem, and its major subjects provides the excellent more LED lamp of thermal diffusivity.
Be used to solve the method for problem
Based on first aspect of the present invention, a kind of LED lamp is provided, it possesses: matrix; By above-mentioned substrate support and the pedestal portion that forms by insulating materials; Directly be laminated in the conductor layer of above-mentioned pedestal portion; With a plurality of led light sources; Above-mentioned pedestal portion has a plurality of interareas towards different each other directions; Above-mentioned a plurality of interarea has first interarea and second interarea; Any one in above-mentioned a plurality of led light source is disposed at above-mentioned first interarea through above-mentioned conductor layer, and any one in above-mentioned a plurality of led light sources is disposed at above-mentioned second interarea through above-mentioned conductor layer.
Preferably, any of above-mentioned a plurality of interareas is all smooth.
Preferably, above-mentioned conductor layer comprises the communication wiring part, and above-mentioned communication wiring part is striden the face beyond above-mentioned first interarea that rides over above-mentioned first interarea and above-mentioned pedestal portion.
Preferably, above-mentioned a plurality of interarea all tilts with respect to above-mentioned axle with the mode of above-mentioned rays close to go along with the first direction that extends to axle.
Preferably, above-mentioned pedestal portion has the end face towards above-mentioned first direction, and any one of above-mentioned a plurality of led light sources is disposed at above-mentioned end face through above-mentioned conductor layer.
Preferably, above-mentioned pedestal portion has any curved surface that is connected with above-mentioned end face with above-mentioned a plurality of interareas, and above-mentioned conductor layer comprises the wiring part that is connected of any of covering above-mentioned a plurality of interareas, above-mentioned end face and above-mentioned curved surface.
Preferably, also possess the lead that is connected with any bonding (bonding) of above-mentioned a plurality of led light sources, above-mentioned lead, spread all over whole above-mentioned first interarea institute towards the direction observation time and above-mentioned first interarea overlapping.
Preferably, above-mentioned pedestal portion have with above-mentioned a plurality of interareas any one be connected and with the parallel side of above-mentioned axle.
Preferably, above-mentioned end face is a polygon.
Preferably, above-mentioned conductor layer comprises any one pipe core welding disc (die pad) that disposes above-mentioned a plurality of led light sources, and above-mentioned pipe core welding disc is when overlooking and above-mentioned a plurality of led light sources any one whole overlapping.
Preferably; Above-mentioned conductor layer comprises a plurality of pipe core welding discs; Each of above-mentioned a plurality of pipe core welding discs disposes any of above-mentioned a plurality of led light sources; And all be formed at the same interarea that is included in above-mentioned a plurality of interarea, possess: with each above-mentioned led light source and the lead that disposes the above-mentioned pipe core welding disc bonding of this led light source; With with each above-mentioned led light source and with disposing the above-mentioned pipe core welding disc of this led light source adjacent above-mentioned pipe core welding disc bonding append lead.
Preferably, above-mentioned pedestal portion have towards with the bottom surface of above-mentioned first direction opposition side, be formed with from above-mentioned bottom surface to the recess of above-mentioned first direction depression in above-mentioned pedestal portion.
Preferably, above-mentioned pedestal portion has the inner face of the above-mentioned recess of regulation, above-mentioned inner face based on the cross sectional shape of the face of above-mentioned first direction quadrature in, have apart from the different first and the second portions of distance of above-mentioned axle.
Preferably, the distance of above-mentioned first interarea and above-mentioned inner face is 3～10mm.
Preferably, also possess cable, above-mentioned conductor layer comprises the power pad portion that is connected with above-mentioned cable, is formed with the groove that is embedded with above-mentioned cable in above-mentioned pedestal portion.
Preferably, above-mentioned power pad portion is disposed at any interarea of above-mentioned a plurality of interareas.
Preferably, above-mentioned conductor layer covers the part of above-mentioned side.
Preferably, also possess cable, above-mentioned conductor layer comprises each a part of power pad portion that is connected with above-mentioned cable and covers above-mentioned interarea and above-mentioned side.
Preferably, above-mentioned conductor layer makes in the above-mentioned side, leans on the part of an opposite side with above-mentioned interarea to expose.
Preferably, above-mentioned conductor layer is formed by the particle of a plurality of electric conductivity, and thickness is 5～10 times of any one particle diameter of above-mentioned a plurality of particles.
Preferably, above-mentioned a plurality of led light source comprises assisting base plate (submount) respectively and is installed in the bare chip LED of above-mentioned assisting base plate.
Preferably, above-mentioned a plurality of led light source is respectively bare chip LED.
Preferably, also possess exist and any and the above-mentioned conductor layer of above-mentioned a plurality of led light sources between knitting layer, above-mentioned knitting layer is formed by conductive material.
Preferably, also possess exist and any and the above-mentioned conductor layer of above-mentioned a plurality of led light sources between knitting layer, above-mentioned knitting layer is formed by insulating materials.
Preferably, also possess the resin bed that comprises fluorophor, above-mentioned fluorophor is energized through the light from a plurality of above-mentioned led light sources, sends the light with this light wavelength different wavelengths thus.
Preferably, also possesses the cover that covers a plurality of above-mentioned led light sources.
Preferably, above-mentioned resin bed is formed at above-mentioned cover.
Preferably, above-mentioned cover has: the top of the end of the first direction side of extending as axle; With the maximum maximum diameter portion of the diameter in the rectangular cross section of above-mentioned first direction; With expose the bottom, it is to be exposed to outside part and end above-mentioned first direction rightabout one side, and compares with the diameter in the rectangular cross section of above-mentioned first direction little with above-mentioned maximum diameter portion.
Preferably, the distance in the above-mentioned top of above-mentioned first direction and above-mentioned maximum diameter portion is bigger than the distance of exposing bottom and above-mentioned maximum diameter portion above-mentioned first direction above-mentioned.
Preferably, above-mentioned cover had in above-mentioned maximum diameter portion and above-mentioned exposing between the bottom, inwardly the reducing diameter part of side's protrusion.
Preferably, also possess any a plurality of framework that is disposed at above-mentioned first interarea and surrounds above-mentioned a plurality of led light sources, above-mentioned resin bed is filled in by in the above-mentioned framework area surrounded.
Preferably, above-mentioned resin bed only covers any of above-mentioned a plurality of led light sources.
Preferably, also possess and be contained in the above-mentioned matrix and the power supply unit of above-mentioned a plurality of led light source supply capabilities.
Preferably, above-mentioned pedestal portion is formed by pottery.
Preferably, above-mentioned conductor layer is formed by the silvery white gold
Preferably, above-mentioned conductor layer forms through printing.
Based on second aspect of the present invention, a kind of manufacturing approach of LED lamp is provided, it comprises: form constitute by insulating materials and have the operation of the pedestal portion of a plurality of interareas towards different direction each other; Form the operation of conductor layer through printing in above-mentioned pedestal portion; Dispose the operation of a plurality of led light sources at above-mentioned conductor layer; With above-mentioned pedestal portion is configured in the operation on the matrix; Above-mentioned a plurality of interarea has first interarea and second interarea; Dispose the operation of above-mentioned a plurality of led light sources; Be that with above-mentioned a plurality of led light sources any one is disposed at above-mentioned first interarea through above-mentioned conductor layer, and any of above-mentioned a plurality of led light sources is disposed at above-mentioned second interarea through above-mentioned conductor layer.
Preferably, in the operation that forms above-mentioned conductor layer, transfer printing.
Preferably, in the operation that forms above-mentioned conductor layer, carry out screen painting.
Preferably, in the operation that forms above-mentioned conductor layer, carry out ink jet printing.
Preferably; Also possesses the operation of preparing first mould and second mould; In the operation of the above-mentioned pedestal of formation portion, in the state that keeps above-mentioned first mould and above-mentioned second mold separation, utilize above-mentioned first mould and above-mentioned second mould that powder is pressurizeed.
Other features and advantages of the present invention can be clear and definite through the following detailed description of carrying out with reference to accompanying drawing.
Description of drawings
Fig. 1 is the front elevation of the LED lamp of expression embodiment of the present invention.
Fig. 2 is the sectional view of expression along II-II line of Fig. 1.
Fig. 3 is the stereogram of main expression pedestal portion shown in Figure 2.
Fig. 4 is the expanded view of the conductor layer that forms in pedestal portion of main expression embodiment of the present invention.
Fig. 5 is the local enlarged cross section figure that expression is equivalent to LED lamp part, embodiment of the present invention of the V-V line along Fig. 4.
Fig. 6 is the local enlarged cross section figure that expression is equivalent to LED lamp part, embodiment of the present invention of the VI-VI line along Fig. 4.
Fig. 7 is the upward view of the pedestal portion of expression embodiment of the present invention.
Fig. 8 is the sectional view of the led light source of main expression embodiment of the present invention.
Fig. 9 is the sectional view that schematically shows the conductor layer of embodiment of the present invention.
Figure 10 is the local expanded view of the structure on the interarea of presentation graphs 4.
Figure 11 is the local expanded view of the structure on the end face of presentation graphs 4.
Figure 12 is the figure of an operation of manufacturing approach of the LED lamp of expression embodiment of the present invention.
Figure 13 is the then figure of the operation of Figure 12 of expression.
Figure 14 is the then figure of the operation of Figure 13 of expression.
Figure 15 is the then figure of the operation of Figure 14 of expression.
Figure 16 is the then figure of the operation of Figure 15 of expression.
Figure 17 is the then figure of the operation of Figure 16 of expression.
Figure 18 is the then figure of the operation of Figure 17 of expression.
Figure 19 is the then figure of the operation of Figure 18 of expression.
Figure 20 is the local enlarged cross section figure of variation of the LED lamp of expression embodiment of the present invention.
Figure 21 is the sectional view of variation of led light source of the LED lamp of expression embodiment of the present invention.
Figure 22 is the sectional view of variation of led light source of the LED lamp of expression embodiment of the present invention.
Figure 23 is the sectional view of variation of led light source of the LED lamp of expression embodiment of the present invention.
Figure 24 is the sectional view of variation of pedestal portion of the LED lamp of expression embodiment of the present invention.
Figure 25 is the sectional view of variation of resin bed of the LED lamp of expression embodiment of the present invention.
Figure 26 is the local amplification view of the resin bed of main expression LED lamp shown in Figure 25.
Figure 27 is the local amplification view of the resin bed of main expression LED lamp shown in Figure 25.
Figure 28 is the sectional view of variation of resin bed of the LED lamp of expression embodiment of the present invention.
Figure 29 is the sectional view of variation of power pad portion of the LED lamp of expression embodiment of the present invention.
Figure 30 is the front elevation of LED lamp of variation that is used to represent the cover of LED lamp of the present invention.
Figure 31 is the sectional view along the XXXI-XXXI line of Figure 30.
The specific embodiment
Below, specify embodiment of the present invention with reference to accompanying drawing.
The LED lamp 100 of Fig. 1～shown in Figure 4 is installed in the ligthing paraphernalia that incandescent lamp bulb uses as the substitute of incandescent lamp bulb and uses.LED lamp 100 possesses: principal part 2; Pedestal portion 3; Conductor layer 4; A plurality of led light sources 5; Line 611,612,613,621,622,623 (, in Fig. 2, Fig. 3, Fig. 5 etc., omitting) with reference to Fig. 4; Knitting layer 71 (with reference to Fig. 8); Cover 72; With resin bed 73 (with reference to Fig. 2).
In addition, matrix 21 also can be different with this embodiment, and article can be formed in one.
The periphery of substrate 231 is clipped between main body 211 and the distance piece 212.Substrate 231 is fixed on the matrix 21 thus.Substrate 231 is formed than higher material by thermal conductivity.Substrate 231 is for example opened laminated plates for the synthetic copper of glass.Substrate 231 is whole rounded.In Fig. 2, be formed with Wiring pattern (omitting diagram) respectively at the lower surface of substrate 231 and upper surface.Wiring pattern that forms at the upper surface of substrate 231 and the Wiring pattern that forms at the lower surface of substrate 231 are for example through the through hole conducting.
A plurality of electronic units 232 are configured in the lower surface in Fig. 2 of substrate 231.A plurality of electronic units 232 are contained in the matrix 21.A plurality of electronic units 232 are capacitor, resistance, coil, diode, IC etc.
Fig. 2, each cable 25 shown in Figure 5 are parts of the led light source 5 stated after being used for the direct current power that is generated by power supply unit 23 sent to.Cable 25 is connected with the Wiring pattern that on substrate 231, forms.
Fig. 1, lamp socket 27 shown in Figure 2 are the parts that are used for being installed in the ligthing paraphernalia that bulb uses.Lamp socket 27 is connected with power supply unit 23 through distribution (not shown).When the use of LED lamp 100, electric power supplies to LED lamp 100 via lamp socket 27.
Fig. 2～pedestal portion 3 shown in Figure 7 is supported by matrix 21.And pedestal portion 3 is fixed on the matrix 21.Pedestal portion 3 is fixed on 21 last times of matrix, for example can uses adhesive or screw.The lubricating grease (grease) that between pedestal portion 3 and matrix 21, also can have heat transmission.Pedestal portion 3 is formed by insulating materials.Such insulating materials for example can give an example pottery, insulative resin etc.For example can give an example as pottery: aluminium oxide, zirconia or aluminium nitride.As the resin of insulating properties for example can give an example polyphenylene sulfide (PPS), liquid crystal polyester (LCP) or polyether-ether-ketone (PEEK).In this embodiment, be that pottery describes with pedestal portion 3.
Like Fig. 3, shown in Figure 4, a plurality of (being 16 in this embodiment) interarea 31 is trapezoidal respectively.A plurality of interareas 31 are respectively towards different directions.That is, the normal direction of a plurality of interareas 31 is different.In this embodiment, a plurality of interareas 31 are smooth.The mode of more approaching axle Ox tilts with respect to axle Ox each interarea 31 to go along with the direction x1 that extends to axle Ox more.Observe at direction x1, a plurality of interareas 31 surround axle Ox.As shown in Figure 3, two in a plurality of interareas 31 interconnect through border 39 respectively.With one in a plurality of interareas 31 as first interarea 311, with one in a plurality of interareas 31 as second interarea 312.
Like the direction x1 that Fig. 2～end face 32 shown in Figure 6 extends towards axle Ox.In this embodiment, end face 32 is smooth, with axle Ox quadrature.As shown in Figure 4, to observe at direction x1, end face 32 is surrounded by a plurality of interareas 31.End face 32 is polygon (being positive ten hexagons in this embodiment).Also can be different with this embodiment, end face 32 can not be polygon but circle.
Any one of the curved surface 33 of Fig. 2～shown in Figure 6 and a plurality of interareas 31 is connected with end face 32.In this embodiment, curved surface 33 is connected with the whole and end face 32 of a plurality of interareas 31.Curved surface 33 is the ring-type of surrounding end face 32.Curved surface 33 needn't one be shaped as ring-type.For example, curved surface 33 band shape that also can form for the zone between first interarea 311 and end face 32 only.Likewise, curved surface 33 band shape that also can form for the zone between second interarea 312 and end face 32 only.In addition, pedestal portion 3 also can not have curved surface 33 originally.
A plurality of sides 34 of Fig. 2～shown in Figure 6 respectively towards axle Ox radially.As shown in Figure 2, each side 34 is parallel with axle Ox.A plurality of sides 34 are smooth in this embodiment.Side 34 is as long as also can be curved surface with spool Ox is parallel.Any one in each side 34 and a plurality of interareas 31 is connected.
Fig. 2～curved surface 35 shown in Figure 6 is connected with side 34 with interarea 31.Curved surface 35 in the form of a ring.Curved surface 35 need not be ring-type.Curved surface 35 band shape that also can form for the zone between first interarea 311 and side 34 only for example.Likewise, curved surface 35 band shape that also can form for the zone between second interarea 312 and side 34 only.In addition, pedestal portion 3 also can not have curved surface 35 originally.
The bottom surface 36 of Fig. 2, Fig. 5～shown in Figure 7 is towards the direction x2 of an opposite side with direction x1, and in this embodiment, bottom surface 36 is the smooth face with axle Ox quadrature.In pedestal portion 3, be formed with the recess 381 of 36 direction x1 depression from the bottom surface.Recess 381 is by inner face 37 regulations.As shown in Figure 7, inner face 37 in the cross sectional shape that forms based on the face with axle Ox quadrature, has apart from the distance of axle Ox different first 371 and second portion 372.That is, inner face 37, it has non-circular shape based on the cross sectional shape that the face with axle Ox quadrature forms.For example, in this embodiment, be key-type based on the cross sectional shape of the inner face 37 that forms with the face of axle Ox quadrature.Also can be different with this embodiment, can be triangle or rectangle based on the cross sectional shape of the inner face 37 that forms with the face of axle Ox quadrature.
The wall thickness La of pedestal portion 3 shown in Figure 5 (separating distance of interarea 31 and inner face 37) for example is 3～10mm.The wall thickness Lb of the pedestal portion 3 shown in this figure (separating distance of end face 32 and inner face 37) for example is 3～10mm.
Fig. 2～conductor layer 4 shown in Figure 6 directly is laminated in pedestal portion 3.That is, conductor layer 4 directly contacts with pedestal portion 3.Conductor layer 4 is for example formed by the silvery white gold.The thickness of conductor layer 4 for example is 10～20 μ m.Like Fig. 3, shown in Figure 4, conductor layer 4 comprises: a plurality of interarea pads (pad, liner) portion 411,412; Two power pad portions 421; A plurality of end face welding disks 431,432; With wiring part 451,452,453,461.
A plurality of interarea welding disks 411,412 cover any of a plurality of interareas 31 respectively.A plurality of interarea welding disks 411,412, its integral body separately is positioned at the outer rim of regulation interarea 31.Therefore, each interarea welding disk 411,412 is all not overlapping with border 39.When overlooking, each interarea welding disk 411 is rectangular.A plurality of interarea welding disks 411 are arranged along a direction in interarea 31.
Two power pad portions 421 cover any in a plurality of interareas 31 respectively.When overlooking, each power pad portion 421 is rectangular.The area of area during the overlooking of each of a plurality of power pad portion 421 during than any one overlooking of interarea welding disk 411 is big.Each power pad portion 421 is all not overlapping with border 39.As shown in Figure 5, be connected with above-mentioned cable 25 respectively in power pad portion 421.
Fig. 2～end face welding disk 431,432 shown in Figure 6 covers end face 32 respectively.A plurality of end face welding disks 431,432 integral body separately is positioned at the frame of regulation end face 32.Therefore, the equal covering surface 33 not of end face welding disk 431,432.It is rectangular when each end face pad 431,432 is overlooked.
A plurality of wiring parts 451,452,453 cover any of a plurality of interareas 31 respectively.As shown in Figure 4, wiring part 451 be along axle Ox circumferential (circumferencial direction) extend circular-arc.Wiring part 451 is striden any at least two of a plurality of interareas 31.That is, wiring part 451 is overlapping with border 39.Wiring part 451 extends to another interarea 31 continuously from an interarea 31.Especially, the wiring part 451 that covers first interarea 311 be equivalent to a to communicate example of wiring part is striden the face beyond first interarea of taking in first interarea 311 and pedestal portion 3 311.In this embodiment, the part of wiring part 451 covering sides 34 and the part of curved surface 35.Any at least two of wiring part 451 and interarea welding disk 411,412 and power pad portion 421 are connected.Thus, any at least two of interarea welding disk 411,412 and power pad portion 421 are conducted.
Fig. 3, wiring part 452 shown in Figure 4 are the shape with position of a plurality of band shapes.Wiring part 452 is striden any at least two that take in a plurality of interareas 31.That is, wiring part 452 is overlapping with border 39.Wiring part 452 extends to other interarea 31 continuously from certain interarea 31.Especially, the wiring part 452 that covers first interarea 311 is striden the face of taking beyond first interarea 311 of first interarea 311 and pedestal portion 3.For example, the wiring part 452 that covers first interarea 311 is striden and is taken in first interarea 311 and the interarea 31 adjacent with first interarea 311.Any at least two of wiring part 452 and interarea welding disk 411,412 are connected.Thus, any at least two of interarea welding disk 411,412 are conducted.
Fig. 3, wiring part 453 shown in Figure 4 are the band shape of radially extending along axle Ox.Wiring part 453 is striden and is taken in interarea 31 and end face 32.In this embodiment, wiring part 453 further covers interarea 31, end face 32 and curved surface 33.Wiring part 453 extends to end face 32 from certain interarea 31 transcendental surface 33.Wiring part 453 is connected with power pad portion 421.
Fig. 3, wiring part 461 shown in Figure 4 are taken in interarea 31 and end face 32 for connecting an example of wiring part, striding.In this embodiment, wiring part 461 further covers interarea 31, end face 32 and curved surface 33.Wiring part 461 extends to end face 32 from an interarea 31 transcendental surfaces 33.
Fig. 9 is the sectional view that schematically shows conductor layer 4.
As shown in Figure 9, conductor layer 4 is formed by the particle 491 of a plurality of electric conductivity.The diameter of particle 491 for example is about 5 μ m.The thickness of conductor layer 4 is 10～20 μ m as stated, is about 5～10 times of diameter of particle 491.
Fig. 2～a plurality of led light sources 5 shown in Figure 6 are disposed at pedestal portion 3 through conductor layer 4 respectively.A plurality of led light sources 5 are disposed at interarea 31 and end face 32 any one through conductor layer 4 respectively.Especially as shown in Figure 3, any one of a plurality of led light sources 5 is disposed at first interarea 311 through conductor layer 4, and any one of a plurality of led light sources 5 is disposed at second interarea 312 through conductor layer 4.
Like the expression in detail of Fig. 4 institute, a plurality of led light sources 5 are disposed at interarea welding disk 411, end face welding disk 431 any one.In interarea welding disk 411, a plurality of led light sources 5 are arranged along a direction.Shown in figure 10, when overlooking, the area of interarea welding disk 411 that disposes led light source 5 is bigger than the area of this led light source 5.And when overlooking, the interarea welding disk 411 that disposes led light source 5 is whole overlapping with this led light source 5.Likewise, shown in figure 11, when overlooking, the area of end face welding disk 431 that disposes led light source 5 is bigger than the area of this led light source 5.And when overlooking, the end face welding disk 431 that disposes led light source 5 is whole overlapping with this led light source 5.
Fig. 8 is a sectional view of mainly representing led light source 5.
As shown in Figure 8, in this embodiment, led light source 5 comprises bare chip LED51 and assisting base plate (sub-mount) 52.
Bare chip LED51 has n type semiconductor layer, p type semiconductor layer and active layer.N type semiconductor layer, p type semiconductor layer and active layer are for example formed by the GaN based semiconductor.Bare chip LED51 for example sends blue light.
Assisting base plate 52 is for example formed by silicon, and bare chip LED51 is installed.Be formed with Wiring pattern at assisting base plate 52.The electrode of this Wiring pattern and bare chip LED51 (omit diagram) conducting, and have and extend to not by the part of bare chip LED51 region covered.In this embodiment, lead 611,612 is arranged at this Wiring pattern bonding.The led light source 5 of this embodiment is so-called twin wire.
As shown in Figure 8, knitting layer 71 is present between led light source 5 and the conductor layer 4.Knitting layer 71 engages led light source 5 with conductor layer 4.Knitting layer 71 can be formed also and can be formed by insulating materials by conductive material.
A plurality of leads as shown in Figure 4 611,612,613,621,622,623 are formed by conductive material.As such conductive material for example can give an example aluminium, gold, silver or copper.Lead 611,612,613 all is disposed at interarea 31.The lead that is disposed at first interarea 311 in the interarea 31 is especially arranged in the lead 611.Be disposed at each lead 611 of first interarea 311, first interarea 311 towards direction see, spread all over whole overlapping with first interarea 311.On the other hand, lead 621,622,623 all is disposed at end face 32.A plurality of leads 611,612,613,621,622,623 are all not overlapping with border 39 and curved surface 33.Lead 611,612,621,622 is bonded to any of a plurality of led light sources 5.On the other hand, lead 613,623 is bonded to any of a plurality of Zener diodes 59.
Shown in figure 10, lead 611 and led light source that is disposed at interarea welding disk 411 5 and interarea welding disk 411 bondings that are different from the interarea welding disk 411 that disposes this led light source 5.Lead 612 and the led light source that is disposed at interarea welding disk 411 5 and these interarea welding disk 411 bondings.As shown in Figure 4, lead 613 and the Zener diode 59 that is disposed at interarea welding disk 412 and interarea welding disk 411 bondings adjacent with this interarea welding disk 412.
Shown in figure 11, lead 621 and the led light source that is configured in end face welding disk 431 5 with dispose this led light source 5 and be different from end face welding disk 431 bondings of end face welding disk 431.Lead 622 and the led light source that is disposed at end face welding disk 431 5 and these end face welding disk 431 bondings.As shown in Figure 4, lead 623 and the Zener diode 59 that is disposed at end face welding disk 432 and end face welding disk 431 bondings adjacent with this end face welding disk 432.
Fig. 1, cover 72 shown in Figure 2 are fixed in matrix 21.Cover 72 is for being the rotational symmetric shape in center with axle Ox.Cover 72 makes the light transmission that sends from a plurality of led light sources 5.Cover 72 is for example formed by polymethyl methacrylate, Merlon.Cover 72 contains pedestal portion 3, conductor layer 4 and a plurality of led light source 5.
When the use of LED lamp 100, supply with alternating electromotive force via lamp socket 27 to power supply unit 23 from the outside of LED lamp 100.Power supply unit 23 converts the alternating electromotive force that is supplied to into direct current power, and the direct current power of being changed is supplied to a plurality of led light sources 5 via cable 25.Then, direct current power is passed to each led light source 5, and each led light source 5 sends light.In each luminous led light source 5, produce heat.This heat arrives pedestal portion 3 from led light source 5 via knitting layer 71, conductor layer 4.The heat that has arrived pedestal portion 3 passes to matrix 21, is discharged into the outside of LED lamp 100 from matrix 21.
Then, simply explain about the manufacturing approach of LED lamp 100.
At first, like Figure 12, shown in Figure 13, form pedestal portion 3 through mould molding.Shown in figure 12, in order to form pedestal portion 3, prepare powder 819.Then, utilize first mould 811, second mould 812 and wall 813 to sandwich powder 819, pressurize.Powder 819 is solidified carry out sintering etc. afterwards, form pedestal portion 3 shown in Figure 13.The interarea 31 of pedestal portion 3, end face 32 and curved surface 33 are by the face of first mould, 811 extruding.On the other hand, the bottom surface 36 of pedestal portion 3 and inner face 37 are by the face of second mould extruding.In this embodiment, when powder 819 was pressurizeed, first mould 811 separated with second mould 812.Therefore, side 34 is not by the face of first mould 811,812 extruding of second mould, but by the face of wall 813 extruding.The state that keeps first mould 811 to separate with second mould 812 pressurizes through first mould 811 and 812 pairs of powders 819 of second mould simultaneously.Therefore, when powder 819 was pressurizeed, first mould 811 did not contact with second mould 812.Thus, contact, can prevent first mould 811 and 812 wearing and tearing of second mould through first mould 811 when powder 819 is pressurizeed and second mould 812.
Then, like Figure 14～shown in Figure 180, form conductor layers 4 in pedestal portion 3.The formation of conductor layer 4 is carried out through printing.In this embodiment, especially use following transfer printing (Pad Printing, bat printing).In addition, the transfer printing also can not be used in the formation of conductor layer 4, and uses screen painting or ink jet printing to carry out.
When transferring printing, shown in figure 14, pedestal portion 3 is carried on workbench 821.Be provided with protuberance 822 at workbench 821.The recess 381 of pedestal portion 3 is embedded in protuberance 822.As stated, recess 381 is by inner face 37 regulations.Inner face 37 in the cross sectional shape that forms based on the face with axle Ox quadrature, has apart from the distance of axle Ox different first 371 and second portion 372.That is, the cross sectional shape based on forming with the face of axle Ox quadrature of recess 381 is not circular shape.Thus, recess 381 engagings of protuberance 822 and pedestal portion 3 prevent that under the state that is equipped on workbench 821 pedestal portion 3 is rotated.
Then, shown in the right side of Figure 14, at the recess 824 of intaglio plate 823, filling conducting fluid 829.As conducting fluid 829, for example can use and utilize high-melting-point solvent such as terpineol for example to dilute and the fluid that obtains normally used conducting fluid in the screen painting.In addition, the roughly the same shape of pattern form that is shaped as the conductor layer 4 that will form in pedestal portion 3 during the overlooking of recess 824.
Then, shown in figure 15 with conducting fluid 829 attached to (operation S 1) on the pad 825.Pad 825 is formed by soft material, is for example formed by silicon rubber.Then, shown in figure 16, make pad 825 and pedestal portion 3 over against.Then shown in figure 17, with pad 825 by being pressed in pedestal portion 3 (operation S2).Conducting fluid 829 is attached to pedestal portion 3 thus, and the pattern of conducting fluid 829 is printed.Next, shown in figure 18, make pad 825 separate (operation S3) from pedestal portion 3.Like this, the pattern form of recess 824 is transferred to pedestal portion 3.
Then, conducting fluid 829 is carried out sintering (operation S4).The sintering of conducting fluid 829, for example in the atmosphere of about 150 degree, conducting fluid 829 carried out about about 10 minutes drying after, under the sintering temperature of about 850 degree, carry out.Thus, form conductor layer 4 ' (with reference to Figure 18) in pedestal portion 3.Through through above operation S1～S4, be formed with conductor layer 4 ' in pedestal portion 3.The thickness that has passed through a conductor layer 4 ' behind operation S 1～S4 for example is about 3～7 μ m, compares with the situation of using screen painting to form conductor layer, and is thinner.This be because, used the transfer printing of pad 825 to compare the attenuation of transfer printing thickness with screen painting.In addition, for example utilize above-mentioned high-melting-point solvent that conducting fluid 829 is diluted also as a reason.The too thin perhaps excessive increase of resistance value that might cause breaking of conductor layer.
Therefore, above-mentioned operation S1～S4 is carried out repeatedly repeatedly (about 2～3 times).Thus, form the conductor layer 4 of pattern form thickness, regulation that has to a certain degree.
Then, shown in figure 19, a plurality of led light source 5, lead 611 (omitting in the figure) are disposed at pedestal portion 3.Then, matrix 21 etc. is fixed in pedestal portion 3, makes LED lamp 100 thus.
Next, the action effect to this embodiment describes.
In this embodiment, pedestal portion 3 is formed by insulating materials.Therefore, can conductor layer 4 directly be layered in pedestal portion 3.This is because even conductor layer 4 directly is layered in pedestal portion 3, two positions that are separated from each other of conductor layer 4 are not also via 3 conductings of pedestal portion.In the time of can conductor layer 4 directly being layered in pedestal portion 3, need be via the flexible base, board of LED lamp of the prior art etc., the heat energy that led light source 5 produces enough directly transmits to pedestal portion 3 from conductor layer 4.Therefore, the heat energy that is produced by led light source 5 transmits to pedestal portion 3 from conductor layer 4 enough efficiently.Thus, can provide thermal diffusivity excellent LED lamp.
In this embodiment,, transfer printing in that conductor layer 4 is formed in the operation of pedestal portion 3.Utilize such structure, when conductor layer 4 is printed on pedestal portion 3, use pad 825.Because pad 825 is soft, so deform when pressing on pedestal portion 3.Therefore, only pad 825 is pushed once to pedestal portion 3, just can pad 825 be pressed on a plurality of (interareas 31 and end face 32) towards different each other directions of pedestal portion 3.Thus, can conductor layer 4 be printed on simply the face towards different each other directions of pedestal portion 3.
In this embodiment, a plurality of interareas 31 are smooth.Based on such structure, can make range upon range of also smooth with conductor layer 4 interarea 31.Therefore, can make posture led light source 5 is not disposed at conductor layer 4 with being destroyed.In addition, with lead 611 grades and led light source 5 bondings the time, can prevent that also the posture of led light source 5 is destroyed.
Usually, towards two face bonding leads of each other different directions the time, need high-tech.In this embodiment, conductor layer 4 has wiring part 451,452.Each wiring part 451,452 is striden the face beyond first interarea of taking in first interarea 311 and pedestal portion 3 311.Based on such structure, the position that is formed at the face beyond first interarea 311 of pedestal portion 3 in the position that is formed at first interarea 311 in the conductor layer 4 and the conductor layer 4 need not be connected through lead.Therefore, first interarea 311 does not need bonding lead with face towards the direction different with the direction of first interarea 311.Therefore,, be formed at the position of the face beyond first interarea 311 that is formed at pedestal portion 3 in part and the conductor layer 4 of first interarea 311 in the conductor layer 4, can pass through wiring part 451,452 conductings simply based on this embodiment.
In this embodiment, pedestal portion 3 has the end face 32 of direction x1.Any one of a plurality of led light sources 5 is disposed at end face 32 through conductor layer 4.Based on such structure, the light intensity of direction x1 is increased.
In this embodiment, pedestal portion 3 has curved surface 33.Any one of curved surface 33 and a plurality of interareas 31 is connected with end face 32.Conductor layer 4 has wiring part 461.Wiring part 461 covers in a plurality of interareas 31 any one, end face 32 and curved surface 33.Based on such structure, have curved surface 33 from interarea 31 to end face 32, therefore be difficult to form pointy part from interarea 31 to end face 32.Therefore, can prevent wiring part 461 broken strings.
Then, the variation to LED lamp 100 describes.In addition, in following explanation and accompanying drawing,, mark the symbol identical with above-mentioned embodiment for identical with above-mentioned embodiment or similar key element about variation.
The LED lamp that Figure 20 representes also possesses keeper 791, screw 792.
Keeper 791 is fixed on the matrix 21.Keeper 791 comprises the inclined-plane 793 with any butt of a plurality of interareas 31.Screw 792 is fixed on matrix 21.When screw 792 is fastening with respect to principal part 2, be used for pedestal portion 3 (Figure 20 is towards the power of left) towards the masterpiece of keeper 791.Because the interarea 31 of pedestal portion 3 tilts to the left of Figure 20, therefore about the interarea 31 of pedestal portion 3, the power effect towards the below of Figure 20 is as the reaction force with respect to the power of keeper 791.Thus, can pedestal portion 3 relative principal parts 2 (for example matrix 21) be firmly fixed.
Then the variation about the led light source 5 of LED lamp 100 describes.
Led light source 5 shown in Figure 21 is light sources of so-called single line type.Assisting base plate 52 is for example formed by silicon, is supported with bare chip LED51.Be formed with Wiring pattern at assisting base plate 52 across dielectric film.The electrode of this Wiring pattern and bare chip LED51 (omit diagram) conducting, and have and extend to not by the part of bare chip LED51 region covered.In this variation, lead 611 is arranged at this Wiring pattern bonding.In addition, the part of assisting base plate 52 for example becomes electric conductor through doping treatment.Other electrode (not shown) of bare chip LED51 contacts and conducting with assisting base plate 52.
Led light source 5 shown in Figure 22 only is made up of bare chip LED51, and is the light source of two line styles.Led light source 5 shown in Figure 23 only is made up of bare chip LED51, and is the light source of single line type.Figure 22, bare chip LED51 shown in Figure 23 are engaged by eutectic with respect to conductor layer 4 respectively.
Then, the variation about the pedestal portion 3 of LED lamp 100 describes.
Then, the variation about the resin bed 73 of LED lamp 100 describes.
The LED lamp that Figure 25～Figure 27 representes also possesses a plurality of frameworks 75.Each framework 75 is formed at interarea 31 (comprising first interarea 311, second interarea 312) and end face 32.Framework 75 shown in Figure 26 is for surrounding the ring-type of a plurality of led light sources 5.Framework 75 is for example formed by the resin of insulating properties.In this variation, resin bed 73 is not formed at cover 72, and is shown in figure 26, is filled with in by 75 area surrounded of framework.Like Figure 26, shown in Figure 27, resin bed 73 covers a plurality of led light sources 5, and contacts with a plurality of led light sources 5.
In the LED lamp that Figure 28 representes, resin bed 73 covers led light source 5 singly.In this variation, resin bed 73 forms through perfusion processing (potting).
In the LED lamp shown in Figure 29, power pad portion 421 is formed at from interarea 31 and crosses over curved surface 35 up to the zone of side 34.Cable 25 for example is bonded to power pad portion 421.Therefore, the bonding of cable 25 part also is present in from interarea 31 leap curved surfaces 35 up to the zone of side 34.In addition, the conductor layer 4 that comprises power pad portion 421 is formed at upper portion among the figure of side 34, and 34 lower portion does not form in the side.
According to this variation, for example cable 25 is being applied under the situation of tractive force, in the bonding part of cable 25, this power along the direction of interarea 31 and along the side 34 direction disperseed.Thus, through tractive force, can avoid cable 25 to break away from from power pad portion 421 to cable 25.In addition, through 34 lower portion does not form conductor layer 4 in the side, can prevent conductor layer 4 and matrix 21 and substrate 231 improper conductings.
Then, the variation about the cover 72 of LED lamp 100 describes.
In the LED lamp that Figure 30, Figure 31 represent, cover 72 shape and Fig. 1, LED lamp shown in Figure 2 are different.Particularly, cover 72 has top 721, maximum diameter portion 722, reducing diameter part 723, exposes bottom 724 and tubular holding section 725.Top 721 is to the most outstanding position of direction x1 one side.Maximum diameter portion 722 is positions maximum with respect to the diameter in the rectangular cross section of x1-x2 direction in the cover 72.In this embodiment, the diameter of maximum diameter portion 722 is about 60mm.Expose bottom 724 for being positioned at the position of leaning on direction x2 one side most in the position that is exposed to outside cover 72.The diameter that exposes bottom 724 is about 42mm.Distance at maximum diameter portion on the directions X 722 and top 721 is about 30mm, and maximum diameter portion 722 is about 26mm with the distance of exposing bottom 724.That is, on the x1-x2 direction, maximum diameter portion 722 apart from the top 721 distance than big apart from the distance of exposing bottom 724.
Reducing diameter part 723 is in maximum diameter portion 722 and expose the position between the bottom 724, is the part of protruding a little to the inboard of cover 72.Tubular holding section 725 is arranged at direction x2 one side of exposing bottom 724, and profile is about 38mm, and the x1-x2 direction is of a size of the circular cylinder shaped portion about 3.5mm.Tubular holding section 725 engages with the recess that is arranged at matrix 21, and is for example bonding each other through adhesive and matrix 21.Thus, cover 72 is fixed with respect to principal part 2.
According to this variation, the compare maximum diameter portion 722 of cover in 72 leans on the part of direction x2 one side to become not towards folk prescription to the x1 side but towards the face of folk prescription to the x2 side.Therefore, the light that sends from these faces advances to the zone of direction x2 one side more easily.Thus, the LED bulb through this variation can shine the zone of direction x2 one side brighter.
According to this variation, the degree of part direction x2 one side that is positioned at direction x1 one side in the reducing diameter part 723 is stronger.Therefore, easier direction x2 one side of sending from this part of light.
In addition, according to this variation, represented that the inner face at cover 72 is formed with the example of resin bed 73, but also can not form resin bed 73 at the inner face of cover 72.Be not formed with under the situation of resin bed 73 at cover 72 inner face, for example like Figure 25～shown in Figure 28, resin bed 73 also can directly cover led light source 5.
The cover 72 of this variation also can use with Figure 20～structure shown in Figure 29.
The present invention is not limited to above-mentioned embodiment, and the concrete structure of each one of the present invention can freely carry out various design alterations.
Claims (41)
1. LED lamp is characterized in that possessing:
Matrix;
By said substrate support and the pedestal portion that forms by insulating materials;
Directly be laminated in the conductor layer of said pedestal portion; With
A plurality of led light sources,
Said pedestal portion has a plurality of interareas towards different each other directions,
Said a plurality of interarea comprises first interarea and second interarea,
Any one in said a plurality of led light source is disposed on said first interarea through said conductor layer,
Any one in said a plurality of led light source is disposed on said second interarea through said conductor layer.
2. LED lamp as claimed in claim 1 is characterized in that:
Said a plurality of interarea is all smooth.
3. LED lamp as claimed in claim 2 is characterized in that:
Said conductor layer comprises the communication wiring part,
Said communication wiring part is striden the face beyond said first interarea that rides over said first interarea and said pedestal portion.
4. like claim 2 or 3 described LED lamps, it is characterized in that:
Said a plurality of interarea all tilts with respect to said axle with the mode of said rays close to go along with the first direction that extends to axle.
5. LED lamp as claimed in claim 4 is characterized in that:
Said pedestal portion has the end face towards said first direction,
Any one of said a plurality of led light sources is disposed at said end face through said conductor layer.
6. LED lamp as claimed in claim 5 is characterized in that:
Said pedestal portion has any curved surface that is connected with said end face with said a plurality of interareas,
Said conductor layer comprises the wiring part that is connected of any of covering said a plurality of interareas, said end face and said curved surface.
7. like each described LED lamp in the claim 1～6, it is characterized in that:
Also possess any one lead that is bonded to said a plurality of led light sources,
Said lead, spread all over whole said first interarea institute towards the direction observation time and said first interarea overlapping.
8. like each described LED lamp in the claim 4～6, it is characterized in that:
Said pedestal portion have with said a plurality of interareas any one be connected and with the parallel side of said axle.
9. like claim 5 or 6 described LED lamps, it is characterized in that:
Said end face is a polygon.
10. like each described LED lamp in the claim 1～9, it is characterized in that:
Said conductor layer comprises any one pipe core welding disc that disposes said a plurality of led light sources,
Said pipe core welding disc is when overlooking and said a plurality of led light sources any one whole overlapping.
11., it is characterized in that like each described LED lamp in the claim 1～6:
Said conductor layer comprises a plurality of pipe core welding discs, disposes any of said a plurality of led light sources at each of said a plurality of pipe core welding discs, and said a plurality of pipe core welding disc all is formed at the same interarea that is included in said a plurality of interarea,
Possess: with each said led light source and the lead that disposes the said pipe core welding disc bonding of this led light source; With with each said led light source and with disposing the said pipe core welding disc of this led light source adjacent said pipe core welding disc bonding append lead.
12., it is characterized in that like each described LED lamp in the claim 4～6:
Said pedestal portion have towards with the bottom surface of said first direction opposition side,
Be formed with from said bottom surface to the recess of said first direction depression in said pedestal portion.
13. LED lamp as claimed in claim 12 is characterized in that:
Said pedestal portion has the inner face of the said recess of regulation,
Said inner face based on the cross sectional shape of the face of said first direction quadrature in, have different first and the second portions of distance from said axle.
14. LED lamp as claimed in claim 13 is characterized in that:
The distance of said first interarea and said inner face is 3～10mm.
15., it is characterized in that like each described LED lamp in the claim 1～14:
Also possess cable,
Said conductor layer comprises the power pad portion that is connected with said cable,
Be formed with the groove that is embedded with said cable in said pedestal portion.
16. LED lamp as claimed in claim 15 is characterized in that:
Said power pad portion is disposed at any interarea of said a plurality of interareas.
17. LED lamp as claimed in claim 8 is characterized in that:
Said conductor layer covers the part of said side.
18. LED lamp as claimed in claim 17 is characterized in that:
Also possess cable,
Said conductor layer comprises each a part of power pad portion that is connected with said cable, covers said interarea and said side.
19., it is characterized in that like claim 17 or 18 described LED lamps:
Said conductor layer makes in the said side, leans on the part of an opposite side with said interarea to expose.
20., it is characterized in that like each described LED lamp in the claim 1～19:
Said conductor layer is made up of the particle of a plurality of electric conductivity, and thickness is 5～10 times of any one particle diameter of said a plurality of particles.
21., it is characterized in that like each described LED lamp in the claim 1～20:
Said a plurality of led light source comprises assisting base plate and the bare chip LED that is installed in said assisting base plate respectively.
22., it is characterized in that like each described LED lamp in the claim 1～20:
Said a plurality of led light source is respectively bare chip LED.
23., it is characterized in that like each described LED lamp in the claim 1～22:
Also possess the knitting layer between any and the said conductor layer of said a plurality of led light sources,
Said knitting layer is formed by conductive material.
24., it is characterized in that like each described LED lamp in the claim 1～22:
Also possess the knitting layer between any and the said conductor layer of said a plurality of led light sources,
Said knitting layer is formed by insulating materials.
25., it is characterized in that like each described LED lamp in the claim 1～24:
Also possess the resin bed that comprises fluorophor,
Said fluorophor is energized through the light from a plurality of said led light sources, sends the light with said light wavelength different wavelengths thus.
26. LED lamp as claimed in claim 25 is characterized in that:
Also possesses the cover that covers a plurality of said led light sources.
27. LED lamp as claimed in claim 26 is characterized in that:
Said resin bed is formed at said cover.
28., it is characterized in that like claim 26 or 27 described LED lamps:
Said cover has: the top of the end of the first direction side of extending as axle; With the maximum maximum diameter portion of the diameter in the rectangular cross section of said first direction; With expose the bottom, it is to be exposed to outside part and end said first direction rightabout side, and littler than said maximum diameter portion with the diameter in the rectangular cross section of said first direction.
29. LED lamp as claimed in claim 28 is characterized in that:
The distance of the said top on the said first direction and said maximum diameter portion is bigger than the distance that said on the said first direction exposes bottom and said maximum diameter portion.
30., it is characterized in that like claim 28 or 29 described LED lamps:
Said cover has and exposes between the bottom and the inside reducing diameter part of side's protrusion in said maximum diameter portion and said.
31. LED lamp as claimed in claim 25 is characterized in that:
Also possess any a plurality of framework that is disposed at said first interarea and surrounds said a plurality of led light sources,
Said resin bed is filled in by in the said framework area surrounded.
32. LED lamp as claimed in claim 25 is characterized in that:
Said resin bed only covers any of said a plurality of led light sources.
33., it is characterized in that like each described LED lamp in the claim of right1:
Also possess and be contained in the said matrix and the power supply unit of said a plurality of led light source supply capabilities.
34., it is characterized in that like each described LED lamp in the claim of right1:
Said pedestal portion is formed by pottery.
35., it is characterized in that like each described LED lamp in the claim 1～34:
Said conductor layer is formed by the silvery white gold.
36., it is characterized in that like each described LED lamp in the claim 1～35:
Said conductor layer forms through printing.
37. the manufacturing approach of a LED lamp is characterized in that, comprising:
Formation is made up of insulating materials and has an operation towards the pedestal portion of a plurality of interareas of each other different directions;
Form the operation of conductor layer through printing in said pedestal portion;
Dispose the operation of a plurality of led light sources at said conductor layer; With
Said pedestal portion is configured in the operation on the matrix,
Said a plurality of interarea has first interarea and second interarea,
The operation of a plurality of led light sources of said configuration is disposed at said first interarea with any of said a plurality of led light sources through said conductor layer, and any of said a plurality of led light sources is disposed at said second interarea through said conductor layer.
38. the manufacturing approach of LED lamp as claimed in claim 37 is characterized in that:
In the operation of said formation conductor layer, transfer printing.
39. the manufacturing approach of LED lamp as claimed in claim 37 is characterized in that:
In the operation of said formation conductor layer, carry out screen painting.
40. the manufacturing approach of LED lamp as claimed in claim 37 is characterized in that:
In the operation of said formation conductor layer, carry out ink jet printing.
41. the manufacturing approach like each described LED lamp in the claim 37～40 is characterized in that:
Also possess the operation of preparing first mould and second mould,
In the operation of said formation pedestal portion, in the state that keeps said first mould and said second mold separation, utilize said first mould and said second mould that powder is pressurizeed.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-136109 | 2011-06-20 | ||
| JP2011136109 | 2011-06-20 | ||
| JP2012-098016 | 2012-04-23 | ||
| JP2012098016A JP2013030459A (en) | 2011-06-20 | 2012-04-23 | Led lamp and method of manufacturing the same |
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| Publication Number | Publication Date |
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| CN102840474A true CN102840474A (en) | 2012-12-26 |
| CN102840474B CN102840474B (en) | 2015-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210208318.XA Expired - Fee Related CN102840474B (en) | 2011-06-20 | 2012-06-19 | LED lamp and production method thereof |
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| CN1770959A (en) * | 2004-10-27 | 2006-05-10 | 精工爱普生株式会社 | Wiring pattern forming method, film pattern forming method, semiconductor device, electro-optical device, and electronic equipment |
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| CN111226072A (en) * | 2018-09-07 | 2020-06-02 | 亮锐控股有限公司 | Support for light emitting elements and lighting devices |
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| CN102840474B (en) | 2015-04-01 |
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