CN102781124B - Wafer-baking hot plate unit used for integrated circuit - Google Patents
Wafer-baking hot plate unit used for integrated circuit Download PDFInfo
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- CN102781124B CN102781124B CN201110120461.9A CN201110120461A CN102781124B CN 102781124 B CN102781124 B CN 102781124B CN 201110120461 A CN201110120461 A CN 201110120461A CN 102781124 B CN102781124 B CN 102781124B
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- hot plate
- lid
- heat
- temperature sensor
- transfer sheet
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Abstract
The invention discloses a wafer-baking hot plate unit used for an integrated circuit. According to a thermal principle, a cover body of the wafer-baking hot plate unit is internally embedded with hot wires having the same characteristics and the same distribution in a hot plate, and the temperature control is synchronously carried out together with the hot plate by embedding a temperature sensor. By embedding the hot wires and the temperature sensor in the cover body of the hot plate unit, the heat flow density on the upper surface of the hot plate which is subjected to heat conduction with the external environment can be greatly reduced due to the arrangement, and the temperature uniformity at the surface of the hot plate can be increased.
Description
Technical field
The present invention relates to a kind of heat-transfer sheet modules curing for IC wafers.
Background technology
In large scale integrated circuit manufacturing industry, people are carved into intensive electronic circuit on wafer by photoetching process.In this technical process, by hot plate, wafer is cured to processing.The temperature homogeneity on hot plate surface is a crucial technical indicator.Especially in front baking, rear baking operation, the temperature homogeneity on hot plate surface is particularly important.Due to photoresist in process engineering, in curing, the chemical substance in suffered tension force and photoresist is to temperature altitude sensitivity, and the temperature homogeneity on hot plate surface will have a huge impact the electronic circuit width of portraying on wafer.So the hot plate of surface temperature uniformity is the necessary links that guarantees photoetching process quality in large scale integrated circuit manufacture when a heating.Simultaneously along with the increasing of integrated circuit integrated level, day by day the dwindling of live width, the inhomogeneity raising of hot plate surface temperature is also the needs of the more intensive electronic circuit of photoetching on wafer.
at present, the heat-transfer sheet modules curing for single-wafer, generally adopts and in hot plate, places heating wire and heat, by the temperature sensor control temperature on hot plate surface.But in the time that temperature is higher, just faster according to the at this moment hot plate surface heat conduction of environment towards periphery of calorifics principle.That is to say by the density of heat flow rate on hot plate surface greatlyr, and then the temperature homogeneity on the hot plate surface causing is just poorer.Will improve the temperature homogeneity on hot plate surface if can reduce the density of heat flow rate of heat-transfer sheet modules.
Summary of the invention
For overcoming above-mentioned deficiency, the object of this invention is to provide a kind of heat-transfer sheet modules curing for single-wafer that reduces heat-transfer sheet modules density of heat flow rate.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is: first increase the thickness of heat-transfer sheet modules lid, embed heated filament and temperature sensor in heat-transfer sheet modules lid.Heated filament adopts helix mode to arrange, and temperature sensor is satisfied with to approach the lower surface of lid.In hot plate heating process, application of temperature controller makes the temperature sensor of lid and the temperature sensor of hot plate keep uniform temp.According to calorifics principle, heat conducts between different temperatures.Due to the uniform temp of lid and hot plate, making does not almost have exchange heat between hot plate lid and hot plate upper surface, so reduced greatly density of heat flow rate between the two.And then the temperature homogeneity on raising hot plate surface.
The heated filament of wherein said hot plate lid and arrange should be as far as possible with the heated filament of hot plate and arrange identically, both temperature sensors also should be identical.
Be specially:
The heat-transfer sheet modules curing for IC wafers, comprises heat-transfer sheet modules lid, is embedded with heated filament and temperature sensor in heat-transfer sheet modules lid.
The temperature sensor that described lid is embedded in is located at the position that approaches lid lower surface in lid.
The heating-up temperature of described temperature sensor reflection lid lower surface in lid.
In the hot plate of described heat-transfer sheet modules, be embedded with heated filament and temperature sensor, the heating-up temperature of the interior heated filament of the temperature sensor reflection hot plate upper surface in hot plate; Temperature sensor in hot plate is located at the position that approaches hot plate upper surface in hot plate.
Described heat-transfer sheet modules also includes a temperature controller, and its signal input part is connected to the feedback signal of the temperature sensor in lid and in hot plate, and the control output end of temperature controller is connected to respectively the control loop in lid and in hot plate; Described hot plate and lid are controlled respectively target temperature by the heated filament and the temperature sensor that embed.
It is identical that the heated filament that described heat-transfer sheet modules lid is embedded in and hot plate are embedded in heated filament, and it is identical with heated filament spacing that the heated filament arrangement mode that heat-transfer sheet modules lid is embedded in and heated filament spacing and hot plate are embedded in heated filament arrangement mode, forming surface symmetrical structure;
The temperature sensor that the temperature sensor that heat-transfer sheet modules lid is embedded in and hot plate are embedded in is used for making both keep uniform temp by temperature controller.
Described heated filament the arrangement mode of lid and hot plate inside be planar spiral that therefrom mind-set outer rim extends gradually, three-back-shaped or arc in one or two or more kinds combination.
The invention has the beneficial effects as follows:
1. the present invention has reduced the density of heat flow rate on hot plate surface greatly, improves the temperature homogeneity on hot plate surface.
2. improvement part of the present invention has easy installation, easy to control, the feature that cost is low.
Accompanying drawing explanation
Fig. 1 heat-transfer sheet modules vertical section structure of the present invention schematic diagram.In figure: 1 heated filament, 2 temperature sensors, 3 heat-transfer sheet modules lids, 4 hot plates, 5 hot plate heating unit housings.
Embodiment
Below in conjunction with accompanying drawing, structure of the present invention and operation principle thereof are described in further detail.
As shown in Figure 1,
The heat-transfer sheet modules curing for IC wafers, comprises heat-transfer sheet modules lid, is embedded with heated filament and temperature sensor in heat-transfer sheet modules lid; The temperature sensor that described lid is embedded in is located at the position that approaches lid lower surface in lid; The heating-up temperature of the temperature sensor reflection lid lower surface in lid.
In the hot plate of described heat-transfer sheet modules, be embedded with heated filament and temperature sensor, the heating-up temperature of the temperature sensor reflection hot plate upper surface in hot plate; Temperature sensor in hot plate is located at the position that approaches hot plate upper surface in hot plate.
Described heat-transfer sheet modules also includes a temperature controller, and its signal input part is connected to the feedback signal of the temperature sensor in lid and in hot plate, and the control output end of temperature controller is connected to respectively the control loop in lid and in hot plate; Described hot plate and lid are controlled respectively target temperature by the heated filament and the temperature sensor that embed.
It is identical that the heated filament characteristic that described heat-transfer sheet modules lid is embedded in and hot plate are embedded in heated filament characteristic, and it is identical with heated filament spacing that the heated filament arrangement mode that heat-transfer sheet modules lid is embedded in and heated filament spacing and hot plate are embedded in heated filament arrangement mode, forming surface symmetrical structure;
The temperature sensor that the temperature sensor that heat-transfer sheet modules lid is embedded in and hot plate are embedded in is used for making both keep uniform temp by temperature controller.
Described heated filament is three-back-shaped at the arrangement mode of lid and hot plate inside.
Hot plate cures heating unit mainly by embedding the heated filament heating in hot plate, controls temperature by the temperature sensor near hot plate upper surface.According to calorifics principle, the present invention, the lid of the heat-transfer sheet modules curing at wafer is embedded in and hot plate internal characteristic and the identical heated filament of arranging, and also embeds temperature sensor and synchronize with hot plate and carry out temperature control.What such arrangement can reduce hot plate upper surface greatly carries out heat conducting density of heat flow rate with external environment.Will greatly improve the temperature homogeneity on hot plate surface.
The present invention has overcome the heat insulation bad drawback of heat-transfer sheet modules effectively, has higher practical value in the baking process of IC wafers.
Claims (2)
1. the heat-transfer sheet modules curing for IC wafers, comprises heat-transfer sheet modules lid, it is characterized in that: in heat-transfer sheet modules lid, be embedded with heated filament and temperature sensor;
The temperature sensor that described lid is embedded in is located at the position that approaches lid lower surface in lid;
The heating-up temperature of described temperature sensor reflection lid lower surface in lid;
In the hot plate of described heat-transfer sheet modules, be embedded with heated filament and temperature sensor, the heating-up temperature of the temperature sensor reflection hot plate upper surface in hot plate; Temperature sensor in hot plate is located at the position that approaches hot plate upper surface in hot plate;
Described heat-transfer sheet modules also includes a temperature controller, and its signal input part is connected to the feedback signal of the temperature sensor in lid and in hot plate, and the control output end of temperature controller is connected to respectively the control loop in lid and in hot plate; Described hot plate and lid are controlled respectively target temperature by the heated filament and the temperature sensor that embed;
It is identical that the heated filament that described heat-transfer sheet modules lid is embedded in and hot plate are embedded in heated filament, and it is identical with heated filament spacing that the heated filament arrangement mode that heat-transfer sheet modules lid is embedded in and heated filament spacing and hot plate are embedded in heated filament arrangement mode, forming surface symmetrical structure;
The temperature sensor that the temperature sensor that heat-transfer sheet modules lid is embedded in and hot plate are embedded in is used for making heat-transfer sheet modules lid lower surface and hot plate upper surface keep uniform temp by temperature controller.
2. according to heat-transfer sheet modules described in claim 1, it is characterized in that:
Described heated filament the arrangement mode of lid and hot plate inside be spirality that therefrom mind-set outer rim extends gradually, three-back-shaped or arc in one or two or more kinds combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110120461.9A CN102781124B (en) | 2011-05-11 | 2011-05-11 | Wafer-baking hot plate unit used for integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110120461.9A CN102781124B (en) | 2011-05-11 | 2011-05-11 | Wafer-baking hot plate unit used for integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102781124A CN102781124A (en) | 2012-11-14 |
| CN102781124B true CN102781124B (en) | 2014-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110120461.9A Expired - Fee Related CN102781124B (en) | 2011-05-11 | 2011-05-11 | Wafer-baking hot plate unit used for integrated circuit |
Country Status (1)
| Country | Link |
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| CN (1) | CN102781124B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6737094B2 (en) * | 2016-09-12 | 2020-08-05 | 東京エレクトロン株式会社 | Substrate heating device, substrate heating method and storage medium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000323486A (en) * | 1999-05-07 | 2000-11-24 | Toshiba Ceramics Co Ltd | Wafer heat treatment device and method therefor |
| US20020066725A1 (en) * | 2000-06-26 | 2002-06-06 | Lee Byung Il | Semiconductor wafer baking apparatus |
| CN1523360A (en) * | 2003-09-10 | 2004-08-25 | 中国电子科技集团公司第十三研究所 | Minisize heat flow accelerometer and method for making same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5010370B2 (en) * | 2007-07-03 | 2012-08-29 | 助川電気工業株式会社 | Heating plate temperature measuring device |
-
2011
- 2011-05-11 CN CN201110120461.9A patent/CN102781124B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000323486A (en) * | 1999-05-07 | 2000-11-24 | Toshiba Ceramics Co Ltd | Wafer heat treatment device and method therefor |
| US20020066725A1 (en) * | 2000-06-26 | 2002-06-06 | Lee Byung Il | Semiconductor wafer baking apparatus |
| CN1523360A (en) * | 2003-09-10 | 2004-08-25 | 中国电子科技集团公司第十三研究所 | Minisize heat flow accelerometer and method for making same |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2000-323486A 2000.11.24 |
| JP特开2009-14446A 2009.01.22 |
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| CN102781124A (en) | 2012-11-14 |
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Granted publication date: 20140514 Termination date: 20170511 |
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| CF01 | Termination of patent right due to non-payment of annual fee |