CN102740601A - Process for producing electronic substrate and adhesive used therein - Google Patents
Process for producing electronic substrate and adhesive used therein Download PDFInfo
- Publication number
- CN102740601A CN102740601A CN2012100414972A CN201210041497A CN102740601A CN 102740601 A CN102740601 A CN 102740601A CN 2012100414972 A CN2012100414972 A CN 2012100414972A CN 201210041497 A CN201210041497 A CN 201210041497A CN 102740601 A CN102740601 A CN 102740601A
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- substrate
- solid
- dry film
- property
- processing procedure
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Links
- 239000000758 substrate Substances 0.000 title claims abstract description 123
- 238000000034 method Methods 0.000 title claims abstract description 66
- 239000000853 adhesive Substances 0.000 title abstract 6
- 230000001070 adhesive effect Effects 0.000 title abstract 6
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 239000007787 solid Substances 0.000 claims description 85
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- -1 ethylhexyl (Ethyl Hexyl) Chemical group 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 4
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 239000004258 Ethoxyquin Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 229940093500 ethoxyquin Drugs 0.000 claims description 2
- 235000019285 ethoxyquin Nutrition 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 14
- 230000003287 optical effect Effects 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000000704 physical effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 16
- 238000003475 lamination Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011469 building brick Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Abstract
A process for preparing electronic substrate and its adhesive used, wherein the process for preparing electronic substrate includes preparing the first substrate, especially the hard substrate, coating liquid adhesive on it, and heating to form dry film; then, a second substrate, especially a flexible substrate, having different physical properties is attached to the first substrate. Then forming an electronic substrate after a processing procedure; and then, the adhesive dry film loses the adhesiveness through cooling or other optical methods, and the electronic substrate can be stripped. Particularly, the adhesive which forms an adhesive dry film after being heated and is cooled for demoulding is a recyclable material.
Description
Technical field
This specification proposes a kind of processing procedure and applied solid of electric substrate, is meant a tool temperature control characteristic solid especially, with the processing procedure of using this solid.
Background technology
Along with the application of circuit board is extensive day by day and powerful, produce the circuit board or the superimposed structure of multilayer material of sandwich construction in the application.On the make; Has certain physical difference between each layer; Meet when hot because the different phenomenon of difference generation of the structure on each layer and material specific heat such as layers of material; Particularly because heating or during low temperature in the processing procedure, each layer to temperature reactions vary produces the problem of warpage, this makes each layer not fit closely.
This type of problem can be shown as the sketch map of multilayer circuit board generation warping phenomenon in the known techniques with reference to figure 1.
Show a board structure of circuit 10 among the figure, be illustrated as the structure that ground floor circuit board 11, second layer circuit board 12 and the 3rd layer circuit board 13 are formed.According to demand, each layer should have different wiring (routing), and the possibility skewness, makes to produce difference between each layer.Because can produce high heat in the processing procedure, such as welding, at the fashionable supervisor of heating of each laminating, at this moment because for temperature reactions vary and produce the problem of warpage, as directed warpage scope 15.
Processing procedure traditionally possibly produce the problem of warpage, can influence the applying of layers of material, concerning the electronic equipment of precision, also can cause assembling to go up error and puzzlement.
Summary of the invention
In order to produce the problem on making because of the difference of the physical characteristic between layers of material, substrate in the processing procedure that improves multilayer material; A kind of a kind of tool temperature control characteristic solid that is applied in the electric substrate processing procedure of the special proposition of this specification; Utilize improvement and described each the interlayer solid of this specification of processing procedure,, can also see through temperature control except the error that can prevent to produce in the processing procedure; Or the processing of other optical means, let between the smooth treatment substrate of this solid applying with peel off.
According to embodiment; The processing procedure of electric substrate comprises purchases first substrate earlier, and this can be a rigid substrate, particularly is applied on the general board; Coating one liquid solid on first substrate can utilize temperature control to make this liquid solid form the solid dry film of a tool property followed again afterwards.
Liquid solid is through solidifying to form a dry film, and second substrate entirely fits on above-mentioned first substrate after can making, such as utilizing roller pressure programming or lamination process, particularly has under the situation of different physical characteristics with second substrate to first substrate.Afterwards, make second substrate form an electric substrate through a handling procedure, this processing program can be the semiconductor processing procedure, on second substrate, forms electronic building brick, or seeing through patterning process forms processing procedures such as circuit.
Specifically, see through temperature control or optical means after the processing procedure and make the solid dry film lose then property, and can peel off electric substrate smoothly.
According to an embodiment, the composition of above-mentioned liquid solid mainly is to have the dry film that heats up and solidify and make solid have the property followed, and also when cooling, makes dry film lose the then characteristics of property.
Description of drawings
Fig. 1 is shown as the sketch map of multilayer circuit board generation warping phenomenon in the known techniques;
Fig. 2 A to Fig. 2 I shows the processing procedure embodiment of electric substrate of the present invention;
Fig. 3 describes one of making flow implementation example of electric substrate of the present invention;
Fig. 4 describe electric substrate of the present invention making flow implementation example two.
[primary clustering symbol description]
Board structure of circuit 10 warpage scopes 15
Ground floor circuit board 11 second layer circuit boards 12
The 3rd layer circuit board 13 first substrates 20
Liquid solid 22 solid dry films 22 '
Second substrate, 24 electronic components 201
The processing procedure one of step S301～S313 electric substrate
The processing procedure two of step S401～S417 electric substrate
Embodiment
(1) this case specifies representative graph to be: Fig. 3.
(2) the element numbers simple declaration of this representative graph:
S301 purchases first substrate
S303 is coated with liquid solid
S305 forms the solid dry film
S307 second substrate of fitting
S309 forms electric substrate
S311 solid dry film loses then property
S313 peels off electric substrate
The chemical formula that can show inventive features:
This specification proposes a kind of solid; This solid is applied to the applying program of different substrate storeroom in the sandwich construction; Solid particularly has the temperature control characteristic, can see through its characteristic of temperature control break, has then property when the high temperature such as the composition of solid; And, can make it lose then property in being cooled under the uniform temperature; The mode of this temperature control can have other embodiment according to the composition of solid.
According to one of embodiment, this composition with solid of temperature control characteristic includes three main compositions, and with the subscript x of figure below, y, z represent that according to enforceable composition, the molar ratio scope between each main composition is respectively x=0 ~ 5 to its molar ratio respectively; Y=5 ~ 25; Z=10.
The embodiment of solid forms as follows:
Wherein:
R
1Be one of hydrogen (Hydrogen), methyl (Methyl);
R
2Be one of nonyl (Nonyl), ethoxyquin nonyl (Ethoxylated Nonyl);
R
3Be one of hydrogen (Hydrogen), methyl (Methyl);
R
4Be one of following compound, comprise: methyl (Methyl), ethyl (Ethyl), butyl (Butyl), ethylhexyl (Ethyl Hexyl), glycidyl (Glycidyl), octadecyl (Stearyl), alkoxide lauryl (Alkoxylated Lauryl), tetrahydrofuran base (Tetrahydro furfuryl), 2-phenoxy group ethyl (2-Phenoxy Ethyl), isodecyl (Isodecyl), octyl group (Octyl), decyl (Decyl) and isobornyl (Isobornyl).
Above-mentioned solid particularly can utilize temperature to control the stickiness of solid in processing procedure, and this type of solid material is recyclable reusable material in a particular embodiment.
In another embodiment; Can utilize optical means control stickiness; Heat up or ultraviolet light (UV) solidifies liquid solid such as utilizing earlier, make it to form solid dry film with stickiness, again in processing procedure when finishing; Utilize optical means to make the solid dry film lose stickiness equally, and the feasible substrate of peeling off easily.But utilize to heat up producing the solid that then property and the mode of utilizing the optical means demoulding use, this type of can not reclaim use.
Utilize above-mentioned solid dry film; Can improve in the processing procedure of multilayer material maybe be because the difference of the physical characteristic between layers of material, substrate produces the problem on making; Especially add man-hour to flexible base plate in the processing procedure; High temperature can make substrate warp, or the warping phenomenon that forms of different layers materials variances.
Therefore can prevent the error that produces in the processing procedure from can see through temperature control simultaneously, or the processing of other optical means can be fitted the solid dry film easily and is peeled off layers of material in processing procedure.
According to an embodiment; The processing procedure that this specification discloses can be the situation of on general board, making flexible circuit board; Because this type of board is generally rigid board; When flexible base plate attached, both physical difference can make processing procedure produce error usually, and the solid that this specification disclosed can improve this phenomenon.
Fig. 2 A to Fig. 2 I then shows the processing procedure embodiment of flexible base plate of the present invention, wherein shows and utilizes the processing procedure of above-mentioned tool temperature control characteristic solid, but still be applicable to that the various implementations of the may command solid property followed make the solid dry film lose then property.
Processing procedure is purchased board, carrier earlier, shown in Fig. 2 A, has purchased first substrate 20 for another example, can be rigid substrates such as glass substrate, metal substrate, more can be like the carrier in the silicon wafer process.
Then shown in Fig. 2 B, coating one liquid solid 22 on first substrate 20, this liquid solid is the then material of usefulness, can its characteristic of treated control, such as having the then characteristic of property of temperature control.Shown in Fig. 2 C, through a Temperature Treatment, produce a process that forms dry film, form the solid dry film 22 ' of the tool property followed.
Then purchase second substrate 24 that a desire forms various electric substrate; Shown in Fig. 2 D; The substrate that second substrate 24 particularly can have different physical characteristics with first substrate 20, such as being a kind of flexible base plate, special because two substrates are because of the material coefficient of expansion different with the different generations of the content of layout, different specific heat; Second substrate 24 sees through solid dry film 22 ' and fits in first substrate 20, shown in Fig. 2 E.The method of fitting is as utilizing the pressure programming of a roller, or the mode of a kind of lamination (lamination) is formed on first substrate 20 second substrate 24.
For another example shown in Fig. 2 F; After second substrate 24 of fitting; This substrate, can see through other manufacture of semiconductor and make electronic component 201 on second substrate 24 as showing among the figure as making other electronic building brick or the substrate of wiring; Other also can see through patterning process such as little shadow (lithography), etching and make circuit, or utilizes printing process (printing) and the various electric substrate of formation.
After accomplishing above-mentioned processing procedure, program is utilized the temperature control or the mode of irradiate light shown in Fig. 2 G, makes solid dry film 22 ' can lose then property, and can peel off second substrate, 24 formed electric substrates easily.
Then shown in Fig. 2 H, stay and lose the then solid dry film 22 ' of property.After remove after the solid dry film, processing procedure stays first substrate 20, like Fig. 2 I.
In the above-mentioned processing procedure, the step of second substrate 24 of fitting roller pressure programming capable of using or lamination process, and before these steps, can use an adjustment program (alignment) adjustment first substrate 20 and second substrate 24.Particularly can make two kinds of smooth applyings of substrate of different qualities, and can carry out successive process smoothly by the solid dry film.Such as Fig. 3 the makings flow implementation of the electric substrate described of arrangement routine.
According to Fig. 3, after step S301 purchased first substrate, step S303 was coated with a kind of liquid solid, like solvent type glue for another example.After desolventizing, form the dry film of the tool property followed, like the said formation solid of step S305 dry film.Second substrate (step S307) of fitting again, first substrate can have different physical characteristics with second substrate.After other fabrication process, on second substrate, form electronic component, wiring etc., to form the electric substrate (step S309) of specific function, make the solid dry film lose then property (step S311) again, can peel off electric substrate (step S313) smoothly.
Fig. 4 describes the making flow implementation example of electric substrate of the present invention, and this is the embodiment that describes the characteristic that sees through Temperature Treatment control solid dry film, in a particular embodiment, and the dry film of the solid dry film of processing procedure back segment on first substrate for reusing.
Step such as S401 purchase first substrate earlier, are in particular a unbending rigid substrate, do not limit for this reason.Step S403 is coated with the liquid solid of one deck on first substrate for another example.After being heated to certain high temperature (step S405) afterwards, liquid solid form has the then solid dry film (step S407) of property.
At this moment, like step S409, second substrate that desire is fitted is harmonized, and single unit system is placed a vacuum environment, second substrate of fitting in a vacuum is in particular a flexible base plate, like soft electronic substrate (step S411).Form electric substrate (step S413) through particular process afterwards.
After the completion, can handle with cooling, after being cooled to a specific low temperature (step S415), the solid dry film will lose then property, make electric substrate can peel off (step S417) easily.
In the step of above-mentioned applying second substrate, particularly under the vacuum environment that can reduce other impurity, carry out, and can carry out the processing procedure of pressurizing attaching again in heating simultaneously.
The then mode of property of above-mentioned change solid dry film can be not limited to above-mentioned execution mode, such as, solid can make it produce then property through a heating schedule; And can make the solid dry film lose then property through a frequency modulating irradiate light program at the processing procedure back segment.
In above-mentioned,, then can impose the dry film that desolventizes with the formation tool property followed if the liquid solid on first substrate is a solvent-borne type glue.
In sum; The solid that this specification proposed can be with reference to chemical equation described herein and is wherein formed; Particularly can see through the then property of its solid dry film of temperature control control, the optical means that still can see through the particular light ray illumination procedure in addition makes the solid dry film change then property.
Only the above is merely the present invention's preferable possible embodiments, and is non-so promptly limit to the present invention's claim, so use specification of the present invention and the equivalent structure variation for it of diagramatic content institute such as, all in like manner is contained in the present invention's the scope, closes and gives Chen Ming.
Claims (10)
1. the processing procedure of an electric substrate comprises:
Purchase one first substrate;
Coating one liquid solid on this first substrate;
Make this liquid state solid form the solid dry film of a tool property followed through a program of desolventizing;
On this first substrate and this solid dry film, fit one have different physical characteristics with this first substrate second substrate;
Make this second substrate form an electric substrate through a handling procedure;
Make this solid dry film lose then property; And
Peel off this electric substrate.
2. according to claim 1 the processing procedure of electric substrate wherein is the solid dry film that forms this tool property followed through a heating schedule.
3. like the processing procedure of the said electric substrate of claim 2, wherein be this solid dry film is under the uniform temperature state and loses then property through a cooling process.
4. like the processing procedure of the said electric substrate of claim 2, wherein the solid dry film of this tool property followed system loses then property through an irradiate light program.
5. according to claim 1 the processing procedure of electric substrate, the step system of second substrate of wherein should fitting uses a roller pressure programming or one deck compacting journey.
6. according to claim 1 the processing procedure of electric substrate should the liquid state solid be a solvent type glue wherein.
7. the processing procedure of an electric substrate comprises:
Purchase one first substrate;
Coating one liquid solid on this first substrate;
Solidify through a heating schedule, make this liquid state solid form the then solid dry film of property of tool absorption;
On this first substrate and this solid dry film, fit one have different physical characteristics with this first substrate second substrate;
Make this second substrate form an electric substrate through a handling procedure;
Make this solid dry film lose then property of absorption through a cooling process; And peel off this electric substrate.
8. the processing procedure of an electric substrate comprises:
Purchase one first substrate;
Coating one liquid solid on this first substrate;
Through a heating schedule, make this liquid state solid form the solid dry film of a tool property followed;
On this first substrate and this solid dry film, fit one have different physical characteristics with this first substrate second substrate;
Make this second substrate form an electric substrate through a handling procedure;
Make this solid dry film lose then property through an irradiate light program; And peel off this electric substrate.
9. solid that is applied to like the 1st or the 7th said electric substrate processing procedure of claim, it consists of:
Wherein:
R
1Be one of hydrogen (Hydrogen), methyl (Methyl);
R
2Be one of nonyl (Nonyl), ethoxyquin nonyl (Ethoxylated Nonyl);
R
3Be one of hydrogen (Hydrogen), methyl (Methyl);
R
4Be one of following compound, comprise: methyl (Methyl), ethyl (Ethyl), butyl (Butyl), ethylhexyl (Ethyl Hexyl), glycidyl (Glycidyl), octadecyl (Stearyl), alkoxide lauryl (Alkoxylated Lauryl), tetrahydrofuran base (Tetrahydro furfuryl), 2-phenoxy group ethyl (2-Phenoxy Ethyl), isodecyl (Isodecyl), octyl group (Octyl), decyl (Decyl) and isobornyl (Isobornyl);
x=0~5；y=5~25；z=10。
10. like the 9th said solid of claim, wherein this composition has the curing of intensification and makes this solid dry film have then property, and makes this solid dry film lose the then characteristic of property in cooling.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100114666 | 2011-04-27 | ||
| TW100114666A TWI422295B (en) | 2011-04-27 | 2011-04-27 | Manufacturing method for electronic substrate and binding agent applied to the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102740601A true CN102740601A (en) | 2012-10-17 |
| CN102740601B CN102740601B (en) | 2015-01-28 |
Family
ID=46995109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210041497.2A Active CN102740601B (en) | 2011-04-27 | 2012-02-23 | Process for producing electronic substrate and adhesive used therein |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102740601B (en) |
| TW (1) | TWI422295B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104122613A (en) * | 2013-04-23 | 2014-10-29 | 住华科技股份有限公司 | Method for manufacturing flexible color filter and flexible color display element |
| CN105372864A (en) * | 2014-09-01 | 2016-03-02 | 中华映管股份有限公司 | Method for manufacturing display panel |
| CN105428261A (en) * | 2015-12-23 | 2016-03-23 | 南通富士通微电子股份有限公司 | SMT (surface mount technology) method for fixing substrate by using UV (ultra violet) film |
| CN109041444A (en) * | 2017-06-12 | 2018-12-18 | 宁波舜宇光电信息有限公司 | Wiring board processing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1355832A (en) * | 1999-06-10 | 2002-06-26 | 新田株式会社 | Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part |
| CN1720766A (en) * | 2002-12-02 | 2006-01-11 | 索尼化学株式会社 | Method for manufacturing flexible wiring circuit board |
| WO2010065457A2 (en) * | 2008-12-02 | 2010-06-10 | Arizona Board Of Regents, For And On Behalf Of Arizona State University | Method of providing a semiconductor device with a dielectric layer and semiconductor device thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201011086A (en) * | 2008-09-12 | 2010-03-16 | Symbio Inc | Heat-peelable pressure-sensitive adhesive sheet |
-
2011
- 2011-04-27 TW TW100114666A patent/TWI422295B/en active
-
2012
- 2012-02-23 CN CN201210041497.2A patent/CN102740601B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1355832A (en) * | 1999-06-10 | 2002-06-26 | 新田株式会社 | Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part |
| CN1720766A (en) * | 2002-12-02 | 2006-01-11 | 索尼化学株式会社 | Method for manufacturing flexible wiring circuit board |
| WO2010065457A2 (en) * | 2008-12-02 | 2010-06-10 | Arizona Board Of Regents, For And On Behalf Of Arizona State University | Method of providing a semiconductor device with a dielectric layer and semiconductor device thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104122613A (en) * | 2013-04-23 | 2014-10-29 | 住华科技股份有限公司 | Method for manufacturing flexible color filter and flexible color display element |
| CN105372864A (en) * | 2014-09-01 | 2016-03-02 | 中华映管股份有限公司 | Method for manufacturing display panel |
| CN105428261A (en) * | 2015-12-23 | 2016-03-23 | 南通富士通微电子股份有限公司 | SMT (surface mount technology) method for fixing substrate by using UV (ultra violet) film |
| CN109041444A (en) * | 2017-06-12 | 2018-12-18 | 宁波舜宇光电信息有限公司 | Wiring board processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI422295B (en) | 2014-01-01 |
| CN102740601B (en) | 2015-01-28 |
| TW201249272A (en) | 2012-12-01 |
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