CN102809128B - Semiconductor lighting device - Google Patents
Semiconductor lighting device Download PDFInfo
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- CN102809128B CN102809128B CN201210261444.1A CN201210261444A CN102809128B CN 102809128 B CN102809128 B CN 102809128B CN 201210261444 A CN201210261444 A CN 201210261444A CN 102809128 B CN102809128 B CN 102809128B
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- illumination device
- upper shell
- semiconductor illumination
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Abstract
The invention relates to a shell. Openings are formed in two ends of the shell, and an optical module, a light source module, an electronic driving module and a heat treatment module are accommodated in the shell. The optical module is arranged on a center shaft in the shell; the top of the optical module is connected with the front end of the shell; the light source module is placed at the bottom of the optical module, and emits light towards the opening in the front end of the shell; the electronic driving module is hooped on the outer wall of the optical module; and the heat treatment module is arranged at the bottom of the light source module, and the opening in the rear end of the shell is closed by the heat treatment module. The optical module is used as an upright column of the semiconductor lighting device, and bears acting force from two ends of the shell and acting force from the heat treatment module, so that the semiconductor lighting device is firm, and the phenomenon that the semiconductor lighting device collapses due to over high pressure from the outer side and then is damaged is avoided.
Description
Technical field
The present invention relates to lighting device, relate in particular to a kind of semiconductor illumination device.
Background technology
Semiconductor light sources (LED) just progressively replaces the status of conventional light source with its environmental protection, the advantage such as energy-conservation, long-lived as a kind of new type light source, be widely used in various lighting fields, but along with becoming increasingly abundant of existing LED illuminating product on the market, user finds several problems gradually, first lighting is comprised of light source and light fixture conventionally, as: LED Down lamp.And LED light source is due to the necessary characteristic himself having in designs such as needing heat radiation and driving power support, manufacturing enterprise has his own strong points simultaneously, therefore between enterprise, between product of the same type, conventionally do not consider the possibility of intercommunication, when therefore the illuminating product light fixture that causes Dang Yijia enterprise is not bad and light source damages, cannot adopt the LED light source of other enterprises to substitute, otherwise also like this, unless therefore whole lamp is changed, otherwise cannot selectively continue to use the LED light source product of this enterprise, this has not only limited consumer's selection, also be unfavorable for market competition simultaneously, more uneconomical for consumers, it is a kind of waste.
Secondly due to the integrated design that mutually combines of the common light source of this type of illuminating product and light fixture, when LED light source damages, ordinary consumer is facing to numerous electronic components, self be difficult to understand the reason of damaging at all, more impossible replacement voluntarily or maintenance, and can only ask enterprise's depot repair or abandon, this has not only increased consumer's maintenance cost, also increased time cost, consumer has been brought to many inconvenience simultaneously.
Summary of the invention
The object of the present invention is to provide a kind of modularization, can integral replacing semiconductor illumination device.
A semiconductor illumination device, comprises a housing, its both ends open, and its inside accommodates an optical module, a light source module, drives electronic module and a heat treatment module.Described optical module is arranged on middle shaft position in described housing, and this optical module top is connected with this housing front end, described light source module is placed in described optical module bottom and bright dipping towards this housing front opening, described driving electronic module hoop is at this optical module outer wall, described heat treatment module is padded on this light source module bottom, and seals described housing open rearward end.
In a preferred embodiment, between described driving electronic module and light source module, be formed with interval.
In a preferred embodiment, described housing comprises the separable upper shell linking together and lower house, and lower house comprises a ringwise connecting plate and the protruding pipe extending substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; At least a portion of described optical module is housed in described protruding pipe, and described protruding pipe end forms described housing open rearward end.
In a preferred embodiment, described housing comprises the separable upper shell linking together and lower house, and described upper shell comprises the sidewall that Ji Cong upper surface, ringwise upper surface outer edge extends substantially vertically.
In a preferred embodiment, described optical module comprises optics cup, described optics cup is roughly the truncated cone-shaped of hollow, both ends open, and described optics cup is towards separable connection of inside edge of upper rim of a cup edge with the described upper surface of described upper surface, with fixed optics cup in the middle shaft part of upper shell.
In a preferred embodiment, on described optics cup cup outer wall, be provided with at least two fixed legs, described heat treatment module is fixed on fixed leg end.
In a preferred embodiment, described driving electronic module comprises ringwise circuit substrate and be arranged on the electronic device on circuit substrate, and described circuit substrate lock ring is on optics cup outer wall; Described lower house comprises a ringwise connecting plate and the protruding pipe extending substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; The end of described protruding pipe forms described housing open rearward end.
In a preferred embodiment, on described connecting plate, near its outer edge, also towards upper shell, vertically extend a connection ring wall, the external diameter of described connecting plate is greater than the external diameter of upper shell sidewall, the external diameter of described connection ring wall is less than the internal diameter of upper shell sidewall, the described circuit substrate ring wall end that is connected.
In a preferred embodiment, in described electronic device, larger electronic component is arranged on a side of the upper surface towards upper shell of circuit substrate, and in electronic device, at least a portion of less electronic device is arranged on the opposite side of circuit substrate.
In a preferred embodiment, the light out part of light source module divides and is arranged on rim of a cup place under optics cup, and is electrically connected to described driving electronic module, and its bottom surface is attached in heat treatment module.
Semiconductor illumination device of the present invention be take optical module as column, bears the active force from housing two ends and heat treatment module, makes semiconductor illumination device more firm, and being difficult for subsides because the pressure from outside is excessive causes lighting device to damage.In addition, can be set to the existing power supplys such as GX53 and mechanical interface by housing rear end, make the semiconductor illumination device can compatible conventional lamp interface and suitable with it, can also compatible aim at present the light fixture with external cooling device (external cooling device and heat treatment module are affixed) of semiconductor illumination device design simultaneously, not only solved semiconductor light sources interchangeability problem, also backward compatible conventional light source light fixture, also met the demand of adaptive existing semiconductor lamp simultaneously, facilitated user only by the knob as conventional bulb, can this type of semiconductor light product-derived of singlehanded convenient changing.
Accompanying drawing explanation
Fig. 1 is the explosive view of the semiconductor illumination device of an embodiment.
Fig. 2 is the part of the semiconductor illumination device of Fig. 1 figure that decides what is right and what is wrong, wherein semiconductor illumination device be connected lock ring and link together.
Fig. 3 is decide what is right and what is wrong figure, wherein semiconductor illumination device connection lock ring of the part at another visual angle of the semiconductor illumination device of Fig. 1.
Fig. 4 is the decomposed figure of semiconductor illumination device in Fig. 1.
The part that Fig. 5 is the semiconductor illumination device of another embodiment figure that decides what is right and what is wrong.
Fig. 6 is the part of the semiconductor illumination device of the another embodiment figure that decides what is right and what is wrong.
The specific embodiment
Below in conjunction with specific embodiment and accompanying drawing, semiconductor illumination device of the present invention is described in further detail.
As shown in Figures 1 to 4, in a preferred embodiment, semiconductor illumination device of the present invention mainly comprises housing 1, optical module 2, drives electronic module 3, light source module 4 and heat treatment module 5.Housing 1 both ends open, profile is cylindrical, square column type or triangular prism shaped substantially, and optical module 2, driving electronic module 3, light source module 4 and at least a portion heat treatment module 5 are placed in housing 1, to form an integral illumination device.
In the present embodiment, housing 1 comprises the separable upper shell linking together 11 and lower house 12.Upper shell 11 is cylindrical, and it comprises the sidewall 112 that 111Ji Cong upper surface, ringwise upper surface 111 outer edge extend substantially vertically, and center, upper surface is formed with light-emitting window 13, and light-emitting window 13 inward flanges are provided with ring draw-in groove 131.The end of sidewall 112 (one end not being connected with upper surface) is provided with the connector 14 that is greater than light-emitting window 13 diameters, wherein on connector 14 inwalls, caves inward to be formed with annular catching groove 141(and to see Fig. 3).
In the present embodiment, adopt the driving electronic module 3 of non-isolated structure, relatively adopted isolated structure, further reduced manufacturing cost, dwindled volume, and improved power supply I/O efficiency.Drive electronic module 3 mainly comprise circuit substrate 32 and be arranged on the electronic device 31 on circuit substrate.Circuit substrate 32 ringwise ，Qi center is provided with an opening 33, by opening 33, can make circuit substrate 32 hoops outside optics cup 21.The external diameter of circuit substrate 32 is greater than connection ring wall 151 inner diameters of lower house 12, thus when upper shell 11 is connected with lower house 12, circuit substrate 32 go back frame (against) connect on ring wall 151, make to drive the position of electronic module 3 more firm, be difficult for mobile.
Wherein it is worth mentioning that the opening 33 of circuit substrate 32 has a pre-set dimension in order to make the circuit substrate 32 can be interior fixing at housing 1, these opening 33 diameters are less than rim of a cup 211 external diameters on optics cup 21, are greater than lower cup mouth 212 external diameters.And when upper shell 11 is connected with lower house 12 buckles when complete, the connection ring wall 151 of lower house 12 will just in time hold up circuit substrate 32 to an immovable extreme position between rim of a cup 211 on optics cup 21 and lower cup mouth 212, form fixing with this.
Please also refer to Fig. 3, the larger electronic component 34 of electronic device 31 is arranged on circuit substrate 32 upsides, towards a side of the upper surface of upper shell 11, and be contained in upper shell 11, and at least a portion of the less electronic device 35 of electronic device 31 is arranged on circuit substrate 32 downsides, and be contained in the connection ring wall 151 of circuit substrate 32, lower house 12 and space that connecting plate 15 surrounds.
In addition, in the present embodiment, drive electronic module 3 also to comprise two joints 36, its corresponding two of inserting lower house 12 connect electric hole 121 and are fixed on wherein, form with the lower structure of lower house 12 syndeton that meets GX53 interface standard by this, joint 36 is also electrically connected to circuit substrate 32 simultaneously, for it imports operating voltage.
The bright dipping of light source module 4 is partly arranged on rim of a cup 212 places under optics cup 21, and is electrically connected to driving electronic module 3, and its bottom surface is attached in heat treatment module 5.In the present embodiment, the LED 41 that light source module 4 comprises substrate 42 and arranges on it.Substrate 42, needs different ceramic substrate, the aluminium bases etc. selected according to material from heat radiation.According to power and lighting demand difference, also can adopt single LEDs of COB encapsulation.Wherein it is worth mentioning that LED 41 arranging on substrate 42 has certain position relationship, be between each LED 41 and LED 41 and substrate 42 edges between spacing distance be at least 4CM, each LED 41 bright dipping correspondences that are wherein placed on substrate 42 rim of a cup under optics cup 21, guide by this and process light source module 4 bright dippings to optical element 22 places by optics cup 21.
The substrate 42 of light source module 4 is placed in conducting strip 51 tops and carries out by this heat conduction, for playing insulation effect, between conducting strip 51 and substrate 42, be provided with an insulating trip 52, wherein insulating trip 52 should have heat conduction and insulation function, and for example sheet type makrolon material or hot gap cushion material are made.
By this when conducting strip 51 lamellar body tops embed protruding pipe 16 open lower side, and by behind rib 53 location, each fixed leg 214 of optics cup 21 will be corresponding with each connecting hole 54 of conducting strip 51, and be bolted, protruding pipe 16 open lower side of final sealing lower house 12, and each functional module is closely fixed in this housing 1, make whole semiconductor illumination device moulding.
Wherein it is worth mentioning that, the internal structure of semiconductor illumination device of the present invention is to adopt thermoelectricity isolating construction, that is: driving light source module 4 and 5 of the heat treatment module thereof of electrical appliance module 3 and thermal source to be separated out a segment distance, to form the structure of this driving electrical appliance module 3 and light source module 4 separations, the work calories that prevents light source module 4 drives the inner intensification of semiconductor illumination device, impact drives the component aging of electrical appliance module 3, greatly improve the life-span that drives electrical appliance module 3, also make to drive electrical appliance module 3 away from conductive devices, improved electrical safety simultaneously.
In addition optics cup 21 is owing to being designed to bear the column of mechanical function, therefore after this semiconductor illumination device has been assembled, optics cup 21 is by after being connected with conducting strip bolt, by the reaction force sustaining from the shelves limit 53 of this conducting strip 51 and the 16 downside tube edges formation of the protruding pipe of lower house 12, also the pulling force of the draw-in groove 131 of upper shell 11 will born simultaneously, and from the tightening force of the opening 33 of circuit substrate 32, forming by this mechanics fastening force after a kind of combination, to be convenient to this semiconductor illumination device whole closely fixing.
In addition owing to providing a kind of semiconductor illumination device that adopts conductive structure in the present embodiment, therefore can correspondence externally in light fixture, radiator be set, when this semiconductor illumination device packs light fixture into, and insert adaptable interface, for example, after the connection lock ring 7 of GX53 interface, conducting strip 51 will attach with radiator thermal conductive surface.In order to make this attaching, be more closely convenient to heat conduction and heat radiation, conventionally GX53 interface can produce a bit of axial displacement after coordinating with the knob that is connected lock ring 7, the thermal conductive surface of the radiator that arranges on conducting strip 51 and light fixture is close to, and produce one active force and towards the optics cup 21 being connected with conducting strip 51, by this by this strand of active force, offset or partial offset the power on the internal optics cup 21 after above-mentioned semiconductor illumination device assembling.It is worth mentioning that this design be for, when this semiconductor illumination device is installed in after adaptive light fixture work, can produce certain work calories, and this strand of heat can bring material to expand, therefore after the material heat expansion for the semiconductor illumination device under preventing in working order, undue mutually squeezing draws generation burst apart or damage, the present invention is through after design test repeatedly, thereby drawn and thisly can descend in working order the inner mechanical relationship of balance, and leave the design in thermal expansion space of part, under off working state and under single product state, keep inner tight fixedly to prevent from rocking damage of product situation loose and that cause by inner body simultaneously.
Although the description of this invention carries out in conjunction with above specific embodiment,, those skilled in the art can carry out many replacements, modifications and variations, be apparent according to above-mentioned content.Therefore, all such substituting, improve and change are all included in the spirit and scope of attached claim.
Claims (10)
1. a semiconductor illumination device, comprise a housing, its both ends open, its inside accommodates an optical module, one light source module, one drives at least a portion of electronic module and a heat treatment module, described optical module is arranged on middle shaft position in described housing, and this optical module top is connected with this housing front end, described light source module is placed in described optical module bottom and bright dipping towards this housing front opening, described heat treatment module is padded on this light source module bottom, it is characterized in that: described driving electronic module hoop is at this optical module outer wall, described heat treatment module is sealed described housing open rearward end.
2. semiconductor illumination device according to claim 1, is characterized in that, between described driving electronic module and light source module, is formed with interval.
3. semiconductor illumination device according to claim 1, it is characterized in that, described housing comprises the separable upper shell linking together and lower house, lower house comprises a ringwise connecting plate and the protruding pipe extending substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; At least a portion of described optical module is housed in described protruding pipe, and described protruding pipe end forms described housing open rearward end.
4. semiconductor illumination device according to claim 1, it is characterized in that, described housing comprises the separable upper shell linking together and lower house, and described upper shell comprises the sidewall that Ji Cong upper surface, ringwise upper surface outer edge extends substantially vertically.
5. semiconductor illumination device according to claim 4, it is characterized in that, described optical module comprises optics cup, described optics cup is roughly the truncated cone-shaped of hollow, both ends open, described optics cup is towards separable connection of inside edge of upper rim of a cup edge with the described upper surface of described upper surface, with fixed optics cup in the middle shaft part of upper shell.
6. semiconductor illumination device according to claim 5, is characterized in that, on described optics cup cup outer wall, is provided with at least two fixed legs, and described heat treatment module is fixed on fixed leg end.
7. semiconductor illumination device according to claim 5, is characterized in that, described driving electronic module comprises ringwise circuit substrate and be arranged on the electronic device on circuit substrate, and described circuit substrate lock ring is on optics cup outer wall; Described lower house comprises a ringwise connecting plate and the protruding pipe extending substantially vertically from the inward flange of connecting plate, and bearing of trend is away from upper shell; The end of described protruding pipe forms described housing open rearward end.
8. semiconductor illumination device according to claim 7, it is characterized in that, on described connecting plate, near its outer edge, also towards upper shell, vertically extend a connection ring wall, the external diameter of described connecting plate is greater than the external diameter of upper shell sidewall, the external diameter of described connection ring wall is less than the internal diameter of upper shell sidewall, the described circuit substrate ring wall end that is connected.
9. semiconductor illumination device according to claim 8, it is characterized in that, in described electronic device, larger electronic component is arranged on a side of the upper surface towards upper shell of circuit substrate, and in electronic device, at least a portion of less electronic device is arranged on the opposite side of circuit substrate.
10. semiconductor illumination device according to claim 5, is characterized in that, the light out part of light source module divides and is arranged on rim of a cup place under optics cup, and is electrically connected to described driving electronic module, and its bottom surface is attached in heat treatment module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210261444.1A CN102809128B (en) | 2012-07-27 | 2012-07-27 | Semiconductor lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210261444.1A CN102809128B (en) | 2012-07-27 | 2012-07-27 | Semiconductor lighting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102809128A CN102809128A (en) | 2012-12-05 |
| CN102809128B true CN102809128B (en) | 2014-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210261444.1A Active CN102809128B (en) | 2012-07-27 | 2012-07-27 | Semiconductor lighting device |
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Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7300173B2 (en) * | 2004-04-08 | 2007-11-27 | Technology Assessment Group, Inc. | Replacement illumination device for a miniature flashlight bulb |
| CN100582568C (en) * | 2007-12-13 | 2010-01-20 | 赵霞 | Power LED intense light device |
| CN201487842U (en) * | 2009-09-01 | 2010-05-26 | 福建科维光电科技有限公司 | LED lamp cup with temperature compensation function |
| KR101102919B1 (en) * | 2009-10-29 | 2012-01-11 | 주식회사 타보스 | Lamp assembly using light emitting diode |
| TW201137271A (en) * | 2010-04-29 | 2011-11-01 | Chin-San Chen | The lamp module of light emitting diode |
| CN201696941U (en) * | 2010-06-23 | 2011-01-05 | 东莞市星点灯饰配件有限公司 | LED crystal lamp |
| CN201968352U (en) * | 2011-03-10 | 2011-09-14 | 程义煌 | Light-emitting palette cup |
| CN202769566U (en) * | 2012-07-27 | 2013-03-06 | 重庆雷士实业有限公司 | Semiconductor lighting device |
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| CN102809128A (en) | 2012-12-05 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: NVC (CHINA) CO., LTD. Free format text: FORMER NAME: CHONGQING NVC INDUSTRIES CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: Chongqing Nan'an District South Road No. 76 (Chongqing international financial center) 22 floor Patentee after: NVC (China) Co., Ltd. Patentee after: Huizhou Leishi Optoelectronic Technology Co., Ltd. Address before: Chongqing Nan'an District South Road No. 76 (Chongqing international financial center) 22 floor Patentee before: Chongqing NVC Industries Co., Ltd. Patentee before: Huizhou Leishi Optoelectronic Technology Co., Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20170124 Address after: 516006 Guangdong city of Huizhou province Ru Town East Village Bridge (NVC Industrial Park) Patentee after: Huizhou Leishi Optoelectronic Technology Co., Ltd. Address before: Chongqing Nan'an District South Road No. 76 (Chongqing international financial center) 22 floor Patentee before: NVC (China) Co., Ltd. Patentee before: Huizhou Leishi Optoelectronic Technology Co., Ltd. |