CN102768335A - Circuit and method for monitoring chip internal circuit signal - Google Patents
Circuit and method for monitoring chip internal circuit signal Download PDFInfo
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- CN102768335A CN102768335A CN2012102272209A CN201210227220A CN102768335A CN 102768335 A CN102768335 A CN 102768335A CN 2012102272209 A CN2012102272209 A CN 2012102272209A CN 201210227220 A CN201210227220 A CN 201210227220A CN 102768335 A CN102768335 A CN 102768335A
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Abstract
The invention provides a circuit for monitoring a chip internal circuit signal, which comprises a plurality of chip internal circuits to be tested, a multiplexer and a frequency dividing circuit, wherein the output ends of all the chip internal circuits are connected with the multiplexer; the multiplexer is used for selecting the signals which are output by the chip internal circuits, and transmitting the signal of a certain chip internal circuit to the frequency dividing circuit; and the frequency dividing circuit is connected with the multiplexer, and is used for dividing the frequency of the signal which is transmitted by the multiplexer or through processing the signal which is transmitted by the multiplexer according to a through control signal which is externally input by a chip. The invention further provides a method for monitoring the chip internal circuit signal. The circuit has a simple structure and low circuit area loss power, and is convenient to operate; and the circuit can be used for observing some key signals in the chip during the chip operating or testing process.
Description
[technical field]
The present invention relates to the chip design art field, relate in particular to a kind of circuit and method that is used for chip monitoring internal circuit signal.
[background technology]
After chip was being produced and encapsulated, the signal on the pin of entire I chip, other all chip internal circuit signals all became unobservable signal, and entire chip becomes an invisible immesurable black box.Unusual or test when unusual at chip operation, owing to can't observe any internal signal, get rid of bug to the tester and caused huge difficulty.As shown in Figure 1; Chip internal circuit A, internal circuit B, internal circuit C, internal circuit D, internal circuit E; Its entire circuit encapsulates, and can only observe the input of circuit A and the output of circuit E, does not observe the RST of any other circuit A to other circuit between the E.If can there be means can in chip operation or test process, observe some key signals of chip internal, this will reduce the difficulty that the tester gets rid of the bug process greatly.
[summary of the invention]
One of technical matters that the present invention will solve is to provide a kind of circuit that is used for chip monitoring internal circuit signal, can in chip operation or test process, observe some key signals of chip internal.
One of technical matters of the present invention is achieved in that a kind of circuit that is used for chip monitoring internal circuit signal, comprising: a plurality of chip internal circuit to be measured, the objective circuit of said each chip internal circuit for testing; The output terminal of each chip internal circuit all is connected with a MUX;
MUX after being responsible for the signal of each chip internal circuit output selected, is transferred to a frequency dividing circuit with the signal of a certain chip internal circuit of selecting;
Frequency dividing circuit is connected with said MUX, is responsible for according to the straight-through control signal of chip exterior input MUX being transmitted next signal and carries out exporting after frequency division or straight-through the processing.
Two of the technical matters that the present invention will solve is to provide a kind of method that is used for chip monitoring internal circuit signal.
Two of technical matters of the present invention is achieved in that a kind of method that is used for chip monitoring internal circuit signal, comprises the steps:
The output terminal of step 1, chip internal circuit that each is to be measured is connected to MUX;
The present invention has following advantage: circuit of the present invention comprises: a plurality of chip internal circuit to be measured, and the output terminal of each chip internal circuit all is connected with a MUX; MUX after being responsible for the signal of each chip internal circuit output selected, is transferred to a frequency dividing circuit with the signal of a certain chip internal circuit of selecting; Frequency dividing circuit is connected with said MUX, is responsible for according to the straight-through control signal of chip exterior input MUX being transmitted next signal and carries out exporting after frequency division or straight-through the processing.Because common IO chip has certain frequency transmission scope, when frequency was too high, high-frequency signal can become very poor through signal quality behind the IO, so just can't learn the actual signal of chip internal circuit, therefore carried out divide operation through frequency dividing circuit.Circuit structure of the present invention is simple, and the circuit area loss power is low, and is easy to operate; Can in chip operation or test process, observe some key signals of chip internal.
[description of drawings]
Fig. 1 is the synoptic diagram that each internal circuit of present technological chips connects.
Fig. 2 is the framework synoptic diagram of circuit structure of the present invention.
Fig. 3 is the inventive method schematic flow sheet.
[embodiment]
See also shown in Figure 2ly, a kind of circuit that is used for chip monitoring internal circuit signal of the present invention comprises
A plurality of chip internal circuit to be measured (like chip internal circuit A, internal circuit B, internal circuit C, internal circuit D, the internal circuit E among Fig. 1), the objective circuit of said each chip internal circuit for testing; The output terminal of each chip internal circuit all is connected with a MUX;
MUX after being responsible for the signal of each chip internal circuit output selected, is transferred to a frequency dividing circuit with the signal of a certain chip internal circuit of selecting;
Frequency dividing circuit is connected with said MUX, and the straight-through control signal of being responsible for according to the chip exterior input (is carried out test phase in chip testing factory to chip, the signal of the test probe input in the test board that this straight-through control signal can be a chip testing machine; Test behind circuit board in chips welding; Should straight-through control signal can be one group of toggle switch input; The figure place of toggle switch equals to need the I/O figure place of control, each corresponding toggle switch position, input position) signal that the MUX transmission is come carries out frequency division or straight-through and handles back output; Because common IO chip has certain frequency transmission scope, when frequency was too high, high-frequency signal can become very poor through signal quality behind the IO, so just can't learn the actual signal of chip internal circuit, therefore carried out divide operation through frequency dividing circuit.
Wherein, said MUX is selected the I/O control signal according to the path of chip exterior input (in chip testing factory chip is carried out test phase, it can be the signal of the test probe input in the test board of chip testing machine that this path is selected the I/O control signal; Test behind circuit board in chips welding; It can be one group of toggle switch input that this path is selected the I/O control signal; The figure place of toggle switch need to equal the I/O figure place of control, each corresponding toggle switch position, input position) signal of each chip internal circuit output is selected.
As shown in Figure 3, be the inventive method schematic flow sheet.A kind of method that is used for chip monitoring internal circuit signal of the present invention comprises the steps:
The output terminal of step 1, chip internal circuit that each is to be measured is connected to MUX;
Wherein, In the said step 3 signal of chip internal circuit output being carried out frequency division handles back output and is specially: the signal of chip internal circuit output is exported through a fixing divider ratios; The acquisition mode of said fixing divider ratios is: in the signal of each chip internal circuit output of MUX, obtain one can arrive maximum clock frequency signal (be have in the signal of each chip internal circuit output the clock frequency of a signal maximum); Inquire about the maximum clock frequency that said chip can bear (being the maximum clock frequency that each chip production is come out all to have oneself and can be born) simultaneously; Round behind the maximum clock frequency that the maximum clock frequency of the signal of chip internal circuit output can be born divided by said chip, as said fixing divider ratios.
In a word, circuit structure of the present invention is simple, and the circuit area loss power is low, and is easy to operate; Can in chip operation or test process, observe some key signals of chip internal.
The above is merely preferred embodiment of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (4)
1. a circuit that is used for chip monitoring internal circuit signal is characterized in that: comprise
A plurality of chip internal circuit to be measured, the objective circuit of said each chip internal circuit for testing; The output terminal of each chip internal circuit all is connected with a MUX;
MUX after being responsible for the signal of each chip internal circuit output selected, is transferred to a frequency dividing circuit with the signal of a certain chip internal circuit of selecting;
Frequency dividing circuit is connected with said MUX, is responsible for according to the straight-through control signal of chip exterior input MUX being transmitted next signal and carries out exporting after frequency division or straight-through the processing.
2. the circuit that is used for chip monitoring internal circuit signal according to claim 1 is characterized in that: said MUX selects the I/O control signal that the signal of each chip internal circuit output is selected according to the path of chip exterior input.
3. a method that is used for chip monitoring internal circuit signal is characterized in that, comprises the steps:
The output terminal of step 1, chip internal circuit that each is to be measured is connected to MUX;
Step 2, when each chip internal circuit to be measured is in work or test mode; Input needs the path of control to select the signal of a certain chip internal circuit that the I/O control signal selects to monitor on MUX, and signal is transferred to a frequency dividing circuit;
Step 3, judge whether this signal is high frequency clock signal, is, then on frequency dividing circuit, is input as 0 straight-through control signal, frequency dividing circuit work this moment is carried out frequency division with the signal of chip internal circuit output and is handled back output; Not, then on frequency dividing circuit, be input as 1 straight-through control signal, frequency dividing circuit work this moment is directly exported the signal of chip internal circuit output;
Step 4, tester observe from frequency dividing circuit and handle the RST that the signal of exporting the back just can be learnt corresponding chip internal circuit.
4. the method that is used for chip monitoring internal circuit signal according to claim 3 is characterized in that:
In the said step 3 signal of chip internal circuit output being carried out frequency division handles back output and is specially: the signal of chip internal circuit output is exported through a fixing divider ratios; The acquisition mode of said fixing divider ratios is: in the signal of each chip internal circuit output of MUX, obtain one can arrive maximum clock frequency signal; Inquire about the maximum clock frequency that said chip can bear simultaneously; Round behind the maximum clock frequency that the maximum clock frequency of the signal of chip internal circuit output can be born divided by said chip, as said fixing divider ratios.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102272209A CN102768335A (en) | 2012-06-29 | 2012-06-29 | Circuit and method for monitoring chip internal circuit signal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102272209A CN102768335A (en) | 2012-06-29 | 2012-06-29 | Circuit and method for monitoring chip internal circuit signal |
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| CN102768335A true CN102768335A (en) | 2012-11-07 |
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| CN2012102272209A Pending CN102768335A (en) | 2012-06-29 | 2012-06-29 | Circuit and method for monitoring chip internal circuit signal |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107407710A (en) * | 2015-03-03 | 2017-11-28 | 高通股份有限公司 | High-frequency signal observation in electronic system |
| CN110011659A (en) * | 2019-04-15 | 2019-07-12 | 上海安路信息科技有限公司 | Frequency divider and its chip |
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| SU1525636A1 (en) * | 1987-07-13 | 1989-11-30 | Таганрогский радиотехнический институт им.В.Д.Калмыкова | Logic tester |
| JPS6473642A (en) * | 1987-09-14 | 1989-03-17 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107407710A (en) * | 2015-03-03 | 2017-11-28 | 高通股份有限公司 | High-frequency signal observation in electronic system |
| CN110011659A (en) * | 2019-04-15 | 2019-07-12 | 上海安路信息科技有限公司 | Frequency divider and its chip |
| CN110011659B (en) * | 2019-04-15 | 2021-01-15 | 上海安路信息科技有限公司 | Frequency divider and chip thereof |
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Application publication date: 20121107 |