CN102766895A - Method for producing metal coatings on plastics material parts - Google Patents
Method for producing metal coatings on plastics material parts Download PDFInfo
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- CN102766895A CN102766895A CN2012101358753A CN201210135875A CN102766895A CN 102766895 A CN102766895 A CN 102766895A CN 2012101358753 A CN2012101358753 A CN 2012101358753A CN 201210135875 A CN201210135875 A CN 201210135875A CN 102766895 A CN102766895 A CN 102766895A
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- carrier
- plastic components
- interconnecting piece
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Inorganic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
A method for producing a metal coating on a plastics material part includes connecting each of a plurality of plastics material parts to a flexible support via a respective connecting part so as to temporarily chain the plurality of plastics material parts together. Each connecting part is attached to a respective one of the plurality of plastics material parts on at least one side. An electrically conductive connection is provided between the flexible support and each of the plurality of plastics material parts via the respective connecting part so as to provide a current supply for producing a galvanic metal coating layer on a conductive layer of each of the plurality of plastics material parts.
Description
Technical field
The present invention relates to a kind of method that is used on plastic components, especially 3D plastic components, making metallization structure, wherein, make conductive layer selectively and the galvanized thickening part of structure on conductive layer.
Background technology
The basic thought of MID member is to be integrated in the metallized injection molding part of being processed by thermoplastic material with mechanical function electric.At this, space structure not only can conduct electricity but also can be used for shielding or constitute emitting surface.
In laser direct organizationization (LDS), on the surface of single component injection molding part, add circuit structure by laser beam.Form surface tissue favourable for subsequent metalization simultaneously, this surface tissue guarantees to adhere to admirably the printed conductor that is produced.Another kind of possibility is, by the metallized surface of laser ablation.
In subtraction technology, the laser subtraction structureization that is otherwise known as (LSS), whole member is not used copper metallization with having foreign current.After applying copper with galvanized mode, can in next procedure, apply resist, it is the laser beam quilt structurizing on the position at following insulated channel place exactly through focusing on subsequently.In next procedure, copper is etched and the surface is made with extra care.
In the bicomponent injection molding moulding, the activation of frosting is carried out as nucleus with palladium through preferred.And then, apply the copper layer thickness of hope with chemistry or electrolytic mode.The shortcoming of the method for said no foreign current is: this method is the very time-consuming and maximum layer thickness that reaches 20 μ m based on lower deposition.
General process is identical in proper order for the method for being mentioned, and it comprises step: injection moulding, pre-treatment/laser activation and chemical metallization.Therefore, all methods all have chemical metallization problem (especially can reach expensive that metal thickness is less, parts residence time in the metallization pond is long and relevant therewith).In addition, various process steps causes the parts processing costs very high in practice.This expense also is further improved through being necessary for the custom-designed part holding device of various frame modes, treatment system, anchor clamps and transport container.
Be to be used for meeting the parts that the point of destination makes up the metal antenna structure and to handle in the chemical metallization pond at the cylinder of rotation what the big market of the antenna that for example is used for mobile telephone or modern smart mobile phone belonged to prior art as loose material.According to the size of parts and cylinder, this cylinder usually is loaded several thousand until several ten thousand parts.The technician know this mode that parts are handled in roller unit as loose material for filament with mechanical sensitive parts problematic exactly or impossible fully.Be clear that in addition metallized quality is owing to the phase mutual friction of parts in the cylinder of rotation reduces.
MID plastic components, the antenna that for example is used for mobile telephone have one or more conductive regions not connected to one another usually.Different according to method, these zones receive special processing after injection moulding, so that deposited copper selectively there only.For plated metalization, a plurality of preconditions must be satisfied in these zones.The first, must pass through chemical metallization or other method that is fit to constructed continuous conduction in these zones initiation layer.The second, All Ranges must be connected on the current potential.The 3rd, these zones must be when production process finishes electrical separation each other.
Each single method steps (for example pre-treatment, chemical metallization etc.) from injection molding part also becomes difficult more owing to the processed respectively member of each single method steps is converged into loose material in the prior art.Therefore in order to reprocess, at first need member accurately be positioned in the accommodation section respectively, and the requirement to bearing accuracy is very high when laser activation.
Summary of the invention
The present invention based on task be to make the processing to member become easy; Especially should remove repeatedly the quantity that with each single member is inserted in the corresponding accommodation section and significantly reduced a large amount of different accommodation sections from this, thereby reduce the installation costs of every kind of element type and can reach fast at low cost through plated metalization to form thick copper layer with the obvious higher sedimentation velocity of the accessible sedimentation velocity of chemical metallization than net income.
According to the present invention, this task is able to solve by the method according to the characteristic of claim 1.Other scheme of the present invention can draw from dependent claims.
According to the present invention; Stipulate a kind of method; Wherein, said plastic components is connected with flexible carrier, especially travelling belt by interconnecting piece, and said carrier is in one or both sides and corresponding plastic components adjacency; So that realize the temporary transient link of a plurality of plastic components, and set up between carrier and plastic components that conduction connects so that supply power for plated metalization by interconnecting piece.Thus, by carrier plastic components is linked into open-ended in principle band through unexpected simple mode, this band can transport through known e Foerderanlage simply.At this; A kind of scheme of process chain is following; Promptly; Carrier directly is supplied to from a plurality of plastic components treatment station of moulding until the formation electrolytic coating continuously, can expect that also the carrier that for example will connect plastic components is wound up on the coil stand as work in-process, so that also can further use as required at different manufacturing locations.Therefore, the MID plastic components can be connected to each other with simple mode, makes these plastic components can be without a doubt transfer to another course of processing and by plated metalization, undertaken by carrier in this power supply from a course of processing.
In a kind of particularly advantageous scheme according to the method for the invention, the one-body molded interconnecting piece of difference on each plastic components.Thus, can in a common manufacturing step, be fabricated to integrated member and reprocessing through making two parts, removed from otherwise can need additionally be used between plastic components and interconnecting piece, forming machinery and the step that is electrically connected.Subsequently, many plastic components connect into band by interconnecting piece and the carrier that one is injection-moulded on the corresponding plastic components.
Can expect in principle and also attainablely in practice be; Except that interconnecting piece; Also can in injection molding process, just carrier be fabricated to open-ended band with plastic components, so that can in unique algorithm, co-manufactured go out the parts that all need.On the contrary, what be particularly suitable for putting into practice is a kind of like this flexible program, wherein, and interconnecting piece and carrier, for example in the forming part and/or the especially mechanically interlock of indent of carrier.Thus, can simplify manufacturing step through following manner, that is, in an algorithm of separating with the carrier manufacturing, make plastic components (its be included in maybe situation under one be injection-moulded in the interconnecting piece on it), make and can the commercial criterion product be used as carrier.Carrier for example is configured to pore area for this reason, is thus connected parts and can passes the portion of running through of carrier and form mechanical snap at this through undercut.Form the connection that to bear high mechanical load in this way.
On the one hand can be through clocklike a plurality of forming parts or recess through driving wheel being embedded guarantee in the forming part propelling of stipulating, on the other hand for propelling and non-essential recess or forming part be used for the mechanical fixation interconnecting piece.This is for example bored a hole also be fit to.
In the particularly advantageous scheme of another kind; Interconnecting piece is along being connected with plastic components as the material portion that weakens of regulation fracture position, so as to simplify plastic components and interconnecting piece future separate and especially through regulation fracture position prevention damage plastic components when the big power of plastic components transmission is avoided for example at the coiling carrier.
The specification of the plastic components of common manufacturing and size often allow one-sided fix of plastic components on unique carrier in the practice.But particularly advantageous is that two carriers are connected with a plastic components between them.Thus, even big relatively plastic components also can be fixing by reliably, these plastic components between the carrier of the outside be protected with the mode of the best in addition and by mechanically stable fix.
Similarly, such carrier also is fit to, and it has the recess that is used for plastic components between two outer ledges.But a kind of like this scheme especially meaningfully of the present invention: a plurality of parallel carriers connect through the web plate that is arranged between the adjacent plastic components, and these web plates remain on carrier on the spacing of regulation and therefore can be of different sizes according to each plastic components.Thus, carrier can generally use and connect by the web plate that is used for different plastic components of different lengths.
Web plate is except having the carrier mechanically stable in the function on the spacing of regulation; According to a kind of flexible program of the present invention (wherein web plate is connected with plastic components); Web plate also satisfies the task of directly connecting plastic components, thereby can plastic components be electrically contacted conducting by web plate.
Certainly, can connect into the interrelated of implementation procedure step under the situation of band at plastic components with simple mode, wherein, plastic components passes through all process steps successively in a unified work period.Even but separated from one another in other words under the situation of separately carrying out on the place in each process steps, the present invention also has significant advantage.With the plastic components of prior art-wherein after each process steps be separate and as loose material be supplied to next processing station and therefore at first need be fixed in the accommodation section-opposite; The embodiment favourable according to another kind, said at least one carrier is wound up on the coil stand with the plastic components of connection and is offered next processing unit (plant) like this.
For this purpose; According to another kind of embodiment; Carrier and/or web plate are connected with spacer, and said spacer has transverse to the height of carrier principal spread direction and such size, makes that each plastic components has enough spacings each other in the reeling condition of carrier.Thus, the carrier of rolling so for example can be used as integral body, promptly in reeling condition, sinks in the metallization pond, thus can the many plastic components of while fast processing.Spacer both can be configured to the integrated integral part that independent element also can be configured to web plate or carrier at this.In addition, also can replenish spacer as required.
In the suitable equally especially scheme of another kind, independent, reusable plastic tape is reeled with carrier as spacer, makes to form alternative plastics belt and carrier layer.At this, plastic tape can have suitable recess, and it allows according to the rules that destination location correctly is configured in the carrier that the front and back reclines.Also can add spacer when needing in this way, thereby can realize making especially flexibly.
Carrier for example can be processed by electro-conductive material, especially metal, electrically contacts conducting so that simplify, and it allows the many plastic components of plated metalization simultaneously.And a kind of particularly advantageous flexible program of the present invention is; At least one carrier process by non-conducting material, for example plastics and; Especially based on previous selectable activation, be manufactured on that interconnecting piece is connected with conduction between the carrier and/or be connected with conduction between at least one of plastic components, the preferred a plurality of conductive regions at interconnecting piece.Thus, in a common method steps, can carry out the activation and the back to back selectable metallization of plastic components, interconnecting piece and carrier.Thereby conductive characteristic forms as required and the zone that therefore can be confined to define in.
Electrically contact the conducting carrier by slider, allow simple plated metalization, its mode is: by the centre feed device needed power supply is delivered on the plastic components of all electrical connections.Slider for example can be realized through the frictionwheel that reclines at this.
In addition, prove also in practice particularly advantageously to be that said interconnecting piece is connected with carrier along a skeletal lines, the length of this skeletal lines is obviously greater than the width of interconnecting piece.In other words, the length of the osculatory between interconnecting piece and carrier obviously increases through following manner, that is, osculatory is not as the crow flies but for example waviness, comb shape or the extension of zig-zag ground.Similarly, the portion of running through in the zone of interconnecting piece on abutting in carrier, for example bore a hole and also can be used for prolonging osculatory.
In the favourable scheme of another kind of the present invention, plated metalization is carried out in electrolyzer, and the carrier in electrolyzer under reeling condition is contacted conducting on end face.Thus, need not carrier be launched from its coil stand, realize the space utilization of the best in the electrolyzer thus on the one hand through the compact Layout of treating metallized plastic components, also can required trucking costs be reduced to minimum degree on the other hand.
In the same advantageous method of another kind; Plastic components, interconnecting piece and carrier are plated conductive layer entirely outwardly in chemistry and/or plated metal process; With after-applied resist, the resist especially processed by tin; After this, by laser introduce insulated track and the most at last the conductive layer zone of so exposing etch away.
Through using the unified carrier with fixed-grid to make flexibly, that is, the different plastics parts only need the sequence of control of change where necessary in order to implement this method, and basically need not be suitable with Technology.
In order to confirm the position, can detect web plate and/or recess in the carrier, so that confirm the position more simply based on unified recognition feature.
The separation of plastic components can be in the individual working step, for example also be installed as product with plastic components carries out in combination.In this proof advantageously, interconnecting piece separates with plastic components through the separation method of machinery or by electromagnetic radiation along regulation fracture position and/or the material portion that weakens.For this reason, known press tool or laser cutting device are fit to.The input of less heat proves favourable for two kinds of methods, and wherein, laser cutting only just can be without a doubt changes along regulation fracture position or the material portion that weakens through routine change to be treated isolating profile and so can use neatly in practice.
Be adapted on the said methodological principle using in all MID method of manufacture, just list at this and enumerate LDS method, bicomponent injection molding forming method or subtractive processes.For example also can implement to be used to change the method on non-conductive surface,, on these groups, electro-conductive material is set in view of the above so that through the fixing functional chemical group that is fit to metal level is set according to the pattern of hope.Therefore, this electro-conductive material is configured for forming the basis according to concrete metal level pattern, that hope thickness of hoping.This adding than thick-layer can be through using traditional autocatalytically pond that is used for metal plating and preferably in electrolytic plating pool, realizing selectively at category of the present invention.
Description of drawings
The present invention allows multiple different embodiment.In order to further specify its ultimate principle, show that with accompanying drawing wherein a kind of embodiment also describes it below.Accompanying drawing is following:
Fig. 1 is presented at the one-sided plastic components that is connected with carrier by interconnecting piece with vertical view;
Fig. 2 is presented at the plastic components that bilateral is connected with carrier by interconnecting piece with vertical view;
Fig. 3 shows the plastic components shown in Fig. 2 with vertical view, and it additionally is connected with web plate;
Fig. 4 shows the scheme of a kind of replacement of the interconnecting piece that is connected with carrier with detail view;
Fig. 5 shows the carrier shown in Fig. 1 to 3 with detail view;
Fig. 6 is presented at according to the carrier of Fig. 4 and the connection between the interconnecting piece with cross sectional side view;
Fig. 7 illustrates the coiling of the carrier that is connected with plastic components on coil stand shown in Fig. 3 with side-view;
Fig. 8 a illustrates interconnecting piece shown in Fig. 3 and carrier with detail view;
Fig. 8 b is illustrated in the another kind of scheme of the connection between interconnecting piece and the carrier with another detail view;
Fig. 9 is illustrated in the plastic components shown in Fig. 3 in the contact conducting on the web plate and by the contact conducting of interconnecting piece on carrier with vertical view.
Embodiment
Specify the method that is used on plastic components, especially 3D-MID plastic components 3, making metallization structure 8 according to of the present invention by Fig. 1 to 9 below, wherein, come to make selectively conductive layer by chemical technology and plated metalization subsequently.
In this idea behind the present invention be: each plastic components 3 that is connected to each other like this makes it can be easily transfer to the next course of processing and by plated metalization from a course of processing.
In order to solve transportation problem, will insert in the unshowned injection molding tool by plastics or metal for example zonal carrier 1, so that the interconnecting piece 2 of this carrier through injection moulding is connected with plastic components 3.Distinguish to some extent in this different scheme according to the method for the invention.
In first kind of embodiment of the present invention, as shown in Figure 1, plastic components 3 is connected with carrier 1 in the side, and this carrier has the transportation that a plurality of forming parts 5 that clocklike are made up of perforation are used to stipulate.
Relative therewith, as shown in Figure 2, bigger plastic components 3 is connected with a carrier 1 respectively in both sides.Therefore advantageously, these two carriers 1 are connected to each other to through web plate 6 and have uniform spacing and be maintained on the spacing of regulation.
Under the situation of using this web plate 6, plastic components 3 also can or be connected with the band structure of carrier 1 at three on four sides, and is as shown in Figure 3.
This carrier 1 that has a plurality of plastic components 3 can be winding on the coil stand 11.This coil can transport between each process step simply and for example can be supplied to laser processing device automatically.After procedure of processing, the carrier 1 that has plastic components fixed thereon 3 can be rolled automatically.Equally, this coil also can be used as integral body and sinks in the metallization pond.Therefore need not single parts processed.
Alternative as these spacers 10; Can unshowned independent, a reusable plastic tape with distance piece be rolled with said carrier 1, make the exterior lateral area of distance piece contact carrier 1 and the interval of guaranteeing the definition of each plastic components 3.
Particularly advantageously be: the described carrier of being processed by metal or plastics 1 is used to the plated metalization of plastic components 3.Plastic components 3 has one or more conductive regions not connected to one another usually.After injection moulding, receive special processing according to different these zones of method, so that deposited copper selectively there only.For these regional plated metalizations, must satisfy a plurality of preconditions.The first, must pass through chemical process constructed continuous conduction in these zones initiation layer.The second, All Ranges must be connected on the current potential.The 3rd, these zones must electricity separation each other when production process finishes.
According to the present invention, as shown in Figure 9, the conductive region of plastic components 3 is connected with one or more carriers 1 by interconnecting piece 2 in a side or many sides, thus, can realize power supply by interconnecting piece 2 and web plate 6 to these conductive regions through carrier 1.
Interconnecting piece 2 between carrier 1 and each plastic components 3 has the material that is embodied as contraction flow region and weakens portion 4, weakens portion through this material, and at first a reliable mechanical complex body is maintained.Simultaneously plastic components 3 can be when production process finishes weakens portion 4 through the separation method that is fit to such as punching press or laser cutting along material and from complex body, separates.Each interconnecting piece 2 can couple together one or more conductive regions of corresponding plastic components 3 with the strip-like carrier 1 that is made of metal.For this reason interconnecting piece 2 at least on regional area with the conductive region of plastic components 3 by pre-treatment and plated metalization.
In the method for being advised, use carrier 1 that is made of metal and the carrier 1 that is made of plastics to distinguish to some extent.
Through pre-treatment (for example through laser beam and chemical metallization pre-treatment subsequently) interconnecting piece, can be at the strip-like carrier that is made of metal 1 and interconnecting piece 2 and produce the conduction connection between the conductive region of plastic components 3 thus.Can continue thus and reliably through carrier 1 to plastic components 3 power supply and satisfied a basic premise condition of the conductive region of plastic components 3 being carried out plated metalization.
Particularly advantageously for the reliable electrical connection of carrier 1 and interconnecting piece 2 be, increase carrier 1 and interconnecting piece 2 the plastics that are metallized be connected length.
The exemplary a kind of favourable pectination 9 that the interconnecting piece 2 of injection moulding is shown of Fig. 4.Other shape that can expect pectination 9 equally is hook, arc, two arc or angle for example.These structures can prolong effective connection length once more.
Equally advantageously the perforation of carrier 1 is together with the portion of running through in the zone of pectination 9 of said interconnecting piece, and is as shown in Figure 5.These run through portion and in injection molding process, are filled plastics.As shown in Figure 6 thus, in the stable connection of generation between the broach on carrier 1 upside and the downside of interconnecting piece 2.
Fig. 6 illustrates the exemplary xsect in the broach zone that is made up of perforation according to being connected between the carrier 1 of Fig. 4 and the interconnecting piece 2.Be favourable: the transportation in the carrier 1 and the zone of bullport are not sealed by plastic injection-moulded yet.Guaranteed according to the rules the supporting of carrier 1 in automatic conveying device and processing unit (plant) on the travelling belt meaning thus.But all low-resistance power supplies on the optional position of carrier 1 in this external plated metal process.
When being used as carrier 1 with plastic tape or by the band that another kind of non-conducting material is processed, just need be through the possibility of carrier 1 power supply and the connection of therefore between interconnecting piece 2 and carrier 1, need not conducting electricity.But, can the interconnecting piece injection moulding that carrier 1 is made of plastics in the regional area on its length continuously be sealed, shown in Fig. 8 a and Fig. 8 b as alternative.The perforation in the injection moulding zone of carrier 1 is similar to the carrier that is made of metal 1 shown in Fig. 5 and designs and guarantee the stable connection between carrier 1 and interconnecting piece 2.
Through chemical metallization interconnecting piece 2, produce the strip conductor that links up along carrier 1, it can be used for continuous power supply, and this can find out from Fig. 8 b.Be proved to be favourable also having at this, at least one side in transportation and bullport zone is not sealed by plastic injection-moulded, so that keep transporting and adding the particularity of height location in man-hour.
Irrelevant with employed solid support material, can use one or more, preferred two carriers 1, it all is used for power supply.These carriers web plate 6 capable of using connects.Web plate 6 can have perforation.Interconnecting piece 2 can with web plate 6 to be connected with carrier 1 identical mode, this especially can find out from Fig. 9.
In one embodiment of the invention, plated metalization is carried out in unshowned container.For this reason, as shown in Figure 7, the copper pin 7 contact conductings that coil stand 11 is provided with through star on end face with the carrier 1 above that, that be loaded with plastic components 3 of reeling.The carrier of being processed by metal strip 1 can directly be connected with copper pin 7 conductions at its end face, and under the situation of using the carrier of being processed by non-conducting material 1, structure interconnecting piece 2 makes it on end face, have metallized surface like this, and this is shown in Fig. 8 b.
Another kind of scheme regulation of the present invention, plastic components 3 are fully by can metallized injection molding and quilt plated with copper outwardly entirely in chemical bath and electrolytic plating pool and then.In subsequent step, plate the resist of processing by tin for plastic components 3.The structurizing of conductive layer is so to realize, promptly in the tin layer, introduces insulated track through laser and etches away the copper zone of so exposing subsequently.Similar with said process, at this through plastic components 3 and be connected the processing of also having simplified between each process steps as travelling belt carrier 1.The plating enhanced advantage of described in the method copper layer has also played effect.
Can be used for all known MID method of manufacture that are used for metallized plastic parts 3 in principle and therefore never only be confined to the laser direct organizationization at this according to the method for the invention.
Claims (21)
1. be used on plastic components (3), especially 3D plastic components, making the method for metallization structure; Wherein, Make conductive layer selectively and structure plated metal structure (8) on conductive layer; It is characterized in that said plastic components (3) is connected with flexible carrier (1), especially travelling belt by interconnecting piece (2), said carrier is in one or both sides and corresponding plastic components (3) adjacency; So that realize the temporary transient link of a plurality of plastic components (3), and between carrier (1) and plastic components (3), set up conduction by interconnecting piece (2) and connect so that supply power for plated metalization (8).
2. method according to claim 1 is characterized in that, goes up one-body molded interconnecting piece (2) respectively at each plastic components (3).
3. method according to claim 1 is characterized in that, said interconnecting piece (2) and carrier (1) are for example in the forming part (5) and/or the especially mechanically interlock of indent of carrier (1).
4. method according to claim 3 is characterized in that, said forming part (5) and/or recess are arranged in the carrier (1) regularly.
5. at least one described method in requiring according to aforesaid right is characterized in that said interconnecting piece (2) weakens portion (4) along the material as the regulation fracture position and is connected with plastic components (3).
6. at least one described method in requiring according to aforesaid right is characterized in that two carriers (1) are connected with a plastic components (3) between them.
7. at least one described method in requiring according to aforesaid right is characterized in that, a plurality of parallel carriers (1) connect through the web plate (6) that is arranged between adjacent each plastic components (3).
8. method according to claim 7 is characterized in that, said web plate (6) is connected with plastic components (3).
9. at least one described method in requiring according to aforesaid right is characterized in that said at least one carrier (1) is wound up on the coil stand (11) with the plastic components that is connected (3).
10. at least one described method in requiring according to aforesaid right; It is characterized in that; Said carrier (1) and/or web plate (6) are connected with spacer (10); Said spacer has transverse to the height of carrier (1) principal spread direction and such size, makes that each plastic components (3) has enough spacings each other in the reeling condition of carrier (1).
11. at least one described method in requiring according to aforesaid right is characterized in that, independent, reusable plastic tape is reeled with carrier (1) as spacer, makes to form alternative plastics belt and carrier (1) layer.
12., it is characterized in that at least one carrier (1) is processed by non-conducting material, for example plastics according at least one described method in the aforesaid right requirement.
13. according at least one described method in the aforesaid right requirement; It is characterized in that; Through thin chemical metallization structure, especially based on previous selectable activation, be manufactured on that interconnecting piece (2) is connected with conduction between the carrier (1) and/or be connected with conduction between at least one of plastic components (3), the preferred a plurality of conductive regions at interconnecting piece (2).
14. require at least one described method in 1 to 12 according to aforesaid right; It is characterized in that, be connected with conduction between the carrier (1) and/or conduction between at least one of interconnecting piece (2) and plastic components (3), preferred a plurality of conductive regions is made through forming conductive surface after being connected previous selectable surface roughening at interconnecting piece (2).
15., it is characterized in that at least one carrier (1) is electrically contacted conducting by slider according at least one described method in the aforesaid right requirement.
16. according at least one described method in the aforesaid right requirement; It is characterized in that; Said interconnecting piece (2) is connected with carrier (1) along a skeletal lines, and the length of this skeletal lines is obviously greater than the development length of interconnecting piece (2) on the longitudinal direction of carrier (1).
17., it is characterized in that according at least one described method in the aforesaid right requirement, in electrolyzer, implement plated metalization (8), the carrier (1) that in electrolyzer, is in reeling condition is contacted conducting on end face.
18. according at least one described method in the aforesaid right requirement; It is characterized in that; Give said plastic components chemistry with the electroplated metal process in plate conductive layer entirely outwardly; With after-applied resist, the resist especially processed by tin, then by laser introduce insulated track and the most at last the zone of so exposing of conductive layer etch away.
19., it is characterized in that the position of optical detection plastic components (3) according at least one described method in the aforesaid right requirement.
20. according at least one described method in the aforesaid right requirement, it is characterized in that,, detect the forming part (5) in web plate (6) and/or the carrier (1) in order to confirm the position.
21. at least one described method in requiring according to aforesaid right is characterized in that, said interconnecting piece (2) weakens portion (4) along regulation fracture position and/or material to be separated with plastic components (3) through the separation method of machinery or by electromagnetic radiation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011050131.2 | 2011-05-05 | ||
| DE102011050131A DE102011050131B3 (en) | 2011-05-05 | 2011-05-05 | Preparing metallizations made of three-dimensional plastic parts, comprises selectively preparing conductive layer, selectively constructing galvanic metallization, and connecting plastic part by connecting part with flexible carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102766895A true CN102766895A (en) | 2012-11-07 |
| CN102766895B CN102766895B (en) | 2015-01-21 |
Family
ID=46579856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210135875.3A Expired - Fee Related CN102766895B (en) | 2011-05-05 | 2012-05-04 | Method for producing metal coatings on plastics material parts |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20120279867A1 (en) |
| EP (1) | EP2546390B1 (en) |
| JP (1) | JP2012233258A (en) |
| KR (1) | KR101431895B1 (en) |
| CN (1) | CN102766895B (en) |
| DE (1) | DE102011050131B3 (en) |
| TW (1) | TWI496960B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109301674A (en) * | 2017-07-24 | 2019-02-01 | 利萨·德雷克塞迈尔有限责任公司 | For manufacturing the method and adapted to injection system of conductor rail complex |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102229767B1 (en) | 2016-05-12 | 2021-03-19 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | A build material source container |
| CN114921826B (en) * | 2022-05-26 | 2022-11-29 | 恩森（台州）化学有限公司 | High-corrosion-resistance plastic electroplating system and method |
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| CN1379829A (en) * | 1999-10-12 | 2002-11-13 | 埃托特克德国有限公司 | Carrier serving for supplying current to workpieces or counter-electrodes that are to be treated electrolytically and method for electrolytically treating workpieces |
| CN1427902A (en) * | 2000-04-20 | 2003-07-02 | 埃托特克德国有限公司 | Electrical contacting element made of elastic material |
| DE202006017857U1 (en) * | 2006-11-23 | 2007-03-29 | Dürr Systems GmbH | Workpiece support for moving vehicle bodies through electro immersion paint bath has contact face where support contacts conveyor electrically insulated from contacting device introducing coating current to prevent friction |
| WO2008081490A1 (en) * | 2007-01-03 | 2008-07-10 | Occleppo S.R.L. | Gripping device and clamping pincers with double cathode contact on both sides of a dielectric substratum to be electroplated |
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| JPH04131654U (en) * | 1991-05-29 | 1992-12-03 | 日立化成工業株式会社 | Molded products for plating |
| US5188546A (en) * | 1992-02-25 | 1993-02-23 | Molex Incorporated | Continuous carrier web member and method of fabricating sheet metal components for electrical connectors |
| US5783370A (en) * | 1996-07-24 | 1998-07-21 | Seagate Technology, Inc. | Panelized printed circuit cables for high volume printed circuit cable manufacturing |
| JP2001003178A (en) * | 1999-06-21 | 2001-01-09 | S M Ii:Kk | Parts tape for plastic plating, its reel and plating method |
| DE10007799C1 (en) * | 1999-10-12 | 2001-06-07 | Atotech Deutschland Gmbh | For supplying current to workpieces to be treated electrolytically or supports serving as counter electrodes and method for the electrolytic treatment of workpieces |
| US6294060B1 (en) * | 1999-10-21 | 2001-09-25 | Ati Properties, Inc. | Conveyorized electroplating device |
| US8336200B2 (en) | 2006-05-26 | 2012-12-25 | Sg Design Technologies | Apparatus, system, and method for maintaining part orientation during manufacturing |
| EP2267184A1 (en) * | 2009-06-22 | 2010-12-29 | Thales Nederland B.V. | A method for plating a copper interconnection circuit on the surface of a plastic device |
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2011
- 2011-05-05 DE DE102011050131A patent/DE102011050131B3/en not_active Expired - Fee Related
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2012
- 2012-04-20 TW TW101114042A patent/TWI496960B/en not_active IP Right Cessation
- 2012-04-23 EP EP12401066.1A patent/EP2546390B1/en not_active Not-in-force
- 2012-05-02 KR KR1020120046354A patent/KR101431895B1/en not_active IP Right Cessation
- 2012-05-02 JP JP2012105196A patent/JP2012233258A/en active Pending
- 2012-05-04 CN CN201210135875.3A patent/CN102766895B/en not_active Expired - Fee Related
- 2012-05-07 US US13/465,063 patent/US20120279867A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1379829A (en) * | 1999-10-12 | 2002-11-13 | 埃托特克德国有限公司 | Carrier serving for supplying current to workpieces or counter-electrodes that are to be treated electrolytically and method for electrolytically treating workpieces |
| CN1427902A (en) * | 2000-04-20 | 2003-07-02 | 埃托特克德国有限公司 | Electrical contacting element made of elastic material |
| DE202006017857U1 (en) * | 2006-11-23 | 2007-03-29 | Dürr Systems GmbH | Workpiece support for moving vehicle bodies through electro immersion paint bath has contact face where support contacts conveyor electrically insulated from contacting device introducing coating current to prevent friction |
| WO2008081490A1 (en) * | 2007-01-03 | 2008-07-10 | Occleppo S.R.L. | Gripping device and clamping pincers with double cathode contact on both sides of a dielectric substratum to be electroplated |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109301674A (en) * | 2017-07-24 | 2019-02-01 | 利萨·德雷克塞迈尔有限责任公司 | For manufacturing the method and adapted to injection system of conductor rail complex |
| CN109301674B (en) * | 2017-07-24 | 2021-05-28 | 利萨·德雷克塞迈尔有限责任公司 | Method and injection molding system for producing conductor rail composite bodies |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102766895B (en) | 2015-01-21 |
| KR20120125169A (en) | 2012-11-14 |
| KR101431895B1 (en) | 2014-08-27 |
| US20120279867A1 (en) | 2012-11-08 |
| DE102011050131B3 (en) | 2012-08-16 |
| EP2546390B1 (en) | 2015-10-07 |
| TWI496960B (en) | 2015-08-21 |
| EP2546390A1 (en) | 2013-01-16 |
| JP2012233258A (en) | 2012-11-29 |
| TW201245507A (en) | 2012-11-16 |
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