CN102820238B - 用于局部区域导航的高精确度射束放置 - Google Patents

用于局部区域导航的高精确度射束放置 Download PDF

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Publication number
CN102820238B
CN102820238B CN201210185985.0A CN201210185985A CN102820238B CN 102820238 B CN102820238 B CN 102820238B CN 201210185985 A CN201210185985 A CN 201210185985A CN 102820238 B CN102820238 B CN 102820238B
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CN
China
Prior art keywords
image
interest
array
feature
sample
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CN201210185985.0A
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English (en)
Chinese (zh)
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CN102820238A (zh
Inventor
R.L.瓦肖尔
R.J.杨
C.吕
P.D.卡尔森
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FEI Co
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FEI Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31749—Focused ion beam

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
CN201210185985.0A 2011-06-08 2012-06-07 用于局部区域导航的高精确度射束放置 Active CN102820238B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161494828P 2011-06-08 2011-06-08
US61/494828 2011-06-08

Publications (2)

Publication Number Publication Date
CN102820238A CN102820238A (zh) 2012-12-12
CN102820238B true CN102820238B (zh) 2017-04-12

Family

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Family Applications (1)

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CN201210185985.0A Active CN102820238B (zh) 2011-06-08 2012-06-07 用于局部区域导航的高精确度射束放置

Country Status (3)

Country Link
EP (1) EP2533278A3 (https=)
JP (1) JP6108684B2 (https=)
CN (1) CN102820238B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9601303B2 (en) * 2015-08-12 2017-03-21 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam device and method for inspecting and/or imaging a sample
US9576772B1 (en) * 2015-08-31 2017-02-21 Fei Company CAD-assisted TEM prep recipe creation
US10409171B2 (en) * 2017-01-25 2019-09-10 Kla-Tencor Corporation Overlay control with non-zero offset prediction
CN110340877B (zh) * 2019-07-11 2021-02-05 深圳市杉川机器人有限公司 移动机器人及其定位方法和计算机可读存储介质
US10903044B1 (en) * 2020-02-12 2021-01-26 Applied Materials Israel Ltd. Filling empty structures with deposition under high-energy SEM for uniform DE layering
US11645831B2 (en) * 2020-07-07 2023-05-09 Applied Materials Israel Ltd. Identification of an array in a semiconductor specimen
CN114494028B (zh) * 2020-11-12 2022-12-09 生物岛实验室 粒子束成像降噪方法及装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5401972A (en) * 1993-09-02 1995-03-28 Schlumberger Technologies, Inc. Layout overlay for FIB operations

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003016988A (ja) * 2001-06-27 2003-01-17 Fujitsu Ltd フォーカストイオンビーム装置及びそれを利用したフォーカストイオンビーム加工方法
US7002513B2 (en) * 2004-03-26 2006-02-21 Topcon Gps, Llc Estimation and resolution of carrier wave ambiguities in a position navigation system
JP4571053B2 (ja) * 2005-09-29 2010-10-27 株式会社日立ハイテクノロジーズ 荷電粒子ビーム装置
JP5069904B2 (ja) * 2006-03-28 2012-11-07 株式会社日立ハイテクノロジーズ 指定位置特定方法及び指定位置測定装置
US7351966B1 (en) * 2006-05-23 2008-04-01 International Business Machines Corporation High-resolution optical channel for non-destructive navigation and processing of integrated circuits
US7442916B2 (en) * 2006-08-25 2008-10-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Lift detection adapted for navigation on a transparent structure
JP5805536B2 (ja) * 2008-10-12 2015-11-04 エフ・イ−・アイ・カンパニー 局所領域ナビゲーション用の高精度ビーム配置
JP2010123354A (ja) * 2008-11-18 2010-06-03 Hitachi High-Technologies Corp 荷電粒子線装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5401972A (en) * 1993-09-02 1995-03-28 Schlumberger Technologies, Inc. Layout overlay for FIB operations

Also Published As

Publication number Publication date
JP6108684B2 (ja) 2017-04-05
CN102820238A (zh) 2012-12-12
JP2012255774A (ja) 2012-12-27
EP2533278A3 (en) 2013-03-20
EP2533278A2 (en) 2012-12-12

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