CN102790247B - 一种波导法兰盘、含该法兰盘的软波导组件及其组装方法 - Google Patents
一种波导法兰盘、含该法兰盘的软波导组件及其组装方法 Download PDFInfo
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- CN102790247B CN102790247B CN201210232461.2A CN201210232461A CN102790247B CN 102790247 B CN102790247 B CN 102790247B CN 201210232461 A CN201210232461 A CN 201210232461A CN 102790247 B CN102790247 B CN 102790247B
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- waveguide
- ring flange
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- 238000000034 method Methods 0.000 title claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000000498 cooling water Substances 0.000 claims abstract description 17
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 5
- 238000007493 shaping process Methods 0.000 claims abstract description 4
- 230000000694 effects Effects 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000013536 elastomeric material Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 21
- 230000005540 biological transmission Effects 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 2
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- 238000004891 communication Methods 0.000 abstract 1
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- 238000005516 engineering process Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
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- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201210232461.2A CN102790247B (zh) | 2012-07-05 | 2012-07-05 | 一种波导法兰盘、含该法兰盘的软波导组件及其组装方法 |
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CN201210232461.2A CN102790247B (zh) | 2012-07-05 | 2012-07-05 | 一种波导法兰盘、含该法兰盘的软波导组件及其组装方法 |
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CN102790247A CN102790247A (zh) | 2012-11-21 |
CN102790247B true CN102790247B (zh) | 2014-09-24 |
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CN201210232461.2A Active CN102790247B (zh) | 2012-07-05 | 2012-07-05 | 一种波导法兰盘、含该法兰盘的软波导组件及其组装方法 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103500866A (zh) * | 2013-09-22 | 2014-01-08 | 西安电子工程研究所 | 一种毫米波波导连接器及其连接方法 |
CN105932373B (zh) * | 2016-05-25 | 2019-06-21 | 电子科技大学 | 一种极化可控的大功率过模微波弯头 |
CN106954977A (zh) * | 2017-05-12 | 2017-07-18 | 上海乔马电子科技有限公司 | 一种软硬可调节的床垫 |
CN109841932B (zh) * | 2019-04-02 | 2023-10-20 | 上海阖煦微波技术有限公司 | 软波导橡胶护套根部加强的法兰构件 |
CN115383411B (zh) * | 2022-09-21 | 2024-04-30 | 西安艾力特电子实业有限公司 | 一种弯波导管加工的方法及弯波导管结构 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4757291A (en) * | 1986-02-28 | 1988-07-12 | Spinner Gmbh, Elektrotechnische Fabrik | Cooled waveguide assembly |
CN102354786A (zh) * | 2011-10-21 | 2012-02-15 | 湖北汉鑫源真空电子科技有限公司 | C波段高能碳化硅陶瓷微波负载 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3641086C1 (de) * | 1986-12-02 | 1988-03-31 | Spinner Gmbh Elektrotech | Hohlleiterabsorber oder -daempfungsglied |
CN2126467U (zh) * | 1992-07-01 | 1992-12-30 | 机械电子工业部第十二研究所 | 高功率小体积匹配负载结构 |
EP1233469A3 (de) * | 2001-01-26 | 2003-07-30 | Spinner GmbH Elektrotechnische Fabrik | Hohlleiterarmatur |
CN201853501U (zh) * | 2010-09-16 | 2011-06-01 | 宜宾红星电子有限公司 | 波导负载吸收冷却装置 |
CN202662744U (zh) * | 2012-07-05 | 2013-01-09 | 上海和旭微波科技有限公司 | 一种波导法兰盘及含该法兰盘的软波导组件 |
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2012
- 2012-07-05 CN CN201210232461.2A patent/CN102790247B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4757291A (en) * | 1986-02-28 | 1988-07-12 | Spinner Gmbh, Elektrotechnische Fabrik | Cooled waveguide assembly |
CN102354786A (zh) * | 2011-10-21 | 2012-02-15 | 湖北汉鑫源真空电子科技有限公司 | C波段高能碳化硅陶瓷微波负载 |
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Address after: 200331, Shanghai, Qilian, Putuo District Road, 1035, Lane 335, C building a (West) 1-3 floor Patentee after: Shanghai closed microwave technology Co. Ltd. Xu Address before: 200331, Shanghai, Qilian, Putuo District Road, 1035, Lane 335, C building a (West) 1-3 floor Patentee before: Shanghai Hexu Microwave Technology Co., Ltd. |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20121121 Assignee: Shanghai Puchuang Longke Finance Leasing Co., Ltd Assignor: Shanghai closed microwave technology Co. Ltd. Xu Contract record no.: X2019310000026 Denomination of invention: Waveguide ring flange, flexible waveguide assembly containing waveguide ring flange and assembly method of flexible waveguide assembly Granted publication date: 20140924 License type: Exclusive License Record date: 20191224 |
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EE01 | Entry into force of recordation of patent licensing contract | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Waveguide ring flange, flexible waveguide assembly containing waveguide ring flange and assembly method of flexible waveguide assembly Effective date of registration: 20200102 Granted publication date: 20140924 Pledgee: Shanghai Puchuang Longke Finance Leasing Co., Ltd Pledgor: Shanghai closed microwave technology Co. Ltd. Xu Registration number: Y2019310000038 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201228 Granted publication date: 20140924 Pledgee: Shanghai Puchuang Longke Finance Leasing Co.,Ltd. Pledgor: SHANGHAI HEXU MICROWAVE TECHNOLOGY Co.,Ltd. Registration number: Y2019310000038 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Shanghai Puchuang Longke Finance Leasing Co.,Ltd. Assignor: SHANGHAI HEXU MICROWAVE TECHNOLOGY Co.,Ltd. Contract record no.: X2019310000026 Date of cancellation: 20210108 |
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EC01 | Cancellation of recordation of patent licensing contract |