CN102770237B - The base wire of coated wire saw - Google Patents
The base wire of coated wire saw Download PDFInfo
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- CN102770237B CN102770237B CN201180010400.5A CN201180010400A CN102770237B CN 102770237 B CN102770237 B CN 102770237B CN 201180010400 A CN201180010400 A CN 201180010400A CN 102770237 B CN102770237 B CN 102770237B
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- 239000011248 coating agent Substances 0.000 claims abstract description 156
- 238000000576 coating method Methods 0.000 claims abstract description 156
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 44
- 239000010959 steel Substances 0.000 claims abstract description 44
- 238000005491 wire drawing Methods 0.000 claims description 40
- 238000005238 degreasing Methods 0.000 claims description 28
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 22
- 229910052799 carbon Inorganic materials 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 2
- 239000003921 oil Substances 0.000 description 31
- 239000000314 lubricant Substances 0.000 description 22
- 239000002966 varnish Substances 0.000 description 18
- 239000010949 copper Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 238000005259 measurement Methods 0.000 description 9
- 229920002635 polyurethane Polymers 0.000 description 9
- 239000004814 polyurethane Substances 0.000 description 9
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 8
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 229910000677 High-carbon steel Inorganic materials 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000006424 Flood reaction Methods 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 210000003298 dental enamel Anatomy 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- -1 polyamidoimide Polymers 0.000 description 4
- 238000004445 quantitative analysis Methods 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 239000011593 sulfur Substances 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 238000004506 ultrasonic cleaning Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 2
- 229910017752 Cu-Zn Inorganic materials 0.000 description 2
- 229910017943 Cu—Zn Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910001566 austenite Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- NKDDWNXOKDWJAK-UHFFFAOYSA-N dimethoxymethane Chemical compound COCOC NKDDWNXOKDWJAK-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 229910018100 Ni-Sn Inorganic materials 0.000 description 1
- 229910018532 Ni—Sn Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000000370 laser capture micro-dissection Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910001105 martensitic stainless steel Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000002137 ultrasound extraction Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Ropes Or Cables (AREA)
Abstract
The invention provides the base wire that the coated wire saw that has organic coating on surface uses, it can suppress the stripping of organic coating.In addition, the invention provides the coated wire saw of the peel resistance excellence of organic coating.In the present invention, there is on surface the base wire of the coated wire saw of organic coating, there is steel wire and be formed at the coating on surface of steel wire.
Description
Technical field
The present invention relates to the saw silk that sawing machine uses, in detail, when relating to the workpiece cutting off metal and pottery etc., carry out the base wire of the saw silk used to saw silk winding-up abrasive particle.
Background technology
The workpiece of metal and pottery etc., is cut off by the sawing machine being provided with saw silk.Saw silk runs along a direction or twocouese (travel directions), and by making this saw silk and absorption surface, workpiece is cut by with arbitrary width.
While spray containing abrasive particle (hereinafter referred to as free abrasive saw silk.) solution, cut off workpiece.The free abrasive contained by solution sprayed is involved between workpiece and saw silk, and the abrasion of workpiece are promoted, and workpiece is cut off.
As the solution sprayed containing free abrasive while the saw silk used when cutting off workpiece, patent document 1 discloses a kind of saw silk, and it is with the outer peripheral face being with abrasive particle resin involucra to be coated to the steel wire of high-carbon steel wire etc.Wherein describe, if use this saw silk, then free abrasive invaded zone abrasive particle resin involucra, can be involved in free abrasive at saw silk and the partially stabilized of absorption surface.
Look-ahead technique document
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2006-179677 publication
Saw silk disclosed in above-mentioned patent document 1, the outer peripheral face of steel wire is directly coated to by being with abrasive particle resin involucra.Therefore, if band abrasive particle resin involucra is peeled off from steel wire, then steel wire self exposes, and because the free abrasive supplied when cutting workpiece causes the abrasion of steel wire acutely to be carried out, steel wire breaks.In addition, if cut off workpiece with the steel wire being with abrasive particle resin involucra to there occurs stripping, then the surface accuracy of cut-off workpiece is deteriorated, and the quality of workpiece reduces.
Summary of the invention
The present invention does in view of such situation, its object is to, and provide a kind of base wire being used to coated wire saw forming organic coating on surface, it can suppress the stripping of organic coating.In addition, another object of the present invention is to, a kind of coated wire saw of peel resistance excellence of organic coating is provided.
The base wire of the present invention of above-mentioned problem can be solved, be the base wire of the coated wire saw on surface with organic coating, it is characterized in that, there is steel wire and be formed at the coating on surface of described steel wire.
As above-mentioned coating, the layer such as containing Cu and/or Zn can be enumerated.The arithmetic average roughness Ra of above-mentioned coating surface is preferably less than 0.2 μm.Be attached to the oil on the surface of above-mentioned coating, preferably every 1g base wire 70 below μ g.The carbon component being attached to the attachment on the surface of above-mentioned coating is preferably every 1m base wire 15 below μ g.
Coated wire saw of the present invention, is characterized in that, has the organic coating on the surface of coating above-mentioned base wire.
In the present invention, also comprise raising and state coated wire saw injection abrasive particle, become to cut off the manufacture method of the cut-out body of body with described coated wire saw by cutting workpiece.
Base wire of the present invention, has steel wire and is formed at the coating on surface of steel wire, form organic coating on the surface of this coating.Coating plays the effect improving the adhesion of steel wire and organic coating, can improve the peel resistance of organic coating.
Detailed description of the invention
When using the coated wire saw disclosed in above-mentioned patent document 1 to cut off workpiece, organic coating, from the sur-face peeling of steel wire, causes the surface accuracy on the saw broken string of silk and the surface of workpiece bad.The present inventors distinguish when studying for its reason, make the adhesion deterioration of steel wire and organic coating, cause organic coating thus easily from the sur-face peeling of steel wire at the ferriferous oxide of the Surface Creation of steel wire.Therefore the present inventors study repeatedly with keen determination in order to improve the adhesion of steel wire and organic coating.Consequently, the present inventors find, if form coating between steel wire and organic coating, then make the adhesion of steel wire and organic coating improve, can improve the peel resistance of organic coating, thus complete the present invention.
That is, base wire of the present invention, is endowed feature, has coating on the surface of steel wire.By forming coating on the surface of steel wire, the adhesion of steel wire and organic coating can be improved.
Above-mentioned coating, as long as the coating be made up of the metal more soft than steel wire, ductility is excellent, then what coating can.Such as, the coating of at least a kind containing selecting from the group that Cu, Zn and Ni are formed can be enumerated.Among these elements, the coating preferably containing Cu and/or Zn.Because Ni is metal costly, so the coating containing Ni becomes high.
As the coating containing Cu, Cu coating, Cu-Sn alloy layer etc. can be illustrated.As the coating containing Zn, Zn coating etc. can be illustrated, as the coating containing Ni, Ni coating etc. can be illustrated.As the coating containing Cu and Zn, brass (brass) coating etc. can be illustrated.As the coating containing Cu and Ni, Cu-Ni alloy layer can be illustrated, Cu-Ni-Sn alloy layer etc.
Final wire drawing and become coated wire saw time, the thickness of above-mentioned coating is such as 0.1 ~ 0.5 μm (be preferably 0.2 ~ 0.4 μm, be more preferably 0.25 ~ 0.35 μm).If coating is excessively thin, then the peel resistance of organic coating can not get improving fully.But coating is blocked up, it is also saturated that the peel resistance of organic coating improves effect, manufactures difficulty in addition.
The arithmetic average roughness Ra on the surface of above-mentioned coating is preferably less than 0.2 μm.If the surface of coating is too coarse, then at cutting workpiece, stress is concentrated constantly, and organic coating is easily peeled off.Therefore, the arithmetic average roughness Ra of coating surface is preferably less than 0.2 μm, is more preferably less than 0.15 μm, more preferably less than 0.1 μm.Further, the lower limit of the arithmetic average roughness Ra of coating surface is not particularly limited, but when Ra is too small, and it is saturated that the peel resistance of organic coating improves effect, and manufacture difficulty.Therefore, the lower limit of Ra is such as 0.01 μm, is preferably 0.03 μm, is more preferably 0.05 μm.
The arithmetic average roughness Ra of above-mentioned coating surface, such as, doubly can carry out observing measuring with multiplying power 1000 with laser microscope.
The arithmetic average roughness Ra of above-mentioned coating surface, can by adjust the kind of such as plating, plating thickness, wire drawing time use mould surface accuracy, wire drawing time drawing speed, wire drawing time the kind of lubricant that uses or the temperature etc. of lubricant control.
Be formed with the steel wire of above-mentioned coating as surface, such as, stainless steel steel wire and high-carbon steel wire etc. can be used.As stainless steel steel wire, the austenite stainless steel steel wire of SUS301, SUS304, SUS310, SUS316, SUS321, SUS347 etc. can be used, the ferrite-group stainless steel steel wire of SUS405, SUS430 etc., the martensitic stainless steel steel wire of SUS403, SUS410 etc., the two phase stainless steel steel wire (austenite/ferrite-group stainless steel steel wire) of SUS329J1 etc., the precipitation solidification of SUS630 etc. is stainless steel steel wire etc.As high-carbon steel wire, such as can use containing C is the high-carbon steel wire of 0.5 ~ 1.2%.As this high-carbon steel wire, such as, the piano wire of JISG3502 defined can be used.
Base wire of the present invention, as above-mentioned, has coating on the surface of steel wire.By forming organic coating on the surface of this base wire of the present invention, the coated wire saw of the peel resistance excellence of organic coating can be obtained.
As above-mentioned organic coating, heat-curing resin or thermoplastic resin can be used.Among such resin, can be suitable for just like inferior: phenolic resins, acid amides system resin, imide series resin, polyamidoimide, epoxy resin, polyurethane, polyvinyl formal, ABS resin, vinyl chloride, polyester.Particularly can be suitable for polyurethane or polyamidoimide.
The thickness of above-mentioned organic coating, is preferably such as 0.05 ~ 15 μm.If organic coating is excessively thin, then the initial stage when cutting off, organic coating abrasion disappear or organic coating is peeled off from substrate, thus cause base wire self to expose.Under these circumstances, stable cut-out workpiece will be difficult to.Therefore, the thickness of organic coating is preferably more than 0.05 μm, is more preferably more than 0.5 μm, more preferably more than 2 μm.But if organic coating is blocked up, then the ratio that organic coating is shared in coated wire saw entirety becomes excessive, and therefore the intensity of coated wire saw entirety reduces.Therefore, when increasing linear speed wiry to boost productivity, wire has the tendency of easily broken string.Therefore, the thickness of organic coating is preferably less than 15 μm, is more preferably less than 13 μm, more preferably less than 10 μm.
The wire diameter of coated wire saw entirety is not particularly limited, but is generally about 100 ~ 300 μm (being preferably 100 ~ 150 μm).
Then, for the method manufacturing base wire of the present invention, and the method that coating organic coating manufactures coated wire saw on obtained base wire is described.
First, the method manufacturing base wire of the present invention is described.In order to manufacture base wire of the present invention, for following after rolled wire that usual way obtains implements heat treatment, carrying out a wire drawing, secondly after the heat treatment, implementing plating, carry out secondary wire drawing afterwards, degreasing.
Heat treatment (wire drawing after annealing) condition after the condition of heat treatment (wire drawing after annealing) condition before a wire drawing, a wire drawing, a wire drawing, plating condition are not particularly limited, and can be usual ways.
The drawing speed of the secondary wire drawing after plating is preferably 1 ~ 30m/ second.If drawing speed departs from this scope, then the arithmetic average roughness Ra of coating surface is more than 0.2 μm, and therefore the peel resistance of organic coating has the tendency of deterioration.Its drawing speed is preferably 2 ~ 20m/ second, is more preferably 3 ~ 18m/ second.
When secondary wire drawing, in order to the arithmetic average roughness Ra of coating surface is suppressed to make with lubricator below 0.2 μm.As lubricant, the oiliness of market sale or the lubricant of water-soluble oil can be used.The oil temperature of this lubricant is preferably 20 ~ 70 DEG C.The oil temperature of lubricant is more preferably 25 ~ 60 DEG C, more preferably 30 ~ 50 DEG C.
After secondary wire drawing, need before formation organic coating, to carry out degreasing, removing lubricant.In the present invention, recommend fully to carry out this degreasing.If at the surface attachment lubricant (oil) of coating, then as embodiment described later confirm, organic coating is easily peeled off.Therefore in the present invention, by reducing the oil being attached to coating surface as far as possible, the peel resistance of organic coating can be improved further.
Degreasing method is not particularly limited, and can enumerate and have the organic molten drug of compatibility (such as, acetone and hexane etc.) to clean the method for above-mentioned base wire with lubricant, and in reducing atmosphere, carry out the bright annealing etc. that heats.
Be attached to the oil on the surface of the above-mentioned coating after degreasing, the every 1g of preferred substrate silk is 70 below μ g, is more preferably 60 below μ g, more preferably 40 below μ g.The oil being preferably attached to the surface of above-mentioned coating is the least possible.
As the measuring method of oil mass on surface being attached to above-mentioned coating, such as, the method for the quality at degreasing fore-and-aft survey base wire can be adopted.Or can adopt with solvent (such as, hexane and carbon tetrachloride etc.) extract the oil being attached to the surface of base wire, use the method etc. of infrared spectrophotometer (IR) and the oil mass contained by Fourier transform infrared spectrophotometer (FT-IR) quantified extract thing.
Be attached to the oil mass on the surface of the above-mentioned coating after degreasing, the carbon component contained by attachment that also can pass through the above-mentioned coating surface after being quantitatively attached to degreasing is evaluated.Be attached to the carbon component contained by attachment of coating surface, the every 1m of base wire is preferably 15 below μ g, is more preferably 13 below μ g, more preferably 10 below μ g.Be attached to the carbon component amount contained by attachment on the surface of above-mentioned coating, preferably the least possible.
Be attached to the carbon component amount of the attachment on the surface of above-mentioned coating, such as, analysis of carbon and sulfur device can be used to be measured by burning infrared absorption.
Coated wire saw of the present invention, as above-mentioned, can be manufactured by the surface-coated organic coating at the base wire obtained through degreasing.
In order to form above-mentioned organic coating, on the surface of above-mentioned base wire, being coated with the varnish of market sale and heating.
As varnish, the enamel line varnish sold by Dong Te coating Co., Ltd. and the electric wire varnish etc. sold by Kyoto Ceramic Co., Ltd can be used.
As above-mentioned enamel line varnish, such as, can use as follows.
Polyurethane lacquer (" TPUF1 ", " TPUF2-NC ", " TPUF2-NCA ", " TPU6200 ", " TPU5100 ", " TPU5200 ", " TPU5700 ", " TPUK5132 ", " TPU3000K ", " TPU3000EA " etc., the commodity of Dong Te coating Co., Ltd..)
Polyester varnish (" LITON2100S ", " LITON2100P ", " LITON3100F ", " LITON3200BF ", " LITON3300 ", " LITON3300KF ", " LITON3500SLD ", " Neoheat 8200K2 " etc., the commodity of Dong Te coating Co., Ltd..)
Polyamidoimide varnish (" Neoheat AI-00C " etc., the commodity of Dong Te coating Co., Ltd..)
Polyesterimide varnish (" Neoheat 8600A ", " Neoheat 8600AY ", " Neoheat8600 ", " Neoheat 8600H3 ", " Neoheat 8625 ", " Neoheat 8600E2 " etc., the commodity of Dong Te coating Co., Ltd..)
As said wires varnish, such as, thermal polyurethane copper cash varnish (" TVE5160-27 " etc. can be used, epoxy modifying polyethylene alcohol methylal resin), formal copper wire is with varnish (" TVE5225A " etc., vinyl-formal resin), heat-proof polythene alcohol formal copper cash is with varnish (" TVE5230-27 " etc., epoxy modifying polyethylene alcohol methylal resin), polyester copper wire varnish (" TVE5350 series ", mylar) etc. (is the commodity of Kyoto Ceramic Co., Ltd.)。
The coated wire saw of the present invention so obtained, such as, uses when workpiece (slice processing) manufacture of cutting off metal, pottery, silicon, crystal, semiconductor component, magnetic material etc. cuts off body.
The cut-out undertaken by sawing machine, contains the solution of abrasive particle while carry out to coated wire saw injection.This is because, the free abrasive contained by solution sprayed is involved between coated wire saw and workpiece, contributes to that workpiece is worn away and cut off.
Solution containing abrasive particle can be known.As abrasive particle, such as, can use silicon carbide abrasive particles (SiC abrasive particle) and diamond abrasive grain etc.
Below, enumerate embodiment and further illustrate the present invention.The present invention does not limit by following embodiment system certainly, and in the scope that can meet the front/rear aim stated, certainly suitably can be changed enforcement, these are all included in the scope of technology of the present invention.
[embodiment]
The present embodiment, is used in the coated wire saw that surface has organic coating, when abrasive particle being sprayed to this coated wire saw and cuts off monocrystalline silicon, and the peel resistance of investigation organic coating.Following experimental example 1, the relation with regard to the surface texture of base wire and the peel resistance of organic coating is investigated, and following experimental example 2,3, the relation with regard to the degreasing condition of base wire and the peel resistance of organic coating is investigated.
[experimental example 1]
(A line, containing C:0.82 quality %, Si:0.19 quality %, Mn:0.49 quality %, surplus is iron and inevitable impurity to the piano wire of preparation JISG3502 defined.) rolled wire (diameter: 5.5mm).After heat-treating (carrying out patenting process (LP) with 550 DEG C), carry out a wire drawing to diameter 0.88mm, then heat-treat (carrying out patenting process (LP) with 550 DEG C).Then, form the coating shown in following table 1, secondary wire drawing, to diameter 0.132mm, is then carried out degreasing, is manufactured base wire thus.
As coating, any one of Cu-Zn coating, Cu coating or Zn coating can be formed.Cu-Zn coating, composition consists of Cu:63 quality %, Zn:37 quality %, is formed by plating.Plating Cu and plating Zn is formed by plating.The kind of the coating formed as described in Table 1.Further, No.1 and No.2 of table 1 is the example not forming coating.
Secondary wire drawing to drawing speed during diameter 0.132mm is 1.70m/ second or 3.30m/ second.Drawing speed as described in Table 1.
When secondary wire drawing is to diameter 0.132mm, use the lubricant (" メ テ Le シ Application (trade name) " of Kyoeisha Chemical Co., Ltd.) of oiliness or the lubricant (" エ Off コ リ ユ mono-ベ (trade name) " of ADEKA ケ ミ カ Le サ プ ラ イ Co., Ltd.) of water-soluble oil.The kind of lubricant as described in Table 1.
The oil temperature of lubricant is 25 DEG C during the lubricant of oiliness, is 25 DEG C or 40 DEG C during the lubricant of water-soluble oil.Oil temperature as described in Table 1.
Degreasing after secondary wire drawing is after flooding 24 hours in acetone, makes it dry and carry out after carrying out Ultrasonic Cleaning.
The surface of the base wire obtained is observed, the arithmetic average roughness Ra of measured surface thus with laser microscope (レ mono-ザ mono-テ ツク society's system " 1LM21W ", multiplying power: 1000 times).Roughness Ra measures in the face of the longitudinal 50 μm × longitudinally 100 μm of the central portion of base wire.The measurement result of arithmetic average roughness Ra as described in Table 1.
In addition, be attached to the oil mass on the surface of base wire, carry out quantitative analysis by Fourier transform infrared spectrophotometer (FT-IR).Quantitative analysis is specifically carried out according to the following steps.First, base wire is cut into length 1 ~ 2cm, after measuring its quality, puts into the beaker of capacity 100ml.Wherein add after carbon tetrachloride 30ml carries out ultrasonic extraction, become 50ml with carbon tetrachloride constant volume, adjust sample thus.
Through the sample of constant volume, put into the silica dish of optical length 100ml, use FT-IR (Jeol Ltd.'s system, " JIR-5500 type "), by transmission beam method, with resolution 4cm
-1, cumulative number is measured for 100 times.Only carry out the measurement of carbon tetrachloride as blank (blank), deduct the measurement result of blank from the measurement result of said sample, the C-H based on methylene combine based on 2927cm
-1the absorbance of part, the oil mass contained by quantitative sample.Oil mass quantitative, carries out according to for the ready-made calibration curve of lubricant used during secondary wire drawing.The quantitative result of oil mass is converted into the result of every 1g base wire, is presented in following table 1.Further, during as lubricant use water-soluble oil, oil mass is not measured.
In addition, the carbon component of the surface attachments of the base wire obtained, by burning infrared absorption, measures with analysis of carbon and sulfur device (hole field makes made, " EMIAU510 ").Measure and specifically carry out according to the following steps.First, base wire is cut into length 80cm, puts into magnetic sheet after measuring its quality.Be heated ignition temperature 600 DEG C, the carbon component amount of measured surface attachment.The measurement result of carbon component amount is converted into every 1m base wire, and the result obtained is presented in following table 1.
Secondly, for the surface of carrying out the base wire that degreasing obtains, formed organic coating so that various thickness is coating by polyurethane or polyamidoimide, manufactured coated wire saw thus.Specifically, coated wire saw makes in the following way: for the surface at above-mentioned base wire, varnish is divided into 4 ~ 10 times and is coated with, and makes it solidification to its heating.The former material of organic coating and thickness are presented at following table 1.
In No.1 ~ 8 shown in following table 1, use polyurethane line varnish " W143 " (Dong Te coating Co., Ltd. system of JISC2351 defined, enamel line is with varnish " TPUF1 (trade name) ", and the film after curing consists of polyurethane).
In No.9 shown in following table 1,10, use polyamidoimide line varnish (Dong Te coating Co., Ltd. system, enamel line is with varnish " Neoheat AI-00C (trade name) ", and the film after curing consists of polyamidoimide).
Further, observe the section of coated wire saw that obtains as a result, the thickness of coating is 0.3 μm.
Then, afterturn test is carried out for obtained coated wire saw, evaluate the peel resistance of organic coating accordingly.Afterturn test is carried out in the following way: the test film extracting long 200mm from coated wire saw, makes chuck spacing (punctuate spacing) be 50mm, applies the tension force of below yield point and carries out.Measure organic coating until the slubbing time (secondary) of stripping, observe the stripping state of organic coating with scanning electron microscope (SEM observes multiplying power: 20 times).Adopting the afterturn value (100D conversion) according to making the following formula of the diameter criteria of test film calculate, evaluating the peel resistance of organic coating.Evaluation criterion is as follows, and evaluation result is presented in following table 1.
Afterturn value (100D conversion)=slubbing time × (diameter/chuck spacing of test film) × 100
" evaluation criterion "
Zero (qualified): afterturn value is more than 25 times
△ (qualified): afterturn value is more than 20 times, lower than 25 times
× (defective): afterturn value is lower than 20 times
Can investigate as follows according to table 1.No.1,2 uses the example not meeting the coated wire saw that important document base wire given to this invention manufactures, and do not form coating between steel wire and organic coating, therefore organic coating is easily peeled off.
Known on the other hand, No.3 ~ 10 are the examples using the base wire meeting the important document that the present invention specifies to manufacture coated wire saw, between steel wire and organic coating, form coating, therefore, it is possible to improve the peel resistance of organic coating.In addition, in No.3 ~ 10, if compare the arithmetic average roughness Ra on base wire surface, then Ra is less, and afterturn value is larger, and the peel resistance reading organic coating has the tendency be further improved.In addition, in No.3 ~ 10, the oil mass being attached to the surface of base wire is every 1g base wire 70 below μ g, and the carbon component of surface attachments is every 1g base wire 15 below μ g.
Further, the base wire that uses of No.2 is become drawing speed during diameter 0.132mm little of 1.70m/ second by secondary wire drawing.Therefore, the base wire that No.2 uses, the arithmetic average roughness Ra on surface reaches less than 0.2 μm, but because between steel wire and organic coating, does not form coating, so can not improve the peel resistance of organic coating.
[table 1]
[experimental example 2]
Same with above-mentioned experimental example 1, after a rolled wire wire drawing is become diameter 0.88mm, then heat-treat (carrying out patenting process (LP) with 550 DEG C), after forming Cu coating afterwards, secondary wire drawing, to diameter 0.132mm, is then carried out degreasing, is manufactured base wire thus.
When secondary wire drawing is to diameter 0.132mm, use the lubricant (" メ テ Le シ Application (trade name) " of Kyoeisha Chemical Co., Ltd.) of oiliness.The oil temperature of lubricant is 25 DEG C, and drawing speed is 3.30m/ second.
In experimental example 2, degreasing is undertaken by following condition.
No.21 shown in following table 2, is after secondary wire drawing to diameter 0.132mm, does not carry out the example of the base wire of degreasing.
No.22 is after secondary wire drawing to diameter 0.132mm, floods in acetone after 8 hours and makes it dry, the example of the base wire obtained through degreasing thus.
No.23 is after secondary wire drawing to diameter 0.132mm, floods after 24 hours in acetone, carries out Ultrasonic Cleaning, then makes it dry, the example of the base wire obtained through degreasing thus.
With the condition identical with above-mentioned experimental example 1, observe with the surface of laser microscope for obtained base wire, thus the arithmetic average roughness Ra of measured surface.The measurement result of arithmetic average roughness Ra is presented in following table 2.
In addition, with the condition identical with above-mentioned experimental example 1, the oil mass on the surface of base wire is attached to FT-IR quantitative analysis.The quantitative result of oil mass is converted into every 1g base wire, the result obtained is presented in following table 2.
In addition, the carbon component of base wire r surface attachments, with the condition identical with above-mentioned experimental example 1, is measured by analysis of carbon and sulfur device by burning infrared absorption.The measurement result of carbon component amount is converted into every 1m base wire, obtained result is presented in following table 2.
Then, on the surface of the base wire obtained through degreasing, with the condition identical with above-mentioned experimental example 1, the polyurethane (organic coating) of coating thick 7 μm, manufactures coated wire saw thus.Further, observe the result of the section of coated wire saw, the thickness of coating is 0.3 μm.
Then, for made coated wire saw, carry out afterturn test with the condition identical with above-mentioned experimental example 1, evaluate the peel resistance of organic coating accordingly.Evaluation result is presented in following table 2.
No.21 ~ 23 are the examples of the coated wire saw using the base wire meeting important document given to this invention to manufacture, and be formed with coating, therefore can improve the peel resistance of organic coating between steel wire and organic coating.As shown in Table 2, the oil mass being attached to base wire surface more reduces, and afterturn value is larger, and the peel resistance of organic coating has the tendency be further improved.
[table 2]
[experimental example 3]
Same with above-mentioned experimental example 1, after a rolled wire wire drawing is become diameter 0.88mm, then form Cu coating after heat-treating (carrying out patenting process (LP) with 550 DEG C), secondary wire drawing is afterwards to diameter 0.132mm, then carry out degreasing, manufacture base wire thus.
When secondary wire drawing is to diameter 0.132mm, use the lubricant (" メ テ Le シ Application (trade name) " of Kyoeisha Chemical Co., Ltd.) of oiliness or the lubricant (" エ Off コ リ ユ mono-ベ (trade name) " of ADEKA ケ ミ カ Le サ プ ラ イ Co., Ltd.) of water-soluble oil.The oil temperature of lubricant is 25 DEG C, and drawing speed is 3.30m/ second.
In experimental example 3, condition when carrying out degreasing is altered to as follows.
No.31 shown in following table 3, is after secondary wire drawing to diameter 0.132mm, does not carry out the example of the base wire of degreasing.
No.32 is after secondary wire drawing to diameter 0.132mm, floods in ethanol after 8 hours and makes it dry, carries out degreasing thus and the example of base wire that obtains
No.33 is after secondary wire drawing to diameter 0.132mm, after carrying out bright annealing, makes it dry, carries out the example of the base wire that degreasing obtains thus in reducing atmosphere with 80 DEG C of heating 30 minutes.
No.34 is after secondary wire drawing to diameter 0.132mm, floods after 24 hours in acetone and carries out Ultrasonic Cleaning, then makes it dry, carries out degreasing thus and the example of base wire that obtains.
The surface of the base wire arrived with the condition laser capture microdissection sem observation gained identical with above-mentioned experimental example 1, the arithmetic average roughness Ra of measured surface thus.The measurement result of arithmetic average roughness Ra as described in Table 3.
In addition, be attached to the oil mass on the surface of base wire, with the condition identical with above-mentioned experimental example 1, carry out quantitative analysis by FT-IR.The quantitative result of oil mass is converted into the result of every 1g base wire, is presented in following table 3.
In addition, the carbon component of the surface attachments of the base wire obtained, with the condition same with above-mentioned experimental example 1, by burning infrared absorption, measures with analysis of carbon and sulfur device.The measurement result of carbon component amount is converted into every 1m base wire, and the result obtained is presented in following table 3.
Then, on the surface of the base wire obtained through degreasing, with the condition identical with above-mentioned experimental example 1, the polyurethane (organic coating) of coating thick 7 μm, manufactures coated wire saw thus.Further, observe coated wire saw section as a result, the thickness of coating is 0.3 μm.
Then, the peel resistance of the organic coating of made coated wire saw, is carry out afterturn test with the condition identical with above-mentioned experimental example 1, evaluates accordingly.Evaluation result is presented in following table 3.
No.31 ~ 34 are the examples of the coated wire saw using the base wire meeting important document given to this invention to manufacture, between steel wire and organic coating, be formed with coating, and therefore the peel resistance of organic coating improves.As shown in Table 3, the carbon component amount of the surface attachments of base wire more reduces, and afterturn value is larger, and the peel resistance of organic coating has the tendency be further improved.
[table 3]
Above, embodiments of the present invention and embodiment are illustrated, but the present invention is not limited to above-mentioned embodiment, as long as the content described in the scope of patent claim, just can various change implements in addition.The application based on the Japanese patent application (patent application 2010-038016) applied on February 23rd, 2010, its content in this as with reference to and quote.
Claims (12)
1. a base wire, it is the base wire of the coated wire saw from the teeth outwards with organic coating, it has steel wire and is formed in the coating on the surface of described steel wire, wherein, described steel wire carries out a wire drawing after implementing heat treatment to rolled wire, then heat-treats rear enforcement plating, then carry out secondary wire drawing, carry out degreasing and the steel wire obtained
The thickness of described coating is that the arithmetic average roughness Ra of 0.1 ~ 0.5 μm and/or described coating surface is below 0.2 μm.
2. base wire according to claim 1, wherein, described coating contains Cu and/or Zn.
3. base wire according to claim 1 and 2, wherein, the oil be attached on the surface of described coating is that every 1g base wire is at 70 below μ g.
4. base wire according to claim 1 and 2, wherein, the carbon component being attached to the surface attachments on the surface of described coating is that every 1m base wire is at 15 below μ g.
5. base wire according to claim 3, wherein, the carbon component being attached to the surface attachments on the surface of described coating is that every 1m base wire is at 15 below μ g.
6. a coated wire saw, it has the organic coating on the surface of the base wire according to any one of coating Claims 1 to 5.
7. cut off a manufacture method for body, wherein, spray abrasive particle to coated wire saw according to claim 6, with described coated wire saw, cutting workpiece is become to cut off body.
8. the manufacture method of a coated wire saw, it is the manufacture method of the coated wire saw from the teeth outwards with organic coating, wherein, the surface-coated organic coating of base wire, described base wire carries out a wire drawing after implementing heat treatment to rolled wire, then heat-treat rear enforcement plating, then carry out secondary wire drawing, carry out degreasing and the base wire obtained.
9. manufacture method according to claim 8, wherein, the thickness of the plating layer after described secondary wire drawing is 0.1 ~ 0.5 μm.
10. manufacture method according to claim 8 or claim 9, wherein, described secondary wire drawing is carried out with the drawing speed of 1 ~ 30m/ second.
11. manufacture methods according to claim 8 or claim 9, wherein, the carbon component being attached to the surface attachments on the coating surface of described base wire is that every 1m base wire is at 15 below μ g.
12. manufacture methods according to claim 10, wherein, the carbon component being attached to the surface attachments on the coating surface of described base wire is that every 1m base wire is at 15 below μ g.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010038016A JP5231471B2 (en) | 2010-02-23 | 2010-02-23 | Manufacturing method of base wire |
| JP2010-038016 | 2010-02-23 | ||
| PCT/JP2011/053748 WO2011105339A1 (en) | 2010-02-23 | 2011-02-21 | Base wire for coated saw wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102770237A CN102770237A (en) | 2012-11-07 |
| CN102770237B true CN102770237B (en) | 2015-10-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180010400.5A Expired - Fee Related CN102770237B (en) | 2010-02-23 | 2011-02-21 | The base wire of coated wire saw |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5231471B2 (en) |
| KR (1) | KR101403228B1 (en) |
| CN (1) | CN102770237B (en) |
| TW (1) | TWI453299B (en) |
| WO (1) | WO2011105339A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201343977A (en) * | 2012-04-27 | 2013-11-01 | Ritedia Corp | Composite wire saw having electroplating and method for fabricating the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002326151A (en) * | 2001-05-01 | 2002-11-12 | Noritake Super Abrasive:Kk | Resin bond wire saw |
| JP2005271131A (en) * | 2004-03-24 | 2005-10-06 | Noritake Super Abrasive:Kk | Resinoid bond wire saw, and its manufacturing method |
| JP2006179677A (en) * | 2004-12-22 | 2006-07-06 | Japan Fine Steel Co Ltd | Saw wire |
| CN1852796A (en) * | 2003-07-25 | 2006-10-25 | 宋健民 | Superabrasive wire saw and associated methods of manufacture |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62279015A (en) * | 1986-05-27 | 1987-12-03 | Daido Steel Co Ltd | Drawing method for wire rod |
| JPH10156584A (en) * | 1996-11-25 | 1998-06-16 | Nippon Steel Weld Prod & Eng Co Ltd | Manufacture of flux-cored wire for welding |
| JP3475271B2 (en) * | 2000-02-16 | 2003-12-08 | 金井 宏彰 | Wire for wire saw |
| JP2003291056A (en) * | 2002-04-01 | 2003-10-14 | Sumitomo Mitsubishi Silicon Corp | Wire cutting method for any object, cutting wire, and manufacturing method for wire |
| JP4299604B2 (en) * | 2003-07-14 | 2009-07-22 | 株式会社神戸製鋼所 | Drawing device |
| JP3959385B2 (en) * | 2003-08-26 | 2007-08-15 | 株式会社神戸製鋼所 | Manufacturing method of solid wire for welding |
| DE602005014019D1 (en) * | 2005-12-27 | 2009-05-28 | Japan Fine Steel Co Ltd | FIXED GRINDING WIRE |
-
2010
- 2010-02-23 JP JP2010038016A patent/JP5231471B2/en not_active Expired - Fee Related
-
2011
- 2011-02-21 WO PCT/JP2011/053748 patent/WO2011105339A1/en active Application Filing
- 2011-02-21 CN CN201180010400.5A patent/CN102770237B/en not_active Expired - Fee Related
- 2011-02-21 KR KR1020127021958A patent/KR101403228B1/en active IP Right Grant
- 2011-02-23 TW TW100105985A patent/TWI453299B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002326151A (en) * | 2001-05-01 | 2002-11-12 | Noritake Super Abrasive:Kk | Resin bond wire saw |
| CN1852796A (en) * | 2003-07-25 | 2006-10-25 | 宋健民 | Superabrasive wire saw and associated methods of manufacture |
| JP2005271131A (en) * | 2004-03-24 | 2005-10-06 | Noritake Super Abrasive:Kk | Resinoid bond wire saw, and its manufacturing method |
| JP2006179677A (en) * | 2004-12-22 | 2006-07-06 | Japan Fine Steel Co Ltd | Saw wire |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5231471B2 (en) | 2013-07-10 |
| KR20120120339A (en) | 2012-11-01 |
| KR101403228B1 (en) | 2014-06-02 |
| JP2011173194A (en) | 2011-09-08 |
| CN102770237A (en) | 2012-11-07 |
| TW201202477A (en) | 2012-01-16 |
| TWI453299B (en) | 2014-09-21 |
| WO2011105339A1 (en) | 2011-09-01 |
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