CN102810602A - Method for storing silicon wafer to be cleaned - Google Patents
Method for storing silicon wafer to be cleaned Download PDFInfo
- Publication number
- CN102810602A CN102810602A CN201210298435XA CN201210298435A CN102810602A CN 102810602 A CN102810602 A CN 102810602A CN 201210298435X A CN201210298435X A CN 201210298435XA CN 201210298435 A CN201210298435 A CN 201210298435A CN 102810602 A CN102810602 A CN 102810602A
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- China
- Prior art keywords
- silicon wafer
- silicon chip
- cleaned
- ethanolic solution
- store method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Agricultural Chemicals And Associated Chemicals (AREA)
Abstract
The invention discloses a method for storing a silicon wafer to be cleaned, relating to a silicon wafer cleaning technology. The silicon wafer is separated from a slicing machine and mortar solution immediately after being sliced, and is then immediately arranged in prepared ethanol solution; and the volume concentration or weight concentration of the ethanol solution is no less than 10 percent. Furthermore, the temperature of the ethanol solution is maintained at 20-70 DEG C. The method has the beneficial effects that the state of the silicon wafer after being sliced can be easily maintained, the silicon wafer to be cleaned can be easily stored, other impurities cannot be introduced onto the surface of the silicon wafer, difficulties in removing dirt on the surface caused when the silicon wafer is not cleaned in a long time can be avoided, and the efficiency and effects of cleaning can be improved.
Description
Technical field
The present invention relates to the manufacturing technology field of solar energy-level silicon wafer, particularly the silicon chip cleaning technique.
Background technology
Have a lot of silicon chips to be cleaned after the solar energy-level silicon wafer section, the processing method of present silicon chip to be cleaned is: be positioned in the particle loaded fluid or be exposed in the air.
And owing to reasons such as the unstable perhaps outages of cleaning equipment; Can make silicon chip be immersed in for a long time in the particle loaded fluid perhaps is exposed in the air; Cause dirty oxidation of silicon chip surface or deposition, cause in back segment cleans, to be difficult to or can't to remove, therefore; Studying a kind of effective solution, is necessary.This method can prevent to be difficult to clean dirty formation, guarantees the cleaning efficiency and the effect of silicon chip.
Summary of the invention
The store method that the purpose of this invention is to provide a kind of silicon chip to be cleaned; State when the method can make silicon chip keep section to finish easily; Make silicon chip to be cleaned be easy to preserve; And silicon chip surface is not introduced other impurity again, can not make silicon chip cause dirty being difficult to of surface to remove owing to can not get for a long time cleaning, and has improved the efficient and the effect of cleaning.
For realizing the foregoing invention purpose, the present invention adopts following technical scheme:
The store method of silicon chip to be cleaned is characterized in that: leave slicing machine and particle loaded fluid immediately after the silicon chip section, and put into ready prepd ethanolic solution immediately; The volumetric concentration of said ethanolic solution or weight concentration are >=10%.
Wherein:
Leave slicing machine and particle loaded fluid after the said silicon chip section, and put into the time of ethanolic solution, be controlled in 30 minutes, further be controlled in 15 minutes, Optimal Control is in 5 minutes.
Said ethanolic solution temperature can select to remain on 20-70 degree centigrade, further is 30-60 degree centigrade; It also can be room temperature state.
The invention has the beneficial effects as follows: the state when the method can make silicon chip keep section to finish easily; Make silicon chip to be cleaned be easy to preserve; And silicon chip surface is not introduced other impurity again; Can not make silicon chip cause dirty being difficult to of surface to remove, improve the efficient and the effect of cleaning owing to can not get for a long time cleaning.
Embodiment
In order to make those skilled in the art person understand the present invention program better, and make above-mentioned purpose of the present invention, feature and advantage can be more obviously understandable, below in conjunction with embodiment the present invention done further detailed explanation.
Embodiment:
At first silicon chip should take out silicon chip after section immediately from slicing machine and particle loaded fluid, can not be exposed to for a long time in the air after the taking-up, promptly from the back timing of cutting into slices; In 30 minutes, put into the ethanolic solution for preparing, during preparation, using the content of ethanol is 97%; Add pure water water and be mixed with ethanolic solution; Its volumetric concentration (or weight concentration) is more than or equal to more than 10%, and the assurance solution temperature is put into solution with silicon chip and preserved at 20 to 70 degrees centigrade.
The above; Be merely embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technical staff who is familiar with the present technique field is in the technical scope that the present invention discloses; The variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.
Claims (5)
1. the store method of silicon chip to be cleaned is characterized in that: leave slicing machine and particle loaded fluid immediately after the silicon chip section, and put into ready prepd ethanolic solution immediately; The volumetric concentration of said ethanolic solution or weight concentration are >=10%.
2. the store method of silicon chip to be cleaned according to claim 1 is characterized in that: leave slicing machine and particle loaded fluid after the said silicon chip section, and put into the time of ethanolic solution, be controlled in 30 minutes.
3. the store method of silicon chip to be cleaned according to claim 1 and 2, it is characterized in that: the temperature of said ethanolic solution is 20-70 degree centigrade.
4. the store method of silicon chip to be cleaned according to claim 1 and 2, it is characterized in that: the temperature of said ethanolic solution is 30-60 degree centigrade.
5. the store method of silicon chip to be cleaned according to claim 1 and 2, it is characterized in that: the temperature of said ethanolic solution is a room temperature state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210298435XA CN102810602A (en) | 2012-08-21 | 2012-08-21 | Method for storing silicon wafer to be cleaned |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210298435XA CN102810602A (en) | 2012-08-21 | 2012-08-21 | Method for storing silicon wafer to be cleaned |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102810602A true CN102810602A (en) | 2012-12-05 |
Family
ID=47234259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210298435XA Pending CN102810602A (en) | 2012-08-21 | 2012-08-21 | Method for storing silicon wafer to be cleaned |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102810602A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4079522A (en) * | 1976-09-23 | 1978-03-21 | Rca Corporation | Apparatus and method for cleaning and drying semiconductors |
| CN101693240A (en) * | 2009-10-26 | 2010-04-14 | 张家港市超声电气有限公司 | Process for degumming and pre-cleaning silicon slices |
| CN101735891A (en) * | 2009-12-24 | 2010-06-16 | 浙江向日葵光能科技股份有限公司 | Solar cell silicon slice detergent and method for using same |
| CN101817006A (en) * | 2010-03-22 | 2010-09-01 | 浙江矽盛电子有限公司 | Method for cleaning surface of solar silicon wafer |
| CN102010796A (en) * | 2010-12-25 | 2011-04-13 | 江西旭阳雷迪高科技股份有限公司 | Cleaning liquid for solar polycrystalline silicon wafer |
-
2012
- 2012-08-21 CN CN201210298435XA patent/CN102810602A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4079522A (en) * | 1976-09-23 | 1978-03-21 | Rca Corporation | Apparatus and method for cleaning and drying semiconductors |
| CN101693240A (en) * | 2009-10-26 | 2010-04-14 | 张家港市超声电气有限公司 | Process for degumming and pre-cleaning silicon slices |
| CN101735891A (en) * | 2009-12-24 | 2010-06-16 | 浙江向日葵光能科技股份有限公司 | Solar cell silicon slice detergent and method for using same |
| CN101817006A (en) * | 2010-03-22 | 2010-09-01 | 浙江矽盛电子有限公司 | Method for cleaning surface of solar silicon wafer |
| CN102010796A (en) * | 2010-12-25 | 2011-04-13 | 江西旭阳雷迪高科技股份有限公司 | Cleaning liquid for solar polycrystalline silicon wafer |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121205 |