CN101839410A - Space omnidirectional light-emitting diode (LED) - Google Patents

Space omnidirectional light-emitting diode (LED) Download PDF

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Publication number
CN101839410A
CN101839410A CN201010149394A CN201010149394A CN101839410A CN 101839410 A CN101839410 A CN 101839410A CN 201010149394 A CN201010149394 A CN 201010149394A CN 201010149394 A CN201010149394 A CN 201010149394A CN 101839410 A CN101839410 A CN 101839410A
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China
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led
substrate
luminescent wafer
blade face
supporter
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CN201010149394A
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Chinese (zh)
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CN101839410B (en
Inventor
梁毅
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Liangye Technology Group Co., Ltd
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BEIJING LAMPEARL PHOTOELECTRIC CO LTD
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Abstract

The invention provides a space omnidirectional light-emitting diode (LED), comprising a substrate, LED luminous wafers, a support body and a reflective blade surface, wherein the LED luminous wafers are distributed on the solid crystal positions of the substrate in an equal-angle circumference array manner; the reflective blade surface is designed to form multi-section angles with the horizontal direction; the substrate and the reflective blade surface are assembled into a stereo bracket via the support body; and the reflective blade surface is arranged on the substrate while the orthographic projection of the reflective blade surface on the substrate only covers a plurality of LED luminous wafers of the multiple LED luminous wafers. The invention adopts the front emitted light and reflective light of the reflective blade surface of the LED to irradiate light to the surrounding space and achieve evenly luminous effect in a stereo space.

Description

Space omnidirectional light-emitting diode (LED)
Technical field
The present invention relates to technical field of semiconductor illumination, relate to a kind of space omnidirectional light-emitting diode (LED) (LightEmitting Diode light emitting diode).
Background technology
Existing LED product majority is flat luminous, is difficult to the luminous effect in implementation space, has brought difficulty for the illumination design.The luminous LED matrix in implementation space has two kinds to a certain extent:
1) a kind of technology is that a plurality of packaged LED are welded on earlier on the aluminium base, and aluminium base is fixed on heat sink side then, realizes that LED is to luminous all around.
Referring to Chinese patent 200820303374.0, as shown in Figure 1, it discloses a kind of LED multiaspect lamp, and its technical scheme that adopts is: light fixture comprises lamp bracket, lamp socket, wherein lamp bracket is an end opening, the cylindrical shell of other end sealing, the lamp bracket surface evenly offers several windows that is used to install wiring board, makes lamp bracket be the claw shaped body that surface segmentation is formed with several fillets, the lamp bracket opening is provided with light cover, and light cover and lamp bracket fasten and form a complete housing.
But in this technology, LED relates to multiple material and operation between heat sink, and scolding tin, aluminium base, bonded adhesives and heat sink have increased thermal resistance greatly, and the utmost point is unfavorable for the heat radiation of LED, has a strong impact on the life-span of LED; And this device volume all can be bigger, is unfavorable for the light fixture appearance design; Moreover the angle of LED all is 120~140 degree usually, and central light strength is very high, integrates, and lights the visual easily spot light to one by one in back, produces dazzle, and appearance is bad.
2) another kind of technology is directly support to be designed to polyhedron, and a plurality of luminescent wafers stick on respectively on polyhedral each vertical side, then the anode and cathode and the support anode and cathode of wafer is distinguished line, covering silica gel again.
Referring to Chinese patent 200780019635.4, as shown in Figure 2, it discloses a kind of semiconductor light sources that is used for the physical space illumination that contains three-dimensional rack, this semiconductor light sources that is used for the physical space illumination, comprise support with a plurality of planes, each plane is provided with one or more semiconductor light-emitting equipments, as LED.Light source is configured to adapt to the geometry of prior lamp holder and other light sources such as strip light and Plane Installation lamp.
But in this technology, this structure adopts luminescent wafer mode all in parallel, and is very high to the coherence request of wafer voltage, if voltage is variant, can cause the electric current difference that flows through each branch road, the branch road that electric current is bigger, the wafer life-span can shorten, and can influence the life-span of LED on the whole; And wafer directly sticks on certain electrode, and electric heating does not separate, and can increase the design difficulty of LED application product greatly; Moreover the polyhedron Pillar stand reaches high accuracy, high conforming production difficulty is very big, and rack surface coating is difficult to control, causes yields very low, is difficult to stable large-scale production; In addition, solid crystalline substance, bonding wire, the some fluorescent glue technology of ripe LED are all finished a horizontal plane drilling, but polyhedral version, make that solid crystalline substance, bonding wire, some fluorescent glue must operations on a plurality of vertical planes, be difficult to realization automation, large-scale production; The positive light intensity of this LED is very weak, and 20% of largest light intensity is only arranged, and positive meeting produces the dark space during use.
As fully visible; existing LED; luminous directive property is very strong; when being applied to throw light on, cause light distribution inhomogeneous, can not the implementation space omnibearing luminous; therefore designed the LED lamp of a special construction; can the comprehensive uniformly light-emitting in implementation space, and can large-scale production, institute's problem demanding prompt solution in the industry become.
Summary of the invention
In view of above problem, the object of the present invention is to provide a kind of space omnidirectional light-emitting diode (LED), can overcome above-mentioned the deficiencies in the prior art, utilize the positive bright dipping of LED and the reflection ray on reflection blade face to realize light directive surrounding space, reach the effect of solid space uniformly light-emitting.
In order to solve the problems of the technologies described above, the present invention has disclosed a kind of space omnidirectional light-emitting diode (LED), comprising: substrate, LED luminescent wafer, supporter, reflection blade face; Wherein, described LED luminescent wafer is distributed in by equal angles circumference array formula on the solid brilliant position of described substrate, and reflection blade face and horizontal direction are the multistage angle design, and described substrate is assembled into the support of a solid by described supporter and described reflection blade face; The reflection blade face is positioned on the described substrate, and making the orthographic projection on described substrate on described reflection blade face only cover the some LED luminescent wafers in described a plurality of LED luminescent wafer, the light that described some LED luminescent wafers send forms reflection through described supporter and reflection blade face.
Further, described LED luminescent wafer by equal angles circumference array formula, is evenly distributed on the solid brilliant position of the inner ring of described substrate and outer ring; But the surface of described supporter is coated with the metal level of reflection ray.
Further, the orthographic projection on described substrate on described reflection blade face covers the locational LED luminescent wafer of solid crystalline substance of described inner ring; The orthographic projection on described substrate on described reflection blade face does not cover the locational LED luminescent wafer of solid crystalline substance of described outer ring, the orthographic projection of perhaps described reflection lobes on substrate only cover described outside the part of the locational LED luminescent wafer of solid crystalline substance lamellar body of figure.
Further, the described LED luminescent wafer that is in inner ring, the side direction light that sends is mapped on described reflection blade face or the supporter, and the forward light that sends is mapped on the described reflection blade face, and light reflects the back to side, side-lower and below emission through described supporter and reflection blade face; The described LED luminescent wafer that is in the outer ring, the light directive top of sending.
Further, described substrate center position is provided with locating hole, and described supporter is coniform and the bottom is provided with reference column, and described substrate and supporter are assembled together by described reference column.
Further, also comprise: colloid, wherein, described colloid is sealed the residence and is stated the LED luminescent wafer.
Further, described LED luminescent wafer also is coated with and is used for and will penetrates the transformational substance that light is converted to white light.
Further, described substrate is metal substrate or ceramic substrate, is provided with on it to comprise: circuit and pad, wherein, described pad is used for fixing LED luminescent wafer and encapsulation, and described circuit is used between the described LED luminescent wafer and described LED luminescent wafer is electrically connected with the outside.
Further, electrically connecting as between the described LED luminescent wafer connected or series-parallel connection.
The present invention's other LED light fixtures more of the same type have following advantage:
1) LED is packaged with the ripe production equipment that is used for planar LED, contains solid crystalline substance, bonding wire, some glue and compression mold device, and LED matrix of the present invention is plane, can directly use the said equipment to do large-scale production.
2) each tame LED factory of home and abroad releases various LED bulbs successively present stage, but the overwhelming majority all is to use directive property LED, and angle only has 120 degree, and the effect of bulb also can only be that below brightness is enough, and top brightness is very weak.And can the implementation space omnibearing luminous if use LED of the present invention instead, the light no dead angle that distributes.
3) the present invention is to be the product basis with LED, because LED possesses the characteristics of low-power consumption, long-life, low-carbon (LC), is the light source in the fast development, and the structure of LED and outward appearance can be flexible and changeable, and the design of LED application product is also very convenient flexibly.With regard to application, family, hotel all require the space illumination, and the present invention has filled up the blank of LED product on the market, have really accomplished space illumination and large-scale production.
Description of drawings
Fig. 1 is the structural representation of a kind of LED lamp in the prior art;
Fig. 2 is the structural representation of another kind of LED lamp in the prior art;
Fig. 3 is the 3-D view of first embodiment of the invention;
Fig. 4 is the 3-D view of second embodiment of the invention;
Fig. 5 is the 3-D view of third embodiment of the invention;
Fig. 6 is the 3-D view of fourth embodiment of the invention
Fig. 7 is the schematic diagram that the present invention realizes the omnibearing stereo illumination effect.
The specific embodiment
Below will cooperate graphic and embodiment describes embodiments of the present invention in detail, by this to the present invention how the application technology means implementation procedure that solves technical problem and reach the technology effect can fully understand and implement according to this.
Core of the present invention comprises:
1) reflection ray of the forward bright dipping of wafer and reflection device is formed spatial light distribution;
2) luminescent wafer distributes at grade by equal angles circumference array formula;
3) reflection device is that a supporter and a plurality of reflections blade face are formed, and reflection blade face and horizontal direction are the multistage angle design.
A kind of space omnidirectional light-emitting diode (LED) of the present invention comprises: substrate, LED luminescent wafer, colloid, supporter, reflection blade face; The LED luminescent wafer is distributed on the substrate by equal angles circumference array formula, and the LED luminescent wafer of outer ring is equal angular to be distributed on the solid brilliant position of substrate outer ring (orthographic projection of reflection lobes on substrate do not cover the LED luminescent wafer of outer ring), and the LED luminescent wafer of inner ring is equal angular to be distributed on the solid brilliant position of substrate inner ring (orthographic projection of reflection lobes on substrate covers the LED luminescent wafer of inner ring); The substrate center position is provided with locating hole; The supporter bottom is provided with reference column; Substrate, supporter and reflection blade face are assembled together, and form the support of a solid.
In this structure, as shown in Figure 7, the luminous of its LED luminescent wafer is lambert's shape, half-power full-shape 120~140 degree.The lateral light that inner ring LED luminescent wafer sends is mapped on reflection blade face or the supporter, the forward light that inner ring LED luminescent wafer sends is mapped on the reflection blade face, the reflection blade face is the multistage angle design, can realize that so a part of light reflects through supporter and reflection blade face and to side and side-lower emission, another part light is through emission downwards after reflecting.The most of directive light source of the light that outer ring LED luminescent wafer (orthographic projection of reflection lobes on substrate do not cover the LED luminescent wafer of outer ring) sends top, so just can guarantee below brightness and top brightness simultaneously, reach the luminous effect of omnibearing stereo on the whole.
In another implementation, described LED luminescent wafer also can not be set to inside and outside diagram form on the circumference of described substrate, and uses individual pen to arrange, but its stereo luminous effect obviously is weaker than the Internal and external cycle arrangement mode in the scheme.
Certainly, the LED luminescent wafer in the solution of the present invention can also be set to the multi-turn layer on the circumference of described substrate equal angles array distributes, to obtain uniform more three-dimensional light efficiency.
In another implementation, the orthographic projection of reflection lobes on substrate can also only cover the part of the LED luminescent wafer lamellar body of outer ring, guarantees that the LED luminescent wafer of outer ring has the bright dipping up of a certain amount of forward to get final product.
In such scheme, described substrate can be metal substrate or ceramic substrate, carries out circuit and pad on the substrate, so that by the also encapsulation of described pad fixed L ED luminescent wafer, and is undertaken between the LED luminescent wafer and and outside being electrically connected by described circuit.
Described LED luminescent wafer can be six, also can be more a plurality of, be distributed in around the substrate to LED luminescent wafer equal angles, the LED luminescent wafer directly is encapsulated on the substrate, the electric heating of realizing LED separates, and use outer sealing to protect wafer, and can improve luminous flux simultaneously, the electrical connection between the LED luminescent wafer can be by series connection or series-parallel connection; On the LED luminescent wafer, also be coated with the light transformational substance that is used for the light that wafer is launched is converted to white light.
Described supporter is coniform, and the supporter bottom is provided with reference column, is convenient to assembling like this, and the surface of supporter is coated with metal level, plays reflection ray and the effect that prevents surface oxidation.
Described reflection blade face and horizontal direction are the multistage angle design, realize reflecting light to side, side-lower and below.
Described in the present invention is not limited to apply for or the structure of listing in the accompanying drawing, the method for utilizing the reflection ray of the positive bright dipping of LED and reflector to reach space luminescence all should be regarded category of the present invention as.
Followingly embodiments of the invention are described with reference to accompanying drawing.
As shown in Figure 3, be the 3-D view of first embodiment of the invention.Present embodiment comprises: substrate 1, substrate orientation hole 2, LED luminescent wafer 3, colloid 4, supporter 5, reflection blade face 6.
Substrate 1 adopts the aluminium base copper-clad plate of metal material, in aluminium base copper-clad plate, do circuit, wiring comprising conducting between solid brilliant pad, routing pad and the realization LED luminescent wafer 3, wherein consolidate the equal angular outer rings (being the square department of substrate 1 among Fig. 3) that are distributed in substrate 1 of brilliant pad for three, other three solid equal angular inner rings (being the rounded portions of substrate 1 among Fig. 3) that are distributed in substrate 1 of brilliant pad have the wiring that connects between the routing pad on the substrate 1; On six of aluminium base copper-clad plate solid brilliant pads, encapsulate six LEDs luminescent wafers 3 respectively, the electrode on the LED luminescent wafer 3 is linked to each other by lead with electrode on the routing pad, seal with colloid 4 outside then;
Substrate 1 center is provided with substrate orientation hole 2, supporter 5 bottoms are provided with reference column, thereby substrate 1 and supporter 5 are assembled together by reference column, supporter 5 is assembled together with reflection blade face 6 simultaneously, like this substrate 1, supporter 5 and the reflection blade face 6 whole supports that form a solid.
Followingly another embodiment of the present invention is described with reference to accompanying drawing.
As shown in Figure 4, be the 3-D view of second embodiment of the invention.Present embodiment comprises: substrate 1, substrate orientation hole 2, LED luminescent wafer 3, colloid 4, supporter 5, reflection blade face 6.
Substrate 1 adopts ceramic material, the known pottery that is applicable to high-power LED encapsulation has aluminium oxide, aluminium nitride etc., all can be used for the present invention, on ceramic substrate, do circuit, wiring comprising conducting between solid brilliant pad, routing pad and the realization LED luminescent wafer 3, wherein consolidate the equally spaced outer rings (being the square department of substrate 1 among Fig. 4) that are distributed in substrate 1 of brilliant pad for four, other four solid equally spaced inner rings (being the rounded portions of substrate 1 among Fig. 4) that are distributed in substrate 1 of brilliant pad have the wiring that connects between the routing pad on the substrate 1; On eight solid brilliant pads of substrate 1, encapsulate eight LEDs luminescent wafers 3 respectively, electrode on the LED luminescent wafer 3 is linked to each other by lead with electrode on the routing pad, also need apply light that one deck launches wafer simultaneously and be converted to the light transformational substance of white light on LED luminescent wafer 3, seal with colloid 4 outside then;
Substrate 1 center is provided with substrate orientation hole 2, supporter 5 bottoms are provided with reference column, thereby substrate 1 and supporter 5 are assembled together by reference column, supporter 5 is assembled together with reflection blade face 6 simultaneously, like this substrate 1, supporter 5 and the reflection blade face 6 whole supports that form a solid.
Followingly another embodiment of the present invention is described with reference to accompanying drawing.
Fig. 5 is the 3-D view of third embodiment of the invention.Present embodiment comprises: substrate 1, substrate orientation hole 2, LED luminescent wafer 3, colloid 4, supporter 5, supporter locating hole 6, reflection blade face 7, reflection blade face locating hole 8.
Substrate 1 adopts the aluminium base copper-clad plate of metal material, in aluminium base copper-clad plate, do circuit, wiring comprising conducting between solid brilliant pad, routing pad and the realization LED luminescent wafer 3, wherein consolidate the equally spaced outer rings (being the square department of substrate 1 among Fig. 5) that are distributed in substrate 1 of brilliant pad for three, other three solid equally spaced inner rings (being the rounded portions of substrate 1 among Fig. 5) that are distributed in substrate 1 of brilliant pad have the wiring that connects between the routing pad on the substrate 1; On six of aluminium base copper-clad plate solid brilliant pads, encapsulate six LEDs luminescent wafers 3 respectively, the electrode on the LED luminescent wafer 3 is linked to each other by lead with electrode on the routing pad, seal with colloid 4 outside then;
Substrate 1 center is provided with substrate orientation hole 2, and supporter 5 bottoms are provided with supporter locating hole 6, and reflection center, blade face is provided with reflection blade face locating hole 8; Supporter 5 is assembled together by locating hole 2,6,8 with substrate 1 and reflection blade face 7 respectively.
Followingly another embodiment of the present invention is described with reference to accompanying drawing.
Fig. 6 is the 3-D view of fourth embodiment of the invention.Present embodiment comprises: substrate 1, substrate orientation hole 2, LED luminescent wafer 3, colloid 4, supporter 5, supporter locating hole 6, reflection blade face 7, reflection blade face locating hole 8.
Substrate 1 adopts ceramic material, the known pottery that is applicable to high-power LED encapsulation has aluminium oxide, aluminium nitride etc., all can be used for the present invention, on ceramic substrate, do circuit, wiring comprising conducting between solid brilliant pad, routing pad and the realization LED luminescent wafer 3, wherein consolidate the equally spaced outer rings (being the square department of substrate 1 among Fig. 6) that are distributed in substrate 1 of brilliant pad for four, other four solid equally spaced inner rings (being the rounded portions of substrate 1 among Fig. 6) that are distributed in substrate 1 of brilliant pad have the wiring that connects between the routing pad on the substrate 1; On eight solid brilliant pads of ceramic substrate, encapsulate eight LEDs luminescent wafers 3 respectively, electrode on the LED luminescent wafer 3 is linked to each other by lead with electrode on the routing pad, also need apply light that one deck launches wafer simultaneously and be converted to the light transformational substance of white light on LED luminescent wafer 3, seal with colloid 4 outside then;
Substrate 1 center is provided with substrate orientation hole 2, and supporter 5 bottoms are provided with supporter locating hole 6, and reflection center, blade face is provided with reflection blade face locating hole 8; Supporter 5 is assembled together by locating hole 2,6,8 with substrate 1 and reflection blade face 7 respectively.
Need to prove that in addition the solution of the present invention is by reflection lobes and supporter, constitute reflection ray, thereby reach space luminescence that this technology also can reflect light respectively by the design of design special lenses to all directions with front light.
And the embodiment shown in Fig. 3 and 4 is more convenient in production and processing than the embodiment of Fig. 5 and 6, is beneficial to technological process.
LED is packaged with the ripe production equipment that is used for planar LED, contains solid crystalline substance, bonding wire, some glue and pressed film equipment, and LED matrix of the present invention is plane, can directly use the said equipment to do large-scale production.
Present stage, each tame LED factory of home and abroad released various LED bulbs successively, but the overwhelming majority all is to use directive property LED, and angle only has 120 degree, and the effect of bulb also can only be that below brightness is enough, and top brightness is very weak.And can the implementation space omnibearing luminous if use LED of the present invention instead, the light no dead angle that distributes.
The present invention is to be the product basis with LED, because LED possesses the characteristics of low-power consumption, long-life, low-carbon (LC), is the light source in the fast development, and the structure of LED and outward appearance can be flexible and changeable, and the design of LED application product is also very convenient flexibly.With regard to application, family, hotel all require the space illumination, and the present invention has filled up the blank of LED product on the market, have really accomplished space illumination and large-scale production.
Though the disclosed embodiment of the present invention as above, yet described content is not in order to direct qualification protection scope of the present invention.Any the technical staff in the technical field of the invention under the prerequisite that does not break away from the disclosed spirit and scope of the present invention, can do a little change what implement in form and on the details.Protection scope of the present invention still must be as the criterion with the scope that appending claims was defined.

Claims (10)

1. the light emitting diode of a space omnidirectional light-emitting (LED) is characterized in that, comprising: substrate, a plurality of LED luminescent wafer, supporter, reflection blade face;
Wherein, described a plurality of LED luminescent wafer is distributed on the solid brilliant position of described substrate by equal angles circumference array formula, reflection blade face and horizontal direction are the multistage angle design, and described substrate is assembled into the support of a solid by described supporter and described reflection blade face; The reflection blade face is positioned on the described substrate, and makes the orthographic projection on described substrate on described reflection blade face only cover the some LED luminescent wafers in described a plurality of LED luminescent wafer.
2. LED as claimed in claim 1 is characterized in that,
Described LED luminescent wafer by equal angles circumference array formula, is evenly distributed on the solid brilliant position of the inner ring of described substrate and outer ring;
But the surface of described supporter is coated with the metal level of reflection ray.
3. LED as claimed in claim 2 is characterized in that,
The orthographic projection on described substrate on described reflection blade face covers the locational LED luminescent wafer of solid crystalline substance of described inner ring;
The orthographic projection on described substrate on described reflection blade face does not cover the locational LED luminescent wafer of solid crystalline substance of described outer ring, and the orthographic projection of perhaps described reflection lobes on substrate only covers the part of the locational LED luminescent wafer of the solid crystalline substance lamellar body of described outer ring.
4. LED as claimed in claim 3 is characterized in that,
The described LED luminescent wafer that is in inner ring, the side direction light that sends is mapped on described reflection blade face or the supporter, the forward light that sends is mapped on the described reflection blade face, and light reflects the back to side, side-lower and below emission through described supporter and reflection blade face;
The described LED luminescent wafer that is in the outer ring, the top of the described LED luminescent wafer of light directive that sends.
5. LED as claimed in claim 4 is characterized in that,
Described substrate center position is provided with locating hole, and described supporter is coniform and the bottom is provided with reference column, and described substrate and supporter are assembled together by described reference column.
6. LED as claimed in claim 4 is characterized in that,
Described substrate center position is provided with the substrate orientation hole, and described supporter bottom is provided with the supporter locating hole, and center, described reflection blade face is provided with reflection blade face locating hole; Described supporter is assembled together by described substrate orientation hole, supporter locating hole and reflection blade face locating hole with substrate and reflection blade face respectively.
7. LED as claimed in claim 4 is characterized in that, also comprises: colloid;
Wherein, described colloid is sealed the residence and is stated the LED luminescent wafer.
8. LED as claimed in claim 7 is characterized in that,
Described LED luminescent wafer also is coated with and is used for and will penetrates the transformational substance that light is converted to white light.
9. as the LED of above arbitrary claim, it is characterized in that,
Described substrate is metal substrate or ceramic substrate, be provided with on it and comprise: circuit and pad, wherein, described pad is used for fixing LED luminescent wafer and encapsulation, and described circuit is used between the described LED luminescent wafer and described LED luminescent wafer is electrically connected with the outside.
10. LED as claimed in claim 9 is characterized in that,
Electrically connecting as between the described LED luminescent wafer connected or series-parallel connection.
CN2010101493949A 2010-04-15 2010-04-15 Space omnidirectional light-emitting diode (LED) Active CN101839410B (en)

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Publication number Priority date Publication date Assignee Title
CN102840474A (en) * 2011-06-20 2012-12-26 罗姆股份有限公司 LED lamp and production method thereof
CN102980075A (en) * 2012-12-26 2013-03-20 深圳市洲明科技股份有限公司 LED (Light-emitting Diode) large-angle light distribution device and LED bulb
CN103032732A (en) * 2012-11-12 2013-04-10 厦门阳光恩耐照明有限公司 Light source module with full space irradiation characteristic
CN103557499A (en) * 2013-10-21 2014-02-05 苏州华之杰电讯有限公司 Light-emitting diode (LED) lamp cap
CN108074359A (en) * 2016-11-11 2018-05-25 西门子瑞士有限公司 Alarm

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US7588360B2 (en) * 2007-12-15 2009-09-15 Huang Yao Hui LED lighting equipment and heat radiating structure
CN201344485Y (en) * 2008-12-12 2009-11-11 张宇 LED polyhedral lamp

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CN1427198A (en) * 2001-12-18 2003-07-02 财团法人工业技术研究院 Luminous diode illuminating light source device
CN101454910A (en) * 2006-04-04 2009-06-10 西尔欧集团 Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
JP2008091238A (en) * 2006-10-03 2008-04-17 Matsushita Electric Works Ltd Led lamp
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CN201344485Y (en) * 2008-12-12 2009-11-11 张宇 LED polyhedral lamp

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102840474A (en) * 2011-06-20 2012-12-26 罗姆股份有限公司 LED lamp and production method thereof
CN102840474B (en) * 2011-06-20 2015-04-01 罗姆股份有限公司 LED lamp and production method thereof
CN103032732A (en) * 2012-11-12 2013-04-10 厦门阳光恩耐照明有限公司 Light source module with full space irradiation characteristic
CN103032732B (en) * 2012-11-12 2016-01-20 厦门阳光恩耐照明有限公司 The light source module that the total space is irradiated
CN102980075A (en) * 2012-12-26 2013-03-20 深圳市洲明科技股份有限公司 LED (Light-emitting Diode) large-angle light distribution device and LED bulb
CN103557499A (en) * 2013-10-21 2014-02-05 苏州华之杰电讯有限公司 Light-emitting diode (LED) lamp cap
CN108074359A (en) * 2016-11-11 2018-05-25 西门子瑞士有限公司 Alarm

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