JP2000054188A - Method and device for continuously coating polymer film with metal, and product produced thereby - Google Patents

Abstract

PROBLEM TO BE SOLVED: To promote the flow of electric current flowing to a substrate by utilizing the current conduction capacity of a deposited metal and to provide an electrodeposition device by which the electrodepositing time is shortened. SOLUTION: This device has a tank holding an electrolyte, a drum 50 set in the tank, having a nonconductive cylindrical surface and rotatable around its horizontal axis and plural slender similar anodes 60 arranged around the outer surface of the drum 50. The anodes 60 form a continuous cylindrical surface separated from the outer surface of the drum 50 and practically following the outer surface. At least one end of each anodes 60 is projected from the tank. Plural power sources are furnished along with a connecting means for connecting the group of the projected ends of the anodes 60 to the respective power sources.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to metal electrodeposition. In particular, it relates to metallization of flexible polymer sheets. The invention is particularly applicable to a method and apparatus for electroplating a metal layer on a non-metallic, electrically insulating substrate having a metal flash adhered to its upper surface.

[0002]

BACKGROUND OF THE INVENTION This application is a continuation-in-part (CIP) of U.S. patent application Ser. No. 08 / 347,850, filed Dec. 1, 1994. The application was filed on July 27, 1993
No. 08 / 098,440, filed on Jul. 1, 1992, which is also a continuation of US Patent Application No. 07 / 907,066, filed Jul. 1, 1992.

[0003] The electrodeposition of metals from aqueous solutions is known in the art. In short, this process is
It includes a cathode, an anode (collectively referred to as "electrodes"), an aqueous solution containing ions of the metal to be electrodeposited, and an external current source. When current is supplied to the anode, metal ions are reduced and electrodeposited from the aqueous solution. Virtually all metals (typically metal salts) that can be solvated by water can be electrodeposited by the equipment defined above.

[0004] Electrodeposited copper is widely used in the electronics industry. Conventionally, electrodeposited copper is obtained in roll form, which is cut into sheet form, adhered to a polymer board and etched. Next, the individual electronic components are mounted on a circuit board,
The circuit board is inserted into the device or device.

When the non-metallic electrically insulating substrate is a flexible polymer sheet, a flash of metal adhered to the flexible polymer substrate by sputtering, vapor deposition, electroless metal deposition, or similar methods. A metal such as copper can be electrodeposited directly on top. According to such a method, there is no need to perform an intermediate step of bonding the metal foil to the substrate. The flexible polymer sheet can be pre-treated before depositing a metal flash on top. If the polymer is pre-metallized, the metal can be electrodeposited on a flash of this metal, and the thickness of the electrodeposited metal is reduced to a conventional thickness, i.
It can be formed up to 5 to about 2 ounces (corresponding to a thickness of about 0.3 to about 2.8 mils).

The resulting metallized flexible polymer films have applications in flex circuits, tape automated bonding, electromagnetic interference shielding, and other fields where metallized substrates are utilized.

The following US patents describe inventions relating to polymers and other similar non-metallic metallizations.

[0008] Morrissey et al., US Pat.
No. 83,036 describes a method for electroplating a non-conductive substrate using the reducing capacity of hydrogen in the presence of a photoresist and a metal catalyst. The catalyst is placed on a substrate covered with metal. U.S. Pat. No. 4,897,164 to Pian et al. Describes a method for electroplating the walls of through holes in a bonded printed wiring board.

No. 4,919,7 to Bladon.
No. 68 describes a method of electroplating a product.

US Patent No. 5,011 to Pendleton
No. 5,339 describes a method of electroplating a metal layer on the surface of a non-conductive material.

No. 4,952, Bladon et al.
No. 286 describes a method of plating the surface of a non-conductive product.

[0012] Beach et al., US Patent No. 4,673,4.
No. 69 describes a method and apparatus for depositing metal on goods, comprising first an autocatalytic process and then an electroplating step.

US Patent No. 4,322, Houska et al.
No. 280 describes an electrolyzer in which metal is electrodeposited on at least one surface of a tape whose surface is previously coated with metal.

[0014] Goffredo et al., US Pat.
No. 6,685, describes a method and apparatus for depositing metal on a substantially planar surface by a non-electrodepositable metal deposition process and then performing the electrodeposition process.

No. 3,963, Deyrup et al.
No. 590 describes a method in which the surface of polyoxymethylene is pre-etched, etched, neutralized, and surface-treated to deposit a non-electrodepositable metal, followed by an electroplating step.

[0016]

Conventional methods of electrodepositing copper on flexible polymer sheets use current densities of about 25 to about 50 amps per square foot. At such current densities, deposition times are increased, especially when copper thicknesses greater than 1 mil are desired. Here, a typical amount of copper electrodeposited on a flexible polymer sheet is typically expressed in "ounces". One ounce of copper weighs 1 sq. Ft. Copper sheet, which means that the average thickness is 1.3 ounces.
5 mil copper). With currently known conventional electrodeposition methods, it takes about 40-60 minutes to electrodeposit one ounce of copper on a square foot of flexible polymer sheet.

The metal deposition rate in such an electrodeposition process basically depends on the current that can be passed to the metal on the polymer substrate. The metal on the polymer substrate acts substantially as a current conductor. In one aspect, the current to the web is limited by the thickness of the metal on the substrate and the current carrying properties of the metal on the substrate. In another aspect, the current flowing through the metal substrate is the design and placement of the anode,
It is determined in particular by the current density that can be generated at the anode surface, as well as the power loss due to the heat generated during the electrodeposition process.

Currently known methods and apparatus are generally limited in their design by the amount of current that can be applied to the polymer substrate, and in another aspect, the current applied to the substrate is limited to the initial metal on the substrate. Limited by being based on flash thickness. The present invention overcomes the limitations of currently known devices and provides a method and apparatus for electrodepositing a metal on a non-metallic, electrically insulating substrate. By reducing the gap between the active anode surface and the moving substrate, thereby reducing the thermal power loss by reducing the voltage and increasing the current density that can be passed to the active anode surface, and reducing the deposited metal By utilizing the current carrying capacity to promote a larger current flow to the substrate, the electrodeposition time is dramatically reduced.

It is an object of the present invention to provide a method and apparatus for electrodepositing a metal on a non-metallic electrically insulating substrate.

It is another object of the present invention to provide an electrodeposition apparatus that substantially reduces the electrodeposition time of conventional devices.

Yet another object of the present invention is to provide an electrodeposition apparatus which forms a precise and uniform gap between the active anode surface and the moving metallized substrate.

It is yet another object of the present invention to provide an electrodeposition device having a plurality of anodes arranged to define a substantially continuous anode surface.

It is yet another object of the present invention to provide an electrodeposition apparatus having a plurality of anodes, each of which is individually activated and may have a different current density than an adjacent anode.

Still another object of the present invention is to provide an electrodeposition apparatus which has a small heat loss of electric power.

It is a further object of the present invention that the anode has one
The purpose of the present invention is to provide an electrodeposition device that is arranged in groups of one or more anodes and the current density applied to a particular group of anodes is greater than that of an adjacent group of anodes.

It is yet another object of the present invention to provide an electrodeposition apparatus wherein the deposited metal is utilized as a conductor to increase the current density applied to a subsequent anode.

Yet another object of the present invention is to provide an electrodeposition apparatus that increases the current flowing from the anode to the web by reducing the distance between the anode and the web.

It is yet another object of the present invention to provide a method for depositing metal on a moving non-conductive substrate.

It is yet another object of the present invention to provide an electrodeposition method using metal deposited on a substrate as a cathode.

It is yet another object of the present invention to continuously increase the current level applied to a moving substrate by:
It is an object of the present invention to provide an electrodeposition method utilizing the current carrying capacity of a deposited metal.

Yet another object of the present invention is to provide an electrodeposition method that can simultaneously apply different current levels to different portions of the substrate.

Still another object of the present invention is to provide an electrodeposition method for increasing a current level in a moving direction of a moving substrate.

Yet another object of the present invention is to provide a flexible polymer sheet having a metal electrodeposited thereon for use in the manufacture of flexible electronic circuits.

Yet another object of the present invention is to provide a flexible polymer / metal sheet in which no lines are formed in the cross section of the metal layer.

Yet another object of the present invention is to provide a flexible polymer / metal sheet with increased sheet flexibility.

Still another object of the present invention is to provide a flexible polymer / metal sheet having high elongation properties.

It is yet another object of the present invention to provide a method and apparatus for continuously manufacturing printed wiring circuits by an electrodeposition process.

[0038]

SUMMARY OF THE INVENTION In accordance with one aspect of the invention, an electrolytic cell includes a tank for holding an electrolytic solution and a tank having a non-conductive cylindrical outer surface and rotatable about a horizontal axis. A drum disposed therein and a plurality of elongated similar anodes having a uniform cross-section disposed about the outer surface of the drum. The anode is generally remote from the outer surface of the drum and forms a substantially continuous cylindrical surface accordingly. Each of the anodes has at least one end protruding from the tank. A plurality of power supplies and connection means for connecting a group of one or more of the protruding ends of adjacent anodes to the respective power supplies are provided. The above object is achieved from the above.

The anode may be a rod having a uniform prismatic cross section.

[0040] The anodes may be arranged in alignment, each anode being symmetrical with respect to an axis extending parallel to the axis of the drum.

Each of the anodes has a rectangular cross section and may have two opposing active anode surfaces.

[0042] Each of the anodes may be mountable in two directions with respect to the drum, one of the two opposing active anode surfaces opposing the drum in each of the two directions.

[0043] The anode may include an inner core formed of a highly conductive first metal material and an outer casing formed of a conductive second metal material that is inert to the electrolytic solution.

The anode is formed by co-extrusion of titanium-copper, the copper forming the inner core;
Titanium may form the outer casing.

The distance between the anode and the drum may be less than 1 inch.

The tank may be formed from a non-conductive material.

An apparatus for electrodepositing a metal according to another aspect of the present invention includes a tank for holding an electrolytic solution, a drum mounted in the tank, and aligned in the tank around the drum. It comprises a plurality of elongated similar anodes. Each of the anodes has at least one end protruding from the tank for connection to a power source and at least two individual active anode surfaces extending along the length of the anode. The anode is attached to the tank;
One of the at least two individual active anode surfaces is located opposite the drum. The above object is achieved by the above. The anode is a rod having a uniform cross-section, and includes an inner core formed of a first metal material having high conductivity and an outer casing formed of a conductive metal material inert to an electrolytic solution. Is also good.

The anode has a rectangular cross-section, the active anode surface is defined by opposing surfaces, and the anode is formed by co-extrusion of titanium-copper, wherein copper forms the inner core, May form the outer casing.

Each of the anodes may be symmetrical about a central axis and parallel to the axis of the drum when mounted on the tank.

[0050] Each of the anodes may be connectable to a separate power supply.

According to another aspect of the present invention, there is provided an apparatus for electrodepositing a metal on a non-conductive, electrically insulating substrate having a metal flash thereon. The apparatus includes a tank for holding an electrolytic solution containing a predetermined concentration of metal ions to be deposited. A cylindrical drum is mounted in the tank. The drum has a non-conductive outer surface and is rotatable about a fixed axis for passing the substrate through the tank. A plurality of elongated similar anodes are attached to the tank and are arranged in alignment around the non-conductive outer surface of the drum. Each of the anodes extends along an axis substantially parallel to the axis of the drum and has a uniform cross section defining at least two active anode surfaces. The anode is attached to the tank, one of the at least two active anode surfaces of each anode facing the drum;
Also aligned with adjacent anodes to define a substantially continuous active anode forming surface around the drum. The active anode forming surface defines a substantially uniform width gap with the outer surface of the drum. At least one power supply is connected to the anode. As the metal portion of the substrate exits the tank, a cathode member located outside the tank engages the metal portion. The above object is achieved by the above.

[0052] The anode may be an elongated rod having a rectangular cross section.

The anodes may be individually mounted to the tank such that one end of each anode protrudes from the tank and that one end is connectable to a power source.

A group consisting of one or more adjacent anodes may be connected to the same power supply.

[0055] The anode may include an inner core formed of a highly conductive first metal material and an outer casing formed of a conductive second metal material that is inert to the electrolyte.

The anode is formed by co-extrusion of titanium-copper, wherein copper forms the inner core;
Titanium may form the outer casing.

The distance between the anode and the drum may be smaller than 1 inch.

According to another aspect of the present invention, there is provided an electrolytic cell for electrodepositing a metal on a substrate having a metal layer thereon.
The electrolytic cell has a tank for holding an electrolytic solution, a non-conductive curved flat surface disposed within the tank and defining a path for the substrate to move, and a uniform prismatic cross-section. , A plurality of elongated similar anodes defining at least two active anode surfaces. Each anode is
Mounted in the tank, one of the at least two active anode surfaces faces the non-conductive surface, and a portion of the anode extends through the tank. The anode is aligned to define a substantially continuous, uniform gap between the non-conductive surface and the active anode surface of the anode. Connector means connects a group of one or more adjacent anodes to a separate power source. As the metal portion of the substrate exits the tank, a cathode member located outside the tank engages the metal portion. The above object is achieved by the above.

[0059] The curved flat surface may be defined by a drum rotatable about a fixed axis, each of the anodes being symmetrical with respect to an anode axis parallel to the axis of the drum.

[0060] The anode may include an inner core formed of a highly conductive first metal material and an outer casing formed of a conductive second metal material that is inert to the electrolyte.

The anode is formed by co-extrusion of titanium-copper, wherein copper forms the inner core;
Titanium may form the outer casing.

The distance between the anode and the drum may be smaller than 1 inch.

The anode has a rectangular cross-section, the active anode surface is defined by opposing surfaces, and the anode is formed by co-extrusion of titanium-copper, wherein copper forms the inner core, May form the outer casing.

According to another aspect of the present invention, a method for electrodepositing a metal on a non-conductive electrically insulating substrate comprises the steps of: a) forming a thin metal flash on one side of the non-conductive electrically insulating substrate. B) moving the substrate in a predetermined direction along the path defined by the non-conductive surface, with the metal surface of the substrate facing away from the surface; Moving the substrate, wherein the surface is disposed in an electrolyte solution and a plurality of anodes are disposed opposite and adjacent to the surface, defining a uniform, narrow gap therebetween; c. A) passing the metal surface of the substrate over a conductive cathode located outside the electrolytic solution; and d) applying the metal to the moving substrate in a continuous manner. Each group of electrodes as they pass through the electrolyte Have different current density levels, which achieves the above objectives.

The current density may be the same or greater at each successive anode.

The non-conductive surface is substantially cylindrical,
The anode may be an elongated rod extending parallel to the substantially cylindrical surface.

A method of electrodepositing a metal on a non-conductive electrically insulating substrate according to another aspect of the present invention comprises providing a plurality of elongated anodes arranged in close proximity to one another in an electrolytic solution. Forming a substantially continuous active forming surface, each said anode having an active anode surface aligned with an active anode surface of an adjacent anode, and a thin metal with a non-conductive backing A flash of less than 1 inch between the metal and the forming surface as the metal moves along the forming surface while moving the flash through the electrolytic solution through the continuous active forming surface. Maintaining a uniform spacing between the two, and, when the metal exits the electrolyte, passing the metal over a cathode outlet located outside the electrolyte. Electrically activating a group of upper adjacent anodes, each successive group of anodes having a higher activation level than the preceding group. Thereby, the above object is achieved.

According to another aspect of the present invention, a method of electrodepositing a metal on a non-conductive electrically insulating substrate comprises the steps of: a) moving the non-conductive substrate having a flash of metal on top along a predetermined path. Wherein the substrate first moves through the electrolyte through a plurality of anodes disposed in the electrolyte, and then passes over a conductive cathode surface located outside the electrolyte, and When the flash of the metal on the substrate opposes the anode in the electrolyte and engages the conductive cathode surface, b) differentiating the group consisting of one or more adjacent anodes Electrically activating at a level, wherein each successive group of anodes has a higher activation level than the preceding group; Is achieved.

The activation level of a particular anode group may be based on the current carrying capacity of the metal on the substrate as the substrate passes through the particular anode group.

There is provided a metal-coated polymer film produced by the above method.

The polymer film may be a polyimide.

The polymer film may be a polyester.

[0073] The metal may be copper.

The copper may be a one ounce foil and the polymer film has an elongation equal to at least 15%.

In another aspect of the invention, a method of forming a printed circuit on a non-conductive, electrically insulating substrate includes the steps of: a) plating a layer of conductive material on one side of an elongated strip of a flexible non-conductive material. Printing resist to expose and leave exposed continuous bands of the conductive layer extending along the length of the strip, and one or more patterns of printed wiring circuits in communication with the bands; b. C.) Moving said strip having printed wiring circuitry thereon along a predetermined path, said strip first moving through the electrolyte through a plurality of anodes disposed in said electrolyte; It then passes over a conductive cathode surface located outside of the electrolyte, where the continuous band of conductive layer on the strip faces the anode in the electrolyte, and Engaging a conductive cathode surface,
C) electrically activating a group of one or more adjacent anodes at different levels, wherein each successive anode group has a higher activation level than the preceding group. ,
Which achieves the above object.

The method may further include: d) removing the plating resist; and e) etching away the conductive layer from an unpatterned region of the substrate.

[0077] The method may further include the step of disconnecting the printed circuit from the continuous band of the conductive layer.

The activation level of a particular anode group may be based on the current carrying capacity of the metal of the continuous band as the strip passes through the particular anode group.

A printed wiring circuit manufactured by the above method is provided.

According to another aspect of the invention, a method of forming a printed circuit on a non-conductive, electrically insulating substrate comprises the steps of: a) providing an elongated strip of a flexible, non-conductive material having a conductive layer coated thereon. B) printing a plating resist on the conductive layer, exposing the conductive layer extending along the length of the strip, leaving a plurality of patterns and bands connecting the patterns together. Forming a continuous exposed area; and c) moving the strip having a pattern thereon along a predetermined path, wherein the strip is first placed in the electrolyte via the electrolyte. Moving through a plurality of anodes and then over a conductive cathode surface located outside the electrolytic solution, wherein the exposed areas of the conductive layer on the strip Opposed to the anode in the solution, also engage the conductive cathode surface, the steps, d) 1
Electrically activating a group of one or more adjacent anodes at different levels, wherein each successive anode group has a higher activation level than the preceding group. Thereby, the above object is achieved.

[0081] The method may further include: d) removing the plating resist; and e) etching away the conductive layer from an unpatterned region of the substrate.

The activation level of a particular anode group may be based on the current carrying capacity of the exposed metal as the strip passes through the particular anode group.

A printed wiring circuit manufactured by the above method is provided.

According to another aspect of the present invention, a method of forming a printed circuit on a non-conductive electrically insulating substrate includes the steps of: a) plating a layer of conductive material on one side of an elongated strip of flexible non-conductive material; Printing a resist, exposing a continuous area of the conductive layer along the length of the strip, the continuous area including a plurality of printed circuit patterns;
b) moving the strip having a printed wiring circuit thereon along a predetermined path, the strip first moving through the electrolyte through a plurality of anodes arranged in the electrolyte. Then over the conductive cathode surface located outside of the electrolyte, wherein the continuous area of the conductive layer on the strip faces the anode in the electrolyte and And c) electrically activating different groups of one or more adjacent anodes at different levels, each successive anode group being higher than the preceding group. Having an activation level, whereby the above object is achieved.

[0085] The method may further include the step of disconnecting the printed wiring circuits from each other.

[0086] The activation level of a particular anode group may be based on the current carrying capacity of the metal in the continuous region as the strip passes through the particular anode group.

A printed wiring circuit manufactured by the above method is provided.

[0088]

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects and advantages will become apparent from the following description of the preferred embodiments, taken in conjunction with the accompanying drawings.

The drawings described below show preferred embodiments of the present invention and do not limit the present invention.

FIG. 1 shows an electrodeposition apparatus 10 for electrodepositing a metal on a substrate 12. The present invention relates to an apparatus and method for electrodepositing a metal on a non-metallic, electrically insulating substrate, preferably a polymer film, having a metal flash adhered to the surface. The present invention is described with reference to flexible polymer sheets ranging in thickness from about 0.5 to about 7 mils. Although a polymer film is a suitable substrate for use in the devices and methods of the present invention, as can be understood from the following description, other non-metallic electrically insulating materials, such as ceramic tape or "Green" tapes, other fabrics, etc. may also be used. As used herein, a "flash" of metal refers to a metal having a thickness of about 500 to about 30.
A thin metal coating in the range of 00 Angstroms is meant. Typically, the flash of metal is coated by sputtering, deposited by electrodeposition, or deposited by conventional chemical vapor deposition, although other methods are contemplated.

The present invention is particularly applied to the case where a metal is electrodeposited on a non-metallic electrically insulating polymer substrate, and the following description will be made with particular reference to this application. It can also be applied advantageously in some cases.

In a broad sense, the apparatus 10 comprises a tank 20 for holding an electrolytic solution, a drum 50 partially disposed in the electrolytic solution in the tank 20, and a drum 50 disposed around the drum 50 in the tank 20. A plurality of similar anodes 60. In the illustrated embodiment, tank 20 comprises
It has a substantially cylindrical shape and is sized to fit a cylindrical drum 50. The tank 20 is defined by a substantially semi-cylindrical bottom wall 22 and two end walls 24 and 26, as best shown in FIG. As best shown in FIGS. 1 and 3, an arcuate reinforcing plate 28 is attached to each end wall 24 and 26. The tank 20 includes a drum 50
And a semi-cylindrical cavity for receiving the electrolytic solution. A supply conduit 32 is provided at the bottom of the tank 20,
The electrolytic fluid is supplied to the tank 20. An overflow tube 34 is provided along the upper end of the tank 20 to collect the overflowing electrolyte and recirculate it through a port 36, as is well known. The tank 20 is supported on a support structure 42 comprising a plurality of transverse webs 44 supported on columns 46.

The drum 50 is cylindrical and has a non-conductive outer surface 52 according to the invention. To this end, the drum 50 may be formed entirely of a rigid plastic or polymer material, or may be formed of a metal material with its outer surface casingd with a non-conductive material. In the illustrated embodiment, the drum 50 is
May rotate about a shaft 54 that is supported by bearings (not shown) in the end walls 24 and 26 of the motor. Drum 50 is preferably rotated by a suitable motor drive (not shown), as is well known in the art.
At this time, the drum 50 can be rotated at a variable peripheral speed, so that the substrate 12 can maintain contact with the electrolytic solution in the tank for a time sufficient to obtain a desired foil thickness. This will be described later in detail.

In the tank 20, a plurality of similar anodes 60 are arranged around the drum 50. Anode 60
Is preferably a uniform prismatic (prismat)
ic) elongate rods having a cross-section, each defining a plurality of flat active anode surfaces. In the illustrated embodiment, as shown in FIGS. 4-7, anode 60 is a thin rod of uniform rectangular cross section. Each anode 6
0 is an inner core 64 formed of a highly conductive material and an outer jacket or casing 66 of a conductive metal that is dimensionally stable in the electrolytic solution, as shown in FIG.
And an elongated body 62 having In the illustrated embodiment, as described above, the anode body 62 is formed having a core 64 of a copper alloy material and an outer cladding or jacket 66 of titanium.
The titanium clad copper body 62 of the anode 60 may be co-extruded as is well known in the art.
sion) process. The rectangular plate 68 is formed of a material similar to the material forming the cladding 66, i.e., titanium in this embodiment, and is attached to one end of the body 62, preferably by welding, and surrounds the core 64. Since the anode 60 is rectangular, opposed active anode surfaces 80a and 80b are defined. As can be understood from the description hereinafter, a square or triangular cross section (not shown)
An anode 60 having the following may also be used without departing from the present invention.

The plate 68 is provided with positioning pins 72 aligned with the longitudinal axis of the body 62, and at the opposite end is provided with an annular collar 74. Pin 72 and collar 74 are also formed of titanium. Two threaded holes 76 are formed in the core 64 at the other end of the body 62, i.e., adjacent to the collar 74. At this end of the anode 60, the core 64 is exposed.

The anode 60 is aligned within the tank 20 and forms a semi-cylindrical electrical metal forming surface 58.
This surface follows the shape of the surface 52 of the drum 50, as best shown in FIG. More specifically, the anodes 60 are aligned and extend the length of the tank 20. The anodes 60 extend parallel to each other and parallel to the axis of the drum 50 and are packed closer together but not in physical contact. Anode 60
Are positioned with respect to the non-conductive surface 52 of the drum 50 to form a uniform gap 90 therebetween.
This gap 90 is, according to the present invention, preferably smaller than 1 inch, and more preferably about 3/4 inch. According to another aspect of the invention, each anode 60 penetrates the tank 20 along a fixed axis indicated by "X" in FIG.
Attached to and supported by at least one of end walls 22 and 24 of tank 20. One end of the anode 60 extends outside the tank 20. In the illustrated embodiment, the anode 60 is located in the tank 20, as shown in FIG. Here, the distance between the side walls 22 and 24 of the tank 20 and the dimensions of the anode 60 are such that the anode 60 extends through the tank 20 between the end walls 22 and 24, and both ends of the anode 60 are 24 and are sized to be supported by them. Specifically, a plurality of cylindrical holes 92 are formed in the end walls 22 and 24 at intervals. As shown in FIG. 3, each hole 92 is connected to the anode 6
It is dimensioned to receive the zero pin 72 snugly.
Preferably, a plug 94 is inserted into the outer end of the hole 92 and welded to seal the hole 92.

A plurality of spaced openings 96 are formed in sidewalls 24 and 26 to receive the collared end of anode 60. Each opening 96 has a first cylindrical portion 96a sized to receive the collar 74 of the anode 60 and a second cylindrical portion 96a having a larger diameter.
And a cylindrical portion 96b. The holes 92 and openings 96 are located along a circular center line whose center is located along the axis "A" of the drum 50, thereby placing the anode 60 in a semi-circular shape as described above. . Holes 92 are located along a circular centerline at each midpoint between openings 96. The circular centerlines of each end wall 22 and 24 are axially aligned with one another. In the embodiment shown, the opening 96 in the side wall 22 is axially aligned with the hole 92 in the side wall 24 and vice versa. Thus, in the illustrated embodiment, adjacent anodes 60 are inserted into tank 20 from opposite ends. That is, the end walls 22 and 24
Openings 96 and holes 92 of the anode 60 are offset from each other, thereby providing the "pinned end" of one anode 60.
Are located next to the “end with collar” of the adjacent anode 60.

A seal arrangement 102 is provided around the collar 74 of each anode 60. The seal arrangement 102 includes a pair of annular seals 104. The pair of annular seals 104 are formed of an elastic compressible material provided between the collar 74 and the inner surface of the second cylindrical portion 96b. A compression ring 106 is received by screwing into a threaded hole 108 in plate 28. The annular seal 104 is compressed by the compression ring 106 and the collar 74 of the anode 60 and the second
It is waterproof (fluid-ti) between the inner surface of the cylindrical portion 96b.
ght) Form a seal. The important thing is that the anode 6
0 is symmetric with respect to axis "X" so that the anode can be positioned in tank 20 with either anode surface 80a or 80b facing drum 50.

As shown in FIG. 3, when installed in the tank 20, a portion of the anode 60,
The outer portion extends outside the tank 20. An electrical connector 82 is attached to the end of the anode 60, as best shown in FIG. The electrical connector 82 has a flat plate portion 84 with spaced through openings. The opening in the plate 84 corresponds to the core 6 of the anode 60.
The size is set to be the same as the size of the hole 76 of FIG. Hole 76 is dimensioned to receive a threaded fastener or lug 78. Clamps or lugs 78 are adapted to attach plate 84 of electrical connector 82 to anode 60. Each connector 82 is connectable to a power supply (not shown). What is important is that the plate 84 of the connector 82 makes direct contact with the copper core 64 of the anode 60.

A guide roller 1 is provided at the entrance side of the electrodeposition apparatus 10.
The substrate 12 is provided to position the substrate 12 to be carried in with respect to the drum 50. Tank 20 on the outlet side of electrodeposition apparatus 10
A cathode take-out roller 114 is provided above and outside the electrolytic solution contained in the tank. Cathode take-out roller 114 is arranged to engage the metal side of substrate 12 and make electrical contact with the metal side as the substrate exits tank 20. Cathode take-off roller 114 is conductive and is designed to conduct the maximum current that can flow through anode 60. This will be described later in detail.

Next, the operation of the apparatus 10 and a method for electrodepositing a metal on a moving substrate will be described. The polymer substrate 12 to which the metal flash is adhered is inserted into the electrodeposition apparatus 10. At this time, the metal flash of the substrate 12 is exposed to the electrolytic cell of the tank 20, and the other surface of the substrate is
It is inserted so as to be located on the outer surface 52 of the non-conductive surface. Virtually any flexible polymer sheet and preferably a thermoplastic sheet can be used, as long as a conductive metal flash can be adhered to the surface of the flexible polymer sheet. Examples of such a polymer sheet include a polyimide sheet (Kapton (registered trademark), EI Du
(Pont) or a polyester sheet sputtered with a metal such as tin, brass, zinc, copper, chromium, etc. at about 2,000 angstroms.

The substrate 12 passes over the guide roller 112 and contacts the drum 50. Substrate 12 advances the electrolyte in tank 20 over drum 50. Substrate 12
Passes through a gap 90 defined between the drum 50 and the anode 60 with the metal flash directed toward the active anode surface 80 of the anode 60. The substrate 12 passes through the cathode take-out roller 114 and exits the electrolytic solution. At this time, the metal-coated side of the substrate 12 is
Contact 4 This allows the metal flash adhered to the substrate 12 to act as a cathode during the electrodeposition process where current is supplied to the anode 60.

According to the present invention, the anodes 60 are activated in groups of one or more anodes 60.
Here, a series of each anode 6 in the direction of travel of the substrate 12
Group 0 has a higher activation level than the preceding group. Substrate 1 by first group of anodes 60
As the metal is deposited on the second initial metal flash, the current carrying capacity of the thicker metal increases, which is utilized to enable the subsequent anode group to have a higher activation level. You. The thick metal acts as a conductor for the cathode take-off roller 114, allowing higher activation levels. That is, the flash of the metal on the substrate 12 is initially
Electrical duct to 14
uit) to accumulate or deposit metal on the substrate 12. The thickness of the metal on the substrate 12 gradually increases,
The current carrying capacity increases. This is because the preceding anode 6
Based on the current carrying capacity of the metal stored up to group 0, it is utilized to increase the electrodeposition of the metal by continually promoting or increasing the current to the subsequent group of anodes 60. . Of course, due to the limited current carrying capacity of the original metal flash on the polymer substrate 12, some anodes 60
Cannot be given different current levels immediately or simultaneously. Initially, the current density that can be provided to the substrate 12 is limited by the current carrying capacity of the metal flash, that is, the current that the metal flash can conduct to the cathode extraction roller 114. Applying an excessive current density to the anode 60 will, in effect, only strip the thin metal flash from the polymer substrate 12. Therefore, it is necessary to gradually activate the group of anodes 60 to gradually deposit metal on the substrate 12.

In particular, the first group of anodes 60, the group of anodes that the substrate 12 first encounters entering the tank 20, is activated to a manageable level by flashing the metal of the polymer substrate 12. Thus, this first group of anodes deposits metal from the electrolytic solution onto the metal flash, thereby increasing the thickness of the metal on the polymer substrate 12. The substrate 12 moves at a predetermined speed through the electrolytic solution in the tank 20, so that the continuous layer of the accumulated metal eventually becomes the cathode take-out roller 1
14, thereby increasing the current carrying capacity that can be provided to the substrate 12. At this time, the second anode group 60 may be activated at a higher activation level than the first anode group. The activation level of the second group of anodes may be based on the current carrying capacity of the metal stored by the first group of 60 anodes. Thus, the metal deposited by the first group of anodes 60 is used as a conductor to allow higher current levels to be applied to the substrate 12 and to be conducted to the cathode ejection roller 114. After a predetermined period of time, the accumulated metal deposited by both the first 60 and second 60 anode groups reaches the cathode take-off roller 114.
The metal deposited by the first 60 and second 60 anode groups is thick enough to activate the third 60 anode group at an even higher activation level than the first two 60 anode groups. . Also in this case, the new accumulation formed by the third anode 60 group is equivalent to the first and second anodes 6.
Depositing metal on the metal provided by group 0 and finally reaching the current extraction cathode, allowing the fourth anode 60 group to be activated at a higher level than the first three anode groups . Here, each anode 60 group basically enhances the metal conduction capacity of the substrate 12 so that the subsequent anode 60
Give the group a higher activation level,
It is possible to produce higher electrodeposition rates in subsequent anode groups. With the continuous activation described above, ultimately each group of anodes 60 of the electrodeposition apparatus 10 can be activated at a desired operating level.

As used herein, the term "anode 60 group" indicates that each anode 60 group can consist of one or more anodes 60. Here, the electrodeposition apparatus 10 is designed such that each anode 60 can be connected to its own individual power supply, ie, a rectifier.

Hereinafter, a specific embodiment of the present invention will be described. These examples are illustrative and do not limit the invention. Various modifications in process parameters, materials, methods and operations can be made by those skilled in the art. All parts and percentages specified in the following examples are by weight unless otherwise indicated.

The present invention relates to copper, gold, silver, nickel, tin,
Although applied to the deposition of many metals, including but not limited to zinc, brass, chromium, platinum, and tungsten, can have many advantages, but copper is typically used in applications in the electronics field . Copper is the most preferred metal because it has high conductivity, can be soldered, and is easy to electroplate.

For effective copper electrodeposition, a sufficient amount of copper (usually as copper sulfate), chlorine, and sulfuric acid must be present in the electrodeposition bath. According to the present invention, the electrolytic solution contains copper sulfate in the range of about 50 to about 80 grams / liter, chloride ions in the range of about 0 to about 30 ppm, and sulfuric acid in the range of about 50 to about 70 grams / liter. I do. Vessel temperature is also a parameter that can affect the performance of the electrodeposition process. Here, a typical operating temperature range is from about 20C to about 95C. According to the present invention, a preferred temperature range is from about 35C to about 80C, and a most preferred temperature range is from about 50C to about 70C.

In the embodiment described below, the apparatus described above and shown in the drawings is used. As shown in FIGS. 1 and 2, 28 anodes 60 are provided in the tank 20. The anodes 60 are aligned or divided into groups of seven anodes 60. Each anode group is connected to its own individual power supply. Specifically, the seven anodes 60 of each group are connected to one rectifier, so that the same current is supplied to each anode belonging to one group. The four anode groups define "processing zones", indicated by "A", "B", "C", and "D" in the figure. In the following example, the drum 50 is made of rubber and is 26 inches long and 30 inches in diameter.
Inches. 3 mil thick Kapton sputter coated about 2000 Angstroms of copper
(Registered trademark) polymer sheet was used. The width of the polymer sheet was 14 inches. The electrodeposition aqueous solution tank contained the following.

1) Copper sulfate pentahydrate 400 g / l 2) sulfuric acid 65 g / l 3) chlorine 25 ppm The temperature of the tank was maintained at about 55 ° C to about 65 ° C.

As can be appreciated by those skilled in the art, the final thickness of the electrodeposited copper depends on the line speed of the equipment, ie, Zone A
Depends on the velocity of the substrate through D and the current density provided to the cell by the anode 60.

The following example illustrates the operation of the above-described apparatus at different "line speeds" and different anode 60 activation levels.

[0113]

[Table 1]

[0114]

[Table 2]

[0115]

[Table 3]

In the above table, "Amps / zone"
Indicates the total current flowing in a particular zone. "Time / Zone" is the time (in seconds) that the substrate is exposed to a particular zone
Is shown. "Zone current density" indicates the current density measured at the active anode surface of a particular zone. “Copper weight” indicates the cumulative weight in ounces of copper deposited on substrate 12 after a particular zone. “Copper thickness” indicates the cumulative thickness of the copper deposited on substrate 12 after a particular zone in mils. “Web current density” refers to the current density flowing through the web, ie, through the metal on substrate 12.

Comparison of the above tables reveals the effect of "line speed" and "current density" on the final thickness of the electrodeposited copper, and the advantages of the present invention.

In the first embodiment, the speed of the substrate 12 is 3.15.
It moves within the electrodeposition device 10 at feet / minute. At this speed, the substrate 12 has been exposed to each zone for about 16.7 seconds. In Example 1, a current of 150 amperes was applied to each zone. Here, each anode in each zone is about 2
Activated with a current of 1-22 amps. The current density in each zone was approximately 146.9 amps / square foot. Here, the difference between the current flowing in each zone and the current actually flowing on the anode surface is very small. That is, little energy was radiated or lost as heat. Under these operating conditions, copper accumulation was approximately proportional. In other words, about 0.825 in each zone
Grams of copper were added to substrate 12 and the thickness was increased by 0.039 mil. The actual current density flowing through the metal stored on substrate 12 as detected by cathode element 114 was approximately 274,793 amps / in 2. The copper accumulation on substrate 12 was uniform and similar in each zone, as would be expected from the same current flowing through each zone.

Example 2 shows an operating condition in which the speed of the substrate 12 is about 2.6 feet / minute, and the current flowing through each zone increases in subsequent zones. Here, 150 amps were passed through zone A, 400 amps were passed through zone B, 660 amps were passed through zone C, and 840 amps were passed through zone D. At the above operating speed, the substrate 12 was exposed to each zone for about 20.2 seconds. Under these conditions, the accumulation of copper on the substrate 12 increased dramatically. As shown in Example 2, in zone A, 0.999 grams of copper is deposited on substrate 12, and at the end of zone B, the weight of copper increases to 3.664 grams. At the end of Zone C, the weight of the copper increased to 8.061 grams and the thickness was 0.381 mil. Substrate 12
13.657 grams of copper had been deposited by the time that the material exited Zone D, producing a 0.646 mil thick copper.

In Example 3, the line speed was reduced to 1.6 feet / minute. At this rate, the substrate 12 is exposed to each zone for 32.813 seconds. In this embodiment, the zone A
At 270 amps, zone B at 500 amps, and zones C and D at 900 amps. Even in such a high level current distribution,
The actual current density at the active anode surface is relatively close to the current density flowing through each zone. Here, due to the configuration and operating characteristics of the present invention, less than 2% of the power supplied to the anode 60 is lost as heat. In Example 3, in Zone A, 2.557 grams of copper was electrodeposited onto substrate 12 and substrate 12 having 0.121 mil copper was deposited.
Was formed. After zone B, the substrate 12 has 7.970
Grams of copper were electrodeposited, resulting in a copper thickness of 0.377 mil. At the end of zone C, the substrate 12 has 17.71
Three grams of copper were deposited, producing a thickness of 0.873 mil. By the time the substrate 12 leaves zone D, 2
7.456 grams of copper were deposited, resulting in a final thickness of about 1.3 mils.

As shown in Example 3, as the line speed decreases, the accumulation of copper on the substrate 12 increases dramatically in each zone, and with this increase in copper, a substantially higher current flows through the substrate 12. And thereby further enhance the electrodeposition process.

As a result of the present invention, for example, the edge effect (ed
A copper coating with little or no "ge effect" is obtained. That is, the resulting copper coating is of uniform thickness throughout the coating body and along its edges. Another advantage of copper electrodeposited by the method of the present invention is that physical properties are improved. One such improvement is that the 1 oz.
%. It exhibits about three times greater elongation than a 1 oz copper foil electrodeposited on a flexible polymer substrate by conventional methods. Further, according to the present invention, the electrodeposited copper has improved ductility, thereby reducing the tendency of the copper to crack or fail during processing or use.

One of the other advantages realized by the present invention is that the properties of the final product produced are excellent. One advantage is that the electrodeposited copper foil produced by the process and apparatus of the present invention is substantially more ductile than copper foil electrodeposited by conventional methods. For example, an elongation of about 28% has been measured for one ounce copper foil. Also,
As mentioned above, the electrodeposited copper of the present invention does not exhibit edge effects. Thus, the thickness of the electrodeposited copper is substantially uniform over the entire area of the plated copper.

The reason why the elongation percentage and the ductility of the metal-coated polymer film of the present invention are improved is considered to be due to the uniform accumulation of the electrodeposited metal. Unlike traditional methods, which typically require several passes through multiple electrolytic cells,
The process of the present invention does not expose each metal layer to air. The electrodeposited metal layer is uniform and continuous,
area). That is, the metal layers cannot be distinguished. Therefore, the electrodeposited metal of the present invention does not have a region containing a metal oxide or airborne contaminants that can be an embrittlement layer or an embrittlement region with high stress concentration. Therefore, in the electrodeposited metal of the present invention, cracking hardly occurs as occurs in a metal-coated polymer film electrodeposited by a conventional method.

FIG. 10 shows an optical micrograph of a side view of a copper foil electrodeposited on Kapton® manufactured by the process of Example 1. This micrograph shows a single, uniform, continuous layer of copper metal on substrate 12. This is in contrast to the micrograph of FIG. FIG.
1 shows an optical micrograph of a side view of a conventional product manufactured by a representative practical electroplating process. FIG. 11 clearly shows the layers of copper metal deposited on the substrate. Each streak is one in a multi-tank device.
Corresponds to the end of one electrodeposition cycle and the beginning of the next electrodeposition cycle. These streaked areas are almost certainly high stress concentration areas.

The invention has been described with reference to the electrodeposition of metals on non-conductive polymer webs. The web is later used in forming a flexible electronic circuit. According to another aspect of the present invention, as shown in FIGS. 12-14, the electrodeposition apparatus 10 can be used to plate a printed circuit pattern directly onto a moving web, indicated by "W". According to this aspect of the invention, the web W generally comprises
(A) and, as best shown in FIG. 13 (b), consists of a flexible thin strip or film 200 of a non-conductive material coated on one side with a thin metal layer 202. The metallized surface of the film 200 is masked with a plating resist mask material 204 by a conventional method, and a plurality of circuit patterns 206 are defined. Pattern 206 is defined by the unmasked exposed areas of base metal layer 202. In the embodiment shown in FIG. 12, the central portion of the web W is masked and the unmasked exposed base metal 2 is unmasked.
02 continuous bands 208 are arranged to extend along both edges of the web W. The unmasked exposed area of the base metal layer 202 forming each pattern 206 is a band 2
Conduction is made with the unmasked exposed area of the base metal 202 that forms 08. In the embodiment shown in FIG. 12, the direction of the adjacent pattern 206 is
Are opposed to each other such that they extend toward opposite edges of the web W.

The strip 200 can be formed of any flexible, non-conductive material, and the layer 202 thereon can be any metal that can be plated. The use of a plastic or polymer film having a thickness of about 1700 angstroms of metal on top and having a thickness of 2-3 mils provides satisfactory results in plating a pattern according to the present invention. Any metal that can be plated can be used,
Metal layer 202 is preferably copper. Significantly, circuit pattern 206 generally includes all branches 206a
That is, all parts of the pattern are in conduction with the band 208. As will be described in greater detail below, a small portion of the circuit pattern 206 may be completely isolated from successive branches or legs of the pattern 206. FIG. 13 (a)
Generally shows a cross section of the web W of FIG. 12, showing a non-conductive polymer film or strip 200, a metal layer 20.
2 and a plating resist mask material 204 that defines a branch 206a of the pattern 206.

Next, a process for forming the circuit pattern 206 will be described. The web W is introduced into the apparatus 10 in the manner generally shown in FIGS. Specifically, the web W passes through the guide roller 112 and contacts the drum 50, and advances on the drum 50 into the electrolytic solution in the tank 20. Here, the web W is a circuit pattern 206
With the unmasked exposed area of the base metal layer 202 facing the active anode surface 80 of the anode 60, it passes through a gap 90 defined between the drum 50 and the anode 60. The web W passes through the cathode take-out roller 114 and exits the electrolytic solution. At this time, the exposed portion of the metal layer 202 comes into contact with the roller 114. This allows the exposed metal layer 202 to act as a cathode during the electrodeposition process where current is supplied to the anode 60.

In the method described above, the anodes 60 are activated in groups of one or more anodes 60.
Here, a series of each anode 6 in the traveling direction of the web W
Group 0 has a higher activation level than the previous group. As metal is deposited on the exposed portions of the metal layer 202 forming the pattern 206 and the band 208, the current carrying capacity of this thicker metal increases, which causes the subsequent anode group to have a higher activation level. It is used to enable Here, the pattern 206 has a continuous branch 206a that is in electrical communication with the band 208, thereby creating a continuity in the length of the web, thereby allowing a larger current to flow through the circuit branch 206a and the band 208. 114 can be conducted. Due to the continuity of the metal in circuit pattern 206 and band 208, the current level to subsequent zones can be increased to higher levels, thereby increasing the plating of the metal forming circuit pattern 206. As mentioned above, the pattern 206 may have a small isolation region indicated by 206b in the figure that is not directly conductive with the branch 206a or band 208 of the circuit pattern 206. With respect to these regions, the underlying metal layer 202, that is, the region of the layer 202 underlying the plating resist 204, can provide sufficient current carrying capacity and conduct higher levels of current through the branches 206a and the band 208; This allows metal to accumulate in these small areas without burning or breaking the web W. Here, most of the current flowing through the web W by the anode 60 is conducted to the cathode take-out roller 114 through the branch 206 a of the pattern 206 and the band 208, so that a large area of the base metal layer 202 located below the mask material 204. Distributes the current to the accumulation region of the pattern branch 206a and the band 208, and
6b is sufficient to allow it to withstand high current levels. However, it is possible that the zone following the device may be provided with a higher activation level, and that the region 206b may constitute only a relatively small area of the entire exposed metal layer 202. And the continuity of the metal accumulated in band 208 and its increased current carrying capacity.

FIG. 13B schematically shows how the metal is accumulated in the unmasked exposed portion of the base metal layer 202. In FIG. 13B, the accumulated metal is indicated by reference numeral 214. Once the circuit 206 has been accumulated to the desired thickness, the mask material 204 can be removed by conventional methods, exposing the accumulated copper pattern extending from the base metal layer 202. Next, base layer 202 is removed by an etching process, leaving desired pattern 206 of accumulated copper on film 200. The copper band 208 is then removed from (ie, cut off from) the pattern 206, leaving the pattern 206 exposed on the film 200.

FIG. 14 shows an alternative embodiment of the web W in which a plurality of similar patterns 216 are located in the center of the web W and are conductive to one another to form a continuous band of the pattern 216. Each pattern 216 has a central portion 216a
From which a plurality of legs or branches 216b extend. The pattern 216 is substantially symmetrical, and the adjacent patterns 216 are arranged such that the legs 216b of the adjacent pattern 216 are conductive to each other. FIG.
In 4, the separation lines indicated by "P" indicate individual patterns 216 and distinguish them. Pattern 216
This arrangement forms a continuous path of exposed metal 202 along web W. This continuous exposed metal is used to promote an increase in the current flowing through the web W in the manner described above. For details, see the first anode 6
The metal deposited in the pattern 216 by the zero group adds additional current carrying capacity to the web W, allowing the subsequent anode 60 group to have a higher activation level. As can be appreciated from the preceding description, it is necessary that a continuous exposed metal be formed along the web W, thereby conducting the current conducted by the anode 60 through the web W to the cathode take-off roller 114. is there.

After pattern 216 has been formed according to the present invention, mask material 204 and base metal layer 202 are removed in a conventional manner, exposing the copper pattern formed by the deposited metal. Next, the pattern 216
Are separated from one another along line "P" to form separate and independent circuits.

Thus, the present invention provides a method for forming a circuit pattern on a flexible non-conductive polymer strip. This method provides a circuit with improved extensibility and flexibility in addition to reduced formation time.

The invention has been described with reference to the preferred embodiments. Those skilled in the art can make other modifications and alterations by reading and understanding the present specification. All modifications and changes are intended to be included in the invention, provided they come within the scope of the appended claims or their equivalents.

[0135]

According to the apparatus for electrodepositing a metal of the present invention, the gap between the active anode surface and the moving substrate can be made small and uniform, and as a result, the voltage can be reduced to reduce the heat. Power loss can be reduced.
Further, by utilizing the current conduction capacity of the deposited metal, a larger current flow to the substrate can be promoted, and there is an effect that the electrodeposition time can be drastically reduced. In addition, the metal-coated substrate manufactured by the apparatus for electrodepositing a metal of the present invention has enhanced extensibility and flexibility, and exhibits excellent physical properties.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view of an apparatus for electrodepositing metal on a moving web, which is a preferred embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of an apparatus for electrodepositing a metal on a moving web, which is a preferred embodiment of the present invention.

FIG. 3 shows a representative anode mounting of the present invention.
FIG. 2 is an enlarged sectional view taken along line 2-2 of FIG. 1.

FIG. 4 is an end view of a first end of the anode shown in FIG. 3;

FIG. 5 is an elevation view of the anode shown in FIG. 3;

6 is an elevational plan view of the anode shown in FIG.

FIG. 7 is an end view of a second end of the anode shown in FIG. 3;

FIG. 8 is an enlarged view of one end of the anode shown in FIG. 3, showing the electrical connector attached to this end.

FIG. 9 is a sectional view taken along line 8-8 in FIG. 6;

FIG. 10 is an optical micrograph of a side view of a copper foil electrodeposited according to the present invention.

FIG. 11 is an optical micrograph of a side view of a copper foil practically electrodeposited on a polymer substrate, showing several layers of copper deposited by a conventional practical process.

FIG. 12 is a plan view of a web having a metal layer masked to define a circuit pattern, illustrating another aspect of the invention.

FIG. 13 (a) is a schematic enlarged sectional view of a web before the metal deposition process of the present invention. FIG. 13 (b) is an enlarged cross-sectional view of the web shown in FIG. 13 (a) showing metal accumulated according to the present invention.

FIG. 14 is a plan view of a web having a metal layer masked to define a plurality of similar circuit patterns connected to extend the length of the web.

[Explanation of symbols]

 Reference Signs List 10 electrodeposition apparatus 12 substrate 20 tank 22 bottom wall 24, 26 end wall 28 arcuate reinforcing plate 32 supply conduit 34 overflow pipe 36 port 44 web 46 support 50 drum 52 outer surface 54 shaft 60 anode 62 main body 64 core 66 casing (jacket) ) 68 plate 72 pin 74 collar 76 hole 78 lug 80a, 80b anode surface 82 electrical connector 84 plate 92 hole 94 plug 96 opening 96a first cylindrical portion 96b second cylindrical portion 102 seal arrangement 104 annular seal 106 compression ring 108 hole 112 Guide roller 114 Cathode take-out roller 200 Strip 202 Base metal layer 204 Plating resist mask material 206 Pattern 206a Branch 206b Separation region 208 Band 2 14 accumulated metal 216 pattern 216a center 216b leg (branch)

 ────────────────────────────────────────────────── ─── Continued on the front page (71) Applicant 594064150 35129 Curtis Boulevard, Eastlake, Ohio 44095, United States of America (72) Inventor Peter Peckham United States of America 44077, Pinesville, Ridgebury Drive 2100 (72) Robert Dee. David United States Ohio 44134, Highland Heights, Medway Road 464 (72) Inventor Ronald Kay. Highness United States Ohio 44060, Center N. Weatherby Drive 6699 (72) Inventor Adam G. Bay United States Ohio 44026, Chesterland, Woodcrest Lane 13005

Claims (24)

[Claims] 1. A method for electrodepositing a metal on a non-conductive electrically insulating substrate, the method comprising: a) forming a thin metal flash on one side of the non-conductive electrically insulating substrate. B) moving the substrate in a predetermined direction along the path defined by the non-conductive surface with the metal surface of the substrate facing away from the surface; Moving the substrate, wherein the surface is disposed in an electrolytic solution and a plurality of anodes are disposed opposite and adjacent to the surface, defining a uniform, narrow gap therebetween. c) passing the metal surface of the substrate over a conductive cathode located outside the electrolyte solution; and d) continuously depositing metal on the moving substrate. Each group of electrodes as they pass through the electrolyte Comprising the steps of: to have a different current densities levels, a method for electrodeposition of metal. 2. The method of claim 1, wherein the current density is the same or greater at each successive anode.
The method for electrodepositing a metal according to item 1. 3. The method of claim 1 wherein said non-conductive surface is substantially cylindrical and said anode is an elongated rod extending parallel to said substantially cylindrical surface. 4. A method for electrodepositing a metal on a non-conductive, electrically insulating substrate, the method comprising providing a plurality of elongated anodes arranged in close proximity to one another in an electrolyte solution. Forming a substantially continuous active forming surface, each said anode having an active anode surface aligned with an active anode surface of an adjacent anode; and a thin layer with a non-conductive backing. While moving a flash of metal through the continuous active forming surface through the electrolytic solution, less than 1 inch between the metal and the forming surface as the metal moves along the forming surface Maintaining a predetermined uniform spacing; and as the metal exits the electrolyte, passing the metal over a cathode outlet located outside the electrolyte. Electrically activating a group of upper adjacent anodes, wherein each successive group of anodes has a higher activation level than the preceding group. How to wear. 5. A method for electrodepositing a metal on a non-conductive electrically insulating substrate, comprising: a) moving a non-conductive substrate having a flash of metal on top along a predetermined path. The substrate first moves through the electrolyte through a plurality of anodes disposed in the electrolyte, and then passes over a conductive cathode surface located outside the electrolyte, where the Flashing the metal on the substrate opposite the anode in the electrolyte and engaging the conductive cathode surface; b) electrically connecting the group of one or more adjacent anodes to different levels Activating, wherein each successive anode group has a higher activation level than the preceding group.
A method of electrodepositing metal. 6. The method of claim 5, wherein the activation level of a particular anode group is based on the current carrying capacity of the metal on the substrate as the substrate passes through the particular anode group. How to wear. 7. A metal-coated polymer film produced by the method of claim 1. 8. The metal-coated polymer film according to claim 7, wherein said polymer film is a polyimide. 9. The metal-coated polymer film of claim 8, wherein said polymer film is a polyester. 10. The metal-coated polymer film according to claim 8, wherein said metal is copper. 11. The metal-coated polymer film of claim 10, wherein said copper is a one ounce foil and said polymer film has an elongation equal to at least 15%. 12. A method of forming a printed wiring circuit on a non-conductive electrically insulating substrate, comprising: a) printing a plating resist on a layer of conductive material on one side of an elongated strip of flexible non-conductive material. And an exposed continuous band of the conductive layer extending along the length of the strip, and one of the printed wiring circuits conducting with the band.
Exposing one or more patterns, and b) moving the strip having printed wiring circuits thereon along a predetermined path, wherein the strip is first passed through the electrolytic solution. Moving through a plurality of anodes disposed within and then over a conductive cathode surface located outside the electrolyte solution, wherein the continuous band of conductive layer on the strip is Opposing the anode in a solution and engaging the conductive cathode surface; c) electrically activating different groups of one or more adjacent anodes at different levels, Wherein each successive anode group has a higher activation level than the preceding group, comprising:
A method for forming a printed wiring circuit. 13. The method of claim 12, further comprising: d) removing the plating resist; and e) etching away the conductive layer from an unpatterned region of the substrate. A method for forming a printed wiring circuit. 14. The method of claim 13, further comprising the step of disconnecting the printed circuit from the continuous band of the conductive layer. 15. The printed circuit of claim 12, wherein the activation level of a particular anode group is based on the current carrying capacity of the metal of the continuous band as the strip passes through the particular anode group. How to form. 16. A printed wiring circuit manufactured by the method of claim 12. 17. A method of forming a printed circuit on a non-conductive, electrically insulating substrate, comprising: a) forming an elongate strip of a flexible, non-conductive material having a conductive layer coated thereon. B) printing a plating resist on the conductive layer, exposing the conductive layer extending along the length of the strip, leaving exposed a plurality of patterns and bands connecting each pattern to each other. C) moving the strip having a pattern on top along a predetermined path, wherein the strip is first placed in the electrolytic solution via the electrolytic solution. Through the plurality of anodes, and then over the conductive cathode surface located outside the electrolytic solution, where the exposed areas of the conductive layer on the strip are exposed to the electrolyte. Opposing the anode in solution and engaging the conductive cathode surface; and d) electrically activating different groups of one or more adjacent anodes at different levels, Wherein each successive anode group has a higher activation level than the preceding group, comprising:
A method for forming a printed wiring circuit. 18. The method of claim 17, further comprising: d) removing the plating resist; and e) etching away the conductive layer from an unpatterned region of the substrate. A method for forming a printed wiring circuit. 19. The printed circuit of claim 17, wherein the activation level of a particular anode group is based on the current carrying capacity of the exposed metal as the strip passes through the particular anode group. Method. 20. A printed wiring circuit manufactured by the method according to claim 17. 21. A method of forming a printed circuit on a non-conductive, electrically insulating substrate, comprising: a) forming a layer of conductive material on one side of an elongated strip of flexible non-conductive material; Printing a plating resist to expose and leave a continuous area of the conductive layer along the length of the strip, the area including a plurality of printed wiring circuit patterns; Moving the strip having printed wiring circuits along a predetermined path, the strip first moving through the electrolyte through a plurality of anodes disposed in the electrolyte, and then Passing over a conductive cathode surface located outside the electrolyte, wherein the continuous region of the conductive layer on the strip faces the anode in the electrolyte and the conductive cathode C) electrically activating a group of one or more adjacent anodes at different levels, each successive anode group being higher than the preceding group. Having an activation level. 22. The method of claim 21, further comprising the step of disconnecting the printed circuit from each other. 23. The printed circuit of claim 21, wherein the activation level of a particular anode group is based on the current carrying capacity of the metal in the continuous region as the strip passes through the particular anode group. How to form. 24. A printed circuit manufactured by the method of claim 21.