TWI299918B - - Google Patents

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TWI299918B
TWI299918B TW95116349A TW95116349A TWI299918B TW I299918 B TWI299918 B TW I299918B TW 95116349 A TW95116349 A TW 95116349A TW 95116349 A TW95116349 A TW 95116349A TW I299918 B TWI299918 B TW I299918B
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Taiwan
Prior art keywords
conductive frame
outer casing
light
power supply
package structure
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TW95116349A
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Chinese (zh)
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TW200743230A (en
Inventor
Bo-Ting Lin
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Asda Technology Co Ltd
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1299918 九、發明說明: 【發明所屬之技術領域】 本發明係有關於一種側向發光元件之封裝結構,藉由 在側向發光元件之外殼體内表面設置有複數個反射層,將 可提高側向發光元件之光源導出效率者。 【先前技術】 科技日新月異,現代之照明發光設備亦不再僅僅侷限 於鎢絲燈泡及日光燈管,隨著高科技的不斷進步,發光二 極體(LED; Light-Emitting Diode)亦漸漸取代了舊式照明設 備。以目前來說發光二極體已可於白天發出鮮明清晰可見 光,例如·將發光一極體應用於交通號誌、上。且,相較於 傳統之照明設備而言,發光二極體具備有壽命長、體積 小、耗電量少、反應速度快、無熱輻射及單色性發光之斗寺 性及優點,而在環保意識逐漸抬頭的現在,發光二極體相 車父於傳統的照明設備來說更具有絕對的優勢。 按,習用之發光元件係如第i A圖及第丄B圖所示。 如圖所示,發光科U)主要係包括有—導電架12、 光一極體19及一外殼體14。導電架12係由一第一導·^ 12:上:第二導電架123所組成,並將發光二極體19 : :弟極:?二1;上導二導線16(金線或_)分別將發 ^體19與P導電架121及第二導電架U3電性連 接。精此,將可直接由第—導電架121及第二導 連 對發光二極體19進行供電,並致使發光二極體19產生光 J299918 源。 •由於發光二極體19產生之光源係為一無方向性之光 源,其中有部分之光源(例如第一光源L1;)係可直接導出發 光兀件ίο的外部。然而對部分之光源(例如第二光源L2) 來說’將可也會被外殼體14所吸收,而導致第二光源u 導出發光元件的比例下降,並影響發光二極體19之光源 導出效率。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package structure for a lateral light-emitting element. By providing a plurality of reflective layers on the inner surface of the casing outside the lateral light-emitting element, the side can be improved. The efficiency is derived from the light source of the light-emitting element. [Prior Art] With the rapid development of science and technology, modern lighting equipment is no longer limited to tungsten bulbs and fluorescent tubes. With the continuous advancement of high technology, LEDs (Light-Emitting Diodes) have gradually replaced the old ones. lighting device. At present, the light-emitting diodes can emit clear and visible light during the day, for example, the light-emitting body is applied to the traffic sign. Moreover, compared with the conventional lighting equipment, the light-emitting diode has the advantages of long life, small volume, low power consumption, fast reaction speed, no heat radiation and monochromatic illumination, and Now that environmental awareness has gradually risen, the LED body of the LED body has an absolute advantage in traditional lighting equipment. According to the conventional light-emitting elements, as shown in the figure iA and the figure B. As shown in the figure, the illuminating section U) mainly includes a conductive frame 12, a light first body 19 and an outer casing 14. The conductive frame 12 is composed of a first guide 12: upper: second conductive frame 123, and the light-emitting diode 19: : brother: two two; upper two wires 16 (gold wire or _) The body 19 is electrically connected to the P conductive frame 121 and the second conductive frame U3, respectively. In this case, the light-emitting diode 19 can be directly powered by the first conductive frame 121 and the second conductive, and the light-emitting diode 19 generates the light J299918 source. • Since the light source generated by the light-emitting diode 19 is a non-directional light source, a part of the light source (for example, the first light source L1;) can be directly exported to the outside of the light-emitting element ίο. However, for a part of the light source (for example, the second light source L2), 'will also be absorbed by the outer casing 14, which causes the proportion of the second light source u to derive the light-emitting element to decrease, and affects the light source extraction efficiency of the light-emitting diode 19. .

【發明内容】 鐘針對上述習用技術所遭遇的問題,設計出 本發明之主此即為本發明之發明重點。 裝結構,其4=二在於提供-種_發光元件之到 所產生之光源導出反射層的設置,可將發光二極體 者。 以提鬲側向發光元件之光源導出效率 本發明之次要曰 農結構,其中發i ’在於提供—種側向發光元件之封 上,並使得發覆晶方式設置於供電基板 去側向發光元件之制广、¥電架電性相連接,藉此將可省 本發明之又〜過程中打線步驟的進行。 裝結構,其中反纟2 ’在於提供-種側向發光元件之封 二極體所魅之3二—傾斜方式設置,而有利於發光 本發明之又導出及導出光源之匯集者。 目的,在於提供一種側向發光元件之封 .1299918 ' 裝結構,其中部分之導電架係外露於外殼體之外部,將有 利於側向發光元件之後續使用步驟的進行。 為此,為達成上述目的,本發明提供一種側向發光元 件之封裝結構,其主要係包括有:一導電架,包含有至少 一第一導電架及至少一第二導電架;至少一發光二極體, 係分別與第一導電架及第二導電架電性相連接;及一外殼 體,係包覆有部分之導電架,並於其容置空間内設有發光 二極體,而外殼體之部分内表面則設置有複數個反射層。 > 又,本發明尚可提供一種側向發光元件之封裝結構, 其主要係包括有:一導電架,係包括有至少一第一導電架 及至少一第二導電架;一發光二極體,係以一覆晶之方式 設置於一供電基板上,並以供電基板與第一導電架及第二 導電架相連接;及一外殼體,係包覆有部分之導電架,並 於其容置空間内設有發光二極體,而外殼體之部分内表面 則設置有複數個反射層。 【實施方式】 首先,請同時參閱第2 A圖及第2 B圖,係分別為本 發明側向發光元件之封裝結構一較佳實施例之俯視圖及剖 面示意圖。如圖所示,本發明所述之側向發光元件20主要 係包括有一導電架22、一發光二極體(LED ; Light-Emitting Diode)29及一外殼體24。其中,導電架22係包括有至少一 第一導電架221及至少一第二導電架223,並於導電架22 上設置有發光二極體29。 6 .1299918 發光二極體29係分別電性連接第一導電架221及第二 導電架223,例如:發光二極體29係設置於第一導電架221 上,並藉由至少一導線20的使用,而分別與第一導電架221 及弟一 ‘黾Ik 223電性相連接。外殼體24係用以包覆部分 之導電架22,並於外殼體24之内部存在有一容置空間28, 可用以谷置發光一極體29,而於外殼體24之部分内表面係 設置有複數個反射層23,例如,於外殼體24之側板241上 設置有複數個反射層23。藉由反射層23之設置係可將發光 ® 二極體29所產生之光源導引至側向發光元件20外部,例 如,發光二極體29所產生第一光源li可直接導出側向發 光元件20,而第二光源L2則經由反射層23之反射,並導 引至侧向發光元件20外部,藉此將可有效提昇側向發光元 件20之光源導出效率及發光亮度。 發光二極體29係包含有一透光基板25、一第一材料層 291及/或一第二材料層293之層疊,例如,於透光基板25 春 上依序設置有第一材料層291及第二材料層293,其中,第 一材料層291及第二材料層293係分別為一 N型半導體材 料及一 P型半導體材料,而第一材料層與第二材料層 293交界處將自然形成有一 pn介面。又,藉由透光基板25 的設置將可提高發光二極體29之結構強度。而發光二極體 29及第一導電架221之間係藉由一黏固層27之使用,以達 到兩者連接之目的。 反射層23之材料係可選擇為一金屬材質(例如鋁或銀 等)或一多層膜反射鏡。而外殼體24之材料則為一絕緣材 1299918 i ’以達到固定導電架22及保護發光二極體29之目的。 脖处再者,ΐ參閱第3圖,係為本發明側向發光元件之封 貝知例之剖面示意圖。如圖所示,本發明所述 之側向I光元件30與第2 Β圖所示之實施例相異之處在 ; 射g 33係為一傾斜態樣,例如反射層33與外殼體 34之底;^反343為一非正交態#,並致使兩者之間的夾▲餐 於0度至90度之間。藉此,不僅可提高發光二極體29所 1生之光源的導出效率,並有利於導出光_ •使用上的便利性。 / 又,於本發明實施例中發光二極體29係可選擇不設置 在導電架32上,例如,將發光二極體29設置在外殼體34 之底板343上,並透過導線26分別與第一導電架321及第 二導電架323電性相連接。 外殼體34所形成之容置空間38内部,係可選擇填充 有一封裝膠體381,藉此以達到保護發光二極體29之目的, • 及延長侧向發光元件30之使用壽命者。 接續,請參閱第4圖,係為本發明側向發光元件之封 裝結構又一實施例之剖面示意圖。如圖所示,本發明所述 之侧向發光元件40内部所設置之發光二極體49係為一直 立型發光二極體。發光二極體49係透過一導電黏固層47 之使用’而設置於導電架22上,例如,發光二極體49係 透過導電黏固層47而設置於第一導電架221上。 藉此,將可直接由第一導電架221對發光二極體49進 行供電’例如’電源訊號可從第一導電架221經由導電黏 8 1299918 固層47傳遞至發光二極體49。發光二極體49再藉由導線 46電性連接第二導電架223,而致使發光二極體49產生光 源。於本發明所述之實施例中係可減少側向發光元件牝的 打線次數,不僅有利於製程效率的提高,同時亦可降低導 線46脫落的可能。 壯最後,請參閱第5圖,係為本發明側向發光元件之封 衣、’、〇構又貝轭例之剖面示意圖。如圖所示,本發明所述 之發光二極體59係以一覆晶之方式設置於-供電基板55 ^,而―供電基板55係包括有至少一第一供電電路551及至 夕第一供電電路553。其中’發光二極體59之第一材料 層591,係透過第一供電電路551係與第一導電架521電性 連接,而發光二極體59之第二材料層593 ,則透過第二供 電電路553與第二導電架S23電性連接,藉此以達到電性 連接發光二極體59及導電架52之目的。 本發明所述之側向發光元件%中,係可完全不藉由 之設置,便可達到導電架22與發光二極體59 : '妾之目的’可有效解決在製作或使用過程當中造成 =線(26/46)的脫落或在經過高低溫熱衝擊後同樣會造成導 !=6)广落之情況發生。又,導電架52及外殼體54在 〇又使得部分導電架52外露在外殼體54的外部, 木52外露的方式,係可依據側向發光元件%之後 績=上的便舰進㈣整。藉由使得 部’將可提高側向發光元件50在使用上的便 1299918 以上所述者,僅為本發明之一較佳實施例而已,並非 用來限定本發明實施之範圍,即凡依本發明申請專利範圍 所述之形狀、構造、特徵及精神所為之均等變化與修飾, 均應包括於本發明之申請專利範圍内。 【圖式簡單說明】 第1A圖:係為習用發光元件之封裝結構的俯視圖。 第1B圖:係為習用發光元件之封裝結構的剖面示意圖。 •第2 A圖:係為本發明側向發光元件之封裝結構一較佳實 施例之俯視圖。 第2 B圖:係為本發明上述實施例之剖面示意圖。 第3圖:係為本發明側向發光元件之封裝結構又一實施例 之剖面示意圖。 第4圖:係為本發明側向發光元件之封裝結構又一實施例 之剖面示意圖。 參 第5圖:係為本發明側向發光元件之封裝結構又一實施例 之剖面示意圖。 【主要元件符號說明】 10 發光元件 12 導電架 121 第一導電架 123 第二導電架 14 外殼體 16 導線 19 發光二極體 20 側向發光元件 22 導電架 221 第一導電架 1299918SUMMARY OF THE INVENTION The present invention is directed to the problems encountered by the above-described conventional techniques, and is the focus of the invention. The mounting structure, 4=2, is to provide the arrangement of the light-emitting elements to the resulting light source-derived reflective layer, which can be used as a light-emitting diode. The light source deriving efficiency of the lateral light-emitting element of the present invention, wherein the secondary structure is provided by providing a lateral light-emitting element, and the flip-chip is disposed on the power supply substrate to laterally emit light. The components are widely manufactured, and the electric frame is electrically connected, thereby omitting the progress of the wire bonding step in the process of the present invention. The mounting structure, wherein the ruthenium 2 ′ is provided in the slanting manner of the slanting diode of the lateral illuminating element, and is advantageous for illuminating the present invention to derive and derive the source of the light source. The purpose is to provide a lateral light-emitting element package. 1299918 ' Mounting structure, in which part of the conductive frame is exposed outside the outer casing, which will facilitate the subsequent use steps of the lateral light-emitting elements. To this end, in order to achieve the above object, the present invention provides a package structure for a lateral light-emitting element, which mainly includes: a conductive frame, including at least one first conductive frame and at least one second conductive frame; at least one light emitting The pole body is electrically connected to the first conductive frame and the second conductive frame respectively; and an outer casing is covered with a part of the conductive frame, and the light emitting diode is disposed in the accommodating space thereof, and the outer casing A portion of the inner surface of the body is provided with a plurality of reflective layers. In addition, the present invention further provides a package structure for a lateral light-emitting element, which mainly includes: a conductive frame, comprising at least one first conductive frame and at least one second conductive frame; and a light-emitting diode , is mounted on a power supply substrate in a flip chip manner, and is connected to the first conductive frame and the second conductive frame by the power supply substrate; and an outer casing body is covered with a part of the conductive frame, and is accommodated therein A light-emitting diode is arranged in the space, and a part of the inner surface of the outer casing is provided with a plurality of reflective layers. [Embodiment] First, please refer to FIGS. 2A and 2B, which are top and cross-sectional views, respectively, of a preferred embodiment of a package structure for a lateral light-emitting device of the present invention. As shown, the lateral light-emitting element 20 of the present invention mainly comprises a conductive frame 22, a light-emitting diode (LED) 29 and an outer casing 24. The conductive frame 22 includes at least one first conductive frame 221 and at least one second conductive frame 223, and the light-emitting diodes 29 are disposed on the conductive frame 22. 6.1299918 The light-emitting diodes 29 are electrically connected to the first conductive frame 221 and the second conductive frame 223, for example, the light-emitting diodes 29 are disposed on the first conductive frame 221, and are connected by at least one wire 20 It is electrically connected to the first conductive frame 221 and the first one 黾Ik 223, respectively. The outer casing 24 is used to cover a portion of the conductive frame 22, and an accommodating space 28 is disposed inside the outer casing 24 for illuminating the pole body 29, and a part of the inner surface of the outer casing 24 is provided. A plurality of reflective layers 23 are provided, for example, on the side plates 241 of the outer casing 24 with a plurality of reflective layers 23. The light source generated by the light emitting diode 26 can be guided to the outside of the lateral light emitting element 20 by the arrangement of the reflective layer 23. For example, the first light source li generated by the light emitting diode 29 can directly lead to the lateral light emitting element. 20, the second light source L2 is reflected by the reflective layer 23 and guided to the outside of the lateral light-emitting element 20, whereby the light source derivation efficiency and the light-emitting luminance of the lateral light-emitting element 20 can be effectively improved. The light-emitting diode 29 includes a light-transmissive substrate 25, a first material layer 291 and/or a second material layer 293. For example, a first material layer 291 is sequentially disposed on the transparent substrate 25 in spring. The second material layer 293, wherein the first material layer 291 and the second material layer 293 are an N-type semiconductor material and a P-type semiconductor material, respectively, and the first material layer and the second material layer 293 at the junction will be naturally formed. There is a pn interface. Moreover, the structural strength of the light-emitting diode 29 can be improved by the arrangement of the light-transmitting substrate 25. The light-emitting diode 29 and the first conductive frame 221 are used by a bonding layer 27 to achieve the purpose of connecting the two. The material of the reflective layer 23 can be selected from a metal material (e.g., aluminum or silver) or a multilayer film mirror. The material of the outer casing 24 is an insulating material 1299918 i ' for the purpose of fixing the conductive frame 22 and protecting the light-emitting diodes 29. Further to the neck, reference is made to Fig. 3, which is a schematic cross-sectional view showing a seal of the lateral light-emitting element of the present invention. As shown, the lateral I-light element 30 of the present invention differs from the embodiment shown in FIG. 2 in that the projection g 33 is in an inclined state, such as the reflective layer 33 and the outer casing 34. The bottom is ^ 343 is a non-orthogonal state #, and causes the sandwich between the two ▲ meal between 0 degrees and 90 degrees. Thereby, not only the efficiency of deriving the light source generated by the light-emitting diodes 29 but also the convenience of use can be improved. In addition, in the embodiment of the present invention, the light-emitting diodes 29 can be selectively disposed not on the conductive frame 32. For example, the light-emitting diodes 29 are disposed on the bottom plate 343 of the outer casing 34, and are respectively transmitted through the wires 26 and A conductive frame 321 and a second conductive frame 323 are electrically connected. The inside of the accommodating space 38 formed by the outer casing 34 is optionally filled with an encapsulant 381 for the purpose of protecting the illuminating diode 29, and extending the service life of the lateral illuminating element 30. Next, referring to Fig. 4, there is shown a cross-sectional view showing still another embodiment of the package structure of the lateral light-emitting element of the present invention. As shown in the figure, the light-emitting diode 49 provided inside the lateral light-emitting element 40 of the present invention is a standing-type light-emitting diode. The light-emitting diode 49 is disposed on the conductive frame 22 through the use of a conductive adhesive layer 47. For example, the light-emitting diode 49 is disposed on the first conductive frame 221 through the conductive adhesive layer 47. Thereby, the light-emitting diode 49 can be directly powered by the first conductive frame 221. For example, the power signal can be transmitted from the first conductive frame 221 to the light-emitting diode 49 via the conductive adhesive layer 12999918. The LEDs 49 are electrically connected to the second conductive frame 223 by wires 46, so that the light-emitting diodes 49 generate a light source. In the embodiment of the present invention, the number of times of the lateral light-emitting elements 牝 can be reduced, which not only facilitates the improvement of the process efficiency, but also reduces the possibility of the wires 46 falling off. Finally, please refer to Fig. 5, which is a schematic cross-sectional view showing the sealing, '〇, and yoke examples of the lateral light-emitting elements of the present invention. As shown in the figure, the light-emitting diode 59 of the present invention is disposed on the power supply substrate 55 ^ in a flip chip manner, and the power supply substrate 55 includes at least one first power supply circuit 551 and the first power supply. Circuit 553. The first material layer 591 of the light-emitting diode 59 is electrically connected to the first conductive frame 521 through the first power supply circuit 551, and the second material layer 593 of the light-emitting diode 59 is transmitted through the second power supply. The circuit 553 is electrically connected to the second conductive frame S23, thereby achieving the purpose of electrically connecting the light-emitting diode 59 and the conductive frame 52. In the aspect of the lateral light-emitting device of the present invention, the conductive frame 22 and the light-emitting diode 59 can be achieved without setting it at all: the purpose of the '妾 can effectively solve the problem during the production or use process. The fall of the wire (26/46) or the high-low temperature thermal shock will also cause the guide!=6) The wide-ranging situation occurs. Moreover, the conductive frame 52 and the outer casing 54 expose a portion of the conductive frame 52 to the outside of the outer casing 54. The manner in which the wood 52 is exposed may be based on the lateral light-emitting element%. By making the portion 'will improve the lateral light-emitting element 50 in use, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the practice of the present invention. The variations, modifications, and modifications of the shapes, structures, features, and spirits of the inventions are intended to be included within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a plan view showing a package structure of a conventional light-emitting element. Fig. 1B is a schematic cross-sectional view showing a package structure of a conventional light-emitting element. • Fig. 2A is a plan view of a preferred embodiment of the package structure of the lateral light-emitting element of the present invention. Figure 2B is a schematic cross-sectional view of the above embodiment of the present invention. Fig. 3 is a cross-sectional view showing still another embodiment of the package structure of the lateral light-emitting element of the present invention. Fig. 4 is a cross-sectional view showing still another embodiment of the package structure of the lateral light-emitting element of the present invention. Fig. 5 is a cross-sectional view showing still another embodiment of the package structure of the lateral light-emitting element of the present invention. [Main component symbol description] 10 Light-emitting component 12 Conductive frame 121 First conductive frame 123 Second conductive frame 14 Outer casing 16 Conductor 19 Light-emitting diode 20 Side light-emitting element 22 Conductive frame 221 First conductive frame 1299918

223 第二導電架 24 外殼體 25 透光基板 27 黏固層 29 發光二極體 293 第二材料層 32 導電架 323 第二導電架 34 外殼體 38 容置空間 40 側向發光元件 47 導電黏固層 50 側向發光元件 521 第一導電架 54 外殼體 551 第一供電電路 59 發光二極體 593 第二材料層 23 反射層 241 側板 26 導線 28 容置空間 291 第一材料層 30 側向發光元件 321 第一導電架 33 反射層 343 底板 381 封裝膠體 46 導線 49 發光二極體 52 導電架 523 第二導電架 55 供電基板 553 第二供電電路 591 第一材料層 11223 second conductive frame 24 outer casing 25 transparent substrate 27 adhesive layer 29 light-emitting diode 293 second material layer 32 conductive frame 323 second conductive frame 34 outer casing 38 accommodating space 40 lateral light-emitting element 47 conductive adhesive Layer 50 lateral light-emitting element 521 first conductive frame 54 outer casing 551 first power supply circuit 59 light-emitting diode 593 second material layer 23 reflective layer 241 side plate 26 wire 28 accommodating space 291 first material layer 30 lateral light-emitting element 321 first conductive frame 33 reflective layer 343 bottom plate 381 encapsulant 46 wire 49 light emitting diode 52 conductive frame 523 second conductive frame 55 power supply substrate 553 second power supply circuit 591 first material layer 11

Claims (1)

1299918 月日修m:_賴 申請專利範圍: 之封餘構,红要係包括有: 導電架’包含有至少一第— 電架 導電架及至少一第二導 至少一發光二極體,伤公别彻>μ 導電架電性相連接;及、该弟—導電架及該第二 覆有部分之導電架,並於其容置空間 極體’而該外殼體之部分内表面則 =,卜=固反射層’其中該外殼體包含有 一底板 夕I彳反’且該反射層設置於該外殼體之侧板 上0 2·如中請專利範圍第丨項所述之塊結構,射該外殼體 係為一絕緣材質者。 3 ·如中請專鄕®fl項所述之封料構,尚包括有-封 裝膠體,係填充於該外殼體之容置空間内部。 4 ·如中請專利第!項所述之封裝結構,其中該反射層 係可選擇為-金屬材質及一多層膜反射鏡之其中之一 者。 5·如申請專利範圍第丄項所述之封裝結構,其中該發光二 極體係設置於該外殼體之底板上。 6·如申請專利範圍第丄項所述之封裝結構,其中該反射層 係與該外殼體之底板係為一傾斜態樣。 7 ·如申請專利範圍第1項所述之封裝結構,其中該發光二 極體係包括有一第一材料層及一第二材料層之層疊。 8 ·如申請專利範圍第1項所述之封裝結構,其中該發光二 極體係透過至少一導線之設置,而與該第一導電架及 12 1^9918 麵買丨 白修(愛u:.:. 5亥弟二導電架電性相連接者。 ―― 9 ·=,圍第1項所述之封裝結構,其中該發光- 極體係設置於該第一導電架上。 Ά— 10 · ^請專利_第9項所述之封裝結構,1中 u 透過-黏固體而與該第-導電架相連接者 申請專利範圍第9項所述之龍結構,其中 極體係為一直立型發光二極體。 / X光— 12·如中請專纖㈣u項所敎封t 二極體係透過一導雷# 、、σ '、中5亥發光 相、查垃^ 固層之設置而與該第—導雷加 =透過至少—導線之設置而與該第二導= 13 Htni1項所叙縣結構,其中該第1 14木及3亥弟一 ¥電架係部分外露於該外殼體之外邻 :種導::發1,^^ 電架少-第-導電架及至少-第二導 至少一發光二極體, 電架上,並透過義設置於該第—導 者;及 —口體而與該第一導電架相連接 一外殼體,係包覆有部 設有該發光二極體,木,並於其容置空間内 有複數個騎層。而斜贿之部分内表面則設置 之封m其主要係包括有: ::架括有至少-第-導電架及至少-第二 13 15 12999181299918 Month repair m: _ application patent scope: The seal structure, the red key system includes: The conductive frame 'contains at least one first - electric frame conductive frame and at least one second guide at least one light emitting diode, injury The public body is electrically connected; and the younger conductive frame and the second partially covered conductive frame, and the space pole body is accommodated therein, and part of the inner surface of the outer casing is , the b = solid reflective layer 'where the outer casing comprises a bottom plate and the reflective layer is disposed on the side plate of the outer casing 0 2 · as described in the patent scope, the block structure, shot The outer casing system is an insulating material. 3 · If you are using the seal material described in the special product, please include the -package gel, which is filled inside the housing space of the outer casing. 4 · For example, please patent! The package structure described in the item, wherein the reflective layer is selected from the group consisting of a metal material and a multilayer film mirror. 5. The package structure of claim 2, wherein the light emitting diode system is disposed on a bottom plate of the outer casing. 6. The package structure of claim 2, wherein the reflective layer and the bottom plate of the outer casing are in an inclined state. 7. The package structure of claim 1, wherein the light emitting diode system comprises a stack of a first material layer and a second material layer. 8. The package structure according to claim 1, wherein the light-emitting diode system is disposed through the at least one wire, and the first conductive frame and the 12 1^9918 face are bought by Bai Xiu (Love u:. 5: Hai's two conductive frame electrical connector. —— 9 ·=, the package structure described in Item 1, wherein the illuminating-pole system is disposed on the first conductive frame. Ά — 10 · ^ In the package structure described in the above-mentioned Patent No. 9, the u-transmissive-viscous solid is connected to the first conductive frame, and the dragon structure described in claim 9 is applied, wherein the pole system is an upright vertical light. / X-ray - 12 · If the special fiber (4) u item is sealed t two-pole system through a guide thunder #,, σ ', in the 5 hai luminescence phase, check the ^ solid layer settings and the first - Thunder plus = through at least - the arrangement of the wire and the second guide = 13 Htni1 item of the county structure, wherein the first 14 wood and 3 hai ji s electric frame part is exposed outside the outer casing : species guide:: hair 1, ^ ^ electric frame less - first - conductive frame and at least - second guide at least one light-emitting diode, on the electric frame, and set by The first guide body is connected to the first conductive frame, and is covered with a light-emitting diode, wood, and has a plurality of riding layers in the receiving space. The inner surface of the part of the oblique bribe is mainly composed of: :: includes at least a - first conductive frame and at least - a second 13 15 1299918 一發光^一極體’係以一覆晶之方式设置於一供電基板上 ,並以該供電基板與該第一導電架及該第二導電架相 連接;及 μ 一外殼體,係包覆有部分之導電架,並於其容置空間 内設有該發光二極體,而該外殼體之部分内表面則 設置有複數個反射層,其中該外殼體包含有一底板 及至少一侧板,且該反射層係設置於該外殼體之側 板的内表面。 16 17 18 · 19 · 20 · •如申請專利範圍第15項所述之封裝結構,其中該外殼 體係為一絕緣材質者。 •如申請專利範圍第15項所述之封裝結構,尚包括有一 封裝膠體,係填充於該外殼體之容置空間内部。 .如申請專·圍第15項所狀封裝結構,其中該發光 二極體係包含有-第-材料層及—第二材料層之^疊 〇 如申請專鄉㈣18項所述之封裝結構,其中該供電 基板係包含有至少一第一供電電路及至少一第二供電 如申請專鄉圍第韻述之封裝結構, 二第-材料層,係透過該第一供電電路她 供電:L電性相連接’而該第二材料層係透過該第. 供電電路與該第二導電架電性相連接。 專^㈣15辦述之縣賴,其中該反』 二去、4 —金屬材質及—多層膜反射鏡之其中: —有0 21 · 1299918 ΓΜΤ 2 層係與該外殼體之絲係為—傾_樣。 23 · ΐΓί專利範圍第15項所述之縣結構,其中該第一 24 ¥1ΐ該第二導電架係部分外露於該外殼體之外部。 一種侧向發光元件之封裝結構,其主要係包括有: 一導電架,係包括有至少—第—導電架及至少-第二 導電架; 一 -發,二極體,包含有1—材料層及—第二材料層之 層豐,亚以-覆晶之方式設置於—供電基板上,該供 電基板包含有至少-第一供電電路及至少一第二供電 電路,並以該ί一供電電路及該第二供電電路與該第 一導電架及該第二導電架相連接;及 -外殼體,係包覆有部分之導電架,並於其容置空間内 設有該發光二極體,而該外殼體之部分内表面則設置 有複數個反射層。 15An illuminating body is disposed on a power supply substrate in a flip chip manner, and is connected to the first conductive frame and the second conductive frame by the power supply substrate; and the μ outer casing is covered a portion of the conductive frame is disposed in the accommodating space, and a part of the inner surface of the outer casing is provided with a plurality of reflective layers, wherein the outer casing comprises a bottom plate and at least one side plate. And the reflective layer is disposed on an inner surface of the side plate of the outer casing. 16 17 18 · 19 · 20 · • The package structure as described in claim 15 wherein the outer casing system is an insulating material. The package structure of claim 15 further comprising an encapsulant filled inside the housing space of the outer casing. For example, in the package structure of claim 15, wherein the light-emitting diode system comprises a package of a -th material layer and a second material layer, such as the package structure described in claim 18 of the application (4), wherein The power supply substrate includes at least one first power supply circuit and at least one second power supply, such as the package structure of the application for the hometown, and the second material layer is powered by the first power supply circuit: the L electrical phase The second material layer is electrically connected to the second conductive frame through the first power supply circuit. Dedicated ^ (4) 15 of the county, which is the anti-"two to, 4 - metal material and - multilayer film mirror: - 0 21 · 1299918 ΓΜΤ 2 layer and the outer shell of the silk is - kind. 23. The county structure of claim 15, wherein the first portion of the second conductive frame is exposed to the exterior of the outer casing. A package structure for a lateral light-emitting element, comprising: a conductive frame comprising at least a first conductive frame and at least a second conductive frame; a hair-emitting diode comprising a 1-material layer And a layer of the second material layer is disposed on the power supply substrate, and the power supply substrate includes at least a first power supply circuit and at least a second power supply circuit, and the power supply circuit is And the second power supply circuit is connected to the first conductive frame and the second conductive frame; and the outer casing is covered with a part of the conductive frame, and the light emitting diode is disposed in the accommodating space thereof. A portion of the inner surface of the outer casing is provided with a plurality of reflective layers. 15
TW095116349A 2006-05-09 2006-05-09 Encapsulating structure of lateral light-emitting device TW200743230A (en)

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