CN202769566U

CN202769566U - Semiconductor lighting device

Info

Publication number: CN202769566U
Application number: CN2012203655196U
Authority: CN
Inventors: 田晓改; 王伟霞; 肖一胜; 郑子豪
Original assignee: CHONGQING NVC INDUSTRIES Co Ltd; Huizhou NVC Lighting Technology Corp
Current assignee: CHONGQING NVC INDUSTRIES Co Ltd; Huizhou NVC Lighting Technology Corp; NVC Lighting Technology Corp
Priority date: 2012-07-27
Filing date: 2012-07-27
Publication date: 2013-03-06
Anticipated expiration: 2022-07-27

Abstract

The utility model relates to a shell, two ends of the shell are provided with openings, and an optical module, a light source module, a driving electronic module and a heat treatment module are contained in the shell. The optical module is arranged on a central shaft in the shell, and the top of the optical module is connected with the front end of the shell. The light source module is arranged at the bottom of the optical module and emits light towards a front end opening of the shell. The driving electronic module is bound on the outer wall of the optical module, and the heat treatment module is placed at the bottom of the light source module and seals a rear end opening of the shell. The semiconductor lighting device takes the optical module as a stand column to bear acting force from the two ends of the shell and the heat treatment module, so that the semiconductor lighting device is firm and not prone to being damaged due to collapse caused by overlarge pressure from the outer side of the semiconductor lighting device.

Description

Semiconductor illumination device

Technical field

The utility model relates to lighting device, relates in particular to a kind of semiconductor illumination device.

Background technology

Semiconductor light sources (LED) just progressively replaces the status of conventional light source with its environmental protection, the advantage such as energy-conservation, long-lived as a kind of new type light source, be widely used in the various lighting fields, but along with becoming increasingly abundant of existing LED illuminating product on the market, the user finds several problems gradually, at first lighting is comprised of light source and light fixture usually, as: the LED Down lamp.And led light source is owing to himself having the necessary characteristic that needs heat radiation and driving power support etc. to design, manufacturing enterprise has his own strong points simultaneously, therefore between enterprise, usually do not consider the possibility of intercommunication between the product of the same type, therefore will cause when the bad and light source damage of the illuminating product light fixture of an enterprise, can't adopt the led light source of other enterprises to substitute, otherwise also like this, unless therefore whole lamp is changed, otherwise can't selectively continue to use the led light source product of this enterprise, this has not only limited consumer's selection, also is unfavorable for market competition simultaneously, more uneconomical for consumers, be a kind of waste.

Secondly the integrated design because the common light source of this type of illuminating product and light fixture mutually combine, when led light source damages, ordinary consumer is facing to numerous electronic components, self is difficult to understand the reason of damage at all, more impossible the replacement voluntarily or maintenance, and can only ask enterprise's depot repair or abandon, this has not only increased consumer's maintenance cost, simultaneously also increased time cost, the consumer has been brought many inconvenience.

Summary of the invention

But the purpose of this utility model is to provide a kind of semiconductor illumination device of modularization integral replacing.

A kind of semiconductor illumination device comprises a housing, its both ends open, and its inside accommodates an optical module, a light source module, drives electronic module and a heat treatment module.Shaft position during described optical module is arranged in the described housing, and this optical module top links to each other with this housing front end, described light source module places described optical module bottom and bright dipping towards this housing front opening, described driving electronic module hoop is at this optical module outer wall, described heat treatment module is padded on this light source module bottom, and seals described housing open rearward end.

In a preferred embodiment, be formed with the interval between described driving electronic module and the light source module.

In a preferred embodiment, described housing comprises the separable upper shell that links together and lower house, and lower house comprises that a ringwise connecting plate reaches the protruding pipe that extends substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; At least a portion of described optical module is housed in the described protruding pipe, the described housing open rearward end of the terminal formation of described protruding pipe.

In a preferred embodiment, described housing comprises the separable upper shell that links together and lower house, and described upper shell comprises ringwise upper surface and the sidewall that extends substantially vertically from the upper surface outer edge.

In a preferred embodiment, described optical module comprises the optics cup, described optics cup roughly is the truncated cone-shaped of hollow, both ends open, and described optics cup is connected with the inside edge of described upper surface is separable towards the upper rim of a cup edge of described upper surface, with the middle shaft part of fixed optics cup in upper shell.

In a preferred embodiment, be provided with at least two fixed legs on the described optics cup cup outer wall, described heat treatment module is fixed on the fixed leg end.

In a preferred embodiment, described driving electronic module comprises ringwise circuit substrate and the electronic device that is arranged on the circuit substrate, and described circuit substrate lock ring is on optics cup outer wall; Described lower house comprises that a ringwise connecting plate reaches the protruding pipe that extends substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; The end of described protruding pipe forms described housing open rearward end.

In a preferred embodiment, also vertically extend one towards upper shell near its outer edge on the described connecting plate and connect ring wall, the external diameter of described connecting plate is greater than the external diameter of upper shell sidewall, the external diameter of described connection ring wall is less than the internal diameter of upper shell sidewall, the described circuit substrate ring wall end that is connected.

In a preferred embodiment, larger electronic component is arranged on the side towards the upper surface of upper shell of circuit substrate in the described electronic device, and at least a portion of less electronic device is arranged on the opposite side of circuit substrate in the electronic device.

In a preferred embodiment, the light out part of light source module divides and is arranged on rim of a cup place under the optics cup, and is electrically connected with described driving electronic module, and its bottom surface is attached on the heat treatment module.

Semiconductor illumination device of the present utility model bears the active force from housing two ends and heat treatment module take optical module as column, makes semiconductor illumination device more firm, is difficult for because causing lighting device to damage from excessive the subsiding of the pressure in the outside.In addition, can be set to existing power supply and the mechanical interfaces such as GX53 by the housing rear end, make the semiconductor illumination device can compatible conventional lamp interface and suitable with it, can also compatible aim at present simultaneously the light fixture with external cooling device (external cooling device and heat treatment module are affixed) of semiconductor illumination device design, not only solved semiconductor light sources interchangeability problem, also backward compatible conventional light source light fixture, also satisfied simultaneously the demand of adaptive existing semiconductor lamp, made things convenient for the user only by the knob as conventional bulb, can this type of semiconductor light product-derived of singlehanded convenient changing.

Description of drawings

Fig. 1 is the explosive view of the semiconductor illumination device of an embodiment.

Fig. 2 is the part of the semiconductor illumination device of Fig. 1 figure that decides what is right and what is wrong, wherein semiconductor illumination device be connected lock ring and link together.

Fig. 3 is decide what is right and what is wrong figure, wherein semiconductor illumination device connection lock ring of the part at another visual angle of the semiconductor illumination device of Fig. 1.

Fig. 4 is the decomposed figure of semiconductor illumination device among Fig. 1.

Fig. 5 is the part of the semiconductor illumination device of another embodiment figure that decides what is right and what is wrong.

Fig. 6 is the part of the semiconductor illumination device of the another embodiment figure that decides what is right and what is wrong.

The specific embodiment

Below in conjunction with specific embodiment and accompanying drawing the utility model semiconductor illumination device is described in further detail.

As shown in Figures 1 to 4, in the preferred embodiment, semiconductor illumination device of the present utility model mainly comprises housing 1, optical module 2, drives electronic module 3, light source module 4 and heat treatment module 5.Housing 1 both ends open, profile is cylindrical, square column type or triangular prism shaped substantially, and optical module 2, driving electronic module 3, light source module 4 and at least a portion heat treatment module 5 place in the housing 1, to form an integral illumination device.

In the present embodiment, housing 1 comprises the separable upper shell that links together 11 and lower house 12.Upper shell 11 is cylindrical, and it comprises ringwise upper surface 111 and the sidewall 112 that 111 outer edge extend substantially vertically from the upper surface, and the center, upper surface is formed with light-emitting window 13, and light-emitting window 13 inward flanges are provided with ring draw-in groove 131.The end of sidewall 112 (end that does not link to each other with the upper surface) is provided with the connector 14 greater than light-emitting window 13 diameters, wherein caves inward on connector 14 inwalls to be formed with annular catching groove 141(and to see Fig. 3).

Lower house 12 comprises that a ringwise connecting plate 15 reaches the protruding pipe 16 that extends substantially vertically from the inward flange of connecting plate 15, and bearing of trend is away from upper shell 11.Also vertically extend one towards upper shell 11 near the outer edge of connecting plate 15 and connect ring wall 151.Wherein the external diameter of connecting plate 15 is greater than connector 14 internal diameters of upper shell 11, connect the external diameter of ring wall 151 less than the internal diameter of connector 14, and a plurality of buckles 152 that are complementary with catching groove 141 that connect that ring wall 151 outer walls are provided with equi-spaced apart, by this when connecting the connector 14 of ring wall 151 insertion upper shells, connecting plate 15 will prop up 14 times edges of connector of upper shell 11, each buckle 152 will buckle in the catching groove 141 simultaneously, be fastened and connected thereby upper shell 11 is formed with lower house 12.In addition, also be provided with symmetrically two near its outer edge on the connecting plate 15 and connect electric hole 121.

Optical module 2 comprises optical element 22 and optics cup 21.Optical element 22 is connected in light-emitting window 13 places and forms sealing, to process the light that penetrates from light-emitting window 13.According to different bright dipping demands, optical element 22 is the element of the one or more mutual combination in diffuser plate, fluorescent plate (remote phosphor), the optical lens.

Optics cup 21 roughly is truncated cone-shaped, and is hollow, both ends open, and its wall has radian, and interior cup face is for example made as required diffuse surface or fully reflecting surface and had specific arc to realize the predetermined optical reflecting effect through optical treatment.Optics cup 21 is provided with rim of a cup 211 on towards the first side of light-emitting window 13, and upper rim of a cup 211 rim of a cup edges form a retainer ring 213 be used for adaptive with the draw-in groove 131 of upper shell 11, with fixed optics cup 21 in upper shell 11 middle shaft parts.Optics cup 21 is provided with diameter less than the lower cup mouth 212 of upper rim of a cup 211 towards the second side of connecting plate 15, the optical reflection of in this optics cup 21, presetting with the light that sends of guiding light source module 4, and finally penetrate towards described upper rim of a cup 211 places.Wherein, two (can be more than two among other embodiment) fixed legs 214 are arranged on the optics cup 21 cup outer walls symmetrically, prepare for being connected with heat treatment module 5.It is worth mentioning that optics cup 21 is designed to support the column of whole semiconductor illumination device, it is arranged on the middle shaft position in upper shell 11 and the lower house 12, and bears from upper shell 11, lower house 12 and heat treatment module 5 its active force that applies.

In the present embodiment, adopt the driving electronic module 3 of non-isolated structure, relatively adopted isolated structure, further reduced manufacturing cost, dwindled volume, and improved the power supply I/O efficiency.Drive electronic module 3 and mainly comprise circuit substrate 32 and the electronic device 31 that is arranged on the circuit substrate.Circuit substrate 32 ringwise, its center is provided with an opening 33, can make circuit substrate 32 hoop outside optics cup 21 by opening 33.The external diameter of circuit substrate 32 is greater than connection ring wall 151 inner diameters of lower house 12, thus when upper shell 11 is connected with lower house 12, circuit substrate 32 go back frame (against) connect on the ring wall 151, make the position that drives electronic module 3 more firm, be difficult for mobile.

It is worth mentioning that wherein the opening 33 of circuit substrate 32 has a pre-set dimension in order to make the circuit substrate 32 can be interior fixing at housing 1, namely these opening 33 diameters are less than rim of a cup 211 external diameters on the optics cup 21, greater than lower cup mouth 212 external diameters.And when upper shell 11 is connected with lower house 12 buckles when complete, the connection ring wall 151 of lower house 12 will just in time hold up circuit substrate 32 immovable extreme position between rim of a cup 211 and the lower cup mouth 212 to the optics cup 21, form fixing with this.

Please also refer to Fig. 3, the larger electronic component 34 of electronic device 31 is arranged on circuit substrate 32 upsides, namely towards a side of the upper surface of upper shell 11, and be contained in the upper shell 11, and at least a portion of the less electronic device 35 of electronic device 31 is arranged on circuit substrate 32 downsides, and is contained in the connection ring wall 151 of circuit substrate 32, lower house 12 and the space that connecting plate 15 surrounds.

In addition, in the present embodiment, drive electronic module 3 and also comprise two joints 36, its corresponding two of inserting lower house 12 connect electric hole 121 and are fixed on wherein, lower structure with lower house 12 forms the syndeton that meets the GX53 interface standard by this, joint 36 also is electrically connected with circuit substrate 32 simultaneously, for it imports operating voltage.

The bright dipping of light source module 4 partly is arranged on rim of a cup 212 places under the optics cup 21, and is electrically connected with driving electronic module 3, and its bottom surface is attached on the heat treatment module 5.In the present embodiment, light source module 4 comprises substrate 42 and the LED 41 on it of arranging.Substrate 42 is according to material and different ceramic substrate, the aluminium bases etc. selected of heat radiation needs.Also can adopt single LEDs of COB encapsulation according to power and lighting demand difference.It is worth mentioning that wherein LED 41 arranging on substrate 42 has certain position relationship, be between each LED 41 and LED 41 and substrate 42 edges between spacing distance be at least 4CM, wherein place each LED 41 bright dipping correspondences on the substrate 42 rim of a cup under the optics cup 21, pass through by this 21 guiding of optics cup and process light source module 4 bright dippings to optical element 22 places.

Heat treatment module 5 mainly comprises rounded conducting strip 51.Conducting strip 51 can be by aluminium, iron, and the contour thermal conductive metallic material of copper and alloy thereof is made, and position corresponding with fixed leg 214 on its lamellar body is provided with two connecting holes 54.Conducting strip 51 peripheral recesses form a step-like rib 53, and rib 53 is corresponding with protruding pipe 16, and rib 53 external diameters are greater than the internal diameter of protruding pipe 16, thereby the part that rib 53 centers on is sealed protruding pipe 16 distal opening.Among other embodiment, can adjust conducting strip 51 thickness according to space size demand in the height of optics cup 21 and the housing, as form heating column 51 ' (Fig. 5, shown in Figure 6), to raise light source module 4, make height and the optics requirement of its adaptive optics cup 21, increase simultaneously heat transfer efficiency, heating column 51 ' outside dimension and protruding pipe 16 internal diameters were adaptive in wherein should implementing, height requirement according to this optics cup 21, this heating column 51 ' can be filled full (Fig. 5) or partially filled (Fig. 6) this protruding pipe 16, and forms sealing at these protruding pipe 16 open lower side places.Among other embodiment, thereby also can make the middle part of heat treatment module be fixed on protruding pipe 16 ends to the formation sealing of protruding pipe 16 open lower side places.

The substrate 42 of light source module 4 places conducting strip 51 tops to carry out by this heat conduction, for playing insulation effect, be provided with an insulating trip 52 between conducting strip 51 and substrate 42, wherein insulating trip 52 should have heat conduction and insulation function, and for example sheet type makrolon material or hot slit cushion material are made.

Embed protruding pipe 16 open lower side when conducting strip 51 lamellar body tops by this, and by behind rib 53 location, each fixed leg 214 of optics cup 21 will be corresponding with each connecting hole 54 of conducting strip 51, and be bolted, protruding pipe 16 open lower side of final sealing lower house 12, and each functional module closely is fixed on make whole semiconductor illumination device moulding in this housing 1.

Wherein it is worth mentioning that, the internal structure of semiconductor illumination device of the present utility model is to adopt thermoelectric isolating construction, that is: be separated out a segment distance in the

light source module

4 and 5 of the heat treatment module thereof that drive electrical appliance module 3 and thermal source, to form the structure of this driving electrical appliance module 3 and light source module 4 separations, the work calories that prevents light source module 4 drives the inner intensification of semiconductor illumination device, impact drives the component aging of electrical appliance module 3, greatly improve the life-span that drives electrical appliance module 3, also make simultaneously to drive electrical appliance module 3 away from conductive devices, improved electrical safety.

Optics cup 21 is owing to being designed to bear the column of mechanical function in addition, therefore after this semiconductor illumination device assembling is finished, optics cup 21 is by with after the conducting strip bolt is connected, to sustain from the shelves limit 53 of this conducting strip 51 and the reaction force of the protruding pipe 16 downside tube edges formation of lower house 12, also will bear simultaneously the pulling force of the draw-in groove 131 of upper shell 11, and from the tightening force of the opening 33 of circuit substrate 32, forming by this mechanics fastening force after a kind of combination, to be convenient to this semiconductor illumination device whole closely fixing.

In addition owing to providing a kind of semiconductor illumination device that adopts conductive structure in the present embodiment, therefore can correspondence externally in the light fixture radiator be set, when this semiconductor illumination device light fixture of packing into, and insertion adaptable interface, for example behind the connection lock ring 7 of GX53 interface, conducting strip 51 will attach with the radiator thermal conductive surface.More closely be convenient to heat conduction and heat radiation in order to make this attaching, usually the GX53 interface with understand a bit of axial displacement of generation after the knob that is connected lock ring 7 cooperates, the thermal conductive surface of the radiator that arranges on conducting strip 51 and the light fixture is close to, and produce one active force and towards the optics cup 21 that is connected with conducting strip 51, by this by this strand active force, offset or partial offset the power on the internal optics cup 21 after the above-mentioned semiconductor illumination device assembling.It is worth mentioning that this design be for, after this semiconductor illumination device is installed in adaptive light fixture and work, can produce certain work calories, and this strand heat can bring material to expand, therefore behind the material heat expansion for the semiconductor illumination device under preventing in working order, undue mutually squeeze to draw to produce burst apart or damage, the utility model is through behind the design test repeatedly, thereby drawn and thisly can descend in working order the inner mechanical relationship of balance, and leave the design in thermal expansion space of part, keep inner tight fixedly to prevent from rocking loose and damage of product situation that cause by inner body under off working state and under single product state simultaneously.

Although description of the present utility model is carried out in conjunction with above specific embodiment,, those skilled in the art that can carry out many replacements, modifications and variations, be apparent according to above-mentioned content.Therefore, all are such substitute, improve and change all is included in the spirit and scope of attached claim.

Claims

1. a semiconductor illumination device comprises a housing, its both ends open, and its inside accommodates at least a portion of an optical module, a light source module, a driving electronic module and a heat treatment module, it is characterized in that:

Shaft position during described optical module is arranged in the described housing, and this optical module top links to each other with this housing front end, described light source module places described optical module bottom and bright dipping towards this housing front opening, described driving electronic module hoop is at this optical module outer wall, described heat treatment module is padded on this light source module bottom, and seals described housing open rearward end.

2. semiconductor illumination device according to claim 1 is characterized in that, is formed with the interval between described driving electronic module and the light source module.

3. semiconductor illumination device according to claim 1, it is characterized in that, described housing comprises the separable upper shell that links together and lower house, lower house comprises that a ringwise connecting plate reaches the protruding pipe that extends substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; At least a portion of described optical module is housed in the described protruding pipe, the described housing open rearward end of the terminal formation of described protruding pipe.

4. semiconductor illumination device according to claim 1, it is characterized in that, described housing comprises the separable upper shell that links together and lower house, and described upper shell comprises ringwise upper surface and the sidewall that extends substantially vertically from the upper surface outer edge.

5. semiconductor illumination device according to claim 4, it is characterized in that, described optical module comprises the optics cup, described optics cup roughly is the truncated cone-shaped of hollow, both ends open, described optics cup is connected with the inside edge of described upper surface is separable towards the upper rim of a cup edge of described upper surface, with the middle shaft part of fixed optics cup in upper shell.

6. semiconductor illumination device according to claim 5 is characterized in that, is provided with at least two fixed legs on the described optics cup cup outer wall, and described heat treatment module is fixed on the fixed leg end.

7. semiconductor illumination device according to claim 5 is characterized in that, described driving electronic module comprises ringwise circuit substrate and the electronic device that is arranged on the circuit substrate, and described circuit substrate lock ring is on optics cup outer wall; Described lower house comprises that a ringwise connecting plate reaches the protruding pipe that extends substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; The end of described protruding pipe forms described housing open rearward end.

8. semiconductor illumination device according to claim 7, it is characterized in that, also vertically extend one towards upper shell near its outer edge on the described connecting plate and connect ring wall, the external diameter of described connecting plate is greater than the external diameter of upper shell sidewall, the external diameter of described connection ring wall is less than the internal diameter of upper shell sidewall, the described circuit substrate ring wall end that is connected.

9. semiconductor illumination device according to claim 8, it is characterized in that, larger electronic component is arranged on the side towards the upper surface of upper shell of circuit substrate in the described electronic device, and at least a portion of less electronic device is arranged on the opposite side of circuit substrate in the electronic device.

10. semiconductor illumination device according to claim 5 is characterized in that, the light out part of light source module divides and is arranged on rim of a cup place under the optics cup, and is electrically connected with described driving electronic module, and its bottom surface is attached on the heat treatment module.