CN102781124A - Wafer-baking hot plate unit used for integrated circuit - Google Patents
Wafer-baking hot plate unit used for integrated circuit Download PDFInfo
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- CN102781124A CN102781124A CN2011101204619A CN201110120461A CN102781124A CN 102781124 A CN102781124 A CN 102781124A CN 2011101204619 A CN2011101204619 A CN 2011101204619A CN 201110120461 A CN201110120461 A CN 201110120461A CN 102781124 A CN102781124 A CN 102781124A
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- hot plate
- heat
- lid
- transfer sheet
- temperature sensor
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Abstract
The invention discloses a wafer-baking hot plate unit used for an integrated circuit. According to a thermal principle, a cover body of the wafer-baking hot plate unit is internally embedded with hot wires having the same characteristics and the same distribution in a hot plate, and the temperature control is synchronously carried out together with the hot plate by embedding a temperature sensor. By embedding the hot wires and the temperature sensor in the cover body of the hot plate unit, the heat flow density on the upper surface of the hot plate which is subjected to heat conduction with the external environment can be greatly reduced due to the arrangement, and the temperature uniformity at the surface of the hot plate can be increased.
Description
Technical field
The present invention relates to a kind of heat-transfer sheet modules that IC wafers cures that is used for.
Background technology
In the large scale integrated circuit manufacturing industry, people are carved into intensive electronic circuit on the wafer through photoetching process.In this technical process, come wafer is cured processing through hot plate.The temperature homogeneity on hot plate surface is the technical indicator of a key.Especially the temperature homogeneity on hot plate surface is particularly important in preceding baking, back baking operation.Because photoresist suffered tension force and chemical substance in the photoresist in curing is responsive to temperature altitude in process engineering, the temperature homogeneity on hot plate surface will produce very big influence to the electronic circuit width of portraying on the wafer.So the hot plate of surface temperature uniformity is the necessary link that guarantees photoetching process quality in the large scale integrated circuit manufacturing during heating.Simultaneously along with the increasing of integrated circuit integrated level, the dwindling day by day of live width, the inhomogeneity raising of hot plate surface temperature also is the needs of the more intensive electronic circuit of photoetching on wafer.
is present; Be used for the heat-transfer sheet modules that single-wafer is cured; Generally be employed in the hot plate and place heating wire and heat, through the temperature sensor control temperature on hot plate surface.But it is when temperature is high more, just fast more according to the heat conduction of hot plate surface ambient at this moment of calorifics principle.That is to say through the density of heat flow rate on hot plate surface greatly more, and then the temperature homogeneity on the hot plate that causes surface is just poor more.If can reduce the temperature homogeneity that the density of heat flow rate of heat-transfer sheet modules will improve the hot plate surface.
Summary of the invention
For overcoming above-mentioned deficiency, the purpose of this invention is to provide a kind of heat-transfer sheet modules that single-wafer is cured that is used for that reduces the heat-transfer sheet modules density of heat flow rate.
For solving the problems of the technologies described above, the technical scheme that the present invention adopted is: at first increase the thickness of heat-transfer sheet modules lid, in the heat-transfer sheet modules lid, embed heated filament and temperature sensor.Heated filament adopts the helix mode to arrange, and temperature sensor is satisfied with the lower surface near lid.The application of temperature controller makes the temperature sensor of lid and the temperature sensor of hot plate keep uniform temp in hot plate heating process.According to the calorifics principle, heat conducts between different temperatures.Because the uniform temp of lid and hot plate, making does not almost have exchange heat between hot plate lid and the hot plate upper surface, so reduced density of heat flow rate between the two greatly.And then the temperature homogeneity on raising hot plate surface.
The heated filament of wherein said hot plate lid and arrange should be as far as possible with the heated filament of hot plate and arrange identically, both temperature sensors also should be identical.
Be specially:
A kind ofly be used for the heat-transfer sheet modules that IC wafers cures, comprise the heat-transfer sheet modules lid, in the heat-transfer sheet modules lid, be embedded with heated filament and temperature sensor.
The temperature sensor that said lid is embedded in is located at the interior position near the lid lower surface of lid.
The heating-up temperature of said temperature sensor reflection lid lower surface in lid.
Be embedded with heated filament and temperature sensor in the hot plate of said heat-transfer sheet modules, the heating-up temperature of the interior heated filament of the temperature sensor reflection hot plate upper surface in the hot plate; Temperature sensor in the hot plate is located at the interior position near the hot plate upper surface of hot plate.
Said heat-transfer sheet modules also includes a temperature controller, and its signal input part is connected in the lid and the feedback signal of the temperature sensor in the hot plate, and the control output end of temperature controller is connected in the lid respectively and the control loop in the hot plate; Said hot plate and lid are controlled respectively target temperature through the heated filament and the temperature sensor that embed.
It is identical that the heated filament that said heat-transfer sheet modules lid is embedded in and hot plate are embedded in heated filament, and it is identical with the heated filament spacing that the heated filament arrangement mode that the heat-transfer sheet modules lid is embedded in and heated filament spacing and hot plate are embedded in the heated filament arrangement mode, forms the face symmetrical structure;
The temperature sensor that temperature sensor that the heat-transfer sheet modules lid is embedded in and hot plate are embedded in is used for making both keep uniform temp through temperature controller.
Said heated filament planar spiral that the inner arrangement mode of lid and hot plate extends for mind-set outer rim therefrom gradually, three-back-shaped or arc in a kind of or combination more than two kinds.
The invention has the beneficial effects as follows:
1. the present invention has reduced the density of heat flow rate on hot plate surface greatly, improves the temperature homogeneity on hot plate surface.
2. improvement part of the present invention has the installation of being prone to, and is easy to control, the characteristics that cost is low.
Description of drawings
Fig. 1 heat-transfer sheet modules vertical section structure of the present invention sketch map.Among the figure: 1 heated filament, 2 temperature sensors, 3 heat-transfer sheet modules lids, 4 hot plates, 5 hot plate heating unit housings.
Embodiment
Below in conjunction with accompanying drawing structure of the present invention and operation principle thereof are done further explain.
It is as shown in Figure 1,
A kind ofly be used for the heat-transfer sheet modules that IC wafers cures, comprise the heat-transfer sheet modules lid, in the heat-transfer sheet modules lid, be embedded with heated filament and temperature sensor; The temperature sensor that said lid is embedded in is located at the interior position near the lid lower surface of lid; The heating-up temperature of the temperature sensor reflection lid lower surface in lid.
Be embedded with heated filament and temperature sensor in the hot plate of said heat-transfer sheet modules, the heating-up temperature of the temperature sensor reflection hot plate upper surface in the hot plate; Temperature sensor in the hot plate is located at the interior position near the hot plate upper surface of hot plate.
Said heat-transfer sheet modules also includes a temperature controller, and its signal input part is connected in the lid and the feedback signal of the temperature sensor in the hot plate, and the control output end of temperature controller is connected in the lid respectively and the control loop in the hot plate; Said hot plate and lid are controlled respectively target temperature through the heated filament and the temperature sensor that embed.
It is identical that the heated filament characteristic that said heat-transfer sheet modules lid is embedded in and hot plate are embedded in the heated filament characteristic, and it is identical with the heated filament spacing that the heated filament arrangement mode that the heat-transfer sheet modules lid is embedded in and heated filament spacing and hot plate are embedded in the heated filament arrangement mode, forms the face symmetrical structure;
The temperature sensor that temperature sensor that the heat-transfer sheet modules lid is embedded in and hot plate are embedded in is used for making both keep uniform temp through temperature controller.
Said heated filament is three-back-shaped at lid and the inner arrangement mode of hot plate.
Hot plate cures heating unit mainly through embedding the heated filament heating in the hot plate, through controlling temperature near the temperature sensor of hot plate upper surface.According to the calorifics principle, the present invention, the lid of the heat-transfer sheet modules that cures at wafer is embedded in and the hot plate internal characteristic and the identical heated filament of arranging, and also embeds temperature sensor and hot plate carries out temperature control synchronously.What such arrangement can reduce the hot plate upper surface greatly carries out heat conducting density of heat flow rate with external environment.Will improve the temperature homogeneity on hot plate surface greatly.
The present invention has overcome the heat insulation bad drawback of heat-transfer sheet modules effectively, in the baking process of IC wafers, has higher utility.
Claims (6)
1. one kind is used for the heat-transfer sheet modules that IC wafers cures, and comprises the heat-transfer sheet modules lid, it is characterized in that: in the heat-transfer sheet modules lid, be embedded with heated filament and temperature sensor.
2. according to the said heat-transfer sheet modules of claim 1, it is characterized in that:
The temperature sensor that said lid is embedded in is located at the interior position near the lid lower surface of lid.
3. according to the said heat-transfer sheet modules of claim 1, it is characterized in that:
The heating-up temperature of said temperature sensor reflection lid lower surface in lid.
4. according to claim 1,2 or 3 said heat-transfer sheet modules, it is characterized in that:
Be embedded with heated filament and temperature sensor in the hot plate of said heat-transfer sheet modules, the heating-up temperature of the temperature sensor reflection hot plate upper surface in the hot plate; Temperature sensor in the hot plate is located at the interior position near the hot plate upper surface of hot plate;
Said heat-transfer sheet modules also includes a temperature controller, and its signal input part is connected in the lid and the feedback signal of the temperature sensor in the hot plate, and the control output end of temperature controller is connected in the lid respectively and the control loop in the hot plate; Said hot plate and lid are controlled respectively target temperature through the heated filament and the temperature sensor that embed.
5. according to the said heat-transfer sheet modules of claim 4, it is characterized in that:
It is identical that the heated filament that said heat-transfer sheet modules lid is embedded in and hot plate are embedded in heated filament, and it is identical with the heated filament spacing that the heated filament arrangement mode that the heat-transfer sheet modules lid is embedded in and heated filament spacing and hot plate are embedded in the heated filament arrangement mode, forms the face symmetrical structure;
The temperature sensor that temperature sensor that the heat-transfer sheet modules lid is embedded in and hot plate are embedded in is used for making heat-transfer sheet modules lid lower surface and hot plate upper surface keep uniform temp through temperature controller.
6. according to the said heat-transfer sheet modules of claim 4, it is characterized in that:
Said heated filament spirality that the inner arrangement mode of lid and hot plate extends for mind-set outer rim therefrom gradually, three-back-shaped or arc in a kind of or combination more than two kinds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110120461.9A CN102781124B (en) | 2011-05-11 | 2011-05-11 | Wafer-baking hot plate unit used for integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110120461.9A CN102781124B (en) | 2011-05-11 | 2011-05-11 | Wafer-baking hot plate unit used for integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102781124A true CN102781124A (en) | 2012-11-14 |
| CN102781124B CN102781124B (en) | 2014-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110120461.9A Expired - Fee Related CN102781124B (en) | 2011-05-11 | 2011-05-11 | Wafer-baking hot plate unit used for integrated circuit |
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| CN (1) | CN102781124B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018046070A (en) * | 2016-09-12 | 2018-03-22 | 東京エレクトロン株式会社 | Substrate heating apparatus, substrate heating method and storage medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000323486A (en) * | 1999-05-07 | 2000-11-24 | Toshiba Ceramics Co Ltd | Wafer heat treatment device and method therefor |
| US20020066725A1 (en) * | 2000-06-26 | 2002-06-06 | Lee Byung Il | Semiconductor wafer baking apparatus |
| CN1523360A (en) * | 2003-09-10 | 2004-08-25 | 中国电子科技集团公司第十三研究所 | Minisize heat flow accelerometer and method for making same |
| JP2009014446A (en) * | 2007-07-03 | 2009-01-22 | Sukegawa Electric Co Ltd | Apparatus for measuring temperature of heating plate |
-
2011
- 2011-05-11 CN CN201110120461.9A patent/CN102781124B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000323486A (en) * | 1999-05-07 | 2000-11-24 | Toshiba Ceramics Co Ltd | Wafer heat treatment device and method therefor |
| US20020066725A1 (en) * | 2000-06-26 | 2002-06-06 | Lee Byung Il | Semiconductor wafer baking apparatus |
| CN1523360A (en) * | 2003-09-10 | 2004-08-25 | 中国电子科技集团公司第十三研究所 | Minisize heat flow accelerometer and method for making same |
| JP2009014446A (en) * | 2007-07-03 | 2009-01-22 | Sukegawa Electric Co Ltd | Apparatus for measuring temperature of heating plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018046070A (en) * | 2016-09-12 | 2018-03-22 | 東京エレクトロン株式会社 | Substrate heating apparatus, substrate heating method and storage medium |
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| CN102781124B (en) | 2014-05-14 |
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Granted publication date: 20140514 Termination date: 20170511 |