CN102809128A

CN102809128A - Semiconductor lighting device

Info

Publication number: CN102809128A
Application number: CN2012102614441A
Authority: CN
Inventors: 田晓改; 王伟霞; 肖一胜; 郑子豪
Original assignee: CHONGQING NVC INDUSTRIES Co Ltd; Huizhou NVC Lighting Technology Corp
Current assignee: Huizhou NVC Lighting Technology Corp
Priority date: 2012-07-27
Filing date: 2012-07-27
Publication date: 2012-12-05
Anticipated expiration: 2032-07-27
Also published as: CN102809128B

Abstract

The invention relates to a shell. Openings are formed in two ends of the shell, and an optical module, a light source module, an electronic driving module and a heat treatment module are accommodated in the shell. The optical module is arranged on a center shaft in the shell; the top of the optical module is connected with the front end of the shell; the light source module is placed at the bottom of the optical module, and emits light towards the opening in the front end of the shell; the electronic driving module is hooped on the outer wall of the optical module; and the heat treatment module is arranged at the bottom of the light source module, and the opening in the rear end of the shell is closed by the heat treatment module. The optical module is used as an upright column of the semiconductor lighting device, and bears acting force from two ends of the shell and acting force from the heat treatment module, so that the semiconductor lighting device is firm, and the phenomenon that the semiconductor lighting device collapses due to over high pressure from the outer side and then is damaged is avoided.

Description

Semiconductor illumination device

Technical field

The present invention relates to lighting device, relate in particular to a kind of semiconductor illumination device.

Background technology

Semiconductor light sources (LED) just progressively replaces the status of conventional light source with advantages such as its environmental protection, energy-conservation, longevities as a kind of new type light source; Be widely used in the various lighting fields; But along with becoming increasingly abundant of existing LED illuminating product on the market; The user finds several problems gradually, and at first lighting is made up of light source and light fixture usually, as: the LED Down lamp.And led light source is owing to himself have the necessary characteristic in the designs such as needing heat radiation and driving power support, and manufacturing enterprise has his own strong points simultaneously, so between enterprise; Usually do not consider the possibility of intercommunication between the product of the same type, therefore will cause when the bad and light source damage of the illuminating product light fixture of a tame enterprise, can't adopt the led light source of other enterprises to substitute; Otherwise also like this, only if therefore put in order the lamp replacing, otherwise can't selectively continue to use the led light source product of this enterprise; This has not only limited consumer's selection; Simultaneously also be unfavorable for market competition, more uneconomical for the consumer, be a kind of waste.

Secondly the integrated design because common light source of this type of illuminating product and light fixture mutually combine, when led light source damaged, ordinary consumer was facing to numerous electronic components; Self is difficult to understand the reason of damage at all; More can not replace voluntarily or keep in repair, and can only ask enterprise's depot repair or abandon, this has not only increased consumer's maintenance cost; Simultaneously also increased time cost, the consumer has been brought many inconvenience.

Summary of the invention

But the object of the present invention is to provide a kind of semiconductor illumination device of modularization integral replacing.

A kind of semiconductor illumination device comprises a housing, its both ends open, and its inside accommodates an optical module, a light source module, drives an electronic module and a heat treatment module.Shaft position during said optical module is arranged in the said housing; And this optical module top links to each other with this housing front end; Said light source module places said optical module bottom and bright dipping towards this housing front opening; Said driving electronic module hoop is at this optical module outer wall, and said heat treatment module pad is in this light source module bottom, and seals said housing open rearward end.

In a preferred embodiment, be formed with between said driving electronic module and the light source module at interval.

In a preferred embodiment, said housing comprises separable upper shell that links together and lower house, and lower house comprises that a ringwise connecting plate reaches the protruding pipe that extends substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; At least a portion of said optical module is housed in the said protruding pipe, the said housing open rearward end of the terminal formation of said protruding pipe.

In a preferred embodiment, said housing comprises separable upper shell that links together and lower house, and said upper shell comprises ringwise upper surface and the sidewall that outer edge extends substantially vertically from the upper surface.

In a preferred embodiment; Said optical module comprises the optics cup; Said optics cup roughly is the truncated cone-shaped of hollow, both ends open, and said optics cup is connected with the inside edge of said upper surface is separable towards the last rim of a cup edge of said upper surface, with the middle shaft part of fixed optics cup in upper shell.

In a preferred embodiment, said optics cup cup outer wall is provided with at least two fixed legs, and said heat treatment module is fixed on the fixed leg end.

In a preferred embodiment, said driving electronic module comprises ringwise circuit substrate and is arranged on the electronic device on the circuit substrate that said circuit substrate lock ring is on optics cup outer wall; Said lower house comprises that a ringwise connecting plate reaches the protruding pipe that extends substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; The end of said protruding pipe forms said housing open rearward end.

In a preferred embodiment; Also vertically extend one near its outer edge on the said connecting plate and connect ring wall towards upper shell; The external diameter of said connecting plate is greater than the external diameter of upper shell sidewall; The external diameter of said connection ring wall is less than the internal diameter of upper shell sidewall, the said circuit substrate ring wall end that is connected.

In a preferred embodiment, bigger electronic component is arranged on the side towards the upper surface of upper shell of circuit substrate in the said electronic device, and at least a portion of less electronic device is arranged on the opposite side of circuit substrate in the electronic device.

In a preferred embodiment, the light out part branch of light source module is arranged on rim of a cup place under the optics cup, and is electrically connected with said driving electronic module, and its bottom surface is attached on the heat treatment module.

Semiconductor illumination device of the present invention is a column with the optical module, bears the active force from housing two ends and heat treatment module, makes semiconductor illumination device more firm, is difficult for because of causing lighting device to damage from excessive the subsiding of the pressure in the outside.In addition; Can be set to existing power supply and mechanical interfaces such as GX53 through the housing rear end; Make the semiconductor illumination device can compatible conventional lamp interface and suitable with it, can also compatible aim at the light fixture with external heat abstractor (external heat abstractor pastes with heat treatment module mutually) of semiconductor illumination device design simultaneously at present, not only solved semiconductor light sources interchangeability problem; Also backward compatible conventional light source light fixture; Also satisfied simultaneously the demand of adaptive existing semiconductor lamp, made things convenient for the user only through the knob as conventional bulb, can this type of optical semiconductor product-derived of singlehanded convenient changing.

Description of drawings

Fig. 1 is the explosive view of the semiconductor illumination device of an embodiment.

Fig. 2 is the part of the semiconductor illumination device of Fig. 1 figure that decides what is right and what is wrong, wherein semiconductor illumination device be connected lock ring and link together.

Fig. 3 is the part at another visual angle of the semiconductor illumination device of Fig. 1 decide what is right and what is wrong figure, wherein semiconductor illumination device connection lock ring.

Fig. 4 is the part exploded view of semiconductor illumination device among Fig. 1.

Fig. 5 is the part of the semiconductor illumination device of another embodiment figure that decides what is right and what is wrong.

Fig. 6 is the part of the semiconductor illumination device of the another embodiment figure that decides what is right and what is wrong.

The specific embodiment

To combine specific embodiment and accompanying drawing that semiconductor illumination device of the present invention is described in further detail below.

To shown in Figure 4, in the preferred embodiment, semiconductor illumination device of the present invention mainly comprises housing 1, optical module 2, drives electronic module 3, light source module 4 and heat treatment module 5 like Fig. 1.Housing 1 both ends open, profile is cylindrical, square column type or triangular prism shaped substantially, and optical module 2, driving electronic module 3, light source module 4 and at least a portion heat treatment module 5 place in the housing 1, to form an integral illumination device.

In the present embodiment, housing 1 comprises separable upper shell that links together 11 and lower house 12.Upper shell 11 is cylindrical, and it comprises ringwise upper surface 111 and the sidewall 112 that 111 outer edge extend substantially vertically from the upper surface, and the center, upper surface is formed with light-emitting window 13, and light-emitting window 13 inward flanges are provided with ring draw-in groove 131.The end of sidewall 112 (end that does not link to each other with the upper surface) is provided with the connector 14 greater than light-emitting window 13 diameters, wherein caves inward on connector 14 inwalls to be formed with annular catching groove 141 (see figure 3)s.

Lower house 12 comprises that a ringwise connecting plate 15 reaches the protruding pipe 16 that extends substantially vertically from the inward flange of connecting plate 15, and bearing of trend is away from upper shell 11.Also vertically extend one near the outer edge of connecting plate 15 and connect ring wall 151 towards upper shell 11.Wherein the external diameter of connecting plate 15 is greater than connector 14 internal diameters of upper shell 11; Connect the internal diameter of the external diameter of ring wall 151 less than connector 14; And a plurality of buckles 152 that are complementary with catching groove 141 that connect that ring wall 151 outer walls are provided with equi-spaced apart, when connecting the connector 14 of ring wall 151 insertion upper shells, connecting plate 15 will prop up connector 14 lower edges of upper shell 11 by this; Each buckle 152 will buckle in the catching groove 141 simultaneously, be fastened and connected thereby upper shell 11 is formed with lower house 12.In addition, also be provided with two symmetrically near its outer edge on the connecting plate 15 and connect electric hole 121.

Optical module 2 comprises optical element 22 and optics cup 21.Optical element 22 is connected in the formation of light-emitting window 13 places and seals, to handle the light that penetrates from light-emitting window 13.According to different bright dipping demands, optical element 22 is the element of the one or more mutual combination in diffuser plate, fluorescent plate (remote phosphor), the optical lens.

Optics cup 21 roughly is truncated cone-shaped, and is hollow, both ends open, and its wall has radian, and interior cup face is for example processed diffuse surface or fully reflecting surface as required and had specific arc to realize the predetermined optical reflecting effect through optical treatment.Optics cup 21 is provided with rim of a cup 211 on towards first side of light-emitting window 13, and go up rim of a cup 211 rim of a cup edges form a retainer ring 213 be used for the draw-in groove 131 of upper shell 11 adaptive, with fixed optics cup 21 in upper shell 11 middle shaft parts.Optics cup 21 is provided with the lower cup mouth 212 of diameter less than last rim of a cup 211 towards second side of connecting plate 15, the optical reflection of in this optics cup 21, presetting with the light that sends of guiding light source module 4, and finally penetrate towards said rim of a cup 211 places of going up.Wherein, two (can be more than two among other embodiment) fixed legs 214 are arranged on the optics cup 21 cup outer walls symmetrically, prepare for being connected with heat treatment module 5.What deserves to be mentioned is that optics cup 21 is designed to support the column of whole semiconductor illumination device; It is set at the middle shaft position in upper shell 11 and the lower house 12, and bears from upper shell 11, lower house 12 and heat treatment module 5 its active force that applies.

In the present embodiment, adopt the driving electronic module 3 of non-isolated structure, adopted isolated structure relatively, further reduced manufacturing cost, dwindled volume, and improved the power supply I/O efficiency.Driving electronic module 3 mainly comprises circuit substrate 32 and is arranged on the electronic device 31 on the circuit substrate.Circuit substrate 32 ringwise, its center is provided with an opening 33, can make circuit substrate 32 hoop outside optics cup 21 through opening 33.The external diameter of circuit substrate 32 is greater than connection ring wall 151 inner diameters of lower house 12, thus when upper shell 11 is connected with lower house 12, circuit substrate 32 go back frame (against) connect on the ring wall 151, make the position that drives electronic module 3 more firm, be difficult for moving.

What deserves to be mentioned is that wherein the opening 33 of circuit substrate 32 has a pre-set dimension for circuit substrate 32 can be fixed in housing 1, promptly these opening 33 diameters are less than rim of a cup 211 external diameters on the optics cup 21, greater than lower cup mouth 212 external diameters.And when upper shell 11 is connected with lower house 12 buckles when finishing, the connection ring wall 151 of lower house 12 will just in time hold up on circuit substrate 32 to the optics cup 21 an immovable extreme position between the rim of a cup 211 and lower cup mouth 212, form fixing with this.

Please be simultaneously with reference to figure 3; The bigger electronic component 34 of electronic device 31 is arranged on circuit substrate 32 upsides; Promptly towards a side of the upper surface of upper shell 11; And be contained in the upper shell 11, and at least a portion of the less electronic device 35 of electronic device 31 is set at circuit substrate 32 downsides, and is contained in the connection ring wall 151 of circuit substrate 32, lower house 12 and the space that connecting plate 15 surrounds.

In addition; In the present embodiment; Drive electronic module 3 and also comprise two joints 36, its corresponding two of inserting lower house 12 connect electric hole 121 and are fixed on wherein, and the lower structure with lower house 12 forms the syndeton that meets the GX53 interface standard by this; Joint 36 also is electrically connected with circuit substrate 32 simultaneously, for it imports operating voltage.

The bright dipping of light source module 4 partly is set at rim of a cup 212 places under the optics cup 21, and is electrically connected with driving electronic module 3, and its bottom surface is attached on the heat treatment module 5.In the present embodiment, light source module 4 comprises substrate 42 and the LED 41 on it of arranging.Substrate 42 is according to different ceramic substrate, the aluminium bases etc. selected for use with the heat radiation needs of material.Also can adopt single LEDs of COB encapsulation according to power and lighting demand difference.What deserves to be mentioned is that wherein LED 41 arranging on substrate 42 has certain position relation; Be between each LED 41 and LED 41 and substrate 42 edges between spacing distance be at least 4CM; Wherein place each LED 41 bright dippings on the substrate 42 corresponding rim of a cup under the optics cup 21, by this through 21 guiding of optics cup and handle light source module 4 bright dippings to optical element 22 places.

Heat treatment module 5 mainly comprises rounded conducting strip 51.Conducting strip 51 can be by aluminium, iron, and high-thermal conductive metal materials such as copper and alloy thereof are processed, and are provided with two connecting holes 54 with fixed leg 214 corresponding positions on its lamellar body.Conducting strip 51 peripheral recesses form a step-like rib 53, and rib 53 is corresponding with protruding pipe 16, and rib 53 external diameters are greater than the internal diameter of protruding pipe 16, thereby the part that rib 53 centers on is sealed protruding pipe 16 end openings.Among other embodiment; Can be according to space size requirement adjustment conducting strip 51 thickness in the height of optics cup 21 and the housing, as forming heating column 51 ' (Fig. 5, shown in Figure 6), to raise light source module 4; Make the height and the optics requirement of its adaptive optics cup 21; Increase heat transfer efficiency simultaneously, heating column 51 ' outside dimension and protruding pipe 16 internal diameters were adaptive in wherein should implementing, according to the height requirement of this optics cup 21; This heating column 51 ' can be filled full (Fig. 5) or partially filled (Fig. 6) this protruding pipe 16, and forms sealing at these protruding pipe 16 open lower side places.Among other embodiment, thereby also can make the middle part of heat treatment module be fixed on protruding pipe 16 ends to the formation sealing of protruding pipe 16 open lower side places.

The substrate 42 of light source module 4 places conducting strip 51 tops to carry out the heat conduction by this; For playing insulation effect; Between conducting strip 51 and substrate 42, be provided with an insulating trip 52, wherein insulating trip 52 should have heat conduction and insulation function, and for example sheet type makrolon material or hot slit cushion material are processed.

Embed protruding pipe 16 open lower side when conducting strip 51 lamellar body tops by this; And through behind rib 53 location; Each fixed leg 214 of optics cup 21 will be corresponding with each connecting hole 54 of conducting strip 51; And connect through bolt, finally seal protruding pipe 16 open lower side of lower house 12, and each functional module closely is fixed on make whole semiconductor illumination device moulding in this housing 1.

Wherein what deserves to be mentioned is; The internal structure of semiconductor illumination device of the present invention is to adopt thermoelectric isolating construction; That is: be separated out a segment distance in the

light source module

4 and 5 of the heat treatment module thereof that drive electrical appliance module 3 and thermal source, be somebody's turn to do the structure that drives electrical appliance module 3 and light source module 4 separations, prevent that the work calories of light source module 4 from driving the inner intensification of semiconductor illumination device to form; Influence drives the component aging of electrical appliance module 3; Greatly improve the life-span that drives electrical appliance module 3, also make simultaneously to drive electrical appliance module 3, improved electrical safety away from conductive devices.

Optics cup 21 is owing to be designed to bear the column of mechanical function in addition; Therefore after this semiconductor illumination device assembling is accomplished; Optics cup 21 is through with after the conducting strip bolt is connected; With sustaining from the shelves limit 53 of this conducting strip 51 and the reaction force of the protruding pipe 16 downside tube edges formation of lower house 12; Also will bear simultaneously the pulling force of the draw-in groove 131 of upper shell 11, and from the tightening force of the opening 33 of circuit substrate 32, forming mechanics fastening force after a kind of combination by this, to be convenient to this semiconductor illumination device whole closely fixing.

In addition owing to provide a kind of semiconductor illumination device that adopts conductive structure in the present embodiment; Therefore can correspondence externally in the light fixture radiator be set; When this semiconductor illumination device light fixture of packing into; And the insertion adaptable interface, for example behind the connection lock ring 7 of GX53 interface, conducting strip 51 will attach with the radiator thermal conductive surface.More closely be convenient to heat conduction and heat radiation in order to make this attaching; Usually the GX53 interface with understand a bit of axial displacement of generation after the knob that is connected lock ring 7 cooperates; The thermal conductive surface of the radiator that is provided with on conducting strip 51 and the light fixture is close to; And produce one active force and towards the optics cup 21 that is connected with conducting strip 51, by this through this strand active force, offset or partial offset the power on the internal optics cup 21 after the above-mentioned semiconductor illumination device assembling.What deserves to be mentioned is this design be for; After this semiconductor illumination device is installed in adaptive light fixture and work, can produce certain work calories, and this strand heat can bring material to expand; Therefore behind the material heat expansion for the semiconductor illumination device under preventing in working order; Undue squeeze each other to draw to produce burst apart or damage, the present invention is through behind the design test repeatedly, thisly can descend balance inside mechanical relationship in working order thereby drawn; And leave the design in thermal expansion space of part, simultaneously under off working state and single article state down the maintenance inner tight fixedly prevent to rock loose and damage of product situation that cause by inner body.

Though the description of this invention combines above specific embodiment to carry out,, those skilled in the art that can carry out many replacements, modification and variation according to above-mentioned content, be conspicuous.Therefore, all are such substitute, improve and change all is included in the spirit and scope of attached claim.

Claims

1. a semiconductor illumination device comprises a housing, its both ends open, and its inside accommodates at least a portion of an optical module, a light source module, a driving electronic module and a heat treatment module, it is characterized in that:

Shaft position during said optical module is arranged in the said housing; And this optical module top links to each other with this housing front end; Said light source module places said optical module bottom and bright dipping towards this housing front opening; Said driving electronic module hoop is at this optical module outer wall, and said heat treatment module pad is in this light source module bottom, and seals said housing open rearward end.

2. semiconductor illumination device according to claim 1 is characterized in that, is formed with between said driving electronic module and the light source module at interval.

3. semiconductor illumination device according to claim 1; It is characterized in that; Said housing comprises separable upper shell that links together and lower house; Lower house comprises that a ringwise connecting plate reaches the protruding pipe that extends substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; At least a portion of said optical module is housed in the said protruding pipe, the said housing open rearward end of the terminal formation of said protruding pipe.

4. semiconductor illumination device according to claim 1; It is characterized in that; Said housing comprises separable upper shell that links together and lower house, and said upper shell comprises ringwise upper surface and the sidewall that outer edge extends substantially vertically from the upper surface.

5. semiconductor illumination device according to claim 4; It is characterized in that; Said optical module comprises the optics cup; Said optics cup roughly is the truncated cone-shaped of hollow, both ends open, and said optics cup is connected with the inside edge of said upper surface is separable towards the last rim of a cup edge of said upper surface, with the middle shaft part of fixed optics cup in upper shell.

6. semiconductor illumination device according to claim 5 is characterized in that, said optics cup cup outer wall is provided with at least two fixed legs, and said heat treatment module is fixed on the fixed leg end.

7. semiconductor illumination device according to claim 5 is characterized in that, said driving electronic module comprises ringwise circuit substrate and be arranged on the electronic device on the circuit substrate that said circuit substrate lock ring is on optics cup outer wall; Said lower house comprises that a ringwise connecting plate reaches the protruding pipe that extends substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; The end of said protruding pipe forms said housing open rearward end.

8. semiconductor illumination device according to claim 7; It is characterized in that; Also vertically extend one near its outer edge on the said connecting plate and connect ring wall towards upper shell; The external diameter of said connecting plate is greater than the external diameter of upper shell sidewall, and the external diameter of said connection ring wall is less than the internal diameter of upper shell sidewall, the said circuit substrate ring wall end that is connected.

9. semiconductor illumination device according to claim 8; It is characterized in that; Bigger electronic component is arranged on the side towards the upper surface of upper shell of circuit substrate in the said electronic device, and at least a portion of less electronic device is arranged on the opposite side of circuit substrate in the electronic device.

10. semiconductor illumination device according to claim 5 is characterized in that, the light out part branch of light source module is arranged on rim of a cup place under the optics cup, and is electrically connected with said driving electronic module, and its bottom surface is attached on the heat treatment module.