CN102746670A - Heat dissipation interface material used for packaging of high-power LED (light emitting diode) lamp and preparation method thereof - Google Patents
Heat dissipation interface material used for packaging of high-power LED (light emitting diode) lamp and preparation method thereof Download PDFInfo
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Abstract
The invention discloses heat dissipation interface material used for packaging of a high-power LED (light emitting diode) lamp and a preparation method thereof. The heat dissipation interface material is obtained by fully mixing flexible AB double-component condensed type room temperature curable silicone resin as matrix and dimethyl silicone oil and functionalized graphene microchip as thermally conductive filler. The unctionalized graphene microchip and silicone resin are mixed thoroughly on a two-roll mill to enable the functionalized graphene microchip to be dispersed in the silicon resin matrix uniformly so as to prepare the heat dissipation interface material with excellent performance. According to the heat dissipation interface material, the contact gap betweena LED chip module metal heat radiating base and a heat dissipation structure of a lamp shell is avoided and the interfacial thermal contact resistance is reduced, thereby forming highly efficient heat dissipation channel and accelerating heat transfer. The material provided by the invention has great benefit for the power, miniaturization, improvement of the reliability of product and increase of the life expectancy of the LED lamp.
Description
Technical field
The invention belongs to the heat sink material technical field, be specifically related to a kind of heat dissipation interface material that is used for the high-power LED lamp encapsulation and preparation method thereof.
Background technology
Along with LED develops to high light intensity, superpower, its heat dissipation problem is outstanding day by day.At present, commercial power-type LED power input is generally 1W
～3W, chip area are 1mm * 1mm, and its heat flow density has reached 100
～300 W/cm
2The heat dissipation problem that causes has thus badly influenced luminous efficiency and the work-ing life of LED.The luminosity of particularly present single LEDs chip has satisfied not the demand of brightness of illumination, for addressing this problem, develops the high-brightness LED illuminating product, and the power-type LED that development is used in groups becomes inevitable.This timely derivation to the heat that produces in its operational process is had higher requirement.
When high-power LED illuminating light source uses under actual environment in groups; The power-type LED that uses is in groups lined up the array of a definite form; The two poles of the earth electrode of each LED all is welded on the special-purpose aluminium base, the heat dissipation metal pedestal on its package support all with aluminium base on the Copper Foil joint of correspondence position, the work calories of LED then is diffused into cooling base through the insulation layer that Copper Foil sees through on the aluminium base; And then further be delivered on the lamp housing radiator structure, thereby reach the technical purpose of heat radiation.Yet there are the gap in led chip module cooling base and lamp housing radiator structure when assembling, its effective contact area is comparatively limited, has a strong impact on its heat transfer efficiency.Given this problem, the gap when generally adopting heat interfacial material to be used to fill up the assembly assembling with high thermal conductivity, thus form certain heat conduction condition.Present widely used heat interfacial material-heat-conducting silicone grease is to be matrix with the silicone grease, adds the thermal conductive metal particle thing.Metallic particles is oxidized easily under the pyritous situation on the one hand for this type of heat interfacial material, causes the deterioration of heat-conducting silicone grease over-all properties; On the other hand, this type of heat interfacial material belongs to body of paste, is not easy even tiling in use, and when long term operation, occurs problems such as caking easily, and these problems have a strong impact on its radiating efficiency.So the flexible patch type heat interfacial material of exploitation excellent combination property is used to solve as the cooling base of led chip module carrier and the heat radiation connectivity problem that has between the lamp housing of radiator structure and has realistic meaning.
Development high brightness, superpower, high reliability and long-life LED, heat dissipation technology is its key.The present invention combines a kind of heat sinking boundary material that is used for the high-power LED lamp encapsulation of Graphene exploitation with excellent thermal property of research at present.Be intended to reduce the thermal contact resistance between high-power LED chip module cooling base and the lamp housing radiator structure, the bottleneck technology of high-power LED lamp heat radiation is solved preferably.
Summary of the invention
The object of the invention is to provide a kind of high thermal conductivity coefficient that has, heat dissipation interface material that is used for the high-power LED lamp encapsulation of excellent combination property and preparation method thereof.
A kind of heat dissipation interface material that is used for the high-power LED lamp encapsulation provided by the invention is to do matrix by flexible AB double-component condensed type self-vulcanizing silicone resin, adds dimethyl silicone oil and functionalization graphene microplate and forms as the heat conductive filler thorough mixing; Its composition by weight is: 100 parts of A component silicone resin, 2 parts of B component silicone resin, 20～30 parts of dimethyl silicone oils, 0.5～2 part of functionalization graphene microplate.
The preparation technology of above-mentioned functions Graphene microplate is: the 4g natural flake graphite is added in the 92mL vitriol oil, add 2g NaNO after stirring successively
3With 12g KMnO
4, in 0 ~ 0.5 ℃ of water bath with thermostatic control, stir 2h; Afterwards the water bath with thermostatic control temperature is increased to 35 ℃, continues to stir 2h; Afterwards the water bath with thermostatic control temperature is increased to 99 ℃, continues to stir when color sample becomes glassy yellow, add 120mL 5wt%H
2O
2At last product is filtered, to neutral, behind 60 ℃ of dry 48h, obtain graphite oxide with washed with de-ionized water; After obtaining graphite oxide, put it into N
2In the microwave oven of protection, the operating power of microwave oven is 1600W, and whole process is at N
2Carry out under the atmosphere, heating 15s, intermittently the alternately type of heating of 15s heats 30min altogether; The microwave oven working temperature reaches 600 ± 50 ℃, is furnace cooling behind the heating back insulation 2min alternately, prepares the Graphene microplate; With silane resin acceptor kh-550 it is carried out surface-treated afterwards and finally obtain the functionalization graphene microplate, the said functionalization graphene microplate number of plies is in 10 layers.
The present invention also provides a kind of preparation method who is used for the heat dissipation interface material of high-power LED lamp encapsulation, and it has following steps:
(1) by weight; With 100 parts of A component silicone resin, 20～30 parts of dimethyl silicone oils, 0.5～2 part of functionalization graphene microplate; On the double roll mill under room temperature mixing repeatedly 30 min; Add 2 parts of B component silicone resin then, on double roll mill, mix, make preliminary heat dissipation interface material;
(2) do in the mould of substrate at polyester film (PET), preliminary heat dissipation interface material is put into the upper and lower surfaces of mould cavity, on vulcanizing press, flatten, processing thickness is the flexible patch shape heat dissipation interface material of 0.3mm～0.5mm; When crosslinked, produce gas for fear of two component silicone resin and on final boundary material, produce the cavity, in the process that flattens, at first carry out exhaust, condition is: 120 ℃ of die temperatures, pressure 14MPa, dwell time 30min;
(3) make flexible patch shape heat dissipation interface material, by the desired shape size patch-shaped heat dissipation interface material is carried out cutting during use, remove the polyester film of upper and lower surfaces, it is tiled in desired location with viscosity.
Two component silicone resin that the present invention uses are commercially available double-component condensed type self-vulcanizing silicone resin, and silane resin acceptor kh-550 is: γ-An Bingjisanyiyangjiguiwan.
Beneficial effect of the present invention:
The heat dissipation interface material that is used for the high-power LED lamp encapsulation of the present invention can be avoided the contact gap between led chip module heat dissipation metal pedestal and the lamp housing radiator structure effectively, reduces the interface thermal contact resistance, forms the high efficiency and heat radiation passage, the accelerated heat transmission; This all has very big benefit to LED lamp powerization, miniaturized and raising product reliability and life-span.The bottleneck technology of high-power LED lamp heat radiation is solved preferably.
Description of drawings
Fig. 1 is the structural relation synoptic diagram of application target thing of the present invention.
Wherein: 1.LED light fixture lens, 2. led chip module, 3. led chip module cooling base, 4. heat dissipation interface material, 5. LED lamp housing radiator structure, 6. radiated rib.
Embodiment
Embodiment 1:
1) silane resin acceptor kh-550 of 0.05 weight part is mixed with the solution of 25wt% with the dissolve with ethanol of 95wt%, continues to stir, and after waiting to dissolve, adds the Graphene microplate of 0.5 parts by weight, places 60 ℃ of water-baths, about 4 hours of ultrasonic agitation.Treat that solvent evaporation finishes, place furnace pot, put into baking oven, dry 10h down at 120 ℃, the back is behind oven dry 2h under 150 ℃, and it is for use to obtain the functionalization graphene microplate;
2) the A component silicone resin of 100 weight parts is extremely even with the functionalization graphene and the mixing repeatedly about 40min of 20 weight part dimethyl silicone oils of above-mentioned 0.5 weight part in two roller mills.The B component silicone resin that adds 2.0 weight parts then; Mixing evenly after, collect the mixture on the roll shaft, being placed on the inner chamber tiling has in the mould of polyester film that compressing tablet is shaped in vulcanizing press; Condition is: 120 ℃ of die temperatures; Pressure 14MPa, dwell time 30min, finally obtaining thickness is the patch-shaped boundary material of 0.3 ~ 0.5mm;
3) combine accompanying drawing,, be cut into suitable size, be tiled in the gap location between led chip module cooling base 3 and the lamp housing radiator structure 5 boundary material of above-mentioned preparation.Cooling base 3 on the led chip module package support is being born the conduction of led chip work calories, and a large amount of heats that it must produce led chip as early as possible are transmitted on lamp housing radiator structure 5 these terminals, and final the completion dispelled the heat.So the heat conductivility of the heat dissipation interface material between LED cooling base and the lamp housing radiator structure is particularly important.
The present invention directly applies to the boundary material of preparation the encapsulation (shown in accompanying drawing) of high-power LED lamp; Through measuring the real time temperature of cooling base and lamp housing radiator structure, calculating temperature head is between the two assessed the heat radiation heat-transfer capability of the heat dissipation interface material of preparation.After experiment recorded and uses above-mentioned boundary material, the LED cooling base dropped to 7.8 ℃ to the temperature head between the lamp housing radiator structure from 13.5 ℃.
Embodiment 2:
1) silane resin acceptor kh-550 of 0.1 weight part is mixed with the solution of 25wt% with the dissolve with ethanol of 95wt%, continues to stir, and after waiting to dissolve, adds the Graphene microplate of 1.0 parts by weight, places 60 ℃ of water-baths, about 4 hours of ultrasonic agitation.Treat that solvent evaporation finishes, place furnace pot, put into baking oven, dry 10h down at 120 ℃, the back is behind oven dry 2h under 150 ℃, and it is for use to obtain the functionalization graphene microplate;
2) the A component silicone resin of 100 weight parts is extremely even with the functionalization graphene and the mixing repeatedly about 40min of 20 weight part dimethyl silicone oils of above-mentioned 1.0 weight parts in two roller mills.The B component silicone resin that adds 2.0 weight parts then; Mixing evenly after, collect the mixture on the roll shaft, being placed on the inner chamber tiling has in the mould of polyester film that compressing tablet is shaped in vulcanizing press; Condition is: 120 ℃ of die temperatures; Pressure 14MPa, dwell time 30min, finally obtaining thickness is the patch-shaped boundary material of 0.3 ~ 0.5mm;
3) combine accompanying drawing,, be cut into suitable size, be tiled in the gap location between led chip module cooling base 3 and the lamp housing radiator structure 5 boundary material of above-mentioned preparation.Cooling base 3 on the led chip module package support is being born the conduction of led chip work calories, and a large amount of heats that it must produce led chip as early as possible are transmitted on lamp housing radiator structure 5 these terminals, and final the completion dispelled the heat.So the heat conductivility of the heat dissipation interface material between LED cooling base and the lamp housing radiator structure is particularly important.The present invention directly applies to the boundary material of preparation the encapsulation (shown in accompanying drawing) of high-power LED lamp; Through measuring the real time temperature of cooling base and lamp housing radiator structure, calculating temperature head is between the two assessed the heat radiation heat-transfer capability of the heat dissipation interface material of preparation.After experiment recorded and uses above-mentioned boundary material, the LED cooling base dropped to 5.0 ℃ to the temperature head between the lamp housing radiator structure from 13.5 ℃.
Embodiment 3:
1) silane resin acceptor kh-550 of 0.15 weight part is mixed with the solution of 25wt% with the dissolve with ethanol of 95wt%, continues to stir, and after waiting to dissolve, adds the Graphene microplate of 1.5 parts by weight, places 60 ℃ of water-baths, about 4 hours of ultrasonic agitation.Treat that solvent evaporation finishes, place furnace pot, put into baking oven, dry 10h down at 120 ℃, the back is behind oven dry 2h under 150 ℃, and it is for use to obtain the functionalization graphene microplate;
2) the A component silicone resin of 100 weight parts is extremely even with the functionalization graphene and the mixing repeatedly about 40min of 25 weight part dimethyl silicone oils of above-mentioned 1.5 weight parts in two roller mills.The B component silicone resin that adds 2.0 weight parts then; Mixing evenly after, collect the mixture on the roll shaft, being placed on the inner chamber tiling has in the mould of polyester film that compressing tablet is shaped in vulcanizing press; Condition is: 120 ℃ of die temperatures; Pressure 14MPa, dwell time 30min, finally obtaining thickness is the patch-shaped boundary material of 0.3 ~ 0.5mm;
3) combine accompanying drawing,, be cut into suitable size, be tiled in the gap location between led chip module cooling base 3 and the lamp housing radiator structure 5 boundary material of above-mentioned preparation.Cooling base 3 on the led chip module package support is being born the conduction of led chip work calories, and a large amount of heats that it must produce led chip as early as possible are transmitted on lamp housing radiator structure 5 these terminals, and final the completion dispelled the heat.So the heat conductivility of the heat dissipation interface material between LED cooling base and the lamp housing radiator structure is particularly important.The present invention directly applies to the boundary material of preparation the encapsulation (shown in accompanying drawing) of high-power LED lamp; Through measuring the real time temperature of cooling base and lamp housing radiator structure, calculating temperature head is between the two assessed the heat radiation heat-transfer capability of the heat dissipation interface material of preparation.After experiment recorded and uses above-mentioned boundary material, the LED cooling base dropped to 2.7 ℃ to the temperature head between the lamp housing radiator structure from 13.5 ℃.
Embodiment 4:
1) silane resin acceptor kh-550 of 0.2 weight part is mixed with the solution of 25wt% with the dissolve with ethanol of 95wt%, continues to stir, and after waiting to dissolve, adds the Graphene microplate of 2.0 parts by weight, places 60 ℃ of water-baths, about 4 hours of ultrasonic agitation.Treat that solvent evaporation finishes, place furnace pot, put into baking oven, dry 10h down at 120 ℃, the back is behind oven dry 2h under 150 ℃, and it is for use to obtain the functionalization graphene microplate;
2) the A component silicone resin of 100 weight parts is extremely even with the functionalization graphene and the mixing repeatedly about 40min of 30 weight part dimethyl silicone oils of above-mentioned 2.0 weight parts in two roller mills.The B component silicone resin that adds 2.0 weight parts then; Mixing evenly after, collect the mixture on the roll shaft, being placed on the inner chamber tiling has in the mould of polyester film that compressing tablet is shaped in vulcanizing press; Condition is: 120 ℃ of die temperatures; Pressure 14MPa, dwell time 30min, finally obtaining thickness is the patch-shaped boundary material of 0.3 ~ 0.5mm;
3) combine accompanying drawing,, be cut into suitable size, be tiled in the gap location between led chip module cooling base 3 and the lamp housing radiator structure 5 the above-mentioned boundary material for preparing.Cooling base 3 on the led chip module package support is being born the conduction of led chip work calories, and a large amount of heats that it must produce led chip as early as possible are transmitted on lamp housing radiator structure 5 these terminals, and final the completion dispelled the heat.So the heat conductivility of the heat dissipation interface material between LED cooling base and the lamp housing radiator structure is particularly important.The present invention directly applies to the boundary material of preparation the encapsulation (shown in accompanying drawing) of high-power LED lamp; Through measuring the real time temperature of cooling base and lamp housing radiator structure, calculating temperature head is between the two assessed the heat radiation heat-transfer capability of the heat dissipation interface material of preparation.After experiment recorded and uses above-mentioned boundary material, the LED cooling base dropped to 1.2 ℃ to the temperature head between the lamp housing radiator structure from 13.5 ℃.
Final experiment is found, uses the boundary material of implementing preparation in 4 during the encapsulation of LED light fixture, and the LED cooling base drops to 1.2 ℃ to the temperature head between the lamp housing radiator structure from 13.5 ℃.Can meet the heat radiation requirement of LED light fixture best.
Claims (3)
1. one kind is used for the heat dissipation interface material that high-power LED lamp encapsulates; It is characterized in that: this heat dissipation interface material is to do matrix by flexible AB double-component condensed type self-vulcanizing silicone resin, adds dimethyl silicone oil and functionalization graphene microplate and forms as the heat conductive filler thorough mixing; Its composition by weight is: 100 parts of A component silicone resin, 2 parts of B component silicone resin, 20～30 parts of dimethyl silicone oils, 0.5～2 part of functionalization graphene microplate.
2. the heat dissipation interface material that is used for the high-power LED lamp encapsulation according to claim 1; It is characterized in that: the preparation technology of above-mentioned functions Graphene microplate is: the 4g natural flake graphite is added in the 92mL vitriol oil, add 2g NaNO after stirring successively
3With 12g KMnO
4, in 0 ~ 0.5 ℃ of water bath with thermostatic control, stir 2h; Afterwards the water bath with thermostatic control temperature is increased to 35 ℃, continues to stir 2h; Afterwards the water bath with thermostatic control temperature is increased to 99 ℃, continues to stir when color sample becomes glassy yellow, add 120mL 5wt%H
2O
2At last product is filtered, to neutral, behind 60 ℃ of dry 48h, obtain graphite oxide with washed with de-ionized water; After obtaining graphite oxide, put it into N
2In the microwave oven of protection, the operating power of microwave oven is 1600W, and whole process is at N
2Carry out under the atmosphere, heating 15s, intermittently the alternately type of heating of 15s heats 30min altogether; The microwave oven working temperature reaches 600 ± 50 ℃, is furnace cooling behind the heating back insulation 2min alternately, prepares the Graphene microplate; With silane resin acceptor kh-550 it is carried out surface-treated afterwards and finally obtain the functionalization graphene microplate, the said functionalization graphene microplate number of plies is in 10 layers.
3. the described preparation method who is used for the heat dissipation interface material of high-power LED lamp encapsulation of a claim 1 is characterized in that having following steps:
(1) by weight; With 100 parts of A component silicone resin, 20～30 parts of dimethyl silicone oils, 0.5～2 part of functionalization graphene microplate; On the double roll mill under room temperature mixing repeatedly 30 min; Add 2 parts of B component silicone resin then, on double roll mill, mix, make preliminary heat dissipation interface material;
(2) do in the mould of substrate at polyester film, preliminary heat dissipation interface material is put into the upper and lower surfaces of mould cavity, on vulcanizing press, flatten, processing thickness is the flexible patch shape heat dissipation interface material of 0.3～0.5mm; When crosslinked, produce gas for fear of two component silicone resin and on final boundary material, produce the cavity, in the process that flattens, at first carry out exhaust, condition is: 120 ℃ of die temperatures, pressure 14MPa, dwell time 30min;
(3) make flexible patch shape heat dissipation interface material, by the desired shape size patch-shaped heat dissipation interface material is carried out cutting during use, remove the polyester film of upper and lower surfaces, it is tiled in desired location with viscosity.
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| CN103337368A (en) * | 2013-06-06 | 2013-10-02 | 广东工业大学 | Preparation method of dye-sensitized solar cell grapheme-doped composite electrode |
| CN103756325A (en) * | 2014-01-16 | 2014-04-30 | 广东工业大学 | Low-filling-capacity and high-heat-conductivity graphene/silicone grease composite material and preparation method thereof |
| CN104214739A (en) * | 2014-08-22 | 2014-12-17 | 浙江工业大学 | High-power LED (light emitting diode) grapheme-based heat radiation device |
| CN104696767A (en) * | 2015-03-31 | 2015-06-10 | 东莞市闻誉实业有限公司 | Led lamp |
| CN104893296A (en) * | 2015-06-05 | 2015-09-09 | 哈尔滨工业大学 | Composite silicone grease with high thermal conductivity and preparation method thereof |
| CN105318211A (en) * | 2014-07-16 | 2016-02-10 | 广州固佳灯具科技有限公司 | High-protection lamp with heat dissipation enhanced by grapheme |
| CN105924888A (en) * | 2016-04-19 | 2016-09-07 | 安徽路明光电科技有限公司 | Mainboard for LED lamp and production process thereof |
| CN107366887A (en) * | 2017-08-06 | 2017-11-21 | 潘金文 | A kind of LED heat dissipation structure |
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| WO2018049569A1 (en) * | 2016-09-13 | 2018-03-22 | 深圳市瑞梓光电科技有限公司 | Led lamp |
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| CN113390046A (en) * | 2021-06-18 | 2021-09-14 | 宝德照明集团有限公司 | Intelligent street lamp with multistage heat dissipation lamp shade |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102020851A (en) * | 2009-09-16 | 2011-04-20 | 大连路明发光科技股份有限公司 | Light conversion flexible high molecular material and application thereof |
| CN102153877A (en) * | 2011-02-22 | 2011-08-17 | 中国科学技术大学 | Graphene composite material and preparation method thereof |
-
2012
- 2012-07-25 CN CN201210259107.9A patent/CN102746670B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102020851A (en) * | 2009-09-16 | 2011-04-20 | 大连路明发光科技股份有限公司 | Light conversion flexible high molecular material and application thereof |
| CN102153877A (en) * | 2011-02-22 | 2011-08-17 | 中国科学技术大学 | Graphene composite material and preparation method thereof |
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| CN103337368A (en) * | 2013-06-06 | 2013-10-02 | 广东工业大学 | Preparation method of dye-sensitized solar cell grapheme-doped composite electrode |
| CN103337368B (en) * | 2013-06-06 | 2016-01-20 | 广东工业大学 | A kind of preparation method of DSSC doped graphene combination electrode |
| CN103756325A (en) * | 2014-01-16 | 2014-04-30 | 广东工业大学 | Low-filling-capacity and high-heat-conductivity graphene/silicone grease composite material and preparation method thereof |
| CN103756325B (en) * | 2014-01-16 | 2016-06-22 | 广东工业大学 | A kind of low loading high thermal conductivity graphene/silicone grease composite and preparation method thereof |
| CN105318211A (en) * | 2014-07-16 | 2016-02-10 | 广州固佳灯具科技有限公司 | High-protection lamp with heat dissipation enhanced by grapheme |
| CN104214739A (en) * | 2014-08-22 | 2014-12-17 | 浙江工业大学 | High-power LED (light emitting diode) grapheme-based heat radiation device |
| CN104696767A (en) * | 2015-03-31 | 2015-06-10 | 东莞市闻誉实业有限公司 | Led lamp |
| CN104893296A (en) * | 2015-06-05 | 2015-09-09 | 哈尔滨工业大学 | Composite silicone grease with high thermal conductivity and preparation method thereof |
| CN105924888A (en) * | 2016-04-19 | 2016-09-07 | 安徽路明光电科技有限公司 | Mainboard for LED lamp and production process thereof |
| WO2018049569A1 (en) * | 2016-09-13 | 2018-03-22 | 深圳市瑞梓光电科技有限公司 | Led lamp |
| CN107482100A (en) * | 2017-07-31 | 2017-12-15 | 信利半导体有限公司 | A kind of TOP LED supports with great heat radiation effect |
| CN107366887A (en) * | 2017-08-06 | 2017-11-21 | 潘金文 | A kind of LED heat dissipation structure |
| CN108676363A (en) * | 2018-05-09 | 2018-10-19 | 山东亿昌照明科技有限公司 | A kind of heat dissipation interface material and its LED lamp for high-power outdoor lighting LED lamp |
| CN108676363B (en) * | 2018-05-09 | 2021-07-09 | 山东亿昌照明科技有限公司 | Heat dissipation interface material for high-power outdoor lighting LED lamp and LED lamp thereof |
| CN113390046A (en) * | 2021-06-18 | 2021-09-14 | 宝德照明集团有限公司 | Intelligent street lamp with multistage heat dissipation lamp shade |
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